DISCRETE SEMICONDUCTORS DATA SHEET dbook, halfpage M3D102 BFS540 NPN 9 GHz wideband transistor Product specification Supersedes data of 1997 Dec 05 2000 May 30 NXP Semiconductors Product specification NPN 9 GHz wideband transistor BFS540 FEATURES DESCRIPTION High power gain NPN transistor in a SOT323 plastic package. Low noise figure Gold metallization ensures excellent reliability 3 handbook, 2 columns High transition frequency PINNING PIN SOT323 package. 1 APPLICATIONS DESCRIPTION 1 base 2 Top view 2 emitter 3 collector RF wideband amplifier applications such as satellite TV systems and RF portable communication equipment with signal frequencies up to 2 GHz. MBC870 Marking code: N4. Fig.1 SOT323. QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT V VCBO collector-base voltage open emitter 20 open base 15 V 120 mA mW VCEO collector-emitter voltage IC DC collector current Ptot total power dissipation Ts 80 C; note 1 500 hFE DC current gain IC = 40 mA; VCE = 8 V; Tj = 25 C 100 120 250 fT transition frequency IC = 40 mA; VCE = 8 V; f = 1 GHz; Tamb = 25 C 9 GHz GUM maximum unilateral power gain IC = 40 mA; VCE = 8 V; f = 900 MHz; Tamb = 25 C 14 dB F noise figure IC = 10 mA; VCE = 8 V; f = 900 MHz; Tamb = 25 C 1.3 1.7 dB Note 1. Ts is the temperature at the soldering point of the collector tab. LIMITING VALUES In accordance with the Absolute Maximum System (IEC 60134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VCBO collector-base voltage open emitter 20 V VCES collector-emitter voltage RBE = 0 15 V open collector 2.5 V 120 mA 500 mW VEBO emitter-base voltage IC DC collector current Ptot total power dissipation Tstg storage temperature 65 150 C Tj junction temperature 175 C Ts 80 C; note 1 Note 1. Ts is the temperature at the soldering point of the collector tab. 2000 May 30 2 NXP Semiconductors Product specification NPN 9 GHz wideband transistor BFS540 THERMAL CHARACTERISTICS SYMBOL Rth j-s PARAMETER CONDITIONS thermal resistance from junction to soldering point VALUE UNIT 190 K/W Ts 80 C; note 1 Note 1. Ts is the temperature at the soldering point of the collector tab. CHARACTERISTICS Tj = 25 C unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT ICBO collector cut-off current IE = 0; VCE = 8 V 50 hFE DC current gain IC = 40 mA; VCE = 8 V 100 120 250 Ce emitter capacitance IC = ic = 0; VEB = 0.5 V; f = 1 MHz 2 pF nA Cc collector capacitance IE = ie = 0; VCB = 8 V; f = 1 MHz 0.9 pF Cre feedback capacitance IC = 0; VCB = 8 V; f = 1 MHz 0.6 pF fT transition frequency IC = 40 mA; VCE = 8 V; f = 1 GHz; Tamb = 25 C 9 GHz GUM maximum unilateral power gain (note 1) IC = 40 mA; VCE = 8 V; f = 900 MHz; Tamb = 25 C 14 dB IC = 40 mA; VCE = 8 V; f = 2 GHz; Tamb = 25 C 8 dB s212 insertion power gain IC = 40 mA; VCE = 8 V; f = 900 MHz; Tamb = 25 C 12 13 dB F noise figure s = opt; IC = 10 mA; VCE = 8 V; f = 900 MHz; Tamb = 25 C 1.3 1.8 dB s = opt; IC = 40 mA; VCE = 8 V; f = 900 MHz; Tamb = 25 C 1.9 2.4 dB s = opt; IC = 10 mA; VCE = 8 V; f = 2 GHz; Tamb = 25 C 2.1 dB PL1 output power at 1 dB gain compression Ic = 40 mA; VCE = 8 V; RL = 50 ; f = 900 MHz; Tamb = 25 C 21 dBm ITO third order intercept point note 2 34 dBm Notes 1. GUM is the maximum unilateral power gain, assuming s12 is zero and 2 s 21 - dB. G UM = 10 log ------------------------------------------------------2 2 1 – s 11 1 – s 22 2. IC = 40 mA; VCE = 8 V; RL = 50 ; f = 900 MHz; Tamb = 25 C; fp = 900 MHz; fq = 902 MHz; measured at f(2pq) = 898 MHz and at f(2qp) = 904 MHz. 2000 May 30 3 NXP Semiconductors Product specification NPN 9 GHz wideband transistor BFS540 MRC008 - 1 400 handbook, halfpage MRC010 200 handbook, halfpage P tot (mW) h FE 300 150 200 100 100 50 0 0 50 100 150 0 10−2 200 T ( o C) 10−1 1 10 s IC (mA) 102 VCE = 8 V; Tj = 25 C. VCE 10 V. Fig.3 DC current gain as a function of collector current. Fig.2 Power derating curve. MRC001 1 MRC002 12 handbook, halfpage handbook, halfpage Cre (pF) fT (GHz) 0.8 VCE = 8 V 8 0.6 4V 0.4 4 0.2 0 0 2 4 6 8 0 10 12 VCB (V) 1 10 IC = 0; f = 1 MHz. f = 1 GHz; Tamb = 25 C. Fig.4 Fig.5 Feedback capacitance as a function of collector-base voltage. 2000 May 30 4 I C (mA) 102 Transition frequency as a function of collector current. NXP Semiconductors Product specification NPN 9 GHz wideband transistor BFS540 In Figs 6 to 9, GUM = maximum unilateral power gain; MSG = maximum stable gain; Gmax = maximum available gain. MRC007 20 GUM (dB) MRC006 15 handbook, halfpage handbook, halfpage gain (dB) 16 VCE = 8 V 4V 10 G max 12 GUM 8 5 4 0 0 10 20 30 0 40 50 IC (mA) f = 900 MHz; Tamb = 25 C. 0 20 40 IC (mA) 60 VCE = 8 V; f = 2 GHz; Tamb = 25 C. Fig.6 Maximum unilateral power gain as a function of collector current. Fig.7 Gain as a function of collector current. MRC004 50 MRC005 50 gain (dB) handbook, halfpage handbook, halfpage gain (dB) 40 40 G UM G UM 30 30 MSG MSG 20 20 G max G max 10 10 0 10−2 10−1 1 f (GHz) 0 10−2 10 IC = 10 mA; VCE = 8 V; Tamb = 25 C. 1 f (GHz) 10 IC = 40 mA; VCE = 8 V; Tamb = 25 C. Fig.8 Gain as a function of frequency. 2000 May 30 10−1 Fig.9 Gain as a function of frequency. 5 NXP Semiconductors Product specification NPN 9 GHz wideband transistor BFS540 MRC009 4 MRC003 4 handbook, halfpage handbook, halfpage F (dB) F (dB) IC = 40 mA 3 3 10 mA f= 2 GHz 2 2 900 MHz 1 0 1 500 MHz 1 10 IC (mA) 0 10−1 102 1 f (GHz) 10 VCE = 8 V; Tamb = 25 C. VCE = 8 V; Tamb = 25 C. Fig.10 Minimum noise figure as a function of collector current. Fig.11 Minimum noise figure as a function of frequency. 2000 May 30 6 NXP Semiconductors Product specification NPN 9 GHz wideband transistor BFS540 handbook, full pagewidth 90° 1.0 1 135° pot. unst. region 0.8 45° 2 0.5 0.6 0.2 0.4 5 Fmin = 1. 3 dB 0.2 ΓOPT 180° 0.2 0 0.5 1 2 5 0° F = 1.5 dB 0 F = 2 dB stability circle 5 0.2 F = 3 dB 0.5 2 −135° −45° 1 MRC079 IC = 10 mA; VCE = 8 V; f = 900 MHz; Zo = 50 . 1.0 −90° Fig.12 Noise circle. 90° handbook, full pagewidth 1.0 1 135° 0.8 45° 2 0.5 0.6 0.2 F = 4 dB 0.4 5 F = 3 dB 180° F = 2.5 dB 0.5 1 0.2 0 0.2 2 5 0° 0 ΓMS Gmax = 8.7 dB Fmin = 2. 1 dB G = 8 dB ΓOPT 0.2 5 G = 7 dB G = 6 dB 0.5 2 −135° −45° 1 MRC080 IC = 10 mA; VCE = 8 V; f = 2 GHz; Zo = 50 . −90° Fig.13 Noise circle. 2000 May 30 7 1.0 NXP Semiconductors Product specification NPN 9 GHz wideband transistor BFS540 90° handbook, full pagewidth 1.0 1 135° 0.8 45° 2 0.5 0.6 3 GHz 0.2 0.4 5 0.2 180° 0.2 0 0.5 1 2 0.2 5 0° 5 40 MHz 0.5 2 −135° 0 −45° 1 MRC062 −90° IC = 40 mA; VCE = 8 V; Zo = 50 . Fig.14 Common emitter input reflection coefficient (s11). 90° handbook, full pagewidth 135° 45° 40 MHz 3 GHz 180° 50 40 30 20 0° 10 −135° −45° −90° MRC063 IC = 40 mA; VCE = 8 V. Fig.15 Common emitter forward transmission coefficient (s21). 2000 May 30 8 1.0 NXP Semiconductors Product specification NPN 9 GHz wideband transistor BFS540 90° handbook, full pagewidth 135° 45° 3 GHz 40 MHz 180° 0.5 0.4 0.3 0.2 0° 0.1 −135° −45° −90° MRC064 IC = 40 mA; VCE = 8 V. Fig.16 Common emitter reverse transmission coefficient (s12). 90° handbook, full pagewidth 1.0 1 135° 0.8 45° 2 0.5 0.6 0.2 0.4 5 0.2 180° 0.2 0 0.5 1 2 5 0° 0 3 GHz 40 MHz 5 0.2 0.5 2 −135° −45° 1 MRC065 IC = 40 mA; VCE = 8 V; Zo = 50 . −90° Fig.17 Common emitter output reflection coefficient (s22). 2000 May 30 9 1.0 NXP Semiconductors Product specification NPN 9 GHz wideband transistor BFS540 PACKAGE OUTLINE Plastic surface-mounted package; 3 leads SOT323 D E B A X HE y v M A 3 Q A A1 c 1 2 e1 bp Lp w M B e detail X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 max bp c D E e e1 HE Lp Q v w mm 1.1 0.8 0.1 0.4 0.3 0.25 0.10 2.2 1.8 1.35 1.15 1.3 0.65 2.2 2.0 0.45 0.15 0.23 0.13 0.2 0.2 OUTLINE VERSION SOT323 2000 May 30 REFERENCES IEC JEDEC JEITA SC-70 10 EUROPEAN PROJECTION ISSUE DATE 04-11-04 06-03-16 NXP Semiconductors Product specification NPN 9 GHz wideband transistor BFS540 DATA SHEET STATUS DOCUMENT STATUS(1) PRODUCT STATUS(2) DEFINITION Objective data sheet Development This document contains data from the objective specification for product development. Preliminary data sheet Qualification This document contains data from the preliminary specification. Product data sheet Production This document contains the product specification. Notes 1. Please consult the most recently issued document before initiating or completing a design. 2. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. Right to make changes NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. DEFINITIONS Product specification The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. Suitability for use NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. DISCLAIMERS Limited warranty and liability Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Applications Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. 2000 May 30 11 NXP Semiconductors Product specification NPN 9 GHz wideband transistor BFS540 Export control This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). 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Limiting values Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. 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No changes were made to the technical content, except for package outline drawings which were updated to the latest version. Contact information For additional information please visit: http://www.nxp.com For sales offices addresses send e-mail to: [email protected] © NXP B.V. 2010 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands R77/04/pp13 Date of release: 2000 May 30