MICROSEMI APTGF150A120T3AG

APTGF150A120T3AG
Phase leg
NPT IGBT Power Module
Power Module
29
30
31
32
VCES = 1200V
IC = 150A @ Tc = 100°C
Application
13
•
•
•
•
4
3
Welding converters
Switched Mode Power Supplies
Uninterruptible Power Supplies
Motor control
Features
26
27
28
22
23
25
R1
•
8
7
16
28 27 26 25
18
19
20
14
•
•
•
•
•
20 19 18
23 22
29
16
30
15
31
14
32
Non Punch Through (NPT) Fast IGBT
- Low voltage drop
- Low tail current
- Switching frequency up to 50 kHz
- Soft recovery parallel diodes
- Low diode VF
- Low leakage current
- RBSOA and SCSOA rated
Very low stray inductance
Kelvin emitter for easy drive
Internal thermistor for temperature monitoring
High level of integration
AlN substrate for improved thermal performance
Benefits
13
2
3
4
7
8
10 11 12
Pins 29/30/31/32 must be shorted together
Pins 26/27/28/22/23/25 must be shorted together
to achieve a phase leg
Pins 16/18/19/20 must be shorted together
•
•
•
•
•
Direct mounting to heatsink (isolated package)
Low junction to case thermal resistance
Solderable terminals both for power and signal for
easy PCB mounting
Low profile
RoHS Compliant
Absolute maximum ratings
ICM
VGE
PD
RBSOA
TC = 25°C
Continuous Collector Current
TC = 100°C
Pulsed Collector Current
Gate – Emitter Voltage
Maximum Power Dissipation
Reverse Bias Safe Operating Area
TC = 25°C
TC = 25°C
TJ = 150°C
Max ratings
1200
210
150
300
±20
1041
300A @ 1150V
Unit
V
July, 2008
IC
Parameter
Collector - Emitter Breakdown Voltage
A
V
W
These Devices are sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed. See application note
APT0502 on www.microsemi.com
www.microsemi.com
1–5
APTGF150A120T3AG – Rev 0
Symbol
VCES
APTGF150A120T3AG
All ratings @ Tj = 25°C unless otherwise specified
Electrical Characteristics
Symbol Characteristic
ICES
Zero Gate Voltage Collector Current
VCE(sat)
Collector Emitter Saturation Voltage
VGE(th)
IGES
Gate Threshold Voltage
Gate – Emitter Leakage Current
Test Conditions
Min
VGE = 0V, VCE = 1200V
Tj = 25°C
VGE =15V
IC = 150A
Tj = 125°C
VGE = VCE , IC = 6mA
VGE = 20V, VCE = 0V
Typ
4.5
3.2
3.9
5.5
Min
Typ
Max
Unit
250
3.7
µA
6.5
400
V
nA
Max
Unit
V
Dynamic Characteristics
Symbol Characteristic
Cies
Coes
Cres
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
QG
Gate charge
Td(on)
Tr
Td(off)
Tf
Turn-on Delay Time
Rise Time
Turn-off Delay Time
Fall Time
Td(on)
Tr
Td(off)
Turn-on Delay Time
Rise Time
Turn-off Delay Time
Tf
Fall Time
Eon
Turn-on Switching Energy
Eoff
Turn-off Switching Energy
Isc
Short Circuit data
Test Conditions
VGE = 0V
VCE = 25V
f = 1MHz
VGE= ±15V ; VCE=600V
IC=150A
Inductive Switching (25°C)
VGE = ±15V
VBus = 600V
IC = 150A
RG = 5.6Ω
Inductive Switching (125°C)
VGE = ±15V
VBus = 600V
IC = 150A
RG = 5.6Ω
VGE = ±15V
Tj = 125°C
VBus = 600V
IC = 150A
Tj = 125°C
RG = 5.6Ω
VGE ≤15V ; VBus = 900V
tp ≤ 10µs ; Tj = 125°C
9.3
1.4
0.7
nF
1.6
µC
120
50
310
20
ns
130
60
360
ns
30
18
mJ
8
900
A
Reverse diode ratings and characteristics
IRM
IF
VF
Test Conditions
Min
Maximum Reverse Leakage Current
VR=1200V
DC Forward Current
Diode Forward Voltage
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
Typ
Max
1200
Maximum Peak Repetitive Reverse Voltage
IF = 120A
VR = 800V
di/dt =400A/µs
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V
Tj = 25°C
Tj = 125°C
150
600
Tj = 125°C
120
2.5
3
1.8
Tj = 25°C
265
Tj = 125°C
Tj = 25°C
350
1120
Tj = 125°C
5780
Tc = 100°C
IF = 120A
IF = 240A
IF = 120A
Unit
µA
A
3
V
July, 2008
VRRM
ns
nC
2–5
APTGF150A120T3AG – Rev 0
Symbol Characteristic
APTGF150A120T3AG
Thermal and package characteristics
Symbol Characteristic
RthJC
VISOL
TJ
TSTG
TC
Torque
Wt
Min
Typ
IGBT
Diode
Junction to Case Thermal Resistance
RMS Isolation Voltage, any terminal to case t =1 min, I isol<1mA, 50/60Hz
Operating junction temperature range
Storage Temperature Range
Operating Case Temperature
Mounting torque
Package Weight
To heatsink
M4
2500
-40
-40
-40
2.5
Max
0.12
0.37
Unit
°C/W
V
150
125
100
4.7
110
°C
N.m
g
Temperature sensor NTC (see application note APT0406 on www.microsemi.com for more information).
Symbol
R25
∆R25/R25
B25/85
∆B/B
Characteristic
Resistance @ 25°C
Min
T25 = 298.15 K
TC=100°C
RT =
R25
Typ
50
5
3952
4
Max
Unit
kΩ
%
K
%
T: Thermistor temperature
⎡
⎛ 1
1 ⎞⎤ RT: Thermistor value at T
− ⎟⎟⎥
exp ⎢ B25 / 85 ⎜⎜
⎝ T25 T ⎠⎦
⎣
SP3 Package outline (dimensions in mm)
12
See application note 1901 - Mounting Instructions for SP3 Power Modules on www.microsemi.com
www.microsemi.com
3–5
APTGF150A120T3AG – Rev 0
July, 2008
28
17
1
APTGF150A120T3AG
Typical Performance Curve
Output Characteristics
300
250
250
TJ=25°C
150
VGE=20V
VGE=12V
VGE=9V
100
TJ=125°C
50
50
0
0
0
1
2
3
VCE (V)
4
5
6
0
1
2
3
4
VCE (V)
5
6
Energy losses vs Collector Current
Transfert Characteristics
300
56
VCE = 600V
VGE = 15V
RG = 5.6 Ω
TJ = 125°C
48
250
40
E (mJ)
200
TJ=125°C
150
Eon
32
24
100
Eoff
16
TJ=25°C
50
8
0
0
5
6
7
8
9
10
11
0
12
50
100
150
200
250
300
IC (A)
VGE (V)
Switching Energy Losses vs Gate Resistance
Reverse Bias Safe Operating Area
70
350
50
40
300
250
Eon
IC (A)
VCE = 600V
VGE =15V
IC = 150A
TJ = 125°C
60
E (mJ)
VGE=15V
150
100
IC (A)
TJ = 125°C
200
200
IC (A)
IC (A)
Output Characteristics (VGE=15V)
300
30
20
200
150
VGE=15V
TJ=125°C
RG=5.6 Ω
100
Eoff
50
10
0
0
0
5
0
10 15 20 25 30 35 40 45 50
Gate Resistance (ohms)
300
600
900
1200
1500
VCE (V)
maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration
0.1
0.9
IGBT
0.7
July, 2008
0.12
0.08
0.06
0.5
0.04
0.3
0.02
0.1
Single Pulse
0.05
0
0.00001
0.0001
0.001
0.01
0.1
1
10
rectangular Pulse Duration (Seconds)
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4–5
APTGF150A120T3AG – Rev 0
Thermal Impedance (°C/W)
0.14
APTGF150A120T3AG
Forward Characteristic of diode
150
ZVS
120
ZCS
300
VCE=600V
D=50%
RG=5.6 Ω
TJ=125°C
TC=75°C
250
200
IF (A)
Fmax, Operating Frequency (kHz)
Operating Frequency vs Collector Current
180
90
150
TJ=125°C
100
60
30
TJ=25°C
50
hard
switching
0
0
0
40
80
120
IC (A)
160
0
200
0.5
1
1.5
2
VF (V)
2.5
3
3.5
maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration
Thermal Impedance (°C/W)
0.4
0.35
0.3
Diode
0.9
0.7
0.25
0.2
0.15
0.5
0.3
0.1
0.05
0.1
Single Pulse
0.05
0
0.00001
0.0001
0.001
0.01
0.1
1
10
Microsemi reserves the right to change, without notice, the specifications and information contained herein
Microsemi's products are covered by one or more of U.S patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522 5,262,336 6,503,786 5,256,583 4,748,103
5,283,202 5,231,474 5,434,095 5,528,058 6,939,743 7,352,045 5,283,201 5,801,417 5,648,283 7,196,634 6,664,594 7,157,886 6,939,743 7,342,262
and foreign patents. U.S and Foreign patents pending. All Rights Reserved.
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5–5
APTGF150A120T3AG – Rev 0
July, 2008
rectangular Pulse Duration (Seconds)