Si7902EDN Datasheet

Si7902EDN
Vishay Siliconix
Dual N-Channel 30-V (D-S) MOSFET, Common Drain
FEATURES
PRODUCT SUMMARY
VDS (V)
30
rDS(on) (Ω)
ID (A)
0.028 at VGS = 4.5 V
8.3
0.030 at VGS = 3.7 V
8.0
0.043 at VGS = 2.5 V
6.7
• TrenchFET® Power MOSFET
• New Low Thermal Resistance PowerPAK®
Package with Low 1.07-mm Profile
• 3000–V ESD Protection
Pb-free
Available
RoHS*
COMPLIANT
APPLICATIONS
• Protection Switch for 1–2–Li–ion/LiP Batteries
PowerPAK 1212-8
D
S1
3.30 mm
D
3.30 mm
1
G1
2
S2
3
G2
1.8 kΩ
4
1.8 kΩ
G1
D
8
G2
D
7
D
6
D
5
Bottom View
S1
S2
N-Channel
Ordering Information: Si7902EDN-T1
N-Channel
Si7902EDN–T1–E3 (Lead (Pb)–free)
ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted
Parameter
Symbol
VDS
VGS
Drain-Source Voltage
Gate-Source Voltage
TA = 25 °C
TA = 85 °C
Continuous Drain Current (TJ = 150 °C)a
ID
IDM
IS
Pulsed Drain Current
Continuous Source Current (Diode Conduction)a
TA = 25 °C
TA = 85 °C
Maximum Power Dissipationa
Operating Junction and Storage Temperature Range
PD
10 secs
Steady State
30
± 12
V
8.3
6.0
5.6
4.0
40
2.7
3.2
1.7
TJ, Tstg
1.3
1.5
0.79
– 55 to 150
260
b,c
Soldering Recommendations
Unit
A
W
°C
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction-to-Ambienta
Symbol
t ≤ 10 sec
Steady State
Steady State
RthJA
Typical
30
65
1.9
Maximum
38
82
2.4
Unit
°C/W
Maximum Junction-to-Case (Drain)
RthJC
Notes
a. Surface Mounted on 1" x 1" FR4 Board.
b. See Solder Profile (http://www.vishay.com/ppg?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is
not required to ensure adequate bottom side solder interconnection.
c. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
* Pb containing terminations are not RoHS compliant, exemptions may apply
Document Number: 71801
S-51210–Rev. B, 27-Jun-05
www.vishay.com
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Si7902EDN
Vishay Siliconix
SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Parameter
Symbol
Gate Threshold Voltage
VGS(th)
Test Condition
Min
VDS = VGS, ID = 250 µA
0.60
Typ
Max
Unit
Static
V
±1
µA
VDS = 0 V, VGS = ± 12 V
±10
nA
VDS = 30 V, VGS = 0 V
1
VDS = 30 V, VGS = 0 V, TJ = 85 °C
20
IGSS
Gate-Body Leakage
Zero Gate Voltage Drain Current
IDSS
On-State Drain Currenta
ID(on)
Drain-Source On-State Resistancea
Forward Transconductancea
Diode Forward Voltage
1.5
VDS = 0 V, VGS = ± 4.5 V
a
VDS ≥ 5 V, VGS = 4.5 V
30
A
VGS = 4.5 V, ID = 8.3 A
0.023
0.028
VGS = 3.7 V, ID = 8.0 A
0.025
0.030
VGS = 2.5 V, ID = 3.0 A
0.035
0.043
gfs
VDS = 15 V, ID = 8.3 A
26
VSD
IS = 2.7 A, VGS = 0 V
0.75
1.2
10
15
VDS = 15 V, VGS = 4.5 V, ID = 8.3 A
2.3
rDS(on)
µA
Ω
S
V
Dynamicb
Total Gate Charge
Qg
Gate-Source Charge
Qgs
nC
Gate-Drain Charge
Qgd
2.4
Turn-On Delay Time
td(on)
0.9
1.5
1.5
2.5
2.5
4.0
2.5
4.0
Rise Time
VDD = 15 V, RL = 15 Ω
ID ≅ 1 A, VGEN = 4.5 V, RG = 6 Ω
tr
Turn-Off DelayTime
td(off)
Fall Time
tf
µs
Notes
a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
TYPICAL CHARACTERISTICS TA = 25 °C, unless otherwise noted
0.8
1000
I GSS – Gate Current ( μA)
I GSS – Gate Current (mA)
100
0.6
0.4
0.2
10
TJ = 150 °C
1
TJ = 25 °C
0.1
0.01
0.0
0.001
0
3
6
9
12
VGS – Gate-to-Source Voltage (V)
Gate-Current vs. Gate-Source Voltage
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2
15
0
3
6
9
12
15
VGS – Gate-to-Source Voltage (V)
Gate Current vs. Gate-Source Voltage
Document Number: 71801
S-51210–Rev. B, 27-Jun-05
Si7902EDN
Vishay Siliconix
TYPICAL CHARACTERISTICS
TA = 25 °C, unless otherwise noted
30
30
VGS = 5 thru 2 V
24
I D – Drain Current (A)
I D – Drain Current (A)
24
2.5 V
18
12
2V
6
18
12
TC = 125 °C
6
25 °C
– 55 °C
1.5 V
0
0
1
2
3
4
0
0.0
5
0.5
VDS – Drain-to-Source Voltage (V)
1.5
2.0
2.5
3.0
VGS – Gate-to-Source Voltage (V)
Output Characteristics
Transfer Characteristics
0.08
5
V GS – Gate-to-Source Voltage (V)
r DS(on) – On-Resistance (Ω )
1.0
0.06
0.04
VGS = 2.5 V
VGS = 3.7 V
0.02
VGS = 4.5 V
VDS = 15 V
ID = 8.3 A
4
3
2
1
0.00
0
0
6
12
18
24
30
0
2
4
6
8
ID – Drain Current (A)
Qg – Total Gate Charge (nC)
On-Resistance vs. Drain Current
Gate Charge
10
1.8
VGS = 4.5 V
ID = 8.3 A
rDS(on) – On–Resistance
(Normalized)
1.6
1.4
1.2
1.0
0.8
0.6
- 50
- 25
0
25
50
75
100
125
150
TJ – Junction Temperature (°C)
On-Resistance vs. Junction Temperature
Document Number: 71801
S-51210–Rev. B, 27-Jun-05
www.vishay.com
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Si7902EDN
Vishay Siliconix
TYPICAL CHARACTERISTICS TA = 25 °C, unless otherwise noted
0.08
30
10
r DS(on) – On-Resistance (Ω)
I S – Source Current (A)
ID = 3 A
TJ = 150 °C
TJ = 25 °C
1
0.06
ID = 8.3 A
0.04
0.02
0.00
0
0.2
0.4
0.6
0.8
1.0
0
1.2
VSD – Source-to-Drain Voltage (V)
1
2
3
4
5
VGS – Gate-to-Source Voltage (V)
Source-Drain Diode Forward Voltage
On-Resistance vs. Gate-to-Source Voltage
0.4
50
ID = 250 µA
40
Power (W)
V GS(th) Variance (V)
0.2
- 0.0
- 0.2
30
20
- 0.4
10
- 0.6
- 50
- 25
0
25
50
75
100
125
150
0
0.01
0.1
1
10
Time (sec)
TJ – Temperature (°C)
Threshold Voltage
100
600
Single Pulse Power, Junction-to-Ambient
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
Notes:
0.1
PDM
0.1
0.05
t1
t2
1. Duty Cycle, D =
0.02
t1
t2
2. Per Unit Base = R thJA = 65 °C/W
3. T JM – TA = PDMZthJA(t)
Single Pulse
0.01
10–4
10–3
4. Surface Mounted
10–2
10–1
1
Square Wave Pulse Duration (sec)
10
100
600
Normalized Thermal Transient Impedance, Junction-to-Ambient
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Document Number: 71801
S-51210–Rev. B, 27-Jun-05
Si7902EDN
Vishay Siliconix
TYPICAL CHARACTERISTICS
TA = 25 °C, unless otherwise noted
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
Single Pulse
0.05
0.02
0.01
10–4
10–3
10–2
Square Wave Pulse Duration (sec)
10–1
1
Normalized Thermal Transient Impedance, Junction-to-Case
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability
data, see http://www.vishay.com/ppg?71801.
Document Number: 71801
S-51210–Rev. B, 27-Jun-05
www.vishay.com
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Disclaimer
All product specifications and data are subject to change without notice.
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therein, which apply to these products.
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Document Number: 91000
Revision: 18-Jul-08
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