IDT 79RC32T336

RC32336
IDTTM InterpriseTM Integrated
Communications Processor
Device Overview
Overview
The RC32336 device is a member of the IDT™ Interprise™ family of
integrated communications processors. It provides an effective solution
for small office/home office (SOHO) applications including gateways and
both single-band and dual-band wireless access points. Featuring a
MIPS compatible CPU core, the device also includes a memory
controller supporting SDRAM memory, a PCI interface featuring an onchip arbiter to support up to three external devices, a PCMCIA interface
that supports a single I/O device, and two integrated on-chip 10/100
Ethernet MACs to enable WAN and LAN connectivity.
The key features of the RC32336 enable SOHO applications at
unmatched price/performance points. The MIPS-compatible CPU core
has the required bandwidth to enable a WAP application with the latest
wireless security protocols, WPA and 802.11i, which include the enterprise-level user authentication schemes 802.1x and Extensible Authentication Protocol (EAP). The ability to connect and support the bandwidth
requirements of one or two WLAN modules is made possible by the high
bandwidth PCI and PCMCIA interfaces. Also, the device has been architected to provide high speed LAN to WAN routing bandwidth through the
Ethernet MACs while simultaneously driving data through the other onchip interfaces.
– MMU
– 16-entry TLB
– Supports variable page sizes and enhanced write algorithm
– Supports variable number of locked entries
– 8KB Instruction Cache
– 2-way set associative
– LRU replacement algorithm
– 4 word line size
– Sub-block ordering
– Word parity
– Per line cache locking
– 2KB Data Cache
– 2-way set associative
– LRU replacement algorithm
– 4 word line size
– Sub-block ordering
– Byte parity
– Per line cache locking
– Can be programmed on a page basis to implement writethrough no write allocate, write-through write allocate, or
write-back algorithms
– Enhanced EJTAG and JTAG Interfaces
– Compatible with IEEE Std. 1149.1-1990
Features List
◆
RC32300 32-bit CPU core
– 32-bit MIPS instruction set
– Supports big or little endian operation
Block Diagram
MII
SPI Bus
JTAG
MIPS-32
CPU Core
EJTAG
D. Cache
Interrupt
Controller
.
.
Bus/System
Integrity
Monitor
MMU
I. Cache
MII
2 Ethernet
10/100
Interfaces
SPI
Controller
DMA
Controller
Arbiter
IPBusTM
SDRAM &
Device
Controllers
Memory &
Peripheral Bus
(including PCMCIA)
3 Counter
Timers
GPIO
Interface
UART
(16550)
PCI
Master/Target
Interface
GPIO Pins
Serial Channel
PCI Arbiter
(Host Mode)
PCI Bus
Figure 1 RC32336 Internal Block Diagram
IDT and the IDT logo are trademarks of Integrated Device Technology, Inc.
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 2005 Integrated Device Technology, Inc.
October 4, 2005
DSC 6405
RC32336
PCI Interface
– 32-bit PCI revision 2.2 compliant
– Supports host or satellite operation in both master and target
modes
– PCI clock: supports frequencies from 16 MHz to 66 MHz, PCI
clock may be asynchronous to master clock (CLK)
– PCI arbiter in Host mode: supports 3 external masters, fixed
priority or round robin arbitration
– I2O “like” PCI Messaging Unit
◆ Two Ethernet Interfaces
– 10 and 100 Mb/s ISO/IEC 8802-3:1996 compliant
– Two IEEE 802.3u compatible Media Independent Interfaces
(MII) with serial management interface
– MII supports IEEE 802.3u auto-negotiation speed selection
– Supports 64 entry hash table based multicast address filtering
– 512 byte transmit and receive FIFOs
– Supports flow control functions outlined in IEEE Std. 802.3x1997
◆
SDRAM Controller
– Supports up to 512 MB of memory
– 2 chip selects (each supports 2 or 4 banks internal SDRAM
banks)
– 32-bit data width, supports 8/16/32-bit width devices
– Supports 16Mb, 64Mb, 128Mb, and 256Mb, and 512Mb
devices
– Automatic refresh generation
◆
Memory and Peripheral Device Controller
– Provides “glueless” interface to standard SRAM, Flash, ROM,
dual-port memory, and peripheral devices
– Provides “glueless” interface to many 16-bit PCMCIA devices
– Demultiplexed address and data buses: 32-bit data bus, 26-bit
address bus, 6 chip selects, control for external data bus
buffers
– Supports 8-bit, 16-bit, and 32-bit width devices: automatic byte
gathering and scattering
– Flexible protocol configuration parameters: programmable
number of wait states (0 to 63), programmable postread/postwrite delay (0 to 31), supports external wait state generation,
supports Intel and Motorola style peripherals
– Write protect capability per chip select
– Programmable bus transaction timer generates warm reset
when counter expires
– Supports up to 64MB of memory per chip select
◆ DMA Controller
– 6 DMA channels: two channels for each of the two Ethernet
interfaces (transmit/receive) and two channels for PCI (PCI to
Memory and Memory to PCI)
– Provides flexible descriptor based operation
– Supports unaligned transfers (i.e., source or destination
address may be on any byte boundary) with arbitrary byte
length
General Purpose Peripherals
– Serial port compatible with 16550 Universal Asynchronous
Receiver Transmitter (UART)
– Three general purpose 32-bit counter/timers
– Interrupt Controller
– Serial Peripheral Interface (SPI) supporting host mode
– 16 general purpose I/O (GPIO) pins which can be configured
as interrupt sources
◆
System Features
– JTAG Interface (IEEE Std. 1149.1 compatible)
– 256 pin CABGA package
– 2.5V core supply and 3.3V I/O supply
◆
◆
CPU Execution Core
The RC32336 is built around the RC32300 32-bit high performance
microprocessor core. The RC32300 implements the enhanced MIPS-II
ISA and helps meet the real-time goals and maximize throughput of
communications and consumer systems by providing capabilities such
as a prefetch instruction, multiple DSP instructions, and cache locking.
The instruction set is largely compatible with the MIPS32 instruction set,
allowing the customer to select from a broad range of software and
development tools. Cache locking guarantees real-time performance by
holding critical code and parameters in the cache for immediate availability. The microprocessor also implements an on-chip MMU with a
TLB, making the it fully compliant with the requirements of real time
operating systems.
PCI Interface
The PCI interface on the RC32336 is compatible with version 2.2 of
the PCI specification. An on-chip arbiter supports up to three external
bus masters, supporting both fixed priority and rotating priority arbitration schemes. The RC32336 can support both satellite and host PCI
configurations, enabling it to act as a slave controller for a PCI add-in
card application, or as the primary PCI controller in the system. The PCI
interface can be operated synchronously or asynchronously to the other
I/O interfaces on the RC32336 device.
PCMCIA Interface
The RC32336 provides a "glueless" connection to a single PCMCIA
I/O device via the memory and peripheral device controller. The
PCMCIA interface allows the RC32336 to connect to various types of I/
O peripherals including fax modems, storage devices, and wireless LAN
chipsets. The RC32336 implementation provides a maximum
throughput of 160 Mbps through the 16-bit wide interface as specified
by the PCMCIA 2.1 Standard.
Ethernet Interface
The RC32336 has two Ethernet Channels supporting 10Mbps and
100Mbps speeds and provides a standard media independent interface
(MII) off-chip, allowing a wide range of external devices to be connected
efficiently.
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RC32336
Memory and II//O Controller
The RC32336 incorporates a flexible memory and peripheral device
controller providing direct support for SDRAM, Flash ROM, SRAM,
PCMCIA, and other I/O devices. It can interface directly to 8-bit boot
ROM for a very low cost system implementation. It also offers various
trade-offs in cost / performance for the main memory architecture. The
timers implemented on the RC32336 satisfy the requirements of most
real time operating systems.
DMA Controller
The DMA controller off-loads the CPU core from moving data among
the on-chip interfaces, external peripherals, and memory. The DMA
controller supports scatter / gather DMA with no alignment restrictions,
appropriate for communications and graphics systems.
Enhanced JTAG Interface
For system debugging, the RC32300 CPU core includes an
Enhanced JTAG (EJTAG) interface which operates in Run-Time Mode.
Thermal Considerations
The RC32336 is guaranteed in a ambient temperature range of 0° to
+70° C for commercial temperature devices and - 40° to +85° for industrial temperature devices.
Revision History
Histor y
July 9, 2003: Initial publication.
October 3, 2003: Changed min values in Table 7 from 1.8 to 1.2 for
all signals except SDCLKINP and SDCKENP. Changed min values for
Tdo 10b and 10c in Table 10 for PCIBEN, etc. and PCIGNTN/PCIREQN
from 2.0 to 1.5.
May 25, 2004: In Table 9, signals MIIxRXCLK and MIIxTXCLK, the
Min and Max values for Thigh/Tlow_9c were changed to 140 and 260
respectively and the Min and Max values for Thigh/Tlow_9d were
changed to 14.0 and 26.0 respectively.
October 4, 2005: Changed 180MHz to 150MHz speed grade with
corresponding values.
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RC32336
Pin Description Table
The following table lists the functions of the pins provided on the RC32336. Some of the functions listed may be multiplexed onto the same pin
(indicated as alternate functions).
To define the active polarity of a signal, a suffix will be used. Signals ending with an “N” should be interpreted as being active, or asserted, when at
a logic zero (low) level. All other signals (including clocks, buses, and select lines) will be interpreted as being active, or asserted, when at a logic one
(high) level.
Signal
Type
Name/Description
Memory and Peripheral Bus
BDIRN
O
External Buffer Direction. Memory and peripheral bus external data bus buffer direction control.
If the RC32336 memory and peripheral bus is connected to the A side of a transceiver such as an
IDT74FCT245, then this pin may be directly connected to the direction control (e.g., BDIR) pin of
the transceiver.
BOEN[1:0]
O
External Buffer Enable. These signals provide output enable control for external buffers on the
memory and peripheral data bus.
BWEN[3:0]
O
Byte Write Enables. These signals are memory and peripheral bus byte write enable signals.
BWEN[0] corresponds to byte lane MDATA[7:0]
BWEN[1] corresponds to byte lane MDATA[15:8]
BWEN[2] corresponds to byte lane MDATA[23:16]
BWEN[3] corresponds to byte lane MDATA[31:24]
During PC Card accesses the BWEN[0] acts as the PC Card memory output enable (OE#) signal
and BWEN[1] acts as the PC Card memory write enable (WE#) signal.
CSN[5:0]
O
Chip Selects. These signals are used to select an external device on the memory and peripheral
bus.
MADDR[21:0]
O
Address Bus. 22-bit memory and peripheral bus address bus.
MADDR[25:22] are available as GPIO[5:2] alternate functions.
MDATA[31:0]
I/O
Data Bus. 32-bit memory and peripheral data bus. During a cold reset, bits 0 through 16 of this
data bus function as inputs that are used to load the boot configuration vector.
OEN
O
Output Enable. This signal is asserted when data should be driven by an external device on the
memory and peripheral bus.
RWN
O
Read Write. This signal indicates whether the transaction on the memory and peripheral bus is a
read transaction or a write transaction. A high level indicates a read from an external device. A
low level indicates a write to an external device.
WAITACKN
I
Wait or Transfer Acknowledge. When configured as wait, this signal is asserted during a memory and peripheral bus transaction to extend the bus cycle. When configured as a transfer
acknowledge, this signal is asserted during a transaction to signal the completion of the transaction.
RASN
O
SDRAM Row Address Strobe. Row address strobe asserted during memory and peripheral bus
SDRAM transactions.
CASN
O
SDRAM Column Address Strobe. Column address strobe asserted during memory and peripheral bus SDRAM transactions.
SDCSN[1:0]
O
SDRAM Chip Selects. These signals are used to select SDRAM device(s) on the memory and
peripheral bus.
SDWEN
O
SDRAM Write Enable. This signal is asserted during memory and peripheral bus SDRAM write
transactions.
SDCLKOUT
O
SDRAM Clock Output. This clock is used for all SDRAM memory and peripheral bus operations.
Table 1 Pin Description (Part 1 of 6)
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RC32336
Signal
SDCLKINP
Type
Name/Description
I
SDRAM Clock Input. This clock input is typically a delayed version of SDCLKOUT. Data from the
SDRAMs is sampled using this clock.
General Purpose I/O
GPIO[0]
I/O
General Purpose I/O. This pin can be configured as a general purpose I/O pin.
Alternate function pin name: U0SOUT
Alternate function: UART channel 0 serial output.
GPIO[1]
I/O
General Purpose I/O. This pin can be configured as a general purpose I/O pin.
Alternate function pin name: U0SINP
Alternate function: UART channel 0 serial input.
GPIO[2]
I/O
General Purpose I/O. This pin can be configured as a general purpose I/O pin.
Alternate function pin name: MADDR[22]
Alternate function: Memory and Peripheral bus address bit 22 (output).
GPIO[3]
I/O
General Purpose I/O. This pin can be configured as a general purpose I/O pin.
Alternate function pin name: MADDR[23]
Alternate function: Memory and Peripheral bus address bit 23 (output).
GPIO[4]
I/O
General Purpose I/O. This pin can be configured as a general purpose I/O pin.
Alternate function pin name: MADDR[24]
Alternate function: Memory and Peripheral bus address bit 24 (output).
GPIO[5]
I/O
General Purpose I/O. This pin can be configured as a general purpose I/O pin.
Alternate function pin name: MADDR[25]
Alternate function: Memory and Peripheral bus address bit 25 (output).
GPIO[6]
I/O
General Purpose I/O. This pin can be configured as a general purpose I/O pin.
The value of this pin may be used as a Counter Timer Clock input.
GPIO[7]
I/O
General Purpose I/O. This pin can be configured as a general purpose I/O pin.
Alternate function pin name: SDCKENP
Alternate function: SDRAM clock enable output
The value of this pin may be used as a Counter Timer Clock input.
GPIO[8]
I/O
General Purpose I/O. This pin can be configured as a general purpose I/O pin.
Alternate function pin name: CEN1
Alternate function: PCMCIA chip enable 1 (CE1#) (output).
GPIO[9]
I/O
General Purpose I/O. This pin can be configured as a general purpose I/O pin.
Alternate function pin name: CEN2
Alternate function: PCMCIA chip enable 2 (CE2#) (output).
GPIO[10]
I/O
General Purpose I/O. This pin can be configured as a general purpose I/O pin.
Alternate function pin name: REGN
Alternate function: PCMCIA Attribute Memory Select (REG#) (output).
GPIO[11]
I/O
General Purpose I/O. This pin can be configured as a general purpose I/O pin.
Alternate function pin name: IORDN
Alternate function: PCMCIA IO Read (IORD#) (output).
GPIO[12]
I/O
General Purpose I/O. This pin can be configured as a general purpose I/O pin.
Alternate function pin name: IOWRN
Alternate function: PCMCIA IO Write (IOWR#) (output).
GPIO[13]
I/O
General Purpose I/O. This pin can be configured as a general purpose I/O pin.
Alternate function pin name: PCIREQN[2]
Alternate function: PCI bus request 2 (output).
Table 1 Pin Description (Part 2 of 6)
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RC32336
Signal
Type
Name/Description
GPIO[14]
I/O
General Purpose I/O. This pin can be configured as a general purpose I/O pin.
Alternate function pin name: PCIGNTN[2]
Alternate function: PCI bus grant 2 (output).
GPIO[15]
I/O
General Purpose I/O. This pin can be configured as a general purpose I/O pin.
Alternate function pin name: PCIMUINTN
Alternate function: PCI Messaging unit interrupt output.
SCK
I/O
Serial Clock. This signal is used as the serial SPI clock output. This pin may be used as a bit
input/output port.
SDI
I/O
Serial Data Input. This signal is used to shift in serial SPI data. This pin may be used as a bit
input/output port.
SDO
I/O
Serial Data Output. This signal is used to shift out serial SPI data. This pin may be used as a bit
input/output port.
PCIAD[31:0]
I/O
PCI Multiplexed Address/Data Bus. Address is driven by a bus master during initial PCIFRAMEN assertion. Data is then driven by the bus master during writes or by the bus target during
reads.
PCICBEN[3:0]
I/O
PCI Multiplexed Command/Byte Enable Bus. PCI command is driven by the bus master during
the initial PCIFRAMEN assertion. Byte enables are driven by the bus master during subsequent
data phase(s).
Serial Interface
PCI Bus
PCICLK
I
PCI Clock. Clock used for all PCI bus transactions.
PCIDEVSELN
I/O
PCI Device Select. This signal is driven by a bus target to indicate that the target has decoded
the address as one of its own address spaces.
PCIFRAMEN
I/O
PCI Frame. Driven by a bus master. Assertion indicates the beginning of a bus transaction.
Negation indicates the last data.
PCIGNTN[1:0]
I/O
PCI Bus Grant.
In PCI host mode with internal arbiter:
The assertion of these signals indicates to the agent that the internal RC32336 arbiter has
granted the agent access to the PCI bus.
In PCI host mode with external arbiter:
PCIGNTN[0]: asserted by an external arbiter to indicate to the RC32336 that access to the PCI
bus has been granted.
PCIGNTN[1]: unused and driven high.
In PCI satellite mode:
PCIGNTN[0]: this signal is asserted by an external arbiter to indicate to the RC32336 that access
to the PCI bus has been granted.
PCIGNTN[1]: this signal takes on the alternate function of PCIEECS and is used as a PCI Serial
EEPROM chip select.
PCIIRDYN
I/O
PCI Initiator Ready. Driven by the bus master to indicate that the current data can complete.
PCILOCKN
I/O
PCI Lock. This signal is asserted by an external bus master to indicate that an exclusive operation is occurring.
PCIPAR
I/O
PCI Parity. Even parity of the PCIAD[31:0] bus. Driven by the bus master during address and
write data phases. Driven by the bus target during the read data phases.
PCIPERRN
I/O
PCI Parity Error. This signal is asserted by the receiving bus agent 2 clocks after the data is
received if a parity error is detected.
Table 1 Pin Description (Part 3 of 6)
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RC32336
Signal
Type
Name/Description
PCIREQN[1:0]
I/O
PCI Bus Request.
In PCI host mode with internal arbiter:
These signals are inputs whose assertion indicates to the internal RC32336 arbiter that an agent
desires ownership of the PCI bus.
In PCI host mode with external arbiter:
PCIREQN[0]: asserted by the RC32336 to request ownership of the PCI bus.
PCIREQN[1]: unused and driven high.
In PCI satellite mode:
PCIREQN[0]: this signal is asserted by the RC32336 to request ownership of the PCI bus.
PCIREQN[1]: function changes to PCIIDSEL and is used as a chip select during configuration
read and write transactions.
PCIRSTN
I/O
PCI Reset. In host mode, this signal is asserted by the RC32336 to generate a PCI reset. In satellite mode, assertion of this signal initiates a warm reset.
PCISERRN
I/O
PCI System Error. This signal is driven by an agent to indicate an address parity error, data parity error during a special cycle command, or any other system error. Requires an external pull-up.
PCISTOPN
I/O
PCI Stop. Driven by the bus target to terminate the current bus transaction. For example, to indicate a retry.
PCITRDYN
I/O
PCI Target Ready. Driven by the bus target to indicate that the current data can complete.
Ethernet Interface
MII0CL
I
Ethernet 0 MII Collision Detected. This signal is asserted by the ethernet PHY when a collision
is detected.
MII0CRS
I
Ethernet 0 MII Carrier Sense. This signal is asserted by the ethernet PHY when either the transmit or receive medium is not idle.
MII0RXCLK
I
Ethernet 0 MII Receive Clock. This clock is a continuous clock that provides a timing reference
for the reception of data.
MII0RXD[3:0]
I
Ethernet 0 MII Receive Data. This nibble wide data bus contains the data received by the ethernet PHY.
MII0RXDV
I
Ethernet 0 MII Receive Data Valid. The assertion of this signal indicates that valid receive data
is in the MII receive data bus.
MII0RXER
I
Ethernet 0 MII Receive Error. The assertion of this signal indicates that an error was detected
somewhere in the ethernet frame currently being sent in the MII receive data bus.
MII0TXCLK
I
Ethernet 0 MII Transmit Clock. This clock is a continuous clock that provides a timing reference
for the transfer of transmit data.
MII0TXD[3:0]
O
Ethernet 0 MII Transmit Data. This nibble wide data bus contains the data to be transmitted.
MII0TXENP
O
Ethernet 0 MII Transmit Enable. The assertion of this signal indicates that data is present on the
MII for transmission.
MII0TXER
O
Ethernet 0 MII Transmit Coding Error. When this signal is asserted together with MIITXENP,
the ethernet PHY will transmit symbols which are not valid data or delimiters.
MII1CL
I
Ethernet 1 MII Collision Detected. This signal is asserted by the ethernet PHY when a collision
is detected.
MII1CRS
I
Ethernet 1 MII Carrier Sense. This signal is asserted by the ethernet PHY when either the transmit or receive medium is not idle.
MII1RXCLK
I
Ethernet 1 MII Receive Clock. This clock is a continuous clock that provides a timing reference
for the reception of data.
Table 1 Pin Description (Part 4 of 6)
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RC32336
Signal
Type
Name/Description
MII1RXD[3:0]
I
Ethernet 1 MII Receive Data. This nibble wide data bus contains the data received by the ethernet PHY.
MII1RXDV
I
Ethernet 1 MII Receive Data Valid. The assertion of this signal indicates that valid receive data
is in the MII receive data bus.
MII1RXER
I
Ethernet 1 MII Receive Error. The assertion of this signal indicates that an error was detected
somewhere in the ethernet frame currently being sent in the MII receive data bus.
MII1TXCLK
I
Ethernet 1 MII Transmit Clock. This clock is a continuous clock that provides a timing reference
for the transfer of transmit data.
MII1TXD[3:0]
O
Ethernet 1 MII Transmit Data. This nibble wide data bus contains the data to be transmitted.
MII1TXENP
O
Ethernet 1 MII Transmit Enable. The assertion of this signal indicates that data is present on the
MII for transmission.
MII1TXER
O
Ethernet 1 MII Transmit Coding Error. When this signal is asserted together with MIITXENP,
the ethernet PHY will transmit symbols which are not valid data or delimiters.
MIIMDC
O
MII Management Data Clock. This signal is used as a timing reference for transmission of data
on the management interface.
MIIMDIO
I/O
MII Management Data. This bidirectional signal is used to transfer data between the station management entity and the ethernet PHY.
JTAG_TMS
I
JTAG Mode. The value on this signal controls the test mode select of the boundary scan logic or
JTAG Controller. When using the EJTAG debug interface, this pin should be left disconnected
(since there is an internal pull-up) or driven high.
EJTAG_TMS
I
EJTAG Mode. The value on this signal controls the test mode select of the EJTAG Controller.
When using the JTAG boundary scan, this pin should be left disconnected (since there is an internal pull-up) or driven high.
JTAG_TRST_N
I
JTAG Reset. This active low signal asynchronously resets the boundary scan logic, JTAG TAP
Controller, and the EJTAG Debug TAP Controller. An external pull-up on the board is recommended to meet the JTAG specification in cases where the tester can access this signal. However, for systems running in functional mode, one of the following should occur:
1) actively drive this signal low with control logic
2) statically drive this signal low with an external pull-down on the board
3) clock JTAG_TCK while holding EJTAG_TMS and/or JTAG_TMS high.
JTAG_TCK
I
JTAG Clock. This is an input test clock used to clock the shifting of data into or out of the boundary scan logic, JTAG Controller, or the EJTAG Controller. JTAG_TCK is independent of the system and the processor clock with a nominal 50% duty cycle.
JTAG_TDO
O
JTAG Data Output. This is the serial data shifted out from the boundary scan logic, JTAG Controller, or the EJTAG Controller. When no data is being shifted out, this signal is tri-stated.
JTAG_TDI
I
JTAG Data Input. This is the serial data input to the boundary scan logic, JTAG Controller, or the
EJTAG Controller.
EJTAG / JTAG
Table 1 Pin Description (Part 5 of 6)
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RC32336
Signal
Type
Name/Description
CLK
I
Master Clock. This is the master clock input. The processor frequency is a multiple of this clock
frequency. This clock is used as the system clock for all memory and peripheral bus operations
except those associated with SDRAMs.
COLDRSTN
I
Cold Reset. The assertion of this signal initiates a cold reset. This causes the processor state to
be initialized, boot configuration to be loaded, and the internal PLL to lock onto the master clock
(CLK).
I/O
Reset. The assertion of this bidirectional signal initiates a warm reset. This signal is asserted by
the RC32336 during a warm reset. It can also be asserted by an external device to force the
RC32336 to take a warm reset exception.
Miscellaneous
RSTN
Table 1 Pin Description (Part 6 of 6)
Pin Characteristics
Pin Name
Memory and Peripheral Bus
BDIRN
BOEN[1:0]
BWEN[3:0]
CSN[5:0]
MADDR[21:0]
MDATA[31:0]
OEN
RWN
WAITACKN
RASN
CASN
SDCSN[1:0]
SDWEN
SDCLKOUT
SDCLKINP
General Purpose I/O
GPIO[15:13]
GPIO[12:0]
Serial Interface
SCK
SDI
SDO
PCI Bus Interface
PCIAD[31:0]
PCICBEN[3:0]
PCICLK
PCIDEVSELN
Internal
Resistor
Type
Buffer
I/O Type
O
O
O
O
O
I/O
O
O
I
O
O
O
O
O
I
LVTTL
LVTTL
LVTTL
LVTTL
LVTTL
LVTTL
LVTTL
LVTTL
LVTTL
LVTTL
LVTTL
LVTTL
LVTTL
LVTTL
LVTTL
High Drive
High Drive
High Drive
High Drive
High Drive
High Drive
High Drive
High Drive
STI2
High Drive
High Drive
High Drive
High Drive
High Drive
STI
I/O
I/O
PCI
LVTTL
PCI
Low Drive
pull-up
I/O
I/O
I/O
LVTTL
LVTTL
LVTTL
Low Drive
Low Drive
Low Drive
pull-up
pull-up
pull-up
I/O
I/O
I
I/O
PCI
PCI
PCI
PCI
PCI
PCI
PCI
PCI
External
Resistor1
pull-up
pull-up
pull-up on board
pull-up on board
pull-up on board
pull-up on board
Table 2 Pin Characteristics (Part 1 of 2)
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RC32336
Pin Name
PCIFRAMEN
PCIGNTN[1:0]
PCIIRDYN
PCILOCKN
PCIPAR
PCIPERRN
PCIREQN[1:0]
PCIRSTN
PCISERRN
PCISTOPN
PCITRDYN
Ethernet Interfaces
MII0CL
MII0CRS
MII0RXCLK
MII0RXD[3:0]
MII0RXDV
MII0RXER
MII0TXCLK
MII0TXD[3:0]
MII0TXENP
MII0TXER
MII1CL
MII1CRS
MII1RXCLK
MII1RXD[3:0]
MII1RXDV
MII1RXER
MII1TXCLK
MII1TXD[3:0]
MII1TXENP
MII1TXER
MIIMDC
MIIMDIO
EJTAG / JTAG
JTAG_TMS
EJTAG_TMS
JTAG_TRST_N
JTAG_TCK
JTAG_TDO
JTAG_TDI
Miscellaneous
CLK
COLDRSTN
RSTN
Type
Buffer
I/O Type
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
PCI
PCI
PCI
PCI
PCI
PCI
PCI
PCI
PCI
PCI
PCI
PCI
PCI
PCI
PCI
PCI
PCI
PCI
PCI
Open Collector; PCI
PCI
PCI
I
I
I
I
I
I
I
O
O
O
I
I
I
I
I
I
I
O
O
O
O
I/O
LVTTL
LVTTL
LVTTL
LVTTL
LVTTL
LVTTL
LVTTL
LVTTL
LVTTL
LVTTL
LVTTL
LVTTL
LVTTL
LVTTL
LVTTL
LVTTL
LVTTL
LVTTL
LVTTL
LVTTL
LVTTL
LVTTL
STI
STI
STI
STI
STI
STI
STI
Low Drive
Low Drive
Low Drive
STI
STI
STI
STI
STI
STI
STI
Low Drive
Low Drive
Low Drive
Low Drive
Low Drive
I
I
I
I
O
I
LVTTL
LVTTL
LVTTL
LVTTL
LVTTL
LVTTL
STI
STI
STI
STI
Low Drive
STI
I
I
I/O
LVTTL
LVTTL
LVTTL
STI
STI
Low Drive / STI
Internal
Resistor
External
Resistor1
pull-up on board
pull-up on board
pull-up on board
pull-up on board
pull-down on board
pull-up on board
pull-up on board
pull-up on board
pull-up
pull-up
pull-up
pull-up
pull-up
pull-up
pull-up
pull-up
pull-up
pull-up
pull-up
pull-up
pull-up
pull-up
pull-up
pull-up
pull-up
pull-up
pull-up
See Chapters 22 and 23
of the RC32336 User
Reference Manual
pull-up
pull-up
pull-up on board
Table 2 Pin Characteristics (Part 2 of 2)
1.
External pull-up required in most system applications. Some applications may require additional pull-ups not identified in this table.
2. Schmidt
Trigger Input (STI).
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RC32336
Boot Configuration Vector
Vector
The boot configuration vector is read into the RC32336 during cold reset. The vector defines parameters in the RC32336 that are essential to operation when cold reset is complete.
The encoding of boot configuration vector is described in Table 3, and the vector input is illustrated in Figure 4.
Signal
Name/Description
MDATA[2:0]
CPU Clock Multiplier. This field specifies the value by which the PLL multiplies the master
clock input (CLK) to obtain the processor clock frequency (PCLK).
0x0 - Multiply by 2
0x1 - 0x7 — Reserved
MDATA[3]
Endian. This bit specifies the endianness.
0x0 - little endian
0x1 - big endian
MDATA[4]
Reserved. This pin may be driven high or low during boot configuration and its state is
recorded in the Boot Configuration Vector (BCV) field of the BCV register. This reserved bit
may be used to pass boot configuration parameters to software.
MDATA[6:5]
Boot Device Width. This field specifies the width of the boot device (i.e., Device 0).
0x0 - 8-bit boot device width
0x1 - 16-bit boot device width
0x2 - 32-bit boot device width
0x3 - reserved
MDATA[7]
Reset Mode. This bit specifies the length of time the RSTN signal is driven.
0x0 - Normal reset: RSTN driven for minimum of 4096 clock cycles
0x1 - reserved
MDATA[8]
Disable Watchdog Timer. When this bit is set, the watchdog timer is disabled following a cold
reset.
0x0 - Watchdog timer is enabled
0x1 - Watchdog timer is disabled
MDATA[11:9]
PCI Mode. This bit controls the operating mode of the PCI bus interface. The initial value of the
EN bit in the PCIC register is determined by the PCI mode.
0x0 - Disabled (EN initial value is zero)
0x1 - PCI satellite mode with PCI target not ready (EN initial value is one)
0x2 - PCI satellite mode with suspended CPU execution (EN initial value is one)
0x3 - PCI host mode with external arbiter (EN initial value is zero)
0x4 - PCI host mode with internal arbiter using fixed priority arbitration algorithm
(EN initial value is zero)
0x5 - PCI host mode with internal arbiter using round robin arbitration algorithm
(EN initial value is zero)
0x6 - reserved
0x7 - reserved
MDATA[15:12]
Reserved. These pins may be driven high or low during boot configuration and their state is
recorded in the Boot Configuration Vector (BCV) field of the BCV register. These reserved bits
may be used to pass boot configuration parameters to software.
Table 3 Boot Configuration Vector Encoding
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RC32336
Logic Diagram
The following Logic Diagram shows the primary pin functions of the RC32336.
Miscellaneous
Signals
CLK
COLDRSTN
RSTN
2
4
6
22
32
MIIMDC
MIIMDIO
Ethernet
MII0CL
MII0CRS
MII0RXCLK
MII0RXD[3:0]
MII0RXDV
MII0RXER
MII0TXCLK
MII0TXD[3:0]
MII0TXENP
MII0TXER
MII1CL
MII1CRS
MII1RXCLK
MII1RXD[3:0]
MII1RXDV
MII1RXER
MII1TXCLK
MII1TXD[3:0]
MII1TXENP
MII1TXER
PCI Bus
PCIAD[31:0]
PCICBEN[3:0]
PCICLK
PCIDEVSELN
PCIFRAMEN
PCIGNTN[1:0]
PCIIRDYN
PCILOCKN
PCIPAR
PCIPERRN
PCIREQN[1:0]
PCIRSTN
PCISERRN
PCISTOPN
PCITRDYN
2
4
BDIRN
BOEN[1:0]
BWEN[3:0]
CSN[5:0]
MADDR[21:0]
MDATA[31:0]
OEN
RWN
WAITACKN
RASN
CASN
SDCSN[1:0]
SDWEN
SDCLKOUT
SDCLKINP
Memory
and
Peripheral
Bus
4
RC32336
4
JTAG_TMS
EJTAG_TMS
JTAG_TRST_N
JTAG_TCK
JTAG_TDO
JTAG_TDI
EJTAG / JTAG
Signals
GPIO[15:0]
General Purpose
I/O
4
16
32
4
SDO
SDI
SCK
Serial I/O
2
VccCore
VccI/O
Vss
VccPLL
VssPLL
2
Power/Ground
Figure 1 RC32336 Logic Diagram
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RC32336
AC Timing Definitions
Definitions
Below are examples of the AC timing characteristics used throughout this document.
Tlow
Tper
Thigh
clock
Tdo
Tdo
Tzd
Tdz
Tjitter
Trise
Tfall
Output signal 1
Output signal 2
Tsu
Thld
Input Signal 1
Tpw
Signal 1
Signal 2
Tskew
Signal 3
Figure 2 AC Timing Definitions Waveform
Symbol
Definition
Tper
Clock period.
Tlow
Clock low. Amount of time the clock is low in one clock period.
Thigh
Clock high. Amount of time the clock is high in one clock period.
Trise
Rise time. Low to high transition time.
Tfall
Fall time. High to low transition time.
Tjitter
Jitter. Amount of time the reference clock (or signal) edge can vary on either the rising or falling edges.
Tdo
Data out. Amount of time after the reference clock edge that the output will become valid. The minimum time represents the data output hold.
The maximum time represents the earliest time the designer can use the data.
Tzd
Z state to data valid. Amount of time after the reference clock edge that the tri-stated output takes to become valid.
Tdz
Data valid to Z state. Amount of time after the reference clock edge that the valid output takes to become tri-stated.
Tsu
Input set-up. Amount of time before the reference clock edge that the input must be valid.
Thld
Input hold. Amount of time after the reference clock edge that the input must remain valid.
Tpw
Pulse width. Amount of time the input or output is active for asynchronous signals.
Tslew
Slew rate. The rise or fall rate for a signal to go from a high to low, or low to high.
X(clock)
Timing value. This notation represents a value of ‘X’ multiplied by the clock time period of the specified clock. Using 5(CLK) as an example:
X = 5 and the oscillator clock (CLK) = 25MHz, then the timing value is 200.
Tskew
Skew. The amount of time two signal edges deviate from one another.
Table 4 AC Timing Definitions
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RC32336
Clock Parameters
15.
The values given below are based on systems running at recommended supply voltages and operating temperatures, as shown in Tables 14 and
Parameter
Symbol
150MHz
Reference
Edge
Min
Max
Units
Timing
Diagram
Reference
See Figure 3
PCLK1
Frequency
none
100
150
MHz
CLK2,3
Frequency
none
50
75
MHz
Tper_5a
13.3
20
ns
Thigh_5a,
Tlow_5a
40
60
% of
Tper_5a
Trise_5a,
Tfall_5a
—
3.0
ns
Tjitter_5a
—
± 250
ps
Table 5 RC32336 Clock Parameters
1.
The CPU pipeline clock (PCLK) speed is selected during cold reset by the boot configuration vector (see Table 3).
2. Ethernet clock
3.
(MIIxRXCLK and MIIxTXCLK) frequency must be less than or equal to 1/2 CLK frequency.
PCI clock (PCICLK) frequency must be less than or equal to two times CLK.
Thigh_5a
Tper_5a
Tlow_5a
CLK
Tjitter_5a
Tjitter_5a
Trise_5a
Tfall_5a
Figure 3 Clock Parameters Waveform
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RC32336
AC Timing Characteristics
The values given below are based on systems running at recommended operating supply voltages and temperatures as shown in Tables 14 and
15.
Signal
150MHz
Symbol
Reference
Edge
Min
Max
Tpw_6a1
none
110
Unit
Conditions
—
ms
Cold reset
—
5.0
ns
Cold reset
CLK rising
2.0
9.0
ns
Cold reset
Tpw_6c
none
2(CLK)
—
ns
Cold reset
Thld_6d
COLDRSTN
rising
3.0
—
ns
Cold reset
Timing
Diagram
Reference
Reset and System
COLDRSTN
Trise_6a
2
Tdo_6b
RSTN2
1
RSTN (output)
(input)
MDATA[15:0]
Boot Configuration Vector
Tdz_6d1
COLDRSTN
falling
—
2(CLK)
ns
Cold reset
Tdz_6d1
RSTN falling
—
2(CLK)
ns
Warm reset
Tzd_6d1
RSTN rising
3.0
—
ns
Warm reset
See Figures 4
and 5
Table 6 Reset and System AC Timing Characteristics
1.
The values for this symbol were determined by calculation, not by testing.
2.
RSTN is a bidirectional signal. It is treated as an asynchronous input.
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RC32336
2
1
3
4
5
6
7
8
CLK
SDCLKOUT
Trise_6a
COLDRSTN
Thld_6d
Tdo_6b
RSTN
Tdz_6d
FFFF_FFFF
BOOT VECTOR
MDATA[31:0]
BDIRN
BOEN[1:0]
>= 100 ms
>=10ms
>= 4096 CLK clock cycles
>= 4096 CLK clock cycles
(RSTN sampled)
(RSTN ignored during this period
to allow pull-up to drive signal high)
Tpw_6a
1.
COLDRSTN asserted by external logic.
2.
RC32336 asserts RSTN, asserts BOEN[0] low, drives BDIRN low, and tri-states the data bus in response.
3.
External logic begins driving valid boot configuration vector on the data bus, and the RC32336 starts sampling it.
4.
External logic negates COLDRSTN and tri-states the boot configuration vector on MDATA[15:0]. The boot configuration vector must not be tri-stated before COLDRSTN is deasserted. The RC32336 stops sampling the boot configuration vector.
5.
The RC32336 starts driving the data bus, MDATA[31:0], deasserts BOEN[0] high, and drives BDIRN high.
6.
SYSCLK may be held constant after this point if Hold SYSCLK Constant is selected in the boot configuration vector.
7.
RSTN negated by the RC32336.
8.
CPU begins executing by taking MIPS reset exception, and the RC32336 starts sampling RSTN as a warm reset input.
Figure 4 Cold Reset AC Timing Waveform
1
2
3
4
5
CLK
COLDRSTN
Tdz_6d
Tzd_6d
RSTN
FFFF_FFFF
MDATA[31:0]
Mem Control Signals
Active
Deasserted
>= 4096 CLK clock cycles
Active
>= 4096 CLK clock cycles
(RSTN sampled)
(RSTN ignored during this period
to allow pull-up to drive signal high)
1.
Warm reset condition caused by either RSTN asserted, write to reset register, or bus transaction timer time-out. The RC32336 asserts RSTN output low in response.
2.
The RC32336 tri-states the data bus, MDATA[31:0], and deasserts all memory control signals, such as RASN, CASN, RWN, OEN, etc.
3.
The RC32336 deasserts RSTN.
4.
The RC32336 starts driving the data bus, MDATA[31:0], again, but does not sample the RSTN input.
5.
CPU begins executing by taking a MIPS soft reset exception and also starts sampling the RSTN input again.
Figure 5 Warm Reset AC Timing Waveform
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RC32336
Signal
Symbol
Reference
Edge
150MHz
Unit
Min
Max
1.0
—
ns
1.7
—
ns
1.2
6.0
ns
1.2
7.0
ns
1.2
8.0
ns
Conditions
Timing
Diagram
Reference
Memory and Peripheral Bus - SDRAM Access
MDATA[31:0]
Tsu_7a
Thld_7a
Tdo_7a
1
Tdz_7a
SDCLKINP
rising
SDCLKOUT
rising
Tzd_7a1
MADDR[20:2]
Tdo_7b
SDCLKOUT
rising
1.2
6.0
ns
RASN
Tdo_7c
SDCLKOUT
rising
1.2
6.0
ns
CASN
Tdo_7d
SDCLKOUT
rising
1.2
6.0
ns
SDWEN
Tdo_7e
SDCLKOUT
rising
1.2
6.0
ns
SDCSN[1:0]
Tdo_7f
SDCLKOUT
rising
1.2
6.0
ns
BDIRN
Tdo_7g
SDCLKOUT
rising
1.2
6.0
ns
BOEN[1:0]
Tdo_7h
SDCLKOUT
rising
1.2
6.0
ns
BWEN[3:0]
Tdo_7i
SDCLKOUT
rising
1.2
6.0
ns
SDCLKINP
Tdelay_7k
SDCLKOUT
rising
0.0
2.5
ns
SDCKENP
Tdo_7l
SDCLKOUT
rising
2.0
6.0
ns
See Figures 6
and 7
See Figures 6
and 8
Table 7 Memory and Peripheral Bus AC Timing Characteristics
1. The
values for this symbol were determined by calculation, not by testing.
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October 4, 2005
RC32336
CLK
SDCLKOUT
Tdo_7b
MADDR[21:0]
SDRAM CAS Latency
Tdelay_7k
Addr
Tdo_7i
BWEN[3:0]
1111
BE's
1111
Tdo_7c, 7d, and 7e
CMD[2:0]*
NOP
READ
NOP
Tdo_7f
SDCSN[1:0]
11
Chip-Sel
11
Tdo_7g
Tdo_7g
BDIRN
Tdo_7h
BOEN[1:0]
11
Tdo_7h
Buffer Enables
Tdz_7a
11
Tsu_7a Thld_7a
Tzd_7a
Data
MDATA[31:0]
RC32336
samples
read data
SDCLKINP
* NOTE: CMD[2:0] = {RASN, CASN, SDWEN}
Figure 6 Memory and Peripheral Bus AC Timing Waveform - SDRAM Read Access
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RC32336
CLK
SDCLKOUT
SDRAM
samples
write data
Tdo_7b
Addr
MADDR[21:0]
Tdo_7i
BWEN[3:0]
1111
BE's
1111
Tdo_7c, 7d, and 7e
CMD[2:0]*
NOP
SDCSN[1:0]
11
WRITE
NOP
Chip-Sel
11
Tdo_7f
Tdo_7g
BDIRN
Tdo_7h
BOEN[1:0]
11
Buff Enable
11
Tdo_7a
MDATA[31:0]
Data
* NOTE: CMD[2:0] = {RASN, CASN, SDWEN}
Figure 7 Memory and Peripheral Bus AC Timing Waveform - SDRAM Write Access
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RC32336
Vcc
pull-up
SDCLKOUT
RSTN
Tdelay_7k
COLDRSTN
RC32336
CLK
SDCLKINP
Memory Bus
external
buffer
SRAM,
SDRAM
EPROM,
etc.
Figure 8 SDCLKOUT - SDCLKINP Relationship
Signal
Symbol
Reference
Edge
150MHz
Unit
Min
Max
2.5
—
ns
Thld_8a
1.0
—
ns
Tdo_8a
2.0
6.5
ns
Tdz_8a2
2.0
9.5
ns
Tzd_8a2
2.0
10.5
ns
Conditions
Timing
Diagram
Reference
Memory and Peripheral Bus1 — Device Access
MDATA[31:0]
Tsu_8a
CLK rising
MADDR[21:0]
Tdo_8b
CLK rising
2.0
6.5
ns
MADDR[25:22]
Tdo_8c
CLK rising
3.0
7.5
ns
CSN[5:0]
Tdo_8d
CLK rising
2.0
6.5
ns
RWN
Tdo_8e
CLK rising
2.0
6.5
ns
OEN
Tdo_8f
CLK rising
2.0
6.5
ns
BWEN[1:0]
Tdo_8g
CLK rising
2.0
6.5
ns
BDIRN
Tdo_8h
CLK rising
2.0
6.5
ns
BOEN[1:0]
Tdo_8i
CLK rising
2.0
6.5
ns
WAITACKN3
Tsu_8j
CLK rising
2.0
—
ns
0.5
—
ns
2(CLK)
—
ns
Thld_8j
Tpw_8j2
none
See Figures 9
and 10
Table 8 Memory and Peripheral Bus AC Timing Characteristics — Device Access (Part 1 of 2)
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October 4, 2005
RC32336
150MHz
Symbol
Reference
Edge
Min
Max
CEN14, CEN24
Tdo_8k
CLK rising
3.0
7.5
ns
4
REGN
Tdo_8l
CLK rising
3.0
7.5
ns
IORDN4
Tdo_8m
CLK rising
3.0
7.5
ns
IOWRN4
Tdo_8n
CLK rising
3.0
7.5
ns
Signal
Unit
Conditions
Timing
Diagram
Reference
See Figures 9
and 10 (cont.)
Table 8 Memory and Peripheral Bus AC Timing Characteristics — Device Access (Part 2 of 2)
1. The RC32336 provides bus turnaround cycles to prevent bus contention when going from a read to write and write to read. For example, there are
no cycles where an external device and the RC32336 are both driving. See Chapter 6, Device Controller, in the RC32336 User Reference Manual.
2.
The values for this symbol were determined by calculation, not by testing.
3. WAITACKN
4.
must meet the setup and hold times if it is synchronous or the minimum pulse width if it is asynchronous.
CEN1, CEN2, REGN, IORDN, and IOWRN are alternate functions of GPIO[12:8].
CLK
Tdo_8b
Addr[21:0]
MADDR[21:0]
Tdo_8c
MADDR[25:22]
Addr[25:22]
RWN
Tdo_8d
Tdo_8d
CSN[5:0]
1111
BWEN[3:0]
Tdo_8f
Tdo_8f
OEN
Thld_8a
Tsu_8a
Tdz_8a
Tzd_8a
Data
MDATA[31:0]
RC32336
samples
read data
Tdo_8h
BDIRN
Tdo_8i
Tdo_8h
Tdo_8i
BOEN[1:0]
WAITACKN
Figure 9 Memory and Peripheral Bus AC Timing Waveform - Device Read Access
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October 4, 2005
RC32336
CLK
Tdo_8b
Addr[21:0]
MADDR[21:0]
Tdo_8c
Addr[25:22]
MADDR[25:22]
Tdo_8e
RWN
Tdo_8d
CSN[5:0]
Tdo_8g
BWEN[3:0]
1111
Byte Enables
1111
OEN
Tdo_8a
Data
MDATA[31:0]
BDIRN
Tdo_8i
BOEN[1:0]
WAITACKN
Figure 10 Memory AC and Peripheral Bus Timing Waveform - Device Write Access
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October 4, 2005
RC32336
Signal
150MHz
Symbol
Reference
Edge
Min
Max
Tper_9a
None
53.3
—
ns
23.0
—
ns
10.0
—
ns
Thld_9b
1.0
—
ns
Tdo_9b
1(ICLK)
3(ICLK)
ns
399.96
400.4
ns
Thigh_9c,
Tlow_9c
140
260
ns
Trise_9c,
Tfall_9c
—
3.0
ns
39.9
40.0
ns
Thigh_9d,
Tlow_9d
14.0
26.0
ns
Trise_9d,
Tfall_9d
—
2.0
ns
3.0
—
ns
2.0
—
ns
5.0
13
ns
Unit
Conditions
Timing
Diagram
Reference
Ethernet1
MIIMDC
Thigh_9a,
Tlow_9a
MIIMDIO
MIIxRXCLK, MIIxTXCLK2
MIIxRXCLK, MIIxTXCLK2
MIIxRXD[3:0], MIIxRXDV,
MIIxRXER
MIIxTXD[3:0],
MIIxTXENP, MIIxTXER
Tsu_9b
Tper_9c
Tper_9d
Tsu_9e
Thld_9e
Tdo_9f
MIIMDC rising
None
None
MIIxRXCLK
rising
MIIxTXCLK
rising
See Figure 11
10 Mbps
100 Mbps
Table 9 Ethernet AC Timing Characteristics
1.
There are two MII interfaces and the timing is the same for each. “x” represents interface 0 or 1 (For example, MIIxRXCLK can be either MII0RXCLK
or MII1RXCLK).
2.
The ethernet clock (MIIxRXCLK and MIIxTXCLK) frequency must be equal to or less than 1/2 CLK (MIIxRXCLK and MIIxTXCLK <= 1/2(CLK)).
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RC32336
Thigh_9d
Tlow
Tlow_9d
Tper_9d
MIIxRXCLK
Thld_9e
Tsu_9e
MIIxRXDV, MIIxRXD[3:0], MIIxRXER
Thigh_9d
Tper_9d
Tlow
Tlow_9d
MIIxTXCLK
Tdo_9f
Tdo_9f
MIIxTXEN, MIIxTXD[3:0], MIIxTXER
Thigh_9a
Tper_9a
Tlow_9a
Tlow
MIIxMDC
Tdo_9b
Tdo_9b
MIIxMDIO (output)
Thld_9b
Tsu_9b
MIIxMDIO (input)
Figure 11 Ethernet AC Timing Waveform
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October 4, 2005
RC32336
Signal
150MHz
Unit
Conditions
Timing
Diagram
Reference
30.0
ns
66 MHz PCI
See Figure 12
6.0
—
ns
1.5
4.0
V/ns
3.0
—
ns
Thld_10b
0
—
ns
Tdo_10b
2.0
6.0
ns
Tdz_10b3
—
14.0
ns
Tzd_10b3
2.0
—
ns
5.0
—
ns
Thld_10b
0
—
ns
Tdo_10b
1.5
6.0
ns
5.0
—
ns
Thld_10c
0
—
ns
Tdo_10c
1.5
6.0
ns
Symbol
Reference
Edge
Min
Max
Tper_10a
none
15.0
Thigh_10a,
Tlow_10a
Tslew_10a
PCI1
PCICLK2
PCIAD[31:0]
Tsu_10b
PCIBEN[3:0],
PCIDEVSELN,
PCIFRAMEN,PCIIRDYN,
PCILOCKN, PCIPAR,
PCIPERRN, PCISTOPN,
PCITRDY4
Tsu_10b5
PCIGNTN[2:0],
PCIREQN[2:0]4,6
Tsu_10c
PCICLK rising
PCICLK rising
PCICLK rising
PCIRSTN (output)7
Tpw_10d3
None
4000
(CLK)
—
ns
See Figure 13
PCIRSTN (input)7,8
Tpw_10e3
None
2(CLK)
—
ns
See Figure 14
Tdz_10e3
PCIRSTN
falling
6(CLK)
—
ns
Tsu_10f
PCICLK rising
3.0
—
ns
Thld_10f
0
—
ns
Tzd_10f3
2.0
6.0
ns
4.7
11.1
ns
PCISERRN9
PCIMUINTN10
Tzd_10g3
PCICLK rising
See Figure 12
Table 10 PCI AC Timing Characteristics
1.
This PCI interface conforms to the PCI Local Bus Specification, Rev 2.2 at 33MHz.
2.
PCICLK must be equal to or less than two times CLK (PCICLK <= 2(CLK)).
3. The
4.
values for this symbol were determined by calculation, not by testing.
PCI Local Bus Specification, Rev 2.2 specifies Tval minimum = 2.0ns.
5. The
5ns minimum set-up time conforms to the PCI Local Bus Specification, Rev 2.2 at 33MHz. At 66MHz, the 5ns minimum set-up time provides
a wide margin of 4ns, which is sufficient to ensure a working design at such frequency.
6.
PCIGNTN[2] and PCIREQN[2] are alternate functions of GPIO[14] and GPIO[13] respectively.
7. PCIRSTN is
8.
an output in host mode and an input in satellite mode.
To meet the PCI delay specification from reset asserted to outputs floating, the PCI reset should be logically combined with the COLDRSTN input,
instead of input on PCIRSTN.
9. PCISERRN
10.
uses open collector I/O types.
PCIMUINTN is an alternate function of GPIO[15].
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Tlow_10a
Thigh_10a
Tper_10a
PCICLK
Tdo_10b
Tdz_10b
Tzd_10b
Bussed output
Tdo_10c
Point to point output
Thld_10b
Tsu_10b
Bussed input
valid
Thld_10c
Tsu_10c
Point to point input
valid
Figure 12 PCI AC Timing Waveform
COLDRSTN
PCIRSTN (output)
cold reset
(tri-state)
PCI interface enabled
Tpw_10d
RSTN
warm reset
Note: During and after cold reset, PCIRSTN is tri-stated and requires a pull-down to reach a low state.
After the PCI interface is enabled in host mode, PCIRSTN will be driven either high or low depending on the
reset state of the RC32336.
Figure 13 PCI AC Timing Waveform — PCI Reset in Host Mode
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CLK
Tpw_10e
PCIRSTN (input)
RSTN
warm reset
Tdz_10e
MDATA[15:0]
PCI bus signals
Figure 14 PCI AC Timing Waveform — PCI Reset in Satellite Mode
Signal
150MHz
Symbol
Reference
Edge
Min
Max
Tper_12a
None
—
Tper_12a
Unit
Conditions
1920
ns
33 MHz PCI
—
960
ns
66 MHz PCI
Tper_12a
100
166667
ns
SPI
Thigh_12a,
Tlow_12a
930
990
ns
33 MHz PCI
Thigh_12a,
Tlow_12a
465
495
ns
66 MHz PCI
Thigh_12a,
Tlow_12a
40
83353
ns
SPI
SCK rising or
falling
60
—
ns
SPI or PCI
60
—
ns
Timing
Diagram
Reference
SPI1
SCK
SDI
Tsu_12b
Thld_12b
SDO
Tdo_12c
SCK rising or
falling
0
60
ns
SPI or PCI
PCIEECS2
Tdo_12d
SCK rising or
falling
0
60
ns
PCI
SCK, SDI, SDO3
Tpw_12e
None
2(CLK)
—
ns
See Figures 15
through 18
Table 11 SPI AC Timing Characteristics
1.
In SPI mode, the SCK period and sampling edge are programmable. In PCI mode, the SCK period is fixed and the sampling edge is rising.
2. PCIEECS is
3.
the PCI serial EEPROM chip select. It is an alternate function of PCIGNTN[1].
In Bit I/O mode, SCK, SDI, and SDO must meet the setup and hold times if they are synchronous or the minimum pulse width if they are asynchronous.
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Thigh_12a
Tper_12a
Tlow_12a
SCK
Tdo_12d
PCIEECS
Thld_12b
Tsu_12b
SDI
MSB
SDO
MSB
bit 6
bit 5
bit 4
bit 3
bit 2
bit 1
LSB
bit 5
bit 4
bit 3
bit 2
bit 1
LSB
Tdo_12c
bit 6
Loading PCI configuration registers through SPI from an EEPROM.
Figure 15 SPI AC Timing Waveform — PCI Configurations Load
Thigh_12a
Tlow_12a
Tper_12a
SCK
Thld_12b
Tsu_12b
SDI
MSB
bit 6
bit 5
bit 4
bit 3
bit 2
bit 1
LSB
bit 3
bit 2
bit 1
LSB
Tdo_12c
SDO
MSB
bit 6
bit 5
bit 4
Control bits CPOL = 0, CPHA = 0 in the SPI Control Register, SPC.
Figure 16 SPI AC Timing Waveform — Clock Polarity 0, Clock Phase 0
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Thigh_12a
Tper_12a
Tlow_12a
SCK
Thld_12b
Tsu_12b
SDI
MSB
SDO
MSB
bit 6
bit 5
bit 4
bit 3
bit 2
bit 1
LSB
bit 3
bit 2
bit 1
LSB
Tdo_12c
bit 6
bit 5
bit 4
Control bits CPOL = 0, CPHA = 1 in the SPI Control Register, SPC.
Figure 17 SPI AC Timing Waveform — Clock Polarity 0, Clock Phase 1
CLK
Tdo_12e
Tdo_12e
SCK, SDI, SDO (output)
Thld_12e
Tsu_12e
SCK, SDI, SDO (input)
Tpw_12e
SCK, SDI, SDO (asynchronous input)
Figure 18 SPI AC Timing Waveform — Bit I/O Mode
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Signal
150MHz
Reference
Edge
Min
Max
CLK rising
4.0
—
ns
Thld_13a
2.0
—
ns
Tdo_13a
2.0
14.0
ns
2(CLK)
—
ns
Symbol
Unit
Timing
Diagram
Reference
Conditions
GPIO
GPIO[15:0]1
Tsu_13a
Tpw_13b2
None
See Figure 19
Table 12 GPIO AC Timing Characteristics
1. GPIO signals
2.
must meet the setup and hold times if they are synchronous or the minimum pulse width if they are asynchronous.
The values for this symbol were determined by calculation, not by testing.
CLK
Tdo_13a
Tdo_13a
GPIO (synchronous output)
Thld_13a
Tsu_13a
GPIO (synchronous input)
Tpw_13b
GPIO (asynchronous input)
Figure 19 GPIO AC Timing Waveform
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Signal
Symbol
150MHz
Reference
Edge
Unit
Min
Max
100
—
ns
Thigh_14a,
Tlow_14a
40
—
ns
Trise_14a,
Tfall_14a
—
5.0
ns
4.0
—
ns
Thld_14b
4.0
—
ns
Tsu_14c
4.0
—
ns
Thld_14c
4.0
—
ns
Tsu_14d
4.0
—
ns
Thld_14d
4.0
—
ns
—
12.5
ns
—
15.0
ns
Conditions
Timing
Diagram
Reference
EJTAG and JTAG
JTAG_TCK
JTAG_TDI
JTAG_TMS
EJTAG_TMS
JTAG_TDO
Tper_14a
Tsu_14b
Tdo_14e
none
JTAG_TCK rising
JTAG_TCK falling
Tdz_14e1
JTAG_TRST_N
1
Tpw_14f
none
100
—
ns
VSENSE
Trise_16f
none
—
2
sec
See Figure 20
Measured from
0.5V (Tactive)
See Figure 22
Table 13 EJTAG/JTAG AC Timing Characteristics
1. The values for this
symbol were determined by calculation, not by testing.
Tlow_1
Tlow_14a
Tper_14a
Thigh_14a
JTAG_TCK
Thld_14b
Tsu_14b
JTAG_TDI
Thld_14c
Tsu_14c
JTAG_TMS
Thld_14d
Tsu_14d
EJTAG_TMS
Tdo_14e
Tdz_14e
JTAG_TDO
Tpw_1
Tpw_14f
JTAG_TRST_N
Figure 20 EJTAG/JTAG AC Timing Waveform
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The IEEE 1149.1 specification requires that the JTAG and EJTAG TAP controllers be reset at power-up whether or not the interfaces are used for
a boundary scan or a probe. Reset can occur through a pull-down resistor on JTAG_TRST_N if the probe is not connected. However, on-chip pull-up
resistors are implemented on the RC32336 due to an IEEE 1149.1 requirement. Having on-chip pull-up and external pull-down resistors for the
JTAG_TRST_N signal requires special care in the design to ensure that a valid logical level is provided to JTAG_TRST_N, such as using a small
external pull-down resistor to ensure this level overrides the on-chip pull-up. An alternative is to use an active power-up reset circuit for
JTAG_TRST_N, which drives JTAG_TRST_N low only at power-up and then holds JTAG_TRST_N high afterwards with a pull-up resistor.
Figure 21 shows the electrical connection of the EJTAG probe target system connector.
Pull-up
RC32336
Pull-up
VDD
TRST*
JTAG_TRST_N
JTAG_TDI
JTAG_TDO
Series-res.
EJTAG_TMS
Other reset
sources
Target System
Reset Circuit
GND
2
GND
TDI
GND
TDO
GND
TMS
GND
TCK
GND
RST*
GND
GND
VSENSE
GND
GND
no connect
no connect
Vcc I/O
Voltage reference no connect
no connect
GND
GND
GND
GND
GND
Pull-up
COLDRSTN
or RSTN
Pull-down
JTAG_TCK
1
23 24
Figure 21 Target System Electrical EJTAG Connection
Using the EJTAG Probe
In Figure 21, the pull-up resistors for JTAG_TDO and RST*, the pull-down resistor for JTAG_TRST_N, and the series resistor for JTAG_TDO must
be adjusted to the specific design. However, the recommended pull-up/down resistor is 1.0 kΩ because a low value reduces crosstalk on the cable to
the connector, allowing higher JTAG_TCK frequencies. A typical value for the series resistor is 33 Ω. Recommended resistor values have ± 5% tolerance.
If a probe is used, the pull-up resistor on JTAG_TDO must ensure that the JTAG_TDO level is high when no probe is connected and the
JTAG_TDO output is tri-stated. This requirement allows reliable connection of the probe if it is hooked-up when the power is already on (hot plug). The
pull-up resistor value of around 47 kΩ should be sufficient. Optional diodes to protect against overshoot and undershoot voltage can be added on the
signals of the chip with EJTAG.
If a probe is used, the RST* signal must have a pull-up resistor because it is controlled by an open-collector (OC) driver in the probe, and thus is
actively pulled low only. The pull-up resistor is responsible for the high value when not driven by the probe of 25pF. The input on the target system
reset circuit must be able to accept the rise time when the pull-up resistor charges the capacitance to a high logical level. Vcc I/O must connect to a
voltage reference that drops rapidly to below 0.5V when the target system loses power, even with a capacitive load of 25pF. The probe can thus detect
the lost power condition.
For additional information on EJTAG, refer to Chapter 23 of the RC32336 User Reference Manual.
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Voltage Sense Signal Timing
Trise_16f
VSENSE
Tactive
Figure 22 Voltage Sense Signal Timing
The target system must ensure that Trise is obeyed after the system reaches 0.5V (Tactive), so the probe can use this value to determine when the
target has powered-up. The probe is allowed to measure the Trise time from a higher value than Tactive (but lower than Vcc I/O minimum) because the
stable indication in this case comes later than the time when target power is guaranteed to be stable. If JTAG_TRST_N is asserted by a pulse at
power-up, this reset must be completed after Trise. If JTAG_TRST_N is asserted by a pull-down resistor, the probe will control JTAG_TRST_N. At
power-down, no power is indicated to the probe when Vcc I/O drops under the Tactive value, which the probe uses to stop driving the input signals,
except for the probe RST*.
AC Test Conditions
1.5V
50 Ω
RC32336
Output
.
Parameter
Test
Point
50 Ω
Value
Units
0 to 3.0
V
Input rise/fall
3.5
ns
Input reference level
1.5
V
Output reference levels
1.5
V
AC test load
35
pF
Input pulse levels
Figure 23 Output Loading for AC Timing
Phase-Locked Loop (PLL)
The processor aligns the pipeline clock, PClock, to the master input clock (CLK) by using an internal phase-locked loop (PLL) circuit that generates
aligned clocks. Inherently, PLL circuits are only capable of generating aligned clocks for master input clock (CLK) frequencies within a limited range.
PLL Analog Filter
The storage capacitor required for the Phase-Locked Loop circuit is contained in the RC32336. However, it is recommended that the system
designer provide a filter network of passive components for the PLL power supply.
VCCPLL (circuit power) and VSSPLL (circuit ground) should be isolated from VCC Core (core power) and VSS (common ground) with a filter circuit
such as the one shown in Figure 24.
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Because the optimum values for the filter components depend upon the application and the system noise environment, these values should be
considered as starting points for further experimentation within your specific application.
RC32336
10 ohm1
Vcc
VccPLL
10 µF
0.1 µF
100 pF
Vss
VssPLL
1.
This resistor may be required in noisy circuit environments.
Figure 24 PLL Filter Circuit for Noisy Environments
Recommended Operating Supply Voltages
Voltages
Symbol
Parameter
Minimum
Typical
Maximum
Unit
0
0
0
V
Vss
Common ground
VssPLL
PLL ground
VccI/O
I/O supply
3.135
3.3
3.465
VccCore
Internal logic supply
2.375
2.5
2.625
VccPLL
PLL supply
Table 14 RC32336 Operating Supply Voltages
Recommended Operating Temperatures
Grade
Temperature
Commercial
0°C+ 70°C Ambient
Industrial
-40°C+ 85°C Ambient
Table 15 RC32336 Operating Temperature
Capacitive Load Deration
Refer to the RC32336 IBIS Model which can be found at the IDT web site (www.idt.com).
Power-on RampUp
The 2.5V VccCore and VccPLL supplies can be fully powered without the 3.3V VccI/O supply. However, the VccI/O supply cannot exceed the
VccCore and VccPLL supplies by more than 1 volt during power up. A sustained large power difference could potentially damage the part. Inputs
should not be driven until the part is fully powered. Specifically, the input high voltages should not be applied until the VccI/O supply is powered.
There is no special requirement for how fast VccI/O ramps up to 3.3V. However, all timing references are based on a stable VccI/O.
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DC Electrical Characteristics
The values given below are based on systems running at recommended supply voltages, as shown in Table 14.
Note: For a complete list of I/O types, see Table 2.
Parameter
Min
Max
Unit
Conditions
IOL
—
7.3
mA
VOL = 0.4V
IOH
—
-8.0
mA
VOH = (VccI/O - 0.4)
VIL
—
0.8
V
—
VIH
2.0
(VccI/O + 0.5)
V
—
IOL
—
9.4
mA
VOL = 0.4V
IOH
—
-15
mA
VOH = (VccI/O - 0.4)
VIL
—
0.8
V
—
VIH
2.0
(VccI/O + 0.5)
V
—
IOL
39
—
mA
VOL = 0.4V
IOH
-24
—
mA
VOH = (VccI/O - 0.4)
IOH(AC) Switching
-12(VccI/O)
—
mA
0 < VOUT < 0.3(VccI/O)
-17.1(VccI/O - VOUT)
—
mA
0.3(VccI/O) < VOUT < 0.9(VccI/O)
—
-32(VccI/O)
mA
0.7(VccI/O)
+16(VccI/O)
mA
VccI/O > VOUT > 0.6(VccI/O)
+26.7(VOUT)
mA
0.6(VccI/O) > VOUT > 0.1(VccI/O)
LOW Drive
Output with
Schmitt Trigger
Input (STI)
HIGH Drive
Output with
Standard Input
Clock Drive
Output
PCI
IOL(AC) Switching
—
+38(VccI/O)
mA
VOUT = 0.18(VccI/O)
VIL
-0.3
0.3(VccI/O)
V
—
VIH
0.5(VccI/O)
5.5
V
—
CIN
—
10
pF
—
I/OLEAK
—
20
µA
—
Capacitance
Leakage
Table 16 DC Electrical Characteristics
Power Consumption
Consumption
Parameter
Power
Dissipation
Unit
Typical
Max.
60
80
mA
Normal mode
710
750
mA
Standby mode1
620
660
mA
Normal mode
2.07
2.2
W
Standby mode1
1.8
2.0
W
IccI/O
IccCore
150MHz
Conditions
CL = 25pF (affects I/O)
Ta = 25oC
Maximum values use the maximum
voltages listed in Table 14.
Typical values use the typical voltages
listed in Table 14.
Table 17 RC32336 Power Consumption
1.
RISCore 32300 CPU core enters Standby mode by executing WAIT instructions; however, other logic continues to function.
Standby mode reduces power consumption by 0.6 mA per MHz of the CPU pipeline clock, PCLK.
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Power Curve
The following graph contains a power curve that shows power consumption at various bus frequencies.
Typical Power Curve
Power (W @ 3.3v IO & 2.5v core)
2.9
2.8
2.7
2.6
2.5
2.4
2.3
2.2
2.1
2.0
1.9
1.8
70
75
80
85
90
95
100
System Bus Speed (MHz)
Figure 25 Typical Power Usage
Absolute Maximum Ratings
Symbol
Parameter
Min1
Max1
Unit
VCCI/O
I/O Supply Voltage
-0.6
4.0
V
VCCCore
Core Supply Voltage
-0.3
3.0
V
VCCPLL
PLL Supply Voltage
-0.3
3.0
V
Vimin
Input Voltage - undershoot
-0.6
—
V
Vi
I/O Input Voltage
Gnd
VCCI/O+0.6
V
Ta,
Industrial
Ambient Operating
Temperature
-40
+85
°C
Ta,
Commercial
Ambient Operating
Temperature
0
+70
°C
Tstg
Storage Temperature
-40
+125
°C
Table 18 Absolute Maximum Ratings
1.
Functional and tested operating conditions are given in Table 14. Absolute maximum ratings are stress ratings only,
and functional operation at the maximums is not guaranteed. Stresses beyond those listed may affect device reliability or cause permanent damage to the device.
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Package Pin-out — 256256-Pin
56-Pin CABGA
The following table lists the pin numbers and signal names for the RC32336.
Pin
Function
Alt
Pin
Function
A1
MII0RXD[0]
E1
GPIO[15]
A2
MII0RXDV
E2
A3
MII0RXER
A4
Alt
1
Pin
Function
Alt
Pin
Function
J1
PCIGNTN[1]
N1
PCIAD[4]
JTAG_TRST_N
J2
PCIDEVSELN
N2
PCIAD[20]
E3
JTAG_TDO
J3
PCIGNTN[0]
N3
PCIAD[19]
MII0TXCLK
E4
JTAG_TDI
J4
PCIFRAMEN
N4
PCIAD[11]
A5
MII0TXD[2]
E5
VccCORE
J5
VccI/O
N5
PCIAD[13]
A6
MII0CRS
E6
VccI/O
J6
Vss
N6
PCIAD[15]
A7
VssPLL
E7
VccI/O
J7
Vss
N7
BOEN[0]
A8
MII1RXCLK
E8
VccI/O
J8
Vss
N8
CSN[2]
A9
MII1TXD[2]
E9
VccI/O
J9
Vss
N9
CSN[3]
A10
MII1CL
E10
VccI/O
J10
Vss
N10
RWN
A11
JTAG_TCK
E11
VccI/O
J11
Vss
N11
MDATA[1]
A12
GPIO[9]
1
E12
VccCORE
J12
VccI/O
N12
MDATA[3]
A13
GPIO[5]
1
E13
MADDR[5]
J13
SDWEN
N13
MDATA[12]
A14
GPIO[3]
1
E14
MADDR[16]
J14
SDCLKINP
N14
MDATA[30]
A15
GPIO[1]
1
E15
MADDR[17]
J15
BWEN[2]
N15
MDATA[11]
A16
MADDR[10]
E16
MADDR[6]
J16
BWEN[3]
N16
MDATA[27]
B1
MII0RXD[3]
F1
GPIO[14]
1
K1
PCICBEN[1]
P1
PCIAD[5]
B2
MII0RXD[1]
F2
GPIO[13]
1
K2
PCICBEN[2]
P2
PCIAD[21]
B3
MII0RXCLK
F3
PCITRDYN
K3
PCICBEN[0]
P3
PCIAD[23]
B4
MII0TXER
F4
PCISTOPN
K4
PCICLK
P4
PCIAD[10]
B5
MII0TXD[3]
F5
VccCORE
K5
VccI/O
P5
PCIAD[28]
B6
MII0CL
F6
VccI/O
K6
Vss
P6
PCIAD[30]
B7
VccPLL
F7
Vss
K7
Vss
P7
BDIRN
B8
MII1RXDV
F8
Vss
K8
Vss
P8
CSN[1]
B9
MII1TXD[3]
F9
Vss
K9
Vss
P9
CSN[4]
B10
MII1CRS
F10
Vss
K10
Vss
P10
WAITACKN
B11
GPIO[12]
1
F11
VccI/O
K11
Vss
P11
MDATA[17]
B12
GPIO[8]
1
F12
VccCORE
K12
VccCORE
P12
MDATA[19]
B13
GPIO[4]
1
F13
MADDR[3]
K13
BWEN[1]
P13
MDATA[5]
B14
GPIO[2]
1
F14
MADDR[14]
K14
RASN
P14
MDATA[9]
B15
MADDR[21]
F15
MADDR[15]
K15
CASN
P15
MDATA[10]
B16
MADDR[20]
F16
MADDR[4]
K16
BWEN[0]
P16
MDATA[26]
C1
MIIMDC
G1
PCIRSTN
L1
PCIAD[16]
R1
PCIAD[6]
C2
MIIMDIO
G2
PCISERRN
L2
PCIAD[1]
R2
PCIAD[7]
Alt
Table 19: 256-pin CABGA Package Pin-Out (Part 1 of 2)
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October 4, 2005
RC32336
Pin
Function
Alt
Pin
Function
Alt
Pin
Function
Alt
Pin
Function
C3
MII0RXD[2]
G3
PCIPERRN
L3
PCIAD[0]
R3
PCIAD[24]
C4
MII0TXENP
G4
PCIREQN[0]
L4
PCICBEN[3]
R4
PCIAD[25]
C5
MII0TXD[1]
G5
VccCORE
L5
VccCORE
R5
PCIAD[27]
C6
MII1RXD[3]
G6
Vss
L6
VccI/O
R6
PCIAD[29]
C7
MII1RXD[0]
G7
Vss
L7
Vss
R7
PCIAD[31]
C8
MII1RXER
G8
Vss
L8
Vss
R8
BOEN[1]
C9
MII1TXENP
G9
Vss
L9
Vss
R9
OEN
C10
MII1TXD[0]
G10
Vss
L10
Vss
R10
MDATA[16]
C11
EJTAG_TMS
G11
Vss
L11
VccI/O
R11
MDATA[18]
C12
GPIO[10]
G12
VccI/O
L12
VccCORE
R12
MDATA[20]
C13
GPIO[6]
G13
MADDR[1]
L13
CLK
R13
MDATA[21]
C14
GPIO[0]
G14
MADDR[12]
L14
SDCLKOUT
R14
MDATA[7]
C15
MADDR[9]
G15
MADDR[13]
L15
MDATA[15]
R15
MDATA[24]
C16
MADDR[19]
G16
MADDR[2]
L16
MDATA[31]
R16
MDATA[25]
D1
SDI
H1
PCIPAR
M1
PCIAD[18]
T1
PCIAD[22]
D2
COLDRSTN
H2
PCIREQN[1]
M2
PCIAD[3]
T2
PCIAD[8]
D3
SDO
H3
PCILOCKN
M3
PCIAD[2]
T3
PCIAD[9]
D4
SCK
H4
PCIRDYN
M4
PCIAD[17]
T4
PCIAD[26]
D5
MII0TXD[0]
H5
VccI/O
M5
VccCORE
T5
PCIAD[12]
D6
MII1RXD[2]
H6
Vss
M6
VccI/O
T6
PCIAD[14]
D7
MII1RXD[1]
H7
Vss
M7
VccI/O
T7
RSTN
D8
MII1TXER
H8
Vss
M8
VccI/O
T8
CSN[0]
D9
MII1TXCLK
H9
Vss
M9
VccI/O
T9
CSN[5]
D10
MII1TXD[1]
H10
Vss
M10
VccI/O
T10
MDATA[0]
D11
JTAG_TMS
H11
Vss
M11
VccI/O
T11
MDATA[2]
D12
GPIO[11]
1
H12
VccI/O
M12
VccCORE
T12
MDATA[4]
D13
GPIO[7]
1
H13
SDCSN[0]
M13
MDATA[14]
T13
MDATA[6]
D14
MADDR[7]
H14
SDCSN[1]
M14
MDATA[13]
T14
MDATA[22]
D15
MADDR[18]
H15
MADDR[11]
M15
MDATA[28]
T15
MDATA[23]
D16
MADDR[8]
H16
MADDR[0]
M16
MDATA[29]
T16
MDATA[8]
1
1
Alt
Table 19: 256-pin CABGA Package Pin-Out (Part 2 of 2)
38 of 44
October 4, 2005
RC32336
RC32336
Power
ower Pins
RC32336 P
VccI/O
VccI/O
VccCore
VccPLL
E6
J5
E5
B7
E7
J12
E12
E8
K5
F5
E9
L6
F12
E10
L11
G5
E11
M6
K12
F6
M7
L5
F11
M8
L12
G12
M9
M5
H5
M10
M12
H12
M11
Table 20 RC32336 Power Pins
RC32336
RC32336 Ground
Ground Pins
Vss
Vss
Vss
VssPLL
F7
H7
K6
A7
F8
H8
K7
F9
H9
K8
F10
H10
K9
G6
H11
K10
G7
J6
K11
G8
J7
L7
G9
J8
L8
G10
J9
L9
G11
J10
L10
H6
J11
Table 21 RC32336 Ground Pins
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October 4, 2005
RC32336
Alternate Pin Functions
Pin
Primary
Alt #1
C14
GPIO[0]
U0SOUT
A15
GPIO[1]
U0SINP
B14
GPIO[2]
MADDR[22]
A14
GPIO[3]
MADDR[23]
B13
GPIO[4]
MADDR[24]
A13
GPIO[5]
MADDR[25]
D13
GPIO[7]
SDCKENP
B12
GPIO[8]
CEN1
A12
GPIO[9]
CEN2
C12
GPIO[10]
REGN
D12
GPIO[11]
IORDN
B11
GPIO[12]
IOWRN
F2
GPIO[13]
PCIREQN[2]
F1
GPIO[14]
PCIGNTN[2]
E1
GPIO[15]
PCIMUNITN
Table 22 Alternate Pin Functions
40 of 44
October 4, 2005
RC32336
RC32336
Pinout
inout — Top View
RC32336 P
1
2
3
A
4
5
6
7
8
9
10
11
12
13
14
15
16
VssPLL
B
VccPLL
C
D
E
F
G
H
J
K
L
M
N
P
R
T
Vss (Ground)
VccI/O (Power)
VccCore (Power)
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October 4, 2005
RC32336
Package Drawing - 256-pin
256-pin CABGA
42 of 44
October 4, 2005
RC32336
Package Drawing - page two
43 of 44
October 4, 2005
RC32336
Ordering Information
79RCXX
Product
Type
YY
Operating
Voltage
XXXX
999
Device
Type
Speed
A
A
Package
Temp range/
Process
Blank
Commercial Temperature
(0°C to +70°C Ambient)
I
Industrial Temperature
(-40° C to +85° C Ambient)
BC
BCG
256-pin CABGA
256-pin Green CABGA
150
150 MHz Pipeline Clk
336
Integrated Core Processor
T
2.5V +/-5% Core Voltage
79RC32
32-bit Embedded
Microprocessor
Valid Combinations
79RC32T336 - 150BC
256-pin CABGA package, Commercial Temperature
79RC32T336 - 150BCG
256-pin CABGA package, Commercial Temperature (Green)
79RC32T336 - 150BCI
256-pin CABGA package, Industrial Temperature
79RC32T336 - 150BCGI
256-pin CABGA package, Industrial Temperature (Green)
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44 of 44
for Tech Support:
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October 4, 2005