Si3853DV Datasheet

Si3853DV
Vishay Siliconix
P-Channel 20-V (D-S) MOSFET with Schottky Diode
FEATURES
PRODUCT SUMMARY
VDS (V)
- 20
RDS(on) (Ω)
ID (A)
0.200 at VGS = - 4.5 V
± 1.8
0.340 at VGS = - 2.5 V
± 1.3
• Halogen-free According to IEC 61249-2-21
Definition
• LITTLE FOOT® Plus
• Compliant to RoHS Directive 2002/95/EC
SCHOTTKY PRODUCT SUMMARY
VKA (V)
VF (V)
Diode Forward Voltage
IF (A)
20
0.48 V at 0.5 A
0.5
TSOP-6
Top View
3 mm
A
1
6
K
S
2
5
N/C
G
3
4
D
S
K
D
A
G
2.85 mm
Ordering Information: Si3853DV-T1-E3 (Lead (Pb)-free)
Si3853DV-T1-GE3 (Lead (Pb)-free and Halogen-free)
P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted
Parameter
Symbol
5s
Steady State
VDS
- 20
Reverse Voltage (Schottky)
VKA
20
Gate-Source Voltage (MOSFET)
VGS
Drain-Source Voltage (MOSFET and Schottky)
Continuous Drain Current (TJ = 150 °C) (MOSFET)a
TA = 25 °C
TA = 70 °C
Continuous Source Current (MOSFET Diode Conduction)a
± 12
± 1.6
± 1.5
TA = 25 °C
TA = 70 °C
TA = 25 °C
PD
TA = 70 °C
TJ, Tstg
± 1.2
±7
- 1.05
- 0.75
A
0.5
IFM
Pulsed Foward Current (Schottky)
Operating Junction and Storage Temperature Range
± 12
IF
Average Forward Current (Schottky)
Maximum Power Dissipation (Schottky)a
IS
V
± 1.8
IDM
Pulsed Drain Current (MOSFET)
Maximum Power Dissipation (MOSFET)a
ID
Unit
7
1.15
0.83
0.73
0.53
1.0
0.76
0.64
0.48
- 55 to 150
W
°C
Notes:
a. Surface mounted on 1" x 1" FR4 board.
Document Number: 70979
S09-2276-Rev. B, 02-Nov-09
www.vishay.com
1
Si3853DV
Vishay Siliconix
THERMAL RESISTANCE RATINGS
Parameter
Device
t≤5s
Junction-to-Ambienta
Steady State
Junction-to-Foot
Steady State
Symbol
Typical
Maximum
MOSFET
93
110
Schottky
103
125
130
150
140
165
MOSFET
RthJA
Schottky
MOSFET
MOSFET
RthJF
75
90
80
95
Unit
°C/W
Notes:
a. Surface mounted on 1" x 1" FR4 board.
MOSFET SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Parameter
Symbol
Test Conditions
Min.
Typ.
Max.
VGS(th)
VDS = VGS, ID = - 250 µA
- 0.5
IGSS
VDS = 0 V, VGS = ± 12 V
± 100
VDS = - 16 V, VGS = 0 V
-1
VDS = - 16 V, VGS = 0 V, TJ = 75 °C
- 10
Unit
Static
Gate Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage Drain Current
IDSS
On-State Drain Currenta
ID(on)
Drain-Source On-State Resistancea
Forward Transconductancea
Diode Forward
Voltagea
VDS ≥ - 5 V, VGS = - 4.5 V
V
-5
µA
A
VGS = - 4.5 V, ID = - 1.8 A
0.160
0.200
VGS = - 2.5 V, ID = - 1.0 A
0.280
0.340
gfs
VDS = - 5 V, ID = - 1.8 A
3.6
VSD
IS = - 1.05 V, VGS = 0 V
- 0.83
- 1.10
2.7
4.0
VDS = - 10 V, VGS = - 4.5 V, ID = - 1.8 A
0.4
RDS(on)
nA
Ω
S
V
Dynamicb
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
0.6
Turn-On Delay Time
td(on)
11
Rise Time
Turn-Off DelayTime
tr
td(off)
Fall Time
tf
Body Diode Reverse Recovery Time
trr
VDD = - 10 V, RL = 10 Ω
ID ≅ - 1 A, VGEN = - 4.5 V, Rg = 6 Ω
IF = - 1.05 A, dI/dt = 100 A/µs
nC
17
34
50
19
30
24
36
20
40
Typ.
Max.
ns
Notes:
a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.
b. Guaranteed by design, not subject to production testing.
SCHOTTKY SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Parameter
Forward Voltage Drop
Maximum Reverse Leakage Current
Junction Capacitance
Symbol
VF
Irm
CT
Test Conditions
Min.
IF = 0.5 A
0.42
0.48
IF = 0.5 A, TJ = 125 °C
0.33
0.4
VR = 20 V
0.002
0.100
VR = 20 V, TJ = 75 °C
0.06
1
VR = 20 V, TJ = 125 °C
1.5
10
VR = 10 V
31
Unit
V
mA
pF
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
www.vishay.com
2
Document Number: 70979
S09-2276-Rev. B, 02-Nov-09
Si3853DV
Vishay Siliconix
MOSFET TYPICAL CHARACTERISTICS TA = 25 °C, unless otherwise noted
10
8
VGS = 4.5 V thru 4 V
3.5 V
TC = - 55 °C
8
I D - Drain Current (A)
I D - Drain Current (A)
6
3V
6
4
2.5 V
2
2V
25 °C
125 °C
4
2
1.5 V
0
0
0
1
2
3
4
5
0
0.5
VDS - Drain-to-Source Voltage (V)
1.0
2.0
2.5
3.0
3.5
4.0
VGS - Gate-to-Source Voltage (V)
Output Characteristics
Transfer Characteristics
450
0.6
0.5
360
VGS = 2.5 V
C - Capacitance (pF)
RDS(on) - On-Resistance (Ω)
1.5
0.4
0.3
VGS = 3.6 V
0.2
Ciss
270
180
Coss
VGS = 4.5 V
90
0.1
Crss
0
0
0
1
2
3
4
5
6
0
7
4
8
16
20
VDS - Drain-to-Source Voltage (V)
ID - Drain Current (A)
Capacitance
On-Resistance vs. Drain Current
4.5
1.8
VDS = 10 V
ID = 1.8 A
1.6
3.6
RDS(on) - On-Resistance
(Normalized)
VGS - Gate-to-Source Voltage (V)
12
2.7
1.8
VGS = 10 V
ID = 1.8 A
1.4
1.2
1.0
0.8
0.9
0.6
0
0
0.6
1.2
1.8
Qg - Total Gate Charge (nC)
Gate Charge
Document Number: 70979
S09-2276-Rev. B, 02-Nov-09
2.4
3.0
0.4
- 50
- 25
0
25
50
75
100
125
150
TJ - Junction Temperature (°C)
On-Resistance vs. Junction Temperature
www.vishay.com
3
Si3853DV
Vishay Siliconix
MOSFET TYPICAL CHARACTERISTICS TA = 25 °C, unless otherwise noted
0.6
10
ID = 1.8 A
RDS(on) - On-Resistance (Ω)
I S - Source Current (A)
0.5
TJ = 150 °C
1
TJ = 25 °C
ID = 1.2 A
0.4
0.3
0.2
0.1
0
0.1
0
0.3
0.6
0.9
1.2
0
1.5
2
3
4
5
VSD - Source-to-Drain Voltage (V)
VGS - Gate-to-Source Voltage (V)
Source-Drain Diode Forward Voltage
On-Resistance vs. Gate-to-Source Voltage
8
0.6
0.4
ID = 250 µA
6
0.2
Power (W)
VGS(th) Variance (V)
1
0.0
4
2
- 0.2
- 0.4
- 50
0
- 25
0
25
50
75
100
125
150
0.01
1
0.1
TJ - Temperature (°C)
10
30
Time (s)
Single Pulse Power, Junction-to-Ambient
Threshold Voltage
2
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
Notes:
0.2
PDM
0.1
0.1
t1
0.05
t2
1. Duty Cycle, D =
t1
t2
2. Per Unit Base = RthJA = 130 °C/W
0.02
3. TJM - TA = PDMZthJA(t)
4. Surface Mounted
Single Pulse
0.01
10-4
10-3
10-2
10-1
1
10
100
600
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Ambient
www.vishay.com
4
Document Number: 70979
S09-2276-Rev. B, 02-Nov-09
Si3853DV
Vishay Siliconix
MOSFET TYPICAL CHARACTERISTICS TA = 25 °C, unless otherwise noted
Normalized Effective Transient
Thermal Impedance
2
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10-4
10-3
10-2
10-1
1
10
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Foot
SCHOTTKY TYPICAL CHARACTERISTICS TA = 25 °C, unless otherwise noted
5
1
I F - Forward Current (A)
I R - Reverse Current (mA)
20
10
0.1
10 V
20 V
0.01
TJ = 150 °C
1
TJ = 25 °C
0.001
0.1
0.0001
0
25
50
75
100
125
0
150
0.2
0.4
0.6
0.8
1.0
VF - Forward Voltage Drop (V)
TJ - Junction Temperature (°C)
Forward Voltage Drop
Reverse Current vs. Junction Temperature
CT - Junction Capacitance (pF)
150
120
90
60
30
0
0
4
8
12
16
20
VKA - Reverse Voltage (V)
Capacitance
Document Number: 70979
S09-2276-Rev. B, 02-Nov-09
www.vishay.com
5
Si3853DV
Vishay Siliconix
SCHOTTKY TYPICAL CHARACTERISTICS TA = 25 °C, unless otherwise noted
2
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
Notes:
0.2
PDM
0.1
0.1
t1
0.05
t2
1. Duty Cycle, D =
t1
t2
2. Per Unit Base = RthJA = 140 °C/W
0.02
3. TJM - TA = PDMZthJA(t)
4. Surface Mounted
Single Pulse
0.01
10-4
10-3
10-2
10-1
1
100
10
600
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Ambient
Normalized Effective Transient
Thermal Impedance
2
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10-4
10-3
10-2
10-1
Square Wave Pulse Duration (s)
1
10
Normalized Thermal Transient Impedance, Junction-to-Foot
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see www.vishay.com/ppg?70979.
www.vishay.com
6
Document Number: 70979
S09-2276-Rev. B, 02-Nov-09
Legal Disclaimer Notice
www.vishay.com
Vishay
Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.
Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or
the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular
purpose, non-infringement and merchantability.
Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical
requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements
about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular
product with the properties described in the product specification is suitable for use in a particular application. Parameters
provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All
operating parameters, including typical parameters, must be validated for each customer application by the customer’s
technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase,
including but not limited to the warranty expressed therein.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
applications or for any other application in which the failure of the Vishay product could result in personal injury or death.
Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. Please
contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by
any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners.
Material Category Policy
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as RoHS-Compliant fulfill the
definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council
of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment
(EEE) - recast, unless otherwise specified as non-compliant.
Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that
all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU.
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Free
requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference
to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21
conform to JEDEC JS709A standards.
Revision: 02-Oct-12
1
Document Number: 91000