Application Note, V1.0, February. 2009 AN2008-05 2ED250E12-F_EVAL Evaluation Driver Board for 1200V PrimePACK™ IFAG IMM INP M Edition 2009-09-21 Published by Infineon Technologies AG 59568 Warstein, Germany © Infineon Technologies AG 2009. All Rights Reserved. LEGAL DISCLAIMER THE INFORMATION GIVEN IN THIS APPLICATION NOTE IS GIVEN AS A HINT FOR THE IMPLEMENTATION OF THE INFINEON TECHNOLOGIES COMPONENT ONLY AND SHALL NOT BE REGARDED AS ANY DESCRIPTION OR WARRANTY OF A CERTAIN FUNCTIONALITY, CONDITION OR QUALITY OF THE INFINEON TECHNOLOGIES COMPONENT. THE RECIPIENT OF THIS APPLICATION NOTE MUST VERIFY ANY FUNCTION DESCRIBED HEREIN IN THE REAL APPLICATION. INFINEON TECHNOLOGIES HEREBY DISCLAIMS ANY AND ALL WARRANTIES AND LIABILITIES OF ANY KIND (INCLUDING WITHOUT LIMITATION WARRANTIES OF NON-INFRINGEMENT OF INTELLECTUAL PROPERTY RIGHTS OF ANY THIRD PARTY) WITH RESPECT TO ANY AND ALL INFORMATION GIVEN IN THIS APPLICATION NOTE. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. AN2008-055 Evaluation Driver Board for 1200V PrimePACK™ AN2008-05 Revision History: Previous Version: Page 2008-05 none Subjects (major changes since last revision) V1.0 Author: Piotr Luniewski IFAG IMM INP M We Listen to Your Comments Any information within this document that you feel is wrong, unclear or missing at all? Your feedback will help us to continuously improve the quality of this document. Please send your proposal (including a reference to this document) to: [email protected] Application Note 3 V1.00, 2008-05 AN2008-05 Evaluation Driver Board for 1200V PrimePACK™ 1 Introduction.................................................................................................................................................... 5 2 Design features............................................................................................................................................. 6 2.1 2.2 2.3 2.4 Main features ................................................................................................................................... 6 Key data........................................................................................................................................... 6 Mechanical dimensions and mounting procedure ........................................................................... 7 Pin assignment ................................................................................................................................ 9 3 Application Note ......................................................................................................................................... 10 3.1 3.2 3.3 3.4 3.5 3.6 3.7 Functionality on board ................................................................................................................... 10 Power supply ................................................................................................................................. 10 Input / Output logic – control signals ............................................................................................. 11 Gate signal amplifier and gate resistors ........................................................................................ 11 VCE monitoring for short circuit detection ....................................................................................... 13 Active voltage clamping ................................................................................................................. 14 Maximum switching frequency ...................................................................................................... 14 4 Schematic and Layout of 2ED250E12-F ..................................................................................... 17 4.1 4.2 4.3 Schematic ...................................................................................................................................... 17 Assembly drawing.......................................................................................................................... 22 Bill of Material ................................................................................................................................ 27 5 How to order Evaluation Driver Boards ....................................................................................... 29 6 Errata .......................................................................................................................................... 29 Part number explanation: 2ED 250 E12 -F -F – Functional or Basic isolation 12 – For 1200 V applications Evaluation Board 250 – 25 A output driver peak current ED – EiceDRIVER™ 2 channel Driver Application Note 4 V1.00, 2008-05 AN2008-05 Evaluation Driver Board for 1200V PrimePACK™ 1 Introduction The 2ED250E12-F evaluation driver board shown in Fig. 1 was developed to support customers during their first design steps with the 1200V PrimePACK™ IGBT module. The evaluation driver board is a fully functional IGBT module driver where two 1ED020I12-F driver IC process control and feedback signals and provide galvanic insulation. An embedded isolated DC/DC converter supplies gate drive power to both IGBTs of a halbridge configuration. The 2ED250E12-F Evaluation driver boards are available from Infineon in small quantities. Functions and properties of these parts are described in the datasheet chapter of this document whereas the remaining paragraphs provide information intended to enable the customer to copy, modify and qualify the design for production according to his specific requirements. The design of the 2ED250E12-F was performed with respect to the environmental conditions described as design target in this document. The requirements for leadfree reflow soldering have been considered when components were selected. The design was tested as described in this documentation but not qualified regarding manufacturing and operation in the whole operating ambient temperature range or lifetime. The boards provided by Infineon are subjected to functional testing only. Due to their purpose evaluation boards are not subjected to the same procedures regarding Returned Material Analysis (RMA), Process Change Notification (PCN) and Product Discontinuation (PD) as regular products. See Legal Disclaimer and Warnings for further restrictions on Infineon warranty and liability. IFX order number: 32418 Figure 1 The 2ED250E12-F Evaluation Driver Board Application Note 5 V1.00, 2008-05 AN2008-05 Evaluation Driver Board for 1200V PrimePACK™ 2 Design features Electric features of the evaluation board and mechanical dimensions including interface connections are presented in following sections. 2.1 Main features The 2ED250E12-F Evaluation Driver Board offers the following features: • • • • • • • • • • • • • Dual channel IGBT driver utilising the 1ED020I12-F1 driver IC Electrically and mechanically suitable for PrimePACK™ modules 1200V family Integrated isolated DC/DC power supply Integrated protection against DC/DC power supply short circuit Under Voltage Lockout Positive logic with CMOS logic level (5V) for PWM and Fault signals. Can be converted to negative logic Separated fault output and ready signal for Top and Bottom IGBT Separated ground potential for DC/DC power supply and input logic Different gate resistor values for turning-on and -off are possible IGBTs are protected against temporary VCE overvoltages during turn-off (Active Clamping) Diodes for IGBT desaturation monitoring implemented (short circuit protection) All components, except DC/DC transformer, are surface mount devices (SMD) with lead free 260°C soldering profile PCB is designed to fulfil the requirements of IEC61800-5-1, pollution degree 2, overvoltage category III 2.2 Key data All values given in the table bellow are typical values, measured at TA = 25 °C. Table 3 General key data and characteristic values Parameter VDC – primary DC/DC voltage supply VDC+5V – logic power supply Control signals (PWM, Fault, RDY, RST) IDC – primary DC/DC current drawn (idle mode/max load) IDC+5V – current drawn by primary logic (idle mode)2 IG – max. peak output current PDC/DC – max. DC/DC output power (total) tpd(on), tpd(off) – propagation delay time tmd – minimum pulse suppression for turn-on and turn-off dmax – max. duty cycle VCES – max. collector – emitter voltage on IGBT Top – operating temperature (design target)3 VIORM – max. working insulation voltage4 Value +15 (±5%) +5 (±0.1V) 0/+5 22/250 16 ±25 3 <350 40 100 1200 -40…+85 500 1 The 1ED020I12-F datasheet available on the Infineon website www.infineon.com 2 Without external loads (no signals connected) 3 Max. ambient temperature strictly depends on load and cooling conditions. For detailed description see chapter 2.3 4 Values defined in datasheets: T60403-D4615-X054 (date: 21.03.2000) Application Note 6 Unit V V V mA mA A W ns ns % V °C VAC V1.00, 2008-05 AN2008-05 Evaluation Driver Board for 1200V PrimePACK™ 2.3 Mechanical dimensions and mounting procedure The 2ED250E12-F should be screwed to the PrimePACK™ auxiliary terminals according to AN2006-09. In that way necessary connections between evaluation driver board and module itself are done correctly (Figure 2). PCB outline and relevant dimensions needed for better system integration are shown in Figure 3. Figure 2 The 2ED250E12-F correctly mounted on PrimePACK™ module Application Note 7 V1.00, 2008-05 AN2008-05 Evaluation Driver Board for 1200V PrimePACK™ 131.5 mm TR 51 mm X 89 mm max. 17 mm Figure 3 max. 20 mm Dimensions of the 2ED250E12-F Evaluation Driver Board Application Note 8 V1.00, 2008-05 AN2008-05 Evaluation Driver Board for 1200V PrimePACK™ 2.4 Pin assignment After the evaluation driver board has been correctly mounted to the PrimePACK™ module all external electrical control signals should be applied to connector X1 as shown on Fig. 4 and listed in Table 2. +5V 15 B_IN+ 13 B_RDY 11 T/B_/RST 9 T_RDY 7 T_IN- 5 GND 3 GND 1 16 S_GND 14 Not Connected 12 B_IN- 10 B_/FLT 8 T_/FLT 6 T_IN+ 4 SUPPLY 2 SUPPLY X1 Figure 4 2ED250E12-F Evaluation Driver Board and external electrical connections (X1) Table 2 2ED250E12-F external electrical signals description Pin X1.1 X1.2 X1.3 X1.4 X1.5 X1.6 X1.7 X1.8 X1.9 X1.10 X1.11 X1.12 X1.13 X1.14 X1.15 X1.16 Label GND SUPPLY GND SUPPLY T_INT_IN+ T_RDY T_/FLT T/B_/RST B_/FLT B_RDY B_INB_IN+ NC +5V S_GND Function Primary ground for DC/DC converter supply voltage Primary voltage supply for DC/DC converter (+15V) Primary ground for DC/DC converter supply voltage Primary voltage supply for DC/DC converter /PWM input signal for high side IGBT transistor (negative logic) PWM input signal for high side IGBT transistor (positive logic) Output signal for ready status of the high side IGBT Output signal for desaturation protection of the high side IGBT Input for the Reset signal Output signal for desaturation protection of the low side IGBT Output signal for ready status of the low side IGBT /PWM input signal for low side IGBT transistor (negative logic) PWM input signal for low side IGBT transistor (positive logic) Not connected Primary voltage supply for input/output signals Primary ground of voltage supply input/output signals NOTE: The S_GND as signal ground is NOT connected internally to the GND witch is the DC/DC converter power supply ground! Application Note 9 V1.00, 2008-05 AN2008-05 Evaluation Driver Board for 1200V PrimePACK™ 3 Application Note 3.1 Functionality on board The 2ED250E12-F evaluation driver board supports only PrimePACK™ IGBT modules in 1200V class. For proper IGBT module operation the 1ED020I12-F IC driver has been complemented by additional components and functions: • Selectable gate resistors (after soldering) • Gate signal amplifier / emitter follower - booster • VCE monitoring for short circuit detection • Active voltage clamping • DC/DC isolated power supply The picture below (Figure 5) depicts the 2ED250E12-F with already mentioned functions and shows their physical location. Gate resistors (to be assembled) Low side IGBT driver X1 AC voltage diodes DC/DC supply Saturation diodes Figure 5 The 2ED250E12-F with marked functions 3.2 Power supply High side IGBT driver The 2ED250E12-F has an integrated DC/DC converter, which generates the required secondary isolated unsymmetrical supply voltage (+15V/-7V). High and low side IGBT driver voltages are independently generated by using one unipolar input voltage of 15V. Additionally, the power supply is protected against Application Note 10 V1.00, 2008-05 AN2008-05 Evaluation Driver Board for 1200V PrimePACK™ gate – emitter short circuit of the IGBTs. In case a DC/DC overcurrent is detected, the output voltage drops down, the IGBT is protected by Undervoltage lockout function and the fault is reported to the isolated input side. 3.3 Input / Output logic – control signals The Evaluation Driver Board is dedicated for a half-bridge PrimePACKTM IGBT configuration, therefore it is necessary to connect two separate PWM signals for high (T_INx) and low (B_INx) side IGBT. Deadtime generation has to be provided externally. Positive or negative logic for PWM signals can be selected by part assembly. By default the evaluation driver board has the logic inputs set up for positive logic. Information on parts assembly is given in Table 3 where Fig. 6 depicts schematic of input circuits. Remaining signals like RDY, /RST, /FLT as output signals have the same logic as the 1ED020I12-F driver IC and can’t be modified by assembly selection on the 2ED250E12-F evaluation driver board. Logic level translation or inversion has to be provided outside of the evaluation driver board if needed. Table 3 Assembly parts for negative or positive PWM logic selection Parts Assembly for positive logic (as delivered) no yes R64, R74 R62, R72 Assembly for negative logic yes no Not used terminals of X1 may be left unconnected. Figure 6 Schematic of the input circuit 3.4 Gate signal amplifier and gate resistors When an IGBT transistor switches -on and -off a high peak of gate current has to be provided by the driver. As the 1ED020i12-F has the maximum current capability of 2 A and the PrimePACK™ module requires a Application Note 11 V1.00, 2008-05 AN2008-05 Evaluation Driver Board for 1200V PrimePACK™ value much higher the implementation of a booster stage (emitter follower) was necessary. In this way a peak gate current exceeding 25 A can be supplied. The 2ED250E12-F evaluation driver board uses an unsymmetrical gate voltage. For turning on a positive value has +15 V is used, for turning off a voltage of -7 V is provided. The gate amplifier is located close by the gate terminals. Switching losses and switching times of an IGBT strongly depend on DC-link stray inductance (Ls) and driving conditions like gate resistor, gate drive voltage and parasitic inductance in the gate drive circuit5. As long as the di/dt given in the IGBT datasheet is not exceeded, Rg may be adjusted to achieve datasheet values of IGBT dynamic losses. The value for new gate resistor for turn off basically can be calculated using formula (1). RGoffnew = VM − VNR ⋅ ( RGoff + RG int ) − RG int VM − V N (1) where: VM – Miller plateau equal to 9.8 V for FF900R12IP4D @IC=900 A, Tj=25°C VN – negative deriver voltage as during characterization (-15V) VNR – reduced negative voltage (-7 V for 2ED250E12-F evaluation driver voltage) RGoff – external gate resistor value (as in datasheet) RGint – internal gate resistor value (as in datasheet) Example: Gate resistance calculation for FF900R12IP4D PrimePACK™ IGBT module using Formula 2. RGoffnew = ( 9 .8 + 7 ⋅ (1.6 + 1.2) − 1.2) Ω ≈ 0.7 Ω 9.8 + 15 (2) NOTE: Reducing the value of RGoff according to this formula mainly is done to avoid an increase in turn-off delay time. There is only little impact of driving conditions on turn-off losses. The new value for the turn-on gate resistor RGonnew is more difficult to determine and depends on the value of DC-link stray inductance Ls. The test setup using a FF900R12IP4D was measured to have a DC-link stray inductance of Ls=42 nH. The value of Ls has significant influence on the di/dt at turn-on and on turn-on losses. Keeping the same Ls is difficult, as every design is unique. The turn-on gate resistors value given in table 4 therefore is just a proposition and the choice of Rgonnew has to be practically evaluated in every design. Propositions of RGon and RGoff resistor values to be used together with 2ED250E12-F evaluation driver board are shown in Table 4. Table 4 External gate resistor proposition for 1200 V PrimePACK™ IGBT modules Module FF450R12IE4 FF600R12IE4 /IP4 FF900R12IE4 FF900R12IP4 / IP4D FF1400R12IP4 RGon [Ω] (datasheet value) 2.5 2.2 1.3 1.6 1 RGonnew [Ω] (new value) 0.92 0.91 0.49 0.7 0.42 RGoff [Ω] (datasheet value) 3.1 2.2 1.5 1.6 1 RGoffnew [Ω] (new value) 1.33 0.91 0.63 0.7 0.42 NOTE: The 2ED250E12-F evaluation driver is delivered without gate resistors soldered. In that way the PCB design is flexible and ready to be utilised with all PrimePACK™ modules in 1200 V class. Physical place for the gate resistors is shown in Fig. 5, where the value has to be splitted between resistors R1, R2, R3, R4, R5 for the high side IGBT and R21, R22, R23, R24, R25 for the low side IGBT. The scheme is shown in Figure 7. 5 4 This phenomenon is widely described in paper: ‘Unsymmetrical Gate Voltage Drive for High Power 1200V IGBT Modules Based on Coreless Transformer Technology Driver’ presented on EPE-PEMC 2008 conference. Paper available on www.infineon.com Application Note 12 V1.00, 2008-05 AN2008-05 Evaluation Driver Board for 1200V PrimePACK™ In many cases the new resistor values RGon and RGoff can be equal but as good practice the practical investigation should be started from higher gate resistor value. If testing with Rgon ≠ Rgoff is required a Schottky diode e.g. BYM13-40 may be soldered on one of the resistor footprints. 7a 7b Figure 7 Scheme schowing gate resistors connection where: high side IGBT - 7a, low side IGBT – 7b 3.5 VCE monitoring for short circuit detection If the IGBT conducts current several times higher than nominal current the VCE voltage desaturates (increases close to DC-link voltage level). This behaviour can be used for short circuit detection. Protection can be achieved by turning off the IGBT in this case. The short circuit duration time for Infineon high power IGBT modules must not exceed 10µs. During this time the short circuit should be detected and the IGBT switched off without exciding VCES. Figure 8 shows the FF900R12IP4 PrimePACK™ modules switching under short circuit. High dIC/dt during switching off creates large overvoltage spike which is limited by active voltage clamping. This function is described in detail in chapter 3.6. After the short circuit is detected and the IGBT is switched off, the event is reported to the input side of the driver – the /FLT signal falls close to 0V level. The fault signal is separated for high and low side IGBT. NOTE: After the Short circuit event the evaluation driver board has to be reseted by providing /RST signal at low state for time specified in 1ED020I12-F Driver IC datasheet. UGE VCE 150V/div UGE 150V/div 5V/div 5V/div IC 1kAV/div IC 1kAV/div 500ns/div 2µs/div 8a Figure 8 VCE 8b Switching behaviour of the FF900R12IP4 PrimePACK™ module under short circuit where hard short circuit (SC1) - 8a short circuit with inductance (SC2) – 8b Application Note 13 V1.00, 2008-05 AN2008-05 Evaluation Driver Board for 1200V PrimePACK™ 3.6 Active voltage clamping Active voltage clamping is a technique which keeps temporary VCE overvoltages below VCES when the IGBT turns off. In the classic approach a chain of TVS-diodes (Transient Voltage Suppressor) is connected between auxilliary collector and gate of an IGBT module. As soon as the VCE voltage exceeds the sum of the diode breadown voltages the diode current is shared between IGBT gate and the driver output. Due to increased gate-emitter voltage the transistor is operated in linear mode and the switching off process is interrupted. The dIC/dt slows down to a value which results with limited VCE overshoot. TVS diodes conduct high peak current during time periode in which VCE overvoltage is limited6. For a proper designed DC-bus and correctly selected IGBT module the VCE voltage should not be limited by active clamping for turn off events within the normal current range. The VCE voltage limitation should occure only occasionally e.g. during short circuit current switch off. Typical overvoltage protection is shown in Fig. 8a. Additional energy losses in this case should be considered. Furthermore it has to be considered, that active clamping as implemented here requires to limit the maximum DC-link voltage to 850 V. 3.7 Maximum switching frequency The IGBT switching frequency of the 2ED250E12-F is limited by the available DC/DC power and by PCB temperature. According to theory the power losses generated in gate resistors are a function of gate charge, voltage step at the driver output and switching frequency. The energy is dissipated mainly through the PCB and increases the temperature around the gate resistors. When the available power of the DC/DC converter (1.5W per IGBT) is not reached, the limiting factor for the IGBT’s switching frequency is the absolute maximum temperature for the FR4 material. The temperature limit is 105°C and shall not be exceeded. Generally the power losses generated in the external gate resistor can be calculated according to following formula (3): Ploss = PDC / DC = P ( REXT ) + P ( RINT ) = ∆Vout ⋅ f s ⋅ QG (3) where: Plos – power losses dissipated in gate rseistors, ∆Vout – voltage step at the driver output fs – switching frequency, QG – IGBT gate charge (for the given gate voltage range - ∆Vout) The losses are shared between the internal – P(RINT) and the external - P(REXT) gate resistors. Due to the PCB temperature criteria maximum switching frequency for a given ambient and baseplate temperature can be calculated using P(REXT) and thermal resistances. The simple PCB temperature model is shown in Fig. 9 and dissipated power in external gate resistors can be calculated by using Formula 4. RthB-G TBASE RthR-A TG 48 K/W 49,6 K/W TA Pdis Figure 9 6 Simple thermal model used for gate resistors temperature calculation. Detailed description of the Active Clamping system function available in AN2007-06 Application Note 14 V1.00, 2008-05 AN2008-05 Evaluation Driver Board for 1200V PrimePACK™ Pdis = TG − TBASE TG − TA + RthB −G RthG − A (4) where: Pdis – power dissipated in external gate resistors, TG – external gate resistors temperature, TBASE – IGBT baseplate temperature, TA – evaluation driver board ambient temperature RthB-G – thermal resistance which couples thermally the IGBT baseplate and external gate resistors RthG-A - thermal resistance which couples external gate resistors and ambient NOTE: Thermal resistances used in Formula 4 are unique for every PCB design. For the 2ED250E12-F Formula 4 can be converted to Formula 5 where FR4 material is used as PCB. Pdis = W (105°C − TBASE ) K 48 W K K (105°C − TA ) °C + °C K 49.6 W (5) Afterwards, the maximum IGBT switching frequency for evaluation driver board can be calculated using Formula (6) fs = Pdis ⋅ ( RG int + RGext ) ∆VGE ⋅ RGext ⋅ QG ⋅ k (6) where: RGint – Internal gate resistor value, RGext – external gate resistor value QG – IGBT gate charge, Datasheet value to be converted to -7/15V 7, k=1.2 – tolerance factor Finally, for the 2ED250E12-F evaluaton driver board Formula 6 can be converted to formula 7. Pdis ⋅ ( RINT + REXT ) fs = ⋅1000 kHz 22 ⋅ REXT ⋅ 0.7 ⋅ QG ⋅1.2 µC (7) Example: Maximum switching frequency for the 2ED250E12-F where TBASE=90°C and TA=70°C8 Step 1. Calculation of possible dissipated power losses in external gate resistors based on Formula (5) Pdis = 105 − 90 105 − 70 W+ W = 0.82W 48 49.6 (8) Step 2. Maximum switching frequency calculation for FF900R12IP4D IGBT using Fomula 7 where external gate resistor value are the new value taken from Table 4. fS = 0.82 ⋅ (1.2 + 0.7) ⋅ 1000 kHz = 18.8 kHz (9) 22 ⋅ 0.7 ⋅ 0.7 ⋅ 6.4 ⋅ 1.2 Step 3. Checking if power from DC/DC power supply is sufficient PDC / DC = ∆Vout ⋅ fs ⋅ 0.7 ⋅ QG ⋅ k = 22 ⋅ 0.0188 ⋅ 0.7 ⋅ 6.4 ⋅ 1.2W = 2.22W (10) 7 Due to changed negative gate emitter voltage in 2ED250E12-F evaluation driver board from -15V to -7V the IGBT gate charge given in datasheet has to be multiplied by factor 0.7 8 Baseplate and ambient temperatures given in calculation example are assumed to be typical for many applications Application Note 15 V1.00, 2008-05 AN2008-05 Evaluation Driver Board for 1200V PrimePACK™ Knowing that maximum power form DC/DC power supply is 1.5W per driver channel the maximum switching frequency calculated by formula 9 is too high. In this case the maximum IGBT switching frequency can be calculated using Formula 11. fs = PDC / DC 1 .5 = ⋅ 1000 kHz ≈ 12,7kHz ∆Vout ⋅ 0.7 ⋅ QG ⋅ k 22 ⋅ 0.7 ⋅ 6.4 ⋅ 1.2 By following above calculation example the switching frequency for every PrimePACK™ 1200V and the 2ED250E12-F can be calculated even for customised ambient and baseplate temperatures. Application Note 16 V1.00, 2008-05 AN2008-05 Evaluation Driver Board for 1200V PrimePACK™ 4 Schematic and Layout of 2ED250E12-F To meet the individual customer requirement and make the evaluation board simple starting point for further development or modification, all necessary technical data like schematic, layout and components are included in this chapter. 4.1 Schematic Figure 10 The 2ED250E12-F – top transistor Application Note 17 V1.00, 2008-05 AN2008-05 Evaluation Driver Board for 1200V PrimePACK™ Figure 11 The 2ED250E12-F – bottom transistor Figure 12 The 2ED250E12-F – main connectors Application Note 18 V1.00, 2008-05 AN2008-05 Evaluation Driver Board for 1200V PrimePACK™ Figure 13 The 2ED250E12-F – external connectors Figure 14 The 2ED250E12-F – high side IGBT driver Application Note 19 V1.00, 2008-05 AN2008-05 Evaluation Driver Board for 1200V PrimePACK™ Figure 15 The 2ED250E12-F – low side IGBT driver Figure 16 The 2ED250E12-F – DC/DC power supply Application Note 20 V1.00, 2008-05 AN2008-05 Evaluation Driver Board for 1200V PrimePACK™ Figure 17 The 2ED250E12-F – DC/DC voltage regulators Application Note 21 V1.00, 2008-05 AN2008-05 Evaluation Driver Board for 1200V PrimePACK™ 4.2 Assembly drawing Bill of material and detailed information about assembly separately for 2ED250E12-F are given in chapter 4.4. Figure 18 The 2ED250E12-F – assembly drawing Application Note 22 V1.00, 2008-05 AN2008-05 Evaluation Driver Board for 1200V PrimePACK™ Layout Figure 19 The 2ED250E12-F – Layer 1 (Top) Application Note 23 V1.00, 2008-05 AN2008-05 Evaluation Driver Board for 1200V PrimePACK™ Figure 20 The 2ED250E12-F – Layer 2 Application Note 24 V1.00, 2008-05 AN2008-05 Evaluation Driver Board for 1200V PrimePACK™ Figure 21 The 2ED250E12-F – Layer 3 Application Note 25 V1.00, 2008-05 AN2008-05 Evaluation Driver Board for 1200V PrimePACK™ Figure 22 The 2ED250E12-F – Layer 4 (Bottom) Application Note 26 V1.00, 2008-05 AN2008-05 Evaluation Driver Board for 1200V PrimePACK™ 4.3 Bill of Material The bill of material not only includes a part list, but also assembly notes. The tolerances for resistors should be less or equal ±1 %, for capacitors of the type C0G less or equal ±5 % and for capacitors of the type X7R less or equal ±10 %. Table 5 Bill of Material for 2ED250E12-F Evaluation Driver Board Type Value / Type Resistor variable Package size imperal 2512 Resistor 0R 0603 Resistor 0R 0402 Resistor 0R Resistor QTY 12 Name Part Recommended Manufacturer Assembly Special * no 2 R1, R2, R3, R4, R5, R6, R21, R22, R23, R24, R25, R26 R61T, R71B no special yes 2 R64, R74 (if negative input logic) no special no 0402 2 R62, R72 (if positive input logic) no special yes 0R15 0805 1 R84 no special yes Resistor 1R 1206 6 R12, R13, R14, R212, R213, R214 no special yes Resistor 10R 0603 6 R16, R17, R18, R216, R217, R218 no special yes Resistor 10R 1206 2 R19, R219 no special yes Resistor 15R 0603 2 R82, R83 no special yes Resistor 47R 0603 6 R9, R10, R11, R29, R210, R211 no special yes Resistor 330R 0402 2 R106B, R106T no special yes Resistor 470R 0402 2 R110B, R110T no special yes yes Resistor 1k 0603 2 R62T, R72B no special Resistor 1k5 0402 4 R60, R61, R70, R71 no special yes Resistor 2k2 0603 1 R85 no special yes yes Resistor 2k2 0805 2 R7, R27 no special Resistor 4k7 0402 4 R65, R66, R75, R77 no special yes Resistor 10k 0402 3 R50, R105B, R105T no special yes Resistor 10k 0603 6 R65T, R68, R69, R75B, R78, R79 no special yes Resistor 15k 0402 2 R109B, R109T no special yes Resistor 68k 0603 1 R81 no special yes Resistor 82k 0402 2 R108B, R108T no special yes Resistor 100k 0402 2 R103B, R103T no special yes Resistor 120k 0402 2 R104B, R104T no special yes Capacitor 100p/50V/COG 0402 6 C62, C72, C60, C70, C103B, C103T no special yes Capacitor 100p/50V/COG 0603 2 C81, C85 no special yes Capacitor 220p/50V/COG 0603 2 C62T, C72B no special yes Capacitor 100n/50V/X7R 0603 8 no special yes Capacitor 4µ7/25V/X7R 1206 37 C61T, C63, C64T, C71B, C73, C74B, C80, C89 C80B, C80T, C81B, C81T, C82, C82B, C82T, C84, C86, C87, C105B, C105T, C1, C2, C3, C4, C5, C6, C11, C12, C13, C14, C15, C16, C21, C22, C23, C24, C25, C26, C50, C211, C212, C213, C214, C215, C216 Murata yes Application Note 27 V1.00, 2008-05 AN2008-05 Evaluation Driver Board for 1200V PrimePACK™ Type Value / Type Semiconductor ZXTN2010Z Package size imperal SOT89 QTY Name Part Recommended Manufacturer 6 T1B, T1T, T2B, T2T, T3B, T3T Zetex yes Semiconductor ZXTP2012Z SOT89 6 T6B, T6T, T7B, T7T, T8B, T8T Zetex yes Semiconductor ES1B SMA 6 D1, D2, D3, D21, D22, D23 Vishay yes Semiconductor STTH112U SMB 2 D4, D24 STM Semiconductor SMCJ188A-E3 SMC 8 Semiconductor BAT165 SOD323 11 Semiconductor IR2085SPbF SO8 1 ZD1, ZD2, ZD3, ZD4, ZD21, ZD22, ZD23, Vishay ZD24 D5B, D5T, D6B, D6T, D80, D80B, D80T, Infineon D81B, D81T, D82B, D82T IC80 TI yes Semiconductor 1ED020I12-F 2 IC60, IC70 yes yes yes yes Semiconductor PMV45EN PG-DSO16 SOT23 2 T82, T83 Philips yes Semiconductor LP2951CM SOIC8 2 IC102B, IC102T National yes Semiconductor TPS72301DBV TG4 Tyco16POL SOT23-5 2 IC103B, IC103T TI yes 1 X1 yes 1 TR80 Tyco (8-188275-6) VAC 1 Size: 89x131.5x1.5mm; material:FR4; Layers - Cu : 4x35µm; Isolation: 3x0,5mm; flammability: UV94V0 Connector Transformer T60403-D4615X054 PCB Infineon Assembly yes *Pulse power rated types Application Note 28 V1.00, 2008-05 AN2008-05 Evaluation Driver Board for 1200V PrimePACK™ 5 How to order Evaluation Driver Boards Every Evaluation Driver Board has its own IFX order number and can be ordered via your Infineon Sales Partner. Information can also be found at the Infineons Web Page: www.infineon.com CAD-data for the board decribed here are available on request. The use of this data is subjected to the disclaimer given in this AN. Please contact: [email protected] IFX order number for 2ED250E12-F_EVAL: 32418 6 Errata Boards from early production lots of this board may be erroneously designated as 2ED250E17-F in the marking print. Application Note 29 V1.00, 2008-05 http://www.infineon.com Published by Infineon Technologies AG