Evaluation Driver Board for EconoDUAL ME3, ME4 and EconoPACK+ modules

Application Note AN 2008-02
V1.3 Feb. 2011
Evaluation Driver Boards for
EconoDUAL™3 and EconoPACK™+
modules
1.1
IFAG IMM INP M AE
N 2010-03
2009
Application Note AN 2008-02
V1.3 Feb. 2011
Driver Boards for EconoDUALTM 3 and EconoPACKTM +
Edition 2011-02-02
Published by
Infineon Technologies AG
59568 Warstein, Germany
© Infineon Technologies AG 2011.
All Rights Reserved.
Attention please!
THE INFORMATION GIVEN IN THIS APPLICATION NOTE IS GIVEN AS A HINT FOR THE
IMPLEMENTATION OF THE INFINEON TECHNOLOGIES COMPONENT ONLY AND SHALL NOT BE
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NOTE MUST VERIFY ANY FUNCTION DESCRIBED HEREIN IN THE REAL APPLICATION. INFINEON
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(INCLUDING WITHOUT LIMITATION WARRANTIES OF NON-INFRINGEMENT OF INTELLECTUAL
PROPERTY RIGHTS OF ANY THIRD PARTY) WITH RESPECT TO ANY AND ALL INFORMATION GIVEN
IN THIS APPLICATION NOTE.
Information
For further information on technology, delivery terms and conditions and prices please contact your nearest
Infineon Technologies Office (www.infineon.com).
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Due to technical requirements components may contain dangerous substances. For information on the types
in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components
may only be used in life-support devices or systems with the express written approval of Infineon
Technologies, if a failure of such components can reasonably be expected to cause the failure of that lifesupport device or system, or to affect the safety or effectiveness of that device or system. Life support
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persons may be endangered.
AN 2008-02
Revision History: date (11-02-02)
, V1.3
Previous Version: V1.2
Page: Subjects Improvement of the active gate clamping circuit
Authors: Alain Siani IFAG IMM INP M AE, Uwe Jansen IFAG IMM INP M AE
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help us to continuously improve the quality of this document. Please send your proposal (including a
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V1.3 Feb. 2011
Driver Boards for EconoDUALTM 3 and EconoPACKTM +
Table of contents
1.1
1
1
Introduction .......................................................................................................... 4
2
Design features.................................................................................................... 5
2.1
2.2
2.3
2.4
2.5
Main features................................................................................................................................... 5
Key data .......................................................................................................................................... 6
Pin assignment ................................................................................................................................ 7
Mechanical dimensions of the EconoDUAL™ 3 Driver Board ....................................................... 8
Mechanical dimensions of the EconoPACK™ + Driver Board........................................................ 8
3
Electrical Features ............................................................................................... 9
3.1
3.2
3.3
3.4
3.5
3.6
3.7
Power Supply .................................................................................................................................. 9
Input logic – PWM signals ............................................................................................................... 9
Maximum switching frequency ........................................................................................................ 9
Booster ..........................................................................................................................................11
Short circuit protection and active clamping .................................................................................11
Fault output ...................................................................................................................................12
Temperature measurement...........................................................................................................13
4
Switching losses ................................................................................................ 15
4.1
4.2
Turn-on losses...............................................................................................................................15
Turn-off losses...............................................................................................................................17
5
Schematic, Layout and Bill of Material - EconoDUAL™ 3 board ...................... 18
5.1
5.2
5.3
5.4
5.5
Schematic......................................................................................................................................18
Assembly drawing .........................................................................................................................20
Layout ............................................................................................................................................21
Bill of Material ................................................................................................................................22
Gate resistor list ............................................................................................................................24
6
Schematic, Layout and Bill of Material - EconoPACK™ + board ....................... 25
6.1
6.2
6.3
6.4
6.5
Schematic......................................................................................................................................25
Assembly drawing .........................................................................................................................27
Layout ............................................................................................................................................28
Bill of material ................................................................................................................................30
Gate resistor list ............................................................................................................................33
7
How to order Evaluation Driver Boards .............................................................. 33
8
References ........................................................................................................ 33
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Application Note AN 2008-02
V1.3 Feb. 2011
Driver Boards for EconoDUALTM 3 and EconoPACKTM +
1 Introduction
The Evaluation Driver Board 2ED100E12-F2 for EconoDUAL™ 3 modules as can be seen in Figure 1 and
the Evaluation Driver Board 6ED100E12-F2 for EconoPACK™ + modules, shown in Figure 2, were
developed to support customers during their first steps designing applications with these modules. The basic
version of each board is available from Infineon in small quantities. The properties of these parts are
described in the following chapters of this document whereas the remaining paragraphs provide information
intended to enable the customer to copy, modify and qualify the design for production, according to his
specific requirements.
The design of the 2ED100E12-F2 and the 6ED100E12-F2 was performed with respect to the environmental
conditions described as design target in this document. The requirements for lead-free reflow soldering have
been considered when components were selected. The design was tested as described in this
documentation but not qualified regarding manufacturing and operation in the whole operating ambient
temperature range or lifetime.
The boards provided by Infineon are subjected to functional testing only.
Due to their purpose Evaluation Boards are not subjected to the same procedures regarding Returned
Material Analysis (RMA), Process Change Notification (PCN) and Product Discontinuation (PD) as regular
products.
See Legal Disclaimer and Warnings for further restrictions on Infineon’s warranty and liability.
Figure 1
The 2ED100E12-F2 Evaluation Driver
Board mounted on the top of the
EconoDUAL™ 3 module
Figure 2
4
The 6ED100E12-F2 Evaluation
Driver Board mounted on the
top of the EconoPACK™ +
module
N 2010-03
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Application Note AN 2008-02
V1.3 Feb. 2011
Driver Boards for EconoDUALTM 3 and EconoPACKTM +
2 Design features
The following sections provide an overview of the boards including main features, key data, pin assignments
and mechanical dimensions.
2.1
Main features
The 2ED100E12-F2 and the 6ED100E12-F2 Evaluation Driver Board offer the following features:










Dual channel IGBT driver in 2ED100E12-F2 version, adapted for use with IGBT4
Six channel IGBT driver in 6ED100E12-F2 version
Electrically and mechanically suitable for 600 V and 1200 V EconoDUAL™ 3 or EconoPACK™ + IGBT
modules
Includes DC/DC power supply with short circuit protection
Isolated temperature measurement
Short circuit protection with toff < 6 µs
Under Voltage Lockout of IGBT driver IC
Positive logic with 5 V CMOS level for PWM and fault signals
One fault output signal for each leg
PCB is designed to fulfill the requirements of IEC61800-5-1, pollution degree 2, overvoltage category II
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Driver Boards for EconoDUALTM 3 and EconoPACKTM +
2.2
Key data
All values given in the table below are typical values, measured at TA = 25 °C
Table 1
Key data and characteristic values (typical values)
Parameter
Value
Unit
VDC
primary DC/DC voltage supply
+15 ±0.5
V
VCC
primary supply voltage for logic devices
+5 ±0.5
V
VLogicIN
PWM signals for high side and low side IGBT
0 / +5
V
VFAULT
/FAULT detection output
0 / +5
V
IFAULT
max. /FAULT detection output load current
VRST
/RST input
IDC
primary DC/DC current drawn per leg
ICC
Vout
primary current drawn for logic devices per leg
drive voltage level for high side and Low side channel
IG
max. peak output current
PDC/DC
max. DC/DC output power high and low side
1)
10
mA
0 / +5
V
40
mA
25
+16 / -8
mA
V
±10
A
3
W
100
kHz
fS
max. PWM signal frequency for high and low side
tPDELAY
propagation delay time
200
ns
tPDISTO
input to output propagation distortion
15
ns
VDesat
Desaturation reference level
9
V
dmax
max. duty cycle
100
%
VCES
max. collector – emitter voltage on IGBT
600/1200
V
VTEMP
temperature measurement output voltage
digital 0/5
V
ITEMP
max. temperature measurement load current
5
mA
-40…+85
°C
2)
Top
operating temperature design target
Tsto
storage temperature design target
Uis,eff
Isolation voltage
VIORM
Maximum Repetitive Insulation Voltage
VIORM
1)
2)
3)
4)
5)
3)
Transformer Vacuumschmelze
Max. working insulation voltage
5)
4)
1ED020I12-F Driver IC
AD7400 Sigma-Delta Converter
-40…+85
°C
500
VAC
1420
Vpeak
891
Vpeak
The maximum switching frequency for every EconoDUAL™ 3 or EconoPACK™ + module type should be calculated
separately. Limitation factors are: max. DC/DC output power of 1.5 W per channel and max. PCB board temperature
measured around gate resistors of 105 °C for used FR4 material. For detailed information see chapter 2.3
Maximum operating temperature strictly depends on load and cooling conditions. For detailed description see chapter 2.3
Values defined in datasheets: T60403-D4615-X054 date: 21.03.2000
1ED020I12-F Datasheet, Version 2.2, December 2009
AD7400 1/11 – Revision C
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Application Note AN 2008-02
V1.3 Feb. 2011
Driver Boards for EconoDUALTM 3 and EconoPACKTM +
2.3
Pin assignment
Except pin 14 of the connectors X1 and X2 of EconoPACK™ + driver board, all connectors for both
EconoDUAL™ 3 and EconoPACK™ + board are configured as listed in Table 2.
Table 2 depicts the pin assignment of connector X3 shown in Figure 3.
Table 2
Inputs and outputs of 6ED100E12-F2 for connector X3
Pin
Label
Function
X3.1
MClock
Clock out for temperature measurement
X3.2
Supply
+15 V Primary voltage for DC/DC converter
X3.3
GND
Primary ground for DC/DC converter supply voltage
X3.4
Supply
+15 V Primary voltage for DC/DC converter
X3.5
TOP IN-
PWM signal for high side IGBT, negative logic
X3.6
TOP IN+
PWM signal for high side IGBT, positive logic
X3.7
TOP RDY
Ready signal for high side IGBT
X3.8
TOP /FLT
Fault detection output high side IGBT
X3.9
TOP/BOT /RST
Reset signal for high and low side IGBT -Driver
X3.10
BOT /FLT
Fault detection output low side IGBT
X3.11
BOT RDY
Ready signal for low side IGBT
X3.12
BOT IN-
PWM signal for low side IGBT, negative logic
X3.13
BOT IN+
PWM signal for low side IGBT, positive logic
X3.14
TEMP-Digital
Sigma / Delta signal for temperature measurement
X3.15
+5V
+5 V Voltage supply for logic devices
X3.16
Signal GND
Primary ground logic devices
Figure 3
The 6ED100E12-F2 Evaluation Driver Board connector layout of X3
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V1.3 Feb. 2011
Driver Boards for EconoDUALTM 3 and EconoPACKTM +
2.4
Mechanical dimensions of the EconoDUAL™ 3 Driver Board
Figure 4
2.5
Dimensions of the 2ED100E12-F2 Driver Board
Mechanical dimensions of the EconoPACK™ + Driver Board
Figure 5
Dimensions of the 6ED100E12-F2 Driver Board
Both Driver Boards should be fastened by self taping screws and soldered to the auxiliary connectors on top
of the IGBT module.
Clearance and creepage distances for EconoDUAL™ 3 and EconoPACK™ + Driver Boards:
Primary/Secondary is not less than 8 mm and Secondary/Secondary is not less than 4 mm.
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Driver Boards for EconoDUALTM 3 and EconoPACKTM +
3 Electrical Features
The following chapter describes the board´s operation in the evaluation setup. Please note that the following
paragraphs describe the circuits of the 2ED100E12-F2 which has been modified compared to the last
revision of this AN to drive IGBT4 modules and to reduce the susceptibility to erroneous triggering of the
Vcesat-detection. The same changes also are applied to the 6ED100E12-12-F2, but layout and part list of this
board as provided in chapter 7 still represent the initial design.
3.1
Power Supply
The 2ED100E12-F2 and the 6ED100E12-F2 have an integrated DC/DC converter for each leg, which
generates the required secondary isolated unsymmetrical supply voltage of +16 V / -8 V. High and Low side
driver voltages are independently generated by using one unipolar input voltage of 15 V. Additionally, the
power supply is protected against gate – emitter short circuit of the IGBTs. In case of DC/DC converter
overload, the output voltage drops. The Under Voltage Lock Out function ensures gate driver operation only
to take place within specified IC supply voltages range. The fault is reported to the driver’s primary side.
3.2
Input logic – PWM signals
The Evaluation Driver Boards are dedicated to solderable IGBT modules. It is necessary to connect two
TM
separate PWM signals for EconoDUAL 3 IGBT modules and six separate PWM signals in case of
TM
EconoPACK + IGBT modules. An individual signal for each IGBT channel is necessary. Parts of the
schematic for a single driver are depicted in Figure 6. The signals dedicated to High- and Low-Side need to
have the correct dead time. Both Evaluation Driver Boards do not provide dead time generation. For
suggested gate resistor values according to Table 5 on page 24, the recommended minimum dead time tTD
is 1µs. If larger gate resistors are used please refer to [1].
Figure 6
Schematic detail of the input circuit for a single driver.
The schematic in Figure 6 shows parts of the driver circuit with positive logic. IN+ is used as signal input
whereas IN- is used as enable signal. Therefore a +5 V signal on the IN+ input pin and a GND signal on the
IN- input pin is necessary to turning-on the IGBT. To operate the whole circuit with negative logic the
capacitors C1 and C2 on the input pins have to be swapped. Otherwise this would cause an additional delay.
IN+ will then operate as an enable signal.
3.3
Maximum switching frequency
The switching frequency of an IGBT is limited either by the maximaum output power of the driver voltage
supply or by the maximum temperature of the PCB due to the power losses in the external gate resistors.
These power losses in the gate resistors depend on the IGBT gate charge, gate voltage magnitude and on
the switching frequency of the IGBT. Due to the power losses in the external gate resistors, heat will be
generated, which leads to an increase of the PCB temperature in the neighborhood of these resistors. This
temperature must not be higher than the maximum temperature of the PCB, i.e. 105°C for a standard FR4
material.
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The calculation of the power losses in the gate resistors can be done by utilizing Equation 1:
Pdis  P( REXT )  P( RINT )  Vout  f s  QG
(1)
where:
Pdis
= dissipated power
P(REXT) = dissipated power external gate resistors
P(RINT) = dissipated power internal gate resistor
ΔVout = voltage step at the driver output
fs
= switching frequency
QG
= IGBT gate charge for the given gate voltage range
The complete gate resistor consists of the internal gate resistor together with an external gate resistor and
due to that, a part of the IGBT drive power losses will be dissipated directly in the PCB, whereas the other
part of the losses will be dissipated externally to the ambient air. The ratio of the losses dissipated internally
P(RINT) and externally P(REXT) corresponds directly to the ratio of the mentioned RINT and REXT resistors.
Corresponding to -8/+16V operation the datasheet value of Qge needs to be reduced by 20%.
Due to the PCB temperature criteria the power dissipated in external gate resistors P(REXT) has to be
considered for the thermal design.
Based on experimentally determined board temperatures the following thermal resistances of the Evaluation
Boards have been calculated as shown in Figure 7.
Thermal resistance, gate resistors to PCB:
RthRG-PCB = 45 K/W
Thermal resistance, gate resistors to ambient:
RthRG-Amb = 39 K/W
Using these values, it is possible to determine the maximum board temperature, if the power losses of the
external gate resistors, the maximum ambient temperature and the maximum PCB temperature are known:
TG  TAmb 
RthRG PCB  (TPCB  TAmb )
R
R
 P( REXT )  thRG Amb thRG PCB
RthRG Amb  RthRG PCB
RthRG Amb  RthRG PCB
TAmb : Ambient temperature
TPCB : Board PCB temperature
TG : PCB Temperature near the external gate resistors
Figure 7
Thermal model of the Gate resistor.
.
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Driver Boards for EconoDUALTM 3 and EconoPACKTM +
3.4
Booster
Figure 8 shows the output stage of the driver where two complementary pairs of transistors are used to
amplify the driver IC’s signal. This allows driving IGBTs that need more current than the driver IC can deliver.
Two NPN transistors are used for turning-on the IGBT and two PNP transistors for turning-off the IGBT.
The transistors are dimensioned to provide enough peak current to drive all 600 V and 1200 V
EconoDUAL™ 3 and EconoPACK™ + modules. The peak current can be calculated according to
Formula (2):
I peak 
RINT
Vout
 REXT  RDriver
Figure 8
(2)
Driver output stage with booster
Gate resistors are connected in between booster stage and IGBT module gate connection. Suggested
values are listed in table 5 on page 25 and table 7 on page 36. For some modules the value for these
resistors is 0 . In this case just a jumper is required. If resistors are needed, care should be taken that
these resistors have a suitable rating for repetitive pulse power to avoid degradation.
3.5
Short circuit protection and active clamping
The short circuit protection of the Evaluation Driver Board basically relies on the detection of a voltage level
higher than 9 V on the DESAT pin of the 1ED020I12-F driver IC and the implemented active clamp function.
Thanks to this operation mode, the collector-emitter overvoltage, which is a result of the stray inductance
and the collector current slope, is limited.
The overvoltage shoots during turning-off changes as a function of the stray inductance, the current and the
DC voltage. Figure 9 shows the parts of the circuit needed for the desaturation function and the active
TM
clamping. The EconoDUAL 3 driver board is equipped with an additional diode D1 to avoid a bypass
current during the turning-on sequence.
Figure 9
Desaturation detection and active clamping
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V1.3 Feb. 2011
Driver Boards for EconoDUALTM 3 and EconoPACKTM +
Active clamping is a technique which keeps transient overvoltages below the critical limits when the IGBT
turns-off. The standard approach to active clamping is to use a chain of avalanche diodes connected
between the auxiliary collector and the gate of an IGBT module. When the Collector-Emitter voltage exceeds
the diodes breakdown voltage the diodes current sums up with the current from the driver output. Due to the
now increased gate-emitter voltage the transistor is held in an active mode and the turning-off process is
prolonged. The dIC/dt slows down which results in a limited voltage overshoot. Avalanche diodes conduct
high peak currents during the time period in which the clamping is actively limiting the overvoltage.
A typical turn-off waveform under short circuit condition of a FF600R12ME4 module at room temperature
without any overvoltage limiting function is shown in Figure 10a. Under short circuit condition at room
temperature with active clamp function a typical waveform is shown in Figure 10b.
a)
b)
Figure 10
3.6
a) Short circuit without active clamping b) with active clamping function
Fault output
When a short circuit occurs, the voltage increase across the IGBT is detected by the desaturation protection
of the 1ED020I12-F and the IGBT is turning-off. The fault is reported to the primary side of the driver as a
low active signal. A red LED is turning-on to signalize the failure condition. The /FLT status remains active as
long as there is no reset signal applied to the driver. The /FLT signal is active low, the according schematic
can be seen in Figure 11.
Figure 11
Fault output for a single driver
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Driver Boards for EconoDUALTM 3 and EconoPACKTM +
3.7
Temperature measurement
Based on the NTC built into both module types, the driver boards offer IGBT base plate temperature
measurement in the range of -40 °C…150 °C. Both Evaluation Driver Boards work with a Sigma/Delta
converter. Thus a digital signal is provided featuring the advantage that digital signal processing can be used
without particular hardware efforts and that the subsequent error is low. However an analog signal can be
produced with the use of the schematic in Figure 12.
Figure 12
Table 3
Schematic to convert digital Σ/Δ to analog output
Bill of Material Σ/Δ to analog converter
Package size
Type
Qty
Value / Device
Recommended
Part Name
imperial
Manufacturer
Capacitor
1
100n/50V/X7R
C0603
C1
Capacitor
1
1n/50V/C0G
C0603
C2
Capacitor
1
10n/50V/X7R
C0603
C3
Capacitor
1
100p/50V/C0G
C0603
C4
Analog
Amplifier
1
AD8542ARZ
SOIC08
IC1
Resistor
2
39k
R0603
R1, R5
Resistor
2
100k
R0603
R2, R6
Resistor
2
22k
R0603
R3, R4
Resistor
1
10R
R0603
R7
Devices
All electronic parts used in the design are lead-free with 260 °C soldering profile. The tolerances for resistors
should be less or equal to ±1 %, for capacitors of the type C0G less or equal to ±5 % and for capacitors of
the type X7R less or equal to ±10 %.
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Driver Boards for EconoDUALTM 3 and EconoPACKTM +
Using the base plate temperature and a thermal model, the junction temperature can be estimated. The
complexity of the thermal model needed for this purpose depends on application and heat sink conditions as
well as on requirements regarding accuracy and dynamic response. In case of a broken wire the output
shuts down to 0 V. The relation between output voltage and base plate temperature is shown in Figure 13.
Temperature Measurement V TEMP=f(TJ)
6
5
VTEMP [V]
4
3
2
1
0
-50
-30
-10
10
30
50
70
90
110
130
150
TJ [°C]
Figure 13
Characteristics of the temperature measurement
Note: This temperature measurement is not suitable for short circuit detection or short term overload but
may be used to protect the module from long term overload conditions or malfunction of the cooling system.
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Driver Boards for EconoDUALTM 3 and EconoPACKTM +
4 Switching losses
The setup used for preparing this application note varies from the setup used to characterize the devices in
three aspects
1. DC-link inductance:
The DC-link inductance of the setup used for these test has a value of approximately 35 nH for all
modules investigated here in contrast to varying values between 35 nH to 80 nH used for device
characterization; see device datasheets for details. For a detailed discussion on the impact of DClink inductance on switching losses please refer to [2].
2. Gate voltage:
This Evaluation Board provides a gate voltage of -8 V for turning-off and 16 V for turning-on whereas
characterization is done with a driver providing +/- 15 V of gate voltage.
3. Gate driver output impedance:
According to IEC 60747-9 for characterization of an IGBT the driver used should resemble an ideal
voltage source as far as possible. For the Evaluation Board a driver output stage has been chosen
that considers board space as well as cost constraints. Therefore it cannot provide close to zero
output impedance.
All aspects discussed above have an impact on the switching speed of the module and hence also on the
switching losses. Gate resistor values have been chosen so that di/dt at turn-on is comparable to
characterization conditions. Nevertheless small deviations in the turn-on losses persist.
4.1
Turn-on losses
The turn-on losses are expected to correspond to the datasheet values of the modules. As an example the
measured turn-on losses for an EconoDUAL™ 3 FF450R12ME3 are shown in Figure 14.
FF450R12ME3 Sw itching losses, Eon= f(Uce,Ic)
160
140
Eon @ Tj = 25°C
Losses Eon [mJ]
120
400V
Eon @ Tj = 125°C
500V
600V
100
700V
800V
80
400V
500V
60
600V
700V
40
800V
20
0
0
100
200
300
400
500
600
700
800
900
1000
Current [A]
Figure 14
Turn-on losses of a FF450R12ME3 measured using the 2ED100E12-F2
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Driver Boards for EconoDUALTM 3 and EconoPACKTM +
The 2ED100E12-F2 is designed to also work on IGBT4-modules as well. Figure 15 depicts the turn-on
losses of a FF450R12ME4 module as an example.
FF450R12ME4 Sw itching losses, Eon= f(Uce,Ic)
160
Eon @ Tj = 25°C
400V
Eon @ Tj = 125°C
500V
600V
140
Eon @ Tj = 150°C
700V
Losses Eon [mJ]
120
800
400V
100
500V
600V
80
700V
800V
60
400V
500V
40
600V
700V
20
800V
0
0
100
200
300
400
500
600
700
800
900
1000
Current [A]
Figure 15
Turn-on losses of a FF450R12ME4 measured using the 2ED100E12-F2
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Driver Boards for EconoDUALTM 3 and EconoPACKTM +
4.2
Turn-off losses
In general the turn-off losses linearly increase with the DC-Link voltage. The following Figure 16 and Figure
17 confirm these characteristics and show the dependencies of the measured turning-off losses vs. the DClink voltage and the current.
FF450R12ME3 Sw itching losses, Eoff= f(Uce,Ic)
160
140
Eoff @ Tj = 25°C
Eoff @ Tj = 125°C
Losses Eoff [mJ]
120
400V
500V
600V
100
700V
800V
80
400V
500V
60
600V
700V
40
800V
20
0
0
100
200
300
400
500
600
700
800
900
1000
Current [A]
a)
Figure 16
Turn-off losses with FF450R12ME3 module
FF450R12ME4 Sw itching losses, Eoff= f(Uce,Ic)
140
Eoff @ Tj = 25°C
400V
500V
Eoff @ Tj = 125°C
120
600V
Eoff @ Tj = 150°C
700V
Losses Eoff [mJ]
100
800V
400V
500V
80
600V
700V
60
800V
400V
40
500V
600V
20
800V
700V
0
0
100
200
300
400
500
600
700
800
900
1000
Current [A]
b)
Figure 17
Turn-off losses with FF450R12ME4 module
All losses are measured according to the IEC 60747-9 standard.
17
N 2010-03
2009
Application Note AN 2008-02
V1.3 Feb. 2011
Driver Boards for EconoDUALTM 3 and EconoPACKTM +
5 Schematic, Layout and Bill of Material - EconoDUAL™ 3 board
Both driver boards were made by keeping the following rules for the copper thickness and the space
between different layers as shown in Figure 18.
Layers:
Copper
Isolation
1: 35 µm
1-2: 0.5 mm
2: 35 µm
2-3: 0.5 mm
3: 35 µm
3-4: 0.5 mm
4: 35 µm
Figure 18
5.1
Copper and isolation used
Schematic
To meet the individual customer requirements and make the Evaluation Driver Board for the EconoDUAL™
3 module simple for development or modification, all necessary technical data like schematic, layout and
components are included in this chapter.
Figure 19
High side IGBT driver
Figure 20
Low side IGBT driver
18
N 2010-03
2009
Application Note AN 2008-02
V1.3 Feb. 2011
Driver Boards for EconoDUALTM 3 and EconoPACKTM +
Figure 21
High and Low side IGBT driver output
Figure 22
Temperature measurement
Figure 23
DC/DC converter
19
N 2010-03
2009
Application Note AN 2008-02
V1.3 Feb. 2011
Figure 24
5.2
External connector
Assembly drawing
Figure 25
Assembly drawing of the EconoDUAL™ 3 driver board
20
N 2010-03
2009
Application Note AN 2008-02
V1.3 Feb. 2011
Driver Boards for EconoDUALTM 3 and EconoPACKTM +
5.3
Layout
a)
b)
Figure 26
EconoDUAL™ 3 IGBT driver – a) Top layer and b) Layer 2
a)
b)
Figure 27
EconoDUAL™ 3 IGBT driver – a) Layer 3 and b) Bottom layer
21
N 2010-03
2009
Application Note AN 2008-02
V1.3 Feb. 2011
Driver Boards for EconoDUALTM 3 and EconoPACKTM +
5.4
Bill of Material
The bill of material includes a part list as well as assembly notes. The external gate resistors are not
assembled, a list for the resistor values is presented in chapter 6.5.
The tolerances for resistors should be less or equal to ±1 %, for capacitors of the type C0G less or equal to
±5 % and for capacitors of the type X7R less or equal to ±10 %.
Table 4
Bill of Material for EconoDUAL™ 3 Driver Board
Package
Type
Qty
Value / Device
size
Recommended
Assem-
Manufacturer
bled
Part Name
Description
imperial
Capacitor
4
100p/50V/C0G
C0603
C1,C4,C10,C12
Capacitor
9
100n/50V/X7R
C0603
Capacitor
2
.../50V/C0G
C0603
C1C,C2C
Capacitor
2
470p/50V/X7R
C0603
C1R,C2R
Capacitor
5
10n/50V/X7R
C0603
C2, C5, C15T, C16T, C17T
C1B, C1T, C4B, C4T,
C3, C6, C8, C13, C18T
no
C2B, C2T, C3B,
C3T,C5B,C5T, C6B,
C6T,C9B, C9T, C10B, C10T,
Capacitor
19
4µ7/25V/X7R
C-EUC1206
Murata
C11B, C11T, C14T, C7, C14,
C15,
C16
Capacitor
2
220p/50V/C0G
C0603
C7B,C7T
Capacitor
2
33p/50V/C0G
C0603
C8B,C8T
Capacitor
3
1µ/25V/X7R
C0805
C11,C12T,C13T
Capacitor
2
optional/50V/C0G
C0603
CGE1,CGE2
Connector
1
TYCO16POL
TYCO16POL
X1
Diode
2
STTH112U
SOD6
D5B,D5T
Diode
4
ES1D
DO214AC
D6,D7,D8,D9
Diode
2
ZLLS1000
SOT23
D7B,D7T
Driver IC
2
1ED020I12-F
P-DSO-16
IC1,IC2
Half-Bridge
TYCO
no
Infineon
International
1
IR2085SPBF
SO08
IC3
Driver IC
Schottky Diode
no
Rectifier
2
BAT165
SOD323R
DB,DT
1
AD7400YRWZ
P-DSO-16
IC5
Infineon
no
Isolated SigmaDelta Modulator
CHIPLED
2
LED1, LED2
LED0805
Resistor
4
27R
R0603
BB, BT, BB1, BT3
Resistor
4
10R
R0603
BT2,R1L,R2L,R2L1
Resistor
4
100R
R0402
R1,R2,R7,R8
no
Vishay /
Resistor
4
12R
R0805
R1B,R1T,R1B2,R1T2
CRCW080512R
0FKEAHP
22
Pulsresistor
N 2010-03
2009
Application Note AN 2008-02
V1.3 Feb. 2011
Driver Boards for EconoDUALTM 3 and EconoPACKTM +
Package
Type
Qty
Value / Device
size
Recommended
Assem-
Manufacturer
bled
Part Name
Description
imperial
Resistor
2
220R
R0805
R1B1,R1T1
no
Resistor
5
0R
R0603
R1C,R1C1,R2C,R2C1,R8T
no
Resistor
2
0R
R0402
R_FR1,R_FR2
Resistor
2
1k
R0603
R2B,R2T
Resistor
5
4k7
R0402
R3,R4,R9,R10,R_R
Resistor
2
4R7
R0603
R20,R21
Resistor
4
10k
R0402
R6,R12,R22,R23
Resistor
2
39R
R0805
R5,R11
Resistor
8
variable
R2010
R4B, R4T, R5B, R5T,
TT electronics
no
R6B, R6T, R7B, R7T
Resistor
1
1k2
R0603
R9T
Resistor
1
820R
R0603
R10T
Resistor
3
2k2
R0603
R11T,R13T,R17
Resistor
1
270R
R0603
R12T
Resistor
2
10R
R1206
R13,R19
Resistor
2
15R
R0603
R15,R16
Resistor
1
68k
R0603
R14
Resistor
1
0R15
R0805
R18
Resistor
1
39k
R0603
R25
SOT23-5
IC4
SN74LVC1G17D
Schmitt-Trigger
1
BVR
D2B,D2R,D2T,D3,
D3B,D3T,D4,D4B,
Schottky Diode
17
BAT165
SOD323R
D4T,D5,D10,D11,
Infineon
D12,D13,D1,
D1R,D2
Shunt Regulator
1
TLV431BIDCKT
SC70-6L
T60403-D4615-
D4615-
IC7
Transformer
1
X054
X054
Transistor
2
BC856
SOT23
T1,T2
Infineon
Transistor
4
ZXTN2010Z
SOT89
T1B, T1B1, T1T, T1T1
Diodes
Transistor
4
ZXTP2012Z
SOT89
T2B, T2B1, T2T, T2T1
Diodes
TrenchMOS
2
PMV45EN
SOT23
T3,T4
philips
2
P6SMB440A
SMB
D1.1C,D2.1C
Vishay
2
P6SMB510A
SMB
D2.1C,D2.2C
Vishay
D1.1B, D1.1T,
On
4
MM3Z5V6T1G
SOD323-R
D1.2B, D1.2T
Semiconductor
VacuumTR
schmelze
1
Unipolar TVS
Diode
Unipolar TVS
Diode
Zener diode
no
Voltage regulator
1
ZMR500FTA
SOT23
IC6
Zener diode
2
BZX84-C11
SOT23
ZB,ZT
23
no
Pulsresistor
N 2010-03
2009
Application Note AN 2008-02
V1.3 Feb. 2011
Driver Boards for EconoDUALTM 3 and EconoPACKTM +
5.5
Gate resistor list
Table 5
External gate resistors RGext, all packages are 2010 types
Module
RGon []
RGoff []
R4T, R4B, R6T,
R6B []
R5T, R5B, R7T,
R7B []
Assembled
FF150R12ME3G
5.6
3,7
7,5
3,7
no
FF150R12MS4
5.1
3,2
6,2
4
no
FF225R12MS4
3
1,5
3
3
no
FF225R12ME3
1.5
0
0
3
no
FF225R12ME4
0
0
0
0
no
FF300R12ME3
1.1
0
0
2,2
no
FF300R12ME4
0
0
0
0
no
FF300R12MS4
1.5
0,5
1
2
No
FF450R12ME3
1
0,25
0,5
1,5
no
FF450R12ME4
1
0
0
2
no
FF600R06ME3
2.0
1,25
2,5
1,5
No
FF600R12ME4
1.5
0,6
2,5
1,5
No
24
N 2010-03
2009
Application Note AN 2008-02
V1.3 Feb. 2011
Driver Boards for EconoDUALTM 3 and EconoPACKTM +
6 Schematic, Layout and Bill of Material - EconoPACK™ + board
To meet the individual customer requirements and to ease the development or modification using the
Evaluation Driver Board for the EconoPACK™ + module, all necessary technical data like schematic, layout
and components are included in this chapter.
The tolerances for resistors should be less or equal to ±1 %, for capacitors of the type C0G less or equal to
±5 % and for capacitors of the type X7R less or equal to ±10 %.
6.1
Schematic
For the EconoDUAL
TM
3 and EconoPACK
TM
+ evaluation boards, the high and low side driver schematics
including their power supplies are similar for all half bridges. Therefore it is sufficient to depict only the
schematic of the EconoDUAL
TM
3.
Figure 28
High side IGBT driver
Figure 29
Low side IGBT driver
25
N 2010-03
2009
Application Note AN 2008-02
V1.3 Feb. 2011
Driver Boards for EconoDUALTM 3 and EconoPACKTM +
Figure 30
Figure 31
DC/DC converter
High and Low side IGBT driver output
Figure 32
Temperature measurement
26
N 2010-03
2009
Application Note AN 2008-02
V1.3 Feb. 2011
Driver Boards for EconoDUALTM 3 and EconoPACKTM +
Figure 33
6.2
Connector
Assembly drawing
Figure 34
Assembly drawing of the EconoPACK™ + driver board
For detailed information use the zoom function of your PDF viewer.
27
N 2010-03
2009
Application Note AN 2008-02
V1.3 Feb. 2011
Driver Boards for EconoDUALTM 3 and EconoPACKTM +
6.3
Layout
Figure 35
Figure 36
EconoPACK™ + IGBT driver – Top layer
EconoPACK™ + IGBT driver – Layer 2
28
N 2010-03
2009
Application Note AN 2008-02
V1.3 Feb. 2011
Driver Boards for EconoDUALTM 3 and EconoPACKTM +
Figure 37
Figure 38
EconoPACK™ + IGBT driver – Layer 3
EconoPACK™ + IGBT driver – Bottom Layer 4
29
N 2010-03
2009
Application Note AN 2008-02
V1.3 Feb. 2011
Driver Boards for EconoDUALTM 3 and EconoPACKTM +
6.4
Bill of material
The bill of material includes a part list as well as assembly notes. The external gate resistors are not
assembled, a list for the resistor values is presented in Table 7 on page 33.
The tolerances for resistors should be less or equal to ±1 %, for capacitors of the type C0G less or equal to
±5 % and for capacitors of the type X7R less or equal to ±10 %.
Table 6
Bill of Material for EconoPACK™ + Driver Board
Package
Type
Qty
Recommended
Value / Device
Part Name
size imperal
Assembled
Manufacturer
C1C, C2C, C3C, C4C, C5C,
Capacitor
6
.../50V/C0G
C0603
no
C6C
C2, C5, C18, C21, C34, C37,
Capacitor
9
10n/50V/X7R
C0603
C40T, C41T, C42T
C8B, C8T, C20B, C20T, C32B,
Capacitor
6
33p/50V/C0G
C0603
no
C32T
C1B, C1T, C3, C4B, C4T, C6,
C13, C13B, C13T, C16B, C16T,
Capacitor
23
100n/50V/X7R
C0603
C19, C22, C25B, C25T, C28B,
C28T, C29, C35, C38, C43T,
C45, C49
C1, C4, C10, C12, C17, C20,
Capacitor
12
100p/50V/C0G
C0603
C26, C28, C33, C36, C42, C44
C7B, C7T, C19B, C19T,
Capacitor
6
220p/50V/C0G
C0603
C31B, C31T
C1R, C2R, C3R, C4R, C5R,
Capacitor
6
470p/50V/X7R
C0603
C6R
CGE1, CGE2, CGE3, CGE4,
Capacitor
6
optional/50V/C0G
C0603
no
CGE5, CGE6
Capacitor
5
1µ/25V/X7R
C0805
C11, C27, C37T, C38T, C43
C2B, C2T, C3B, C3T, C5B, C5T,
C6B, C6T, C7, C9B, C9T, C10B,
C10T, C11B, C11T, C14, C14B,
C14T, C15, C15B, C15T, C16,
C17B, C17T, C18B, C18T,
C21B, C21T, C22B, C22T, C23,
Capacitor
55
4µ7/25V/X7R
C1206
Murata
C23B, C23T, C26B, C26T,
C27B, C27T, C29B, C29T, C30,
C30B, C30T, C31, C32, C33B,
C33T, C34B, C34T, C35B,
C35T, C39, C39T, C46, C47,
C48
T60403-D4615Transformer
3
VacuumD4615-X054
TR1, TR2, TR3
X054
schmelze
30
N 2010-03
2009
Application Note AN 2008-02
V1.3 Feb. 2011
Driver Board for EconoDUALTM3 and EconoPACKTM+
Package
Type
Qty
Part Name
Value / Device
size imperal
Recommended
Assembled
Manufacturer
LED1, LED2, LED3, LED4,
LED5, LED6
LED
6
LEDCHIP-
LED0805
D1, D2, D2B, D2T, D3, D3B,
D3T, D4, D4B, D4T, D5, D6, D7,
D8, D9, D9B, D9T, D10, D10B,
Schottky
39
BAT64-02W
SCD80
D10T, D11, D11B, D11T, D12,
Infineon
Diodes
D13, D14, D15, D16, D16B,
D16T, D17, D17B, D17T, D18,
D18B, D18T, D19, D20, D21
Rectifier
6
ES1D
DO214AC
D28, D29, D30, D31, D32, D33
6
BAT64-02W
SCD80
DB1, DB2, DB3, DT1, DT2, DT3
Diode
Diode
Unipolar
Infineon
no
D1.1C, D2.1C, D3.1C, D4.1C,
6
P6SMB/440V
SMB
TVS Diode
D5.1C, D6.1C,
Unipolar
D1.2C, D2.2C, D3.2C, D4.2C,
6
P6SMB/510V
SMB
TVS Diode
D5.2C, D6.2C
D5B, D5T, D12B, D12T, D19B,
Diode
6
STTA112U
SOD6
D19T
D1.1B, D1.1T, D1.2B, D1.2T,
Zener Diode
12
MM3Z5V6T1G
D8.1B, D8.1T, D8.2B, D8.2T,
On
D15.1B, D15.1T, D15.2B,
Semiconductor
SOD323-R
no
D15.2T
Zener Diode
6
BZX84-C11
SOT23
Diode
6
ZLLS1000
SOT23
ZB1, ZB2, ZB3, ZT1, ZT2, ZT3
no
D7B, D7T, D14B, D14T, D21B,
Diodes
D21T
Driver IC
6
1ED020I12-F
P-DSO-16
IC1, IC2, IC5, IC6, IC8, IC9
3
IR2085SPBF
SO08
IC3, IC7, IC10
Half-Bridge
International
Driver
Rectifier
Schmitt-
SN74LVC1G17DBV
1
Trigger
SOT23-5
IC11
P-DSO-16
IC12
R
Isolated
Analog
Sigma-Delta
1
AD7400YRWZ
Devices
Modulator
Voltage
1
ZMR500FTA
SOT23
IC13
1
TLV431BIDCKT
SC70-6L
IC14
regulator
Shunt
Regulator
31
N 2010-03
2009
Application Note AN 2008-02
V1.3 Feb. 2011
Driver Boards for EconoDUALTM3 and EconoPACKTM +
Package
Type
Qty
Recommended
Value / Device
Part Name
size imperal
Assembled
Manufacturer
R_FR1, R_FR2, R_FR3,
Resistor
6
0R
R0402
R_FR4, R_FR5, R_FR6
R_R1, R_R2, R_R3, R3, R4, R9,
Resistor
15
4k7
R0402
R10, R22, R23, R28, R29, R41,
R42, R47, R48
R6, R12, R25, R31, R44, R50
Resistor
6
10k
R0402
Resistor
R1, R2, R7, R8, R20, R21, R26,
12
100R
R0402
6
0R
R0603
Resistor
R27, R39, R40, R45, R46
R1C1, R2C1, R3C1, R4C1,
no
R5C1, R6C1
Resistor
6
27R
R0603
Resistor
6
1k
R0603
BB1, BB2, BB3, BT1, BT2, BT3
R2B, R2T, R10B, R10T, R18B,
R18T
Resistor
1
1k2
R0603
R26T
Resistor
5
2k2
R0603
R18, R28T, R30T, R37, R56
Resistor
6
4R7
R0603
Resistor
6
10R
R0603
R1L, R2L, R3L, R4L, R5L, R6L
Resistor
6
15R
R0603
R16, R17, R35, R36, R54, R55
Resistor
1
39k
R0603
R64
Resistor
3
68k
R0603
R15, R34, R53
Resistor
1
270R
R0603
R29T
Resistor
1
820R
R0603
R27T
Resistor
3
0R15
R0805
R19, R38, R57
Resistor
7
0R
R0603
R13, R14, R51, R52, R60, R61
no
R1C, R2C, R3C, R4C, R5C,
no
R6C, R25T
R1B, R1T, R9B, R9T, R17B,
Resistor
6
12R
R0805
Resistor
6
39R
R0805
Resistor
6
220R
R0805
R17T
R5, R11, R24, R30, R43, R49
R1B1, R1B2, R1B3, R1T1,
no
R1T2, R1T3
Resistor
6
10R
R1206
R32, R33, R58, R59, R62, R63
R4B, R4T, R5B, R5T, R6B, R6T,
R7B, R7T, R12B, R12T, R13B,
no: See
Resistor
24
variable
R2010
R13T, R14B, R14T, R15B,
TT electronics
Table 8
R15T, R20B, R20T, R21B,
R21T, R22B, R22T, R23B, R23T
32
N 2010-03
2009
Application Note AN 2008-02
V1.3 Feb. 2011
Driver Boards for EconoDUALTM 3 and EconoPACKTM +
Type
Package
Qty
Recommended
Value / Device
Part Name
Assembled
size imperal
Manufacturer
Transistor
6
BC856
SOT23
T1, T2, T5, T6, T9, T10
TrenchMOS
6
PMV45EN
SOT23
T3, T4, T7, T8, T11, T12
Philips
Transistor
6
ZXTN2010Z
SOT89
T1B, T1T, T3B, T3T, T5B, T5T
Diodes
Transistor
6
ZXTP2012Z
SOT89
T2B, T2T, T4B, T4T, T6B, T6T
Diodes
Connector
3
8-188275-6
16POL
X1, X2, X3
Tyco
6.5
Gate resistor list
Table 7
External gate resistors RGext are listed below, all packages are 2010 types
Module
RGext []
R4T, R4B, R6T, R6B
R12T, R12B, R14T, R14B
R20T, R20B, R22T, R22B []
R5T, R5B, R7T, R7B
R13T, R13B, R15T, R15B
R21T, R21B, R23T, R23B []
FS150R12KE3G
8.2
5.6
5.6
FS225R12KE3
3.3
1.5
1.5
FS300R12KE3
2.4
1.1
1.1
FS450R12KE3
1.6
1
1
7 How to order Evaluation Driver Boards
Every Evaluation Driver Board has its own IFX order number and can be ordered via your Infineon Sales
Partner.
Information can also be found at the Infineons Web Page: www.infineon.com
CAD-data for the board described here are available on request. The use of this data is subjected to the
disclaimer given in this AN. Please contact: [email protected]
IFX order number for EconoDUAL™ 3 Evaluation Driver Board: 31165
IFX order number for EconoPACK™ + Evaluation driver board: 31166
8 References
[1]
Infineon Technologies AG, AN2007-04, ‘How to calculate and to minimize the dead time requirement
for IGBTs properly’, V1.0, May 2007, www.infineon.com
[2]
Bäßler, M., Ciliox A., Kanschat P., ‘On the loss – softness trade-off: Are different chip versions
needed for softness improvement?’ PCIM Europe 2009, Nuremberg, May 2009
33