Evaluation Driver Board for EconoPACK™4 3-Level Modules in NPC1-Topology with 1ED020I12-F gate driver IC

Application Note AN 2011-03
V1.0 June 2011
AN2011-03 F3L020E07-F-P_EVAL
Evaluation Driver Board for EconoPACKTM 4 3-Level Modules
in NPC1-Topology with 1ED020I12-F gate driver IC
IFAG IMM INP M AE
Evaluation Driver Board for
EconoPACKTM 4 3-Level Modules
Application Note AN 2011-03
V1.0 June 2011
Edition 2011-06-01
Published by
Infineon Technologies AG
59568 Warstein, Germany
© Infineon Technologies AG 2011.
All Rights Reserved.
Attention please!
THE INFORMATION GIVEN IN THIS APPLICATION NOTE IS GIVEN AS A HINT FOR THE IMPLEMENTATION OF THE INFINEON TECHNOLOGIES COMPONENT ONLY AND SHALL NOT BE REGARDED
AS ANY DESCRIPTION OR WARRANTY OF A CERTAIN FUNCTIONALITY, CONDITION OR QUALITY
OF THE INFINEON TECHNOLOGIES COMPONENT. THE RECIPIENT OF THIS APPLICATION NOTE
MUST VERIFY ANY FUNCTION DESCRIBED HEREIN IN THE REAL APPLICATION. INFINEON
TECHNOLOGIES HEREBY DISCLAIMS ANY AND ALL WARRANTIES AND LIABILITIES OF ANY KIND
(INCLUDING WITHOUT LIMITATION WARRANTIES OF NON-INFRINGEMENT OF INTELLECTUAL
PROPERTY RIGHTS OF ANY THIRD PARTY) WITH RESPECT TO ANY AND ALL INFORMATION
GIVEN IN THIS APPLICATION NOTE.
Information
For further information on technology, delivery terms and conditions and prices please contact your
nearest Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements components may contain dangerous substances. For information on the
types in question please contact your nearest Infineon Technologies Office. Infineon Technologies
Components may only be used in life-support devices or systems with the express written approval of
Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of
that life-support device or system, or to affect the safety or effectiveness of that device or system. Life
support devices or systems are intended to be implanted in the human body, or to support and/or maintain
and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or
other persons may be endangered.
AN 2011-03
Revision History: date (2011-06-01)
, V1.0
Previous Version: none
Subjects: none
Author: Alain Siani (IFAG IMM INP M AE)
We Listen to Your Comments
Any information within this document that you feel is wrong, unclear or missing at all? Your feedback will
help us to continuously improve the quality of this document. Please send your proposal (including a
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2
Evaluation Driver Board for
EconoPACKTM 4 3-Level Modules
Application Note AN 2011-03
V1.0 June 2011
1 Introduction .................................................................................................................................................. 4
1.1
Part Number explanation ................................................................................................................... 5
2 Design features ............................................................................................................................................ 5
2.1
Key Data ............................................................................................................................................ 6
3 Pin assignments .......................................................................................................................................... 7
3.1
Mechanical dimensions ....................................................................................................................10
4 Functionality of the board ........................................................................................................................10
4.1
Power supply....................................................................................................................................10
4.2
Input stage .......................................................................................................................................11
4.3
Short circuit detection ......................................................................................................................12
4.4
Output stage.....................................................................................................................................12
5 Paralleling...................................................................................................................................................13
6 Temperature measurement ......................................................................................................................14
7 Schematics and Layouts ..........................................................................................................................16
7.1
Schematics.......................................................................................................................................16
7.2
Layouts .............................................................................................................................................18
8 Bill of Material of F3L020E07-F-P_EVAL .................................................................................................21
9 How to order the Evaluation Driver Board ..............................................................................................22
10 Literature ....................................................................................................................................................22
The board described is an evaluation board dedicated for laboratory
environment only. It operates at high voltages. This board must be operated
by qualified and skilled personnel familiar with all applicable safety standards.
3
Application Note AN 2011-03
Evaluation Driver Board for
EconoPACKTM 4 3-Level Modules
V1.0 June 2011
1 Introduction
TM
The evaluation driver board F3L020E07-F-P_EVAL for 3-Level EconoPACK 4 modules as shown in
Figure 1 was developed to support customers during their first steps designing applications with
TM
EconoPACK 4 3-Level modules. This evaluation board was designed in addition to the module adapter
1
board MA3L080E07_EVAL or could be a complementary part for an existing customer driver solution. For
more details about the 3-Level topology, please refer to [1].
The board is available from Infineon in small quantities. The properties of this part are described in the
datasheet chapter of this document, whereas the remaining paragraphs provide information intended to
enable the customer to copy, modify and qualify the design for production, according to their own specific
requirements.
Environmental conditions were considered in the design of the F3L020E07-F-P _EVAL. Components
qualified for a lead-free reflow soldering process were selected. The design was tested as described in this
document but not qualified regarding manufacturing and operation over the whole operating temperature
range or lifetime.
The boards provided by Infineon are subjected to functional testing only.
Due to their purpose evaluation boards are not subjected to the same procedures regarding Returned
Material Analysis (RMA), Process Change Notification (PCN) and Product Discontinuation (PD) as regular
products.
See Legal Disclaimer and Warnings for further restrictions on Infineon’s warranty and liability.
Figure 1: Evaluation Driver Board F3L020E07-F-P_EVAL, adapter board and EconoPACK
module as evaluation kit
1
TM
Evaluation Adapter Board for 3-Level EconoPACK
4 AN2011-04
4
TM
4 3-Level
Evaluation Driver Board for
EconoPACKTM 4 3-Level Modules
1.1
Application Note AN 2011-03
V1.0 June 2011
Part Number explanation
2 Design features
The following sections provide an overview of the board including main features, key data, pin assignments
and mechanical dimensions.
Figure 2: The Evaluation Driver Board F3L020E07-F-P_EVAL for EconoPACK
TM
4 3-Level modules
The driver board F3L020E07-F-P_EVAL as presented in Figure 2 offers four independent channels to drive
IGBTs. It is based on Infineon’s 1ED020I12-F CoreLess Transformer driver IC.
5
Evaluation Driver Board for
EconoPACKTM 4 3-Level Modules
Application Note AN 2011-03
V1.0 June 2011
The board operates as single module driver or as main driver for up to three IGBT modules in parallel
configuration. The evaluation board is developed to operate in combination with the MA3L080E07_EVAL
TM
evaluation adapter board mounted in conjunction with a 3-Level EconoPACK
4 module. The
F3L020E07-F-P_EVAL driver board provides:
2.1
-
Functional isolation between logic and power side utilizing CoreLess Transformer technology.
-
Short circuit protection and Under Voltage Lock Out (UVLO)
-
Active clamping protection for the two IGBTs directly connected to the DC-bus bar.
-
Bipolar power supply of the driver’s secondary side with +15V/-8V
-
Isolated IGBT DCB temperature measurement
-
Positive or negative input logic with 5 V CMOS level for PWM, RDY and /FLT signals.
Key Data
General key data and characteristic values are given in Table 1. These are typical values, measured at an
ambient temperature of Tamb = 25 °C.
Table 1: Electrical Parameters
Parameter
VDD
VEE
IDD+
IEEULS
ILOGIC
IOUT
tPDELAY
VDESAT
Top
Description
IGBT driver positive supply voltage each channel
IGBT driver negative supply voltage each channel
IGBT driver positive supply current each channel
IGBT driver negative supply current each channel
Logic power supply voltage
Logic power supply current
Maximum peak output current; each channel
Propagation delay time
Desaturation reference level
Operating temperature
Value
15
-8
5
4
+5
100
2
200
9
-40...+85
TM
Unit
V
V
mA
mA
V
mA
A
ns
V
°C
The EconoPACK 4 3-Level IGBT module has four series connected IGBTs. As a reference, Figure 3
presents the positions of the IGBTs with their designation used throughout this document.
Figure 3: IGBT module with the designation of each IGBT
6
Application Note AN 2011-03
Evaluation Driver Board for
EconoPACKTM 4 3-Level Modules
V1.0 June 2011
Figure 4 hints out the functional groups of the F3L020E07-F-P_EVAL evaluation board’s top side.
1: Connectors outer high side IGBT
2: Connectors inner high side IGBT
3: Connectors inner low side IGBT
4: Connectors outer low side IGBT
5: Power side outer high side IGBT
6: Power side inner high side IGBT
7: Power side inner low side IGBT
8: Power side outer low side IGBT
9: Logic connector
10: Power supply connector
11: Temperature measurements
Figure 4: Functional groups of the F3L020E07-F-P_EVAL evaluation board’s top side
Figure 5 illustrates the functional groups of the F3L020E07-F-P_EVAL evaluation board’s bottom side.
1:
2:
3:
4:
Connector outer high side IGBT
Connector inner high side IGBT
Connector inner low side IGBT
Connector outer low side IGBT
Figure 5: Functional groups of the F3L020E07-F-P_EVAL evaluation board’s bottom side
3 Pin assignments
All PWM, logic signals and voltage supplies have to be applied as listed in Tables 2 to 5.
Table 2: Pin assignment of the connector X6 for the outer high side IGBT
Pin name
Pin function
X6-1
X6-2
X6-3
X6-4
X6-5
DESAT1
OUT_T1
-8V_T1
GND_T1
+15V_T1
For paralleling, connectors X3, X4 and X5 for the outer high side IGBT share a common pin assignment with
the connector X6.
7
Application Note AN 2011-03
Evaluation Driver Board for
EconoPACKTM 4 3-Level Modules
V1.0 June 2011
Table 3: Pin assignment of the connector X10 for the inner high side IGBT
Pin name
X10-1
X10-2
X10-3
X10-4
X10-5
Pin function
NC
OUT_T2
-8V_T2
GND_T2
+15V_T2
For paralleling, connectors X7, X8 and X9 for the inner high side IGBT share a common pin assignment with
the connector X10.
Table 4: Pin assignment of the connector X14 for the inner low side IGBT
Pin name
X14-1
X14-2
X14-3
X14-4
X14-5
Pin function
NC
OUT_T3
-8V_T3
GND_T3
+15V_T3
For paralleling, connectors X11, X12 and X13 for the inner low side IGBT share a common pin assignment
with the connector X14.
Table 5: Pin assignment of the connector X19 for the outer low side IGBT
Pin name
X19-1
X19-2
X19-3
X19-4
X19-5
Pin function
DESAT4
OUT_T4
-8V_T4
GND_T4
+15V_T4
For paralleling, connectors X16, X17 and X18 for the outer low side IGBT share a common pin assignment
with the connector X19.
8
Application Note AN 2011-03
Evaluation Driver Board for
EconoPACKTM 4 3-Level Modules
V1.0 June 2011
The connector pin assignment of X15 and X2 are listed in Table 6 and 7.
Table 6: Pin assignment of the logic connector X15
Pin name
Pin function
X15-1
+5V
X15-2
S_GND
X15-3
/RST
X15-4
/FLT_T1
X15-5
IN+_T1
X15-6
IN-_T1
X15-7
IN+_T2
X15-8
IN-_T2
X15-9
IN+_T3
X15-10
IN-_T3
X15-11
/FLT_T4
X15-12
IN+_T4
X15-13
IN-_T4
X15-14
TEMP
Table 7: Pin assignment of the power supply connector X2
Pin name
X2-1
X2-2
X2-3
X2-4
X2-5
X2-6
X2-7
X2-8
X2-9
X2-10
X2-11
X2-12
X2-13
X2-14
X2-15
X2-16
X2-17
X2-18
X2-19
X2-20
X2-21
X2-22
Pin function
GND_T3
NC
-8V_T3
+15V_T3
NC
NC
GND_T4
+15V_T4
-8V_T4
NC
NC
NC
GND_T2
+15V_T2
-8V_T2
NC
NC
NC
+15V_T1
-8V_T1
GND_T1
NC
9
Application Note AN 2011-03
Evaluation Driver Board for
EconoPACKTM 4 3-Level Modules
3.1
V1.0 June 2011
Mechanical dimensions
The dimensions of the F3L020E07-F-P_EVAL Evaluation board are given in Figure 6.
Figure 6: Mechanical dimensions of the F3L020E07-F-P_EVAL
4 Functionality of the board
The F3L020E07-F-P_EVAL driver board is a complementary part to the evaluation kit to drive one 3-Level
2
TM
IGBT Module as displayed in Figure 7. The adapter board should be pressed to the EconoPACK 4.
F3L020E07-F-P_EVAL
MA3L080E07_EVAL
F3L300R07PE4
Figure 7: Driver board, adapter board and IGBT module of the 3-level evaluation kit
4.1
Power supply
Four external power supplies for the IGBT driver ICs and external booster stages are needed. These
-8V/+15V power supplies are applied to the F3L020E07-F-P_EVAL board using connector X2.
2
Further assembly instructions of EconoPACK
TM
4 can be found in AN2010-06
10
Evaluation Driver Board for
EconoPACKTM 4 3-Level Modules
Application Note AN 2011-03
V1.0 June 2011
The logic side has to be powered with +5V via the connector X15, further pin assignments can be found in
Table 6 and Table 7 on page 9.
Figure 8: Principle diagram of the F3L020E07-F-P_ EVAL
3
The 1ED020I12-F IGBT driver IC monitors the supply voltage and activates the UVLO as soon as the
supply voltage drops below the UVLO reference value.
In order to assure a proper shutdown sequence of all IGBTs in case of an under-voltage of the driver ICs, it
is important to turn off the outer high side and the outer low side IGBTs first. There are two high voltage
blocking diodes D3 and D12 each in series with the according +15V power line of the outer high side and the
outer low side IGBT drivers as can be seen in Figure 8. This generates an additional voltage drop so that the
outer high side and the outer low side IGBT will be switched off first when their driver ICs detect an undervoltage.
4.2
Input stage
The Evaluation Driver Board is designed for one leg of a 3-Level IGBT configuration; therefore it is
necessary to apply four separate PWM signals dedicated to each IGBT. Schematic details for a single IGBT
driver are depicted in Figure 9.
Figure 9: Schematic details of the input stage for a single IGBT driver.
3
Infineon IGBT Gate Driver IC 1ED020I12-F
11
Evaluation Driver Board for
EconoPACKTM 4 3-Level Modules
Application Note AN 2011-03
V1.0 June 2011
It is possible to choose positive or negative logic according to individual designs. For the use of IN+ as PWM
input, the IN- pin needs to be connected to S_GND via RJ1- or it can be used as enable signal pin.
For the use of IN- pin as PWM input, the IN+ pin needs to be connected to +5V via RJ1+ or it can be used as
enable signal pin.
4
If the power supply voltage of the logic side exceeds the power-up voltage VUVLOL1 and the power supply
5
voltage of the high side exceeds the power-up voltage VUVLOH2 , green RDY LEDs shown in Figure 10 for
IGBT1 to IGBT4 are turned on.
4.3
Short circuit detection
Short circuit is monitored individually by the outer high side and outer low side driver channels. Each of the
two channels provides an independent fault signal; they share a common reset input. Failure handling has to
be part of the superordinated control.
When a short circuit occurs, the voltage increase across the IGBT is detected by the desaturation protection
of the 1ED020I12-F and the IGBT is turned off. The fault is reported to the primary side of the driver as a low
active signal. A red LED /FLT_T1 or /FLT_T4 as presented in Figure 10 is turned on to signalize the failure
condition. The fault status remains active as long as there is no reset signal applied to the driver. The /FLT
signal is active low.
Figure 10: Positions of the status Leds on F3L020E07-F-P_EVAL
4.4
Output stage
The output stage of the F3L020E07-F-P_EVAL is prepared to be connected to the complementary
TM
MA3L080E07_EVAL evaluation module adapter directly plugged to the 3-level EconoPACK 4 module as
shown in Figure 7 on page 10. The MA3L080E07_EVAL evaluation board consists of an active booster
stage to provide the necessary switching power, demanded by the IGBT module.
Figure 11: Schematic details of the output stage for a single IGBT driver
4
5
Under Voltage Lockout Low side of 1ED020I12-F
Under Voltage Lockout High side of 1ED020I12-F
12
Application Note AN 2011-03
Evaluation Driver Board for
EconoPACKTM 4 3-Level Modules
V1.0 June 2011
5 Paralleling
The F3L020E07-F-P_EVAL was designed to work with the evaluation adapter board MA3L080E07_EVAL as
single unit like depicted in Figure 7 on side 10 or to allow the parallel connection of up to three modules,
each equipped with one MA3L080E07_EVAL adapter board as represented in Figure 12. In case of
paralleling, the driver board doesn’t need to be plugged into the complementary adapter board. The
connection from the driver to the adapter boards is done utilizing the connectors on the top side of the driver
board as shown in Figure 13.
Figure 12: Principle of parallel connection of three EconoPACK
TM
4 IGBT modules
Figure 13 displays a parallel connection of three 3-Level IGBT modules. In this case it is necessary to assure
the same length of the gate cables between the driver and adapter boards to obtain the same run time of the
gate signals for the three IGBTs. Star connection of the IGBTs reduces the cross flow in the Emitter lines
after the switching sequence. The F3L020E07-F-P_EVAL driver board allows to switch up to three IGBTs in
parallel.
TM
Figure 13: Three parallel connected EconoPACK 4 IGBT modules equipped with MA080E07_EVAL
adapter boards driven by F3L020E07-F-P_EVAL driver board.
13
Application Note AN 2011-03
Evaluation Driver Board for
EconoPACKTM 4 3-Level Modules
V1.0 June 2011
6 Temperature measurement
TM
Based on the NTC built into the EconoPACK 4, the driver board offers IGBT base plate temperature
measurement in the range of -40 °C…150 °C. The circuit of the temperature measurement on the evaluation
driver boards works with a Sigma/Delta converter. Thus a digital signal is provided featuring the advantage
that digital signal processing can be used without particular hardware efforts and that the subsequent error is
low. However an analog signal can be produced with the circuit shown in Figure 14.
Figure 14: Schematic to convert the Σ/Δ data stream to analog voltage
Table 8: Bill of Material Σ/Δ to analog converter
Type
Qty
Capacitor
1
Capacitor
Value /
Package
Part Name
100n/50V/X7R
C0603
C1
1
1n/50V/C0G
C0603
C2
Capacitor
1
10n/50V/X7R
C0603
C3
Capacitor
1
100p/50V/C0G
C0603
C4
Amplifier
1
AD8542ARZ
SOIC08
IC1
Resistor
2
39k
R0603
R1, R5
Resistor
2
100k
R0603
R2, R6
Resistor
2
22k
R0603
R3, R4
Resistor
1
10R
R0603
R7
Device
Recommended
Manufacturer
Analog
Devices
All electronic parts used in the design are lead-free and qualified for a 260 °C soldering profile. The
tolerances for resistors should be less or equal to ±1 %, for capacitors of the type C0G less or equal to ±5 %
and for capacitors of the type X7R less or equal to ±10 %.
14
Evaluation Driver Board for
EconoPACKTM 4 3-Level Modules
Application Note AN 2011-03
V1.0 June 2011
Using the base plate temperature and a thermal model, the junction temperature can be estimated. The
complexity of the thermal model needed for this purpose depends on application and heat sink conditions as
well as on requirements regarding accuracy and dynamic response. In case of a broken wire the output
shuts down to 0 V. The relation between output voltage and base plate temperature is shown in Figure 15.
Figure 15: Characteristics of the temperature measurement
Note: This temperature measurement is not suitable for short circuit detection or short term overload, but
may be used to protect the module from long term overload conditions or malfunction of the cooling system.
15
Evaluation Driver Board for
EconoPACKTM 4 3-Level Modules
Application Note AN 2011-03
V1.0 June 2011
7 Schematics and Layouts
To meet the individual customer requirements and make the evaluation driver board for the EconoPACK™ 4
module simple for development or modification, all necessary technical data like schematic, layout and
components are included in this chapter.
7.1
Schematics
Figure 16 depicts the driver circuit of the outer high side and the outer low side IGBT.
Figure 16: Driver schematic of the outer high side and the outer low side IGBT
Figure 17 illustrates the driver circuit of the inner high side and the inner low side IGBT.
Figure 17: Driver schematic of the inner high side and the inner low side IGBT
16
Evaluation Driver Board for
EconoPACKTM 4 3-Level Modules
Application Note AN 2011-03
V1.0 June 2011
Figure 18 shows the temperature measurement schematic with the  modulator.
Figure 18: Temperature measurement
Figure 19 depicts the pin assignment of the power connector X2 and logic connector X15.
Figure 19: Power connector X2 and Logic connector X15
Figure 20 details the pin assignment of the IGBT gate connectors.
Figure 20: Gate signal connectors
17
Evaluation Driver Board for
EconoPACKTM 4 3-Level Modules
7.2
Application Note AN 2011-03
V1.0 June 2011
Layouts
Figure 21: Components placed on the top side of the F3L020E07-F-P_EVAL
Figure 22: Components placed on the bottom side of the F3L020E07-F-P_EVAL
18
Evaluation Driver Board for
EconoPACKTM 4 3-Level Modules
Figure 23: F3L020E07-F-P_EVAL Top Layer
Figure 24: F3L020E07-F-P_EVAL Bottom Layer
19
Application Note AN 2011-03
V1.0 June 2011
Evaluation Driver Board for
EconoPACKTM 4 3-Level Modules
Figure 25: F3L020E07-F-P_EVAL Layer 2
Figure 26: F3L020E07-F-P_EVAL Layer 3
20
Application Note AN 2011-03
V1.0 June 2011
Application Note AN 2011-03
Evaluation Driver Board for
EconoPACKTM 4 3-Level Modules
V1.0 June 2011
8 Bill of Material of F3L020E07-F-P_EVAL
The bill of material includes a part list as well as assembly notes.
The tolerances for resistors should be less or equal to ±1 %, for capacitors of the type C0G less or equal to
±5 % and for capacitors of the type X7R less or equal to ±10 %.
Type
Value
Package
QTY
Name Part
Resistor
0R0
R0603
9
RJ2-, RJ3+, RJ3-, RJ4+,
Recommended
Manufacturer
R37, RJ1+, RJ1- RJ2+,
-
RJ4Resistor
39R
R0805
2
R2, R24
Resistor
100R
R0603
8
Resistor
270R
R0603
1
R35
-
Resistor
820R
R0603
1
R32
-
Resistor
1k
R0805
4
R8, R15, R22, R30
-
Resistor
1k2
R0603
1
R31
-
Resistor
2k2
R0603
2
R33, R34
-
Resistor
4k7
R0603
6
Resistor
4k7
R0805
3
Resistor
10k
R0603
10
Resistor
39k
R0603
1
R4, R5, R11, R12, R18,
R19, R26, R27
R3, R9, R10, R16, R17,
R25
R38, R39, R40
R1, R6, R7, R13, R14,
R20, R21, R23, R28, R29
R36
-
-
C3, C4, C7, C8, C14, C15,
Capacitor
4µ7/25V/X7R
C1206
17
C18, C19, C25, C26, C29,
C30 , C37, C38, C41, C42,
Murata
C54
Capacitor
1µ/25V/X7R
C0805
2
C47, C48
Capacitor
100n/50V/X7R
C0603
14
C23, C24, C28, C34, C36,
Murata
C2, C6, C12, C13, C17,
Murata
C40, C46, C49, C52
Capacitor
10n/50V/X7R
C0603
3
C50, C51, C53
Murata
Capacitor
100p/50V/C0G
C0603
4
C11, C22, C33, C45
Murata
Capacitor
220p/50V/C0G
C0603
2
C1, C35
Murata
Capacitor
470p/50V/X7R
C0603
4
C10, C21, C32, C44
Murata
Semiconductor
BAT165
SOD323R
4
D1, D2, D10, D11
Infineon
Semiconductor
ES1D
DO214AC
2
D3, D12
Vishay
Semiconductor
BC846
SOT23
4
T2, T3, T4, T6
-
Semiconductor
BC856
SOT23
4
T1, T5
-
Semiconductor
1ED020I12-F
P-DSO-16
4
U1, U3, U5, U7
Infineon
21
Application Note AN 2011-03
Evaluation Driver Board for
EconoPACKTM 4 3-Level Modules
V1.0 June 2011
Recommended
Type
Value / Type
Package
QTY
Name Part
Semiconductor
ZMR500FTA
SOT23
1
U9
Diodes
Semiconductor
AD7400YRWZ
P-DSO-16
1
U10
-
Semiconductor
SN74LVC1G17DB
SOT23-5
1
U11
-
Semiconductor
TLV431BIDCKT
SC70-6L
1
IC1
-
Semiconductor LEDCHIPLED_GREEN
0805
4
Semiconductor
0805
2
/FLT_T1, /FLT_T4
-
1
X15
TYCO / AMP
LEDCHIPLED_RED
TYCO / AMP
Connector
1-1634688-4
RDY_T1, RDY_T2,
RDY_T3, RDY_T4,
Manufacturer
-
Connector
MOLEX 22022025
4455-2
1
X1
Molex
Connector
MOLEX 43045-2216
MICROFIT
1
X2
Molex
Connector
MOLEX 22022055
4455-5
4
X6, X10, X14, X19
Molex
Connector
MOLEX 22232051
PITCH KK
12
X11, 12, X13, X16, X17,
X3, X4, X5, X7, X8, X9,
Molex
X18
9 How to order the Evaluation Driver Board
Every evaluation driver board has its own IFX order number and can be ordered via your Infineon sales
partner.
Information can also be found at the Infineon Web Page: www.infineon.com
CAD-data for the board described here are available on request. The use of this data is subjected to the
disclaimer given in this AN. Please contact: [email protected]
IFX order number for F3L020E07-F-P_EVAL: 36294
IFX order number for MA3L080E07_EVAL:
36293
10 Literature
[1]
[2]
[3]
Zhang Xi, Uwe Jansen, Holger Rüthing: ‘IGBT power modules utilizing new 650V IGBT3 and Emitter
Controlled Diode3 chips for 3-Level converter’ ISBN: 978-3-8007-3158-9 Proceedings PCIM Europe
2009 Conference
Infineon Technologies, AN2009-10, ‘Using the NTC inside a power electronic module’,
www.infineon.com
TM
Infineon Technologies, AN2011-04, ‘Evaluation Module Adapter Board for 3-Level EconoPACK 4’,
www.infineon.com
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