Evaluation Adapter Board for EconoPACK™4 650V, 3-Level Modules in NPC2-Topology

Application Note AN 2012-04
V1.0 May 2012
AN2012-04 MA3L120E07_EVAL
Evaluation Adapter Board for EconoPACKTM 4 3-Level
Modules in NPC2-Topology
Evaluation Adapter Board for
EconoPACKTM 4 3-Level NPC2 Modules
Application Note AN 2012-04
V1.0 May 2012
Edition 2011-05-15
Published by
Infineon Technologies AG
59568 Warstein, Germany
© Infineon Technologies AG 2011.
All Rights Reserved.
Attention please!
THE INFORMATION GIVEN IN THIS APPLICATION NOTE IS GIVEN AS A HINT FOR THE IMPLEMENTATION OF THE INFINEON TECHNOLOGIES COMPONENT ONLY AND SHALL NOT BE REGARDED
AS ANY DESCRIPTION OR WARRANTY OF A CERTAIN FUNCTIONALITY, CONDITION OR QUALITY
OF THE INFINEON TECHNOLOGIES COMPONENT. THE RECIPIENT OF THIS APPLICATION NOTE
MUST VERIFY ANY FUNCTION DESCRIBED HEREIN IN THE REAL APPLICATION. INFINEON
TECHNOLOGIES HEREBY DISCLAIMS ANY AND ALL WARRANTIES AND LIABILITIES OF ANY KIND
(INCLUDING WITHOUT LIMITATION WARRANTIES OF NON-INFRINGEMENT OF INTELLECTUAL
PROPERTY RIGHTS OF ANY THIRD PARTY) WITH RESPECT TO ANY AND ALL INFORMATION
GIVEN IN THIS APPLICATION NOTE.
Information
For further information on technology, delivery terms and conditions and prices please contact your
nearest Infineon Technologies Office (www.infineon.com).
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Due to technical requirements components may contain dangerous substances. For information on the
types in question please contact your nearest Infineon Technologies Office. Infineon Technologies
Components may only be used in life-support devices or systems with the express written approval of
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other persons may be endangered.
AN 2012-04
Revision History: date (2012-04-15), V1.0
Previous Version: none
Subjects: none
Authors: A. S.
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2
Evaluation Adapter Board for
EconoPACKTM 4 3-Level NPC2 Modules
Application Note AN 2012-04
V1.0 May 2012
1 Introduction .................................................................................................................................................. 4
1.1
Part Number explanation ................................................................................................................... 4
2 Design features ............................................................................................................................................ 5
2.1
Main features ..................................................................................................................................... 5
2.2
Key Data ............................................................................................................................................ 5
2.3
Mechanical dimensions ...................................................................................................................... 6
3 Pin assignments .......................................................................................................................................... 7
4 Functionality of the board .......................................................................................................................... 8
4.1
Power supply...................................................................................................................................... 8
4.2
Booster ............................................................................................................................................... 9
4.3
VCE monitoring for short circuit detection .......................................................................................10
4.4
Active clamping function ..................................................................................................................10
4.5
Maximum switching frequency .........................................................................................................10
5 Paralleling...................................................................................................................................................12
5.1
Static current imbalance ..................................................................................................................12
5.2
Dynamic current imbalance .............................................................................................................12
5.3
Paralleling with MA3L120E07_EVAL ...............................................................................................12
6 Schematics and Layouts ..........................................................................................................................14
6.1
Schematics.......................................................................................................................................14
6.2
Layouts .............................................................................................................................................16
7 Bill of Material of MA3L120E07_EVAL .....................................................................................................18
8 How to order the Evaluation Adapter Board ...........................................................................................19
9 Literature ....................................................................................................................................................19
The board described is an evaluation board dedicated for laboratory environment
only. It operates at high voltages. This board must be operated by qualified and
skilled personnel familiar with all applicable safety standards.
3
Evaluation Adapter Board for
EconoPACKTM 4 3-Level NPC2 Modules
1
Application Note AN 2012-04
V1.0 May 2012
Introduction
TM
The evaluation adapter board MA3L120E07_EVAL for 3-level NPC2 EconoPACK 4 modules as shown in
Figure 1 was developed to support customers during their first steps designing applications with
TM
EconoPACK 4 3-level NPC2 modules. This evaluation board was designed in addition to the module driver
1
board F3L2020E07-F-P_EVAL [1] or could be a complementary part for an existing customer driver
solution. For more details about the 3-level topology, please refer to [2].
The board is available from Infineon in small quantities. The properties of this part are described in the
design features chapter of this document, whereas the remaining paragraphs provide information to enable
the customers to copy, modify and qualify the design for production, according to their own specific
requirements.
Environmental conditions were considered in the design of the MA3L120E07_EVAL. Components qualified
for a lead-free reflow soldering process were selected. The design was tested as described in this document
but not qualified regarding manufacturing and operation over the whole operating temperature range or
lifetime.
The boards provided by Infineon are subject to functional testing only.
Due to their purpose evaluation boards are not subject to the same procedures regarding Returned Material
Analysis (RMA), Process Change Notification (PCN) and Product Discontinuation (PD) as regular products.
See Legal Disclaimer and Warnings for further restrictions on Infineon’s warranty and liability.
Figure 1: The evaluation adapter board MA3L120E07_EVAL for EconoPACK
1.1
1
Part Number explanation
TM
Evaluation Driver Board for 3-Level EconoPACK 4 AN2012-03 [2]
4
TM
4 3-level modules
Application Note AN 2012-04
Evaluation Adapter Board for
EconoPACKTM 4 3-Level NPC2 Modules
2
V1.0 May 2012
Design features
Electrical features of the evaluation board and mechanical dimensions including necessary interface
connections are presented in the following sections.
2.1
Main features
2
The evaluation board is developed to work in combination with the F3L2020E07-F-P_EVAL driver board .
The MA3L120E07 adapter board provides following features:





TM
Electrically and mechanically suitable for 3-level NPC2 EconoPACK 4 module family
Different gate resistor values for turning-on and -off are possible
Active clamping protection for all IGBTs
Desaturation output signals for short circuit monitoring
3
Suitable for -8V/+15V or up to ±20V
2.2
Key Data
All values given in Table 1 are typical values, measured at an ambient temperature of Tamb = 25 °C.
Table 1: General key data and characteristic values
Parameter
Description
Value
Unit
VDC
maximum DC supply voltage
±20
V
IG
continuous output current
±12
A
fS
maximum PWM signal frequency
60
kHz
Top
operating temperature (design target)
-40…+85
°C
Tstg
storage temperature (design target)
-40…+85
°C
TM
The EconoPACK 4 3-level IGBT module has two vertically and two horizontally aligned IGBTs. As a
reference, Figure 2 presents the positions of the semiconductors with their designation used throughout this
document.
Figure 2: IGBT module with the designation of each IGBT
2
3
Evaluation Driver Board for 3-Level NPC2 EconoPACKTM4 (AN2012-03)
Due to IGBT short circuit performance a maximum value of VGE ~15V is recommended.
5
Application Note AN 2012-04
Evaluation Adapter Board for
EconoPACKTM 4 3-Level NPC2 Modules
V1.0 May 2012
Figure 3 shows the functional groups of the MA3L120E07 evaluation board top side.
1:
2:
3:
4:
Booster for high side IGBT
Booster for inner left side IGBT
Booster for inner right side IGBT
Booster for low side IGBT
Figure 3: Functional groups of the evaluation board MA3L120E07_EVAL top side
2.3
Mechanical dimensions
The dimensions of the MA3L120E07 adapter board are given in Figure 4.
Figure 4: Mechanical dimensions of the MA3L120E07_EVAL
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Evaluation Adapter Board for
EconoPACKTM 4 3-Level NPC2 Modules
3
Application Note AN 2012-04
V1.0 May 2012
Pin assignments
All PWM, logic signals and voltage supplies have to be applied as listed in the following tables.
Table 2: Pin assignment of the connector X100 of the high side IGBT
Pin name
Pin function
X100-1
+15V_T1
X100-2
GND_T1
X100-3
-8V_T1
X100-4
PWM_T1
X100-5
DESAT1
Table 3: Pin assignment of the connector X200 of the inner high side IGBT
Pin name
Pin function
X200-1
+15V_T2
X200-2
GND_T2
X200-3
-8V_T2
X200-4
PWM_T2
X200-5
DESAT2
Table 4: Pin assignment of the connector X300 of the inner low side IGBT
Pin name
Pin function
X300-1
+15V_T3
X300-2
GND_T3
X300-3
-8V_T3
X300-4
PWM_T3
X300-5
DESAT3
Table 5: Pin assignment of the connector X400 of the low side IGBT
Pin name
Pin function
X400-1
+15V_T4
X400-2
GND_T4
X400-3
-8V_T4
X400-4
PWM_T4
X400-5
DESAT4
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Evaluation Adapter Board for
EconoPACKTM 4 3-Level NPC2 Modules
4
Application Note AN 2012-04
V1.0 May 2012
Functionality of the board
The MA3L120E07_EVAL adapter board is a complementary part of the evaluation kit to drive one 3-level
TM
IGBT module as shown in Figure 5. The adapter board should be pressed onto the EconoPACK 4 as
described in the AN2010-06.
F3L2020E07-F-P_EVAL
MA3L120E07_EVAL
F3L400R07PT4
Figure 5: Mounting sequence of the Evaluation Kit
The IGBT module is not a part of this evaluation kit. The IGBT module needed can be purchased separately.
4.1
Power supply
The evaluation kit as shown in Figure 5 needs four external isolated power supplies of -8V/+15V. The
magnitude of each power supply should not exceed the maximum supply voltage allowed for 1ED020I12-F
driver IC on the F3L2020E07-F-P_EVAL board, fixed at 28V. The power supply of the evaluation kit with four
4
isolated -8V/+15 V voltage sources can be done using a MA040E12_EVAL evaluation board.
If the MA3L120E07 adapter board is not used in conjunction with the F3L2020E07-F-P_EVAL driver board, it
can be supplied with isolated power supplies providing up to maximum ±20V.
The input PWM voltage level should be selected according to the power supply voltage level. If an
asymmetrical supply voltage of -8V/+15V is applied, the PWM signal should not exceed +15V and should not
be lower than -8V.
The voltage sources are applied to the corresponding driver channels using the connectors X100, X200,
X300 and X400.
TM
Figure 6: Principle diagram of the MA3L120E07_ EVAL and 3-level EconoPACK 4
4
AN2010-04 MA040E12_EVAL Isolated Gate Driver Power Supply and Logic Interface for MIPAQTM Serve
8
Evaluation Adapter Board for
EconoPACKTM 4 3-Level NPC2 Modules
Application Note AN 2012-04
V1.0 May 2012
Figure 7 gives hints about the power as a function of the switching frequency. This power is needed to drive
TM
one IGBT of an F3L400R07PT4 EconoPACK 4 3-level module equipped with the adapter board at
Tcase = 125°C and Tamb = 25°C. The adapter board is supplied with -8V/+15V.
Figure 7: Power consumption of one IGBT of the 3-level leg
4.2
Booster
Figure 8 shows the booster circuit where three complementary pairs of transistors are used to amplify the
input PWM signal. This allows to drive IGBTs that need more current than the driver IC can deliver. Three
NPN transistors are used for turning-on the IGBT and three PNP transistors for turning-off the IGBT.
The transistors are dimensioned to provide enough peak current to drive all EconoPACK™4 3-level IGBT
modules.
Figure 8: Schematic details of the output stage for a single IGBT driver
Gate resistors are connected between the booster stage and the IGBT module’s gate terminals. These
resistors should have a suitable rating for repetitive pulse power to avoid degradation.
9
Evaluation Adapter Board for
EconoPACKTM 4 3-Level NPC2 Modules
4.3
Application Note AN 2012-04
V1.0 May 2012
VCE monitoring for short circuit detection
The short circuit protection of the four IGBTs is based on the monitoring of the collector emitter voltage for
the corresponding IGBT, using the active clamping feature as represented in Figure 9. If the IGBT conducts
a current several times higher than the nominal value, the transistor desaturates and the voltage across the
device increases. This behavior can be used for short circuit detection and to turn-off of the IGBT. The rated
short circuit withstand time for Infineon IGBT modules is 10µs. During this time, the short circuit needs to be
detected and the IGBT has to be turned off without exceeding its maximum blocking voltage.
When the MA3L120E07_EVAL is connected to a F3L2020E07-F-P_EVAL driver board, each 1ED020I12-F
Coreless Transformer driver IC of the four IGBTs detects and handles the short circuit separately.
Figure 9: Desaturation protection and active clamping diodes
4.4
Active clamping function
Active clamping is a technique which keeps transient overvoltage below the critical limits when the IGBT
turns off. The standard approach for active clamping is to use a TVS diode connected between the auxiliary
collector and the gate of an IGBT module. When the Collector-Emitter voltage exceeds the diode breakdown
voltage the diode current sums up with the current from the driver output. Due to the increased Gate-Emitter
voltage, the transistor is held in an active mode and the turn-off process is prolonged. The dIC/dt slows down
which results in a limited voltage overshoot. Avalanche diodes conduct high peak currents during the time in
which the clamping is actively limiting the overvoltage.
A typical turn-off waveform of a F3L400R12PT4_B26 module at room temperature without overvoltage
limiting function can be seen in Figure 10a. Figure 10b shows the waveform with the same load conditions
as Figure 10a but with active clamping function.
a)
b)
Figure 10: turn-off a) without active clamping
4.5
b) with active clamping function
Maximum switching frequency
The switching frequency on the adapter board is limited either by the maximum output power of the driver
power supply or by the maximum temperature of the PCB due to the power losses in the external gate
resistors. These power losses in the gate resistors depend on the IGBT gate charge, gate voltage magnitude
10
Evaluation Adapter Board for
EconoPACKTM 4 3-Level NPC2 Modules
Application Note AN 2012-04
V1.0 May 2012
and on the switching frequency of the IGBT. Due to the power losses in the external gate resistors, heat will
be generated, which leads to an increase of the PCB temperature in the neighborhood of these resistors.
This temperature must not be higher than the maximum working temperature of the PCB, i.e. 105°C for a
standard FR4 material.
The calculation of the power losses in the gate resistors can be done by utilizing equation (1):
Pdis  P( REXT )  P( RINT )  Vout  f s  QG
(1)
where:
Pdis
= dissipated power
P(REXT) = dissipated power external gate resistors
P(RINT) = dissipated power internal gate resistor
ΔVout = voltage magnitude at the driver output
fs
= switching frequency
QG
= IGBT gate charge for the given gate voltage range
The complete gate resistor consists of the internal gate resistor together with an external gate resistor and
due to that, a part of the IGBT drive power losses will be dissipated directly to the PCB, whereas the other
part of the losses will be dissipated to the ambient air. The ratio of the losses dissipated internally P(RINT)
and externally P(REXT) corresponds directly to the ratio of the mentioned RINT and REXT resistors. According
to -8/+15V operation, the datasheet value of QGE needs to be reduced by 20%.
Due to the PCB temperature criteria, the power dissipated in external gate resistors P(REXT) has to be
considered for the thermal design.
Figure 11 illustrates the PCB board temperature around the gate resistors depending on the switching
frequency and following conditions: Tcase = 125°C, Tamb = 25°C, VGE = -8V/+15V.
Figure 11: Local temperature development of the MA3L120E07_EVAL adapter board
11
Evaluation Adapter Board for
EconoPACKTM 4 3-Level NPC2 Modules
5
Application Note AN 2012-04
V1.0 May 2012
Paralleling
In contrast to the operation of one single IGBT, where the operating point is relatively simple to set up, the
switching of paralleled IGBT modules on the same operation point is not trivial. This can be explained by the
fact that the IGBTs have a certain variation in their characteristics. A direct consequence of this is a slight
current imbalance between the IGBTs. The biggest challenge is to minimize the deviation of the leg current
to achieve highly efficient systems and an improved reliability.
Two main factors have a dominant role in the current maldistribution:
- the difference between the impedance of each leg of the paralleled setup
- the difference in the output voltages of the individual leg of the paralleled setup
5.1
Static current imbalance
The static current imbalance can be caused due to:
- the variation of the Collector-Emitter voltage of each leg of the paralleled setup
- the variation of the resistance of the main current path
5.2
Dynamic current imbalance
The dynamic current imbalance can be caused by
- the variation of the transmission characteristics caused by the different VGEth of each IGBT
- the variation of the impedance of the main current path
- the stray inductance of the internal and external commutation path of the IGBT module
- the IGBT driver output resistance in the paralleled legs
- the transfer characteristic IC = f(VGE)
5.3
Paralleling with MA3L120E07_EVAL
The MA3L120E07_EVAL was designed primarily to work with the evaluation driver board
3FL020E07-F-P1_EVAL, which allows the parallel connection of up to three modules, each equipped with
one MA3L120E07_EVAL adapter board as represented in Figure 12a. In case of paralleling, the driver board
does not need to be plugged into the complementary adapter board. The connection from the driver to the
adapter boards is done utilizing the connectors on the top side of the driver board as shown in Figure 12b.
a)
b)
Figure 12: a) Principle of parallel connection, b) Photo of the setup
Figure 12b shows a parallel connection of three 3-level IGBT modules. The wires to connect the driver to the
adapter boards should have the same length to avoid differences in signal run time between the gates of the
three legs. Star connection of the IGBTs improves the reduction of cross flow in the auxiliary emitter paths
during the switching sequence. The MA3L120E07_EVAL boards are equipped with 4R7 resistors in the
auxiliary emitter path and other power supply lines (-8V / +15V) to reduce the current cross flow between the
units of the paralleled circuits.
The MA3L120E07 adapter board is equipped with 4R7 decoupling resistors in the power supply lines by
default. This avoids currents in the emitter path between the paralleled modules.
12
Evaluation Adapter Board for
EconoPACKTM 4 3-Level NPC2 Modules
Application Note AN 2012-04
V1.0 May 2012
Figure 13a gives a hint about the balancing current flowing in the emitter paths when MA3L120E07_EVAL is
equipped with 0R instead of 4R7. Balancing currents of up to 4A can be measured after the turn-on of the
IGBT. With a standard equipped adapter board, the balancing current is reduced to a few mA as depicted in
Figure 13b.
a)
b)
Figure 13: Current distribution in the auxiliary emitter paths
a) With 0R as decoupling resistor
b) With 4R7 as decoupling resistor
Figure 14 shows the turn-on and turn-off behavior of 3 IGBT modules in parallel and their current sharing on
the AC terminals.
a)
b)
Figure 14: Current distribution on the AC terminals of 3 parallel F3L400R07PT4 modules
a) Turn-on
b) Turn-off
The Eon and Eoff values measured with a gate resistance Rgon = Rgoff = 1R5 and at ambient temperature of
25°C are listed in Table 6.
Datasheet values of Eon and Eoff for F3L400R07PT4: Eon = 8.75 mJ; Eoff = 18 mJ
Table 6: Overview of Eon and Eoff of three paralleled F3L400R07PT4 modules
Device under Test
DUT1
DUT2
Eon [mJ]
12.27
12.15
Eoff [mJ]
19.2
23
DUT3
12.2
20
Compared to the datasheet values, the measured Eoff values are similar. The variation in Eon is higher and in
general higher than the datasheet values. Nevertheless the influence of Eoff is dominating.
13
Evaluation Adapter Board for
EconoPACKTM 4 3-Level NPC2 Modules
6
Application Note AN 2012-04
V1.0 May 2012
Schematics and Layouts
To meet the individual customer requirements and to make the evaluation adapter board simple for
development or modification, all necessary technical data like schematic, layout and components are
included in this chapter.
6.1
Schematics
Figure 15 to Figure 18 depict the driving circuit of the IGBTs.
Figure 15: Driving circuit of the high side IGBT
Figure 16: Driving circuit of the inner left side IGBT
14
Evaluation Adapter Board for
EconoPACKTM 4 3-Level NPC2 Modules
Application Note AN 2012-04
V1.0 May 2012
Figure 17: Driving circuit of the inner right side IGBT
Figure 18: Driving circuit of the low side IGBT
Figure 19: Pin description of the connectors of the MA3L120E07_EVAL
15
Evaluation Adapter Board for
EconoPACKTM 4 3-Level NPC2 Modules
6.2
Layouts
Figure 20: Component placement, top side
Figure 21: Component placement, bottom side
Figure 22: Top-Layer
16
Application Note AN 2012-04
V1.0 May 2012
Evaluation Adapter Board for
EconoPACKTM 4 3-Level NPC2 Modules
Figure 23: Layer 2
Figure 24: Layer 3
Figure 25: Bottom-Layer
17
Application Note AN 2012-04
V1.0 May 2012
Application Note AN 2012-04
Evaluation Adapter Board for
EconoPACKTM 4 3-Level NPC2 Modules
7
V1.0 May 2012
Bill of Material of MA3L120E07_EVAL
The bill of material includes a part list as well as assembly notes.
The tolerances for resistors should be less or equal to ±1 %, for capacitors of the type C0G less or equal to
±5 % and for capacitors of the type X7R less or equal to ±10 %.
Type
Value
Package
QTY
Name Part
Manufacturer
Resistor
1R8
R-EU_1206
4
R112, R212, R312, R412
-
-
-
Resistor
Puls resistors
optional
R-EU_1206
24
R106,R107, R108, R109, R110, R111,
R206, R207, R208, R209, R210,
R211, R306, R307,R308, R309, R310,
R311, R406, R407, R408, R409,
R410, R411
Resistor
4R7
R-EU_1206
12
R114, R115, R116, R214, R215,
R216, R314, R315, R316, R414,
R415, R416
Resistor
1k
R-EU_0805
4
R101, R201, R301, R401
Resistor
39R
R-EU_0805
12
R103, R104, R105, R203, R204,
R205, R303, R304, R305, R403,
R404, R405
-
Resistor
10k
R-EU_0805
4
R113, R213, R313, R413
-
Murata
Capacitor
4µ7/25V/X7R
C1206
24
C101, C102, C103, C104, C105,
C106, C201, C202, C203, C204,
C205, C206, C301, C302, C303,
C304, C305, C306, C401, C402,
C403, C404, C405, C406
Diode
ES1D
DO214AC
8
D102, D106, D202, D206, D302,
D306, D402, D406
Diode
P6SMB480C
SMB
2
D105, D205, D305, D405
Diode
STTH112U
SOD6
4
D101, D201, D301, D401
-
Diode
BAT165
SOD323R
8
D103, D104, D203, D204, D303,
D304, D403, D404
Infineon
Bipolar
transistor
ZXTN2010Z
SOT89
12
T101, T102, T103, T201, T202, T203,
T301, T302, T303, T401, T402, T403
Diodes
Bipolar
transistor
ZXTP2012Z
SOT89
12
T104, T105, T106, T204, T205, T206,
T304, T305, T306, T404, T405, T406
Diodes
Connector
MOLEX
2223-2051
PITCH KK
4
X100, X200, X300, X400
Molex
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Evaluation Adapter Board for
EconoPACKTM 4 3-Level NPC2 Modules
8
Application Note AN 2012-04
V1.0 May 2012
How to order the Evaluation Adapter Board
Every Evaluation Adapter Board has its own IFX order number and can be ordered via your Infineon Sales
Partner.
Information can also be found at the Infineon’s Web Page: www.infineon.com
CAD-data for the board described here are available on request. The use of this data is subjected to the
disclaimer given in this AN. Please contact: [email protected]
IFX order number for MA3L120E07_EVAL:
SP000979670
IFX order number for F3L2020E07-F-P_EVAL: SP001000644
9
Literature
[1]
AN2012-03 Evaluation Driver Board for EconoPACKTM 4 3-level Modules in NPC2-Topology with
1ED020I12-F gate driver IC
[2]
Zhang Xi, Uwe Jansen, Holger Rüthing: ‘IGBT power modules utilizing new 650V IGBT3 and Emitter
Controlled Diode3 chips for 3-level converter’ ISBN: 978-3-8007-3158-9 Proceedings PCIM Europe
2009 Conference
19