DISCRETE SEMICONDUCTORS DATA SHEET M3D883 BOTTOM VIEW 2PC4617M series NPN general purpose transistors Product data sheet 2003 Jul 15 NXP Semiconductors Product data sheet NPN general purpose transistors 2PC4617M series FEATURES QUICK REFERENCE DATA • Leadless ultra small plastic package (1 mm × 0.6 mm × 0.5 mm) SYMBOL • Board space 1.3 × 0.9 mm • Power dissipation comparable to SOT23. APPLICATIONS PARAMETER MAX. UNIT VCEO collector-emitter voltage 50 V IC collector current (DC) 100 mA ICM peak collector current 200 mA PINNING • General purpose small signal DC applications PIN • Low and medium frequency AC applications • Mobile communications, digital (still) cameras, PDAs, PCMCIA cards. DESCRIPTION 1 base 2 emitter 3 collector DESCRIPTION NPN general purpose transistor in a SOT883 leadless ultra small plastic package. PNP complement: 2PA1776M series. 3 handbook, halfpage 2 1 3 1 MARKING 2 TYPE NUMBER Bottom view MARKING CODE 2PC4617QM D7 2PC4617RM D8 2PC4617SM D9 MAM475 Fig.1 Simplified outline (SOT883) and symbol. LIMITING VALUES In accordance with the Absolute Maximum System (IEC 60134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VCBO collector-base voltage open emitter − 50 V VCEO collector-emitter voltage open base − 50 V VEBO emitter-base voltage open collector − 5 V IC collector current (DC) − 100 mA ICM peak collector current − 200 mA IBM peak base current − 200 mA Ptot total power dissipation note 1 − 250 mW note 2 Tamb ≤ 25 °C − 430 mW Tstg storage temperature −65 +150 °C Tj junction temperature − 150 °C Tamb operating ambient temperature −65 +150 °C Notes 1. Refer to SOT883 standard mounting conditions (footprint), FR4 with 60 μm copper strip line. 2. Device mounted on a FR4 printed-circuit board, single-sided copper, mounting pad for collector 1 cm2. 2003 Jul 15 2 NXP Semiconductors Product data sheet NPN general purpose transistors 2PC4617M series THERMAL CHARACTERISTICS SYMBOL Rth j-a PARAMETER CONDITIONS thermal resistance from junction to ambient VALUE UNIT note 1 500 K/W note 2 290 K/W in free air Notes 1. Refer to SOT883 standard mounting conditions (footprint), FR4 with 60 μm copper strip line. 2. Device mounted on a FR4 printed-circuit board, single-sided copper, mounting pad for collector 1 cm2. CHARACTERISTICS Tamb = 25 °C unless otherwise specified. SYMBOL ICBO PARAMETER CONDITIONS MIN. MAX. UNIT VCB = 30 V; IE = 0 − 100 nA VCB = 30 V; IE = 0; Tj = 150 °C − 5 μA − 100 nA 2PC4617QM 120 270 2PC4617RM 180 390 2PC4617SM 270 560 collector-base cut-off current IEBO emitter-base cut-off current VEB = 4 V; IC = 0 hFE DC current gain VCE = 6 V; IC = 1 mA VCEsat collector-emitter saturation voltage IC = 50 mA; IB = 5 mA; note 1 − 200 mV Cc collector capacitance IE = ie = 0; VCB = 12 V; f = 1 MHz − 1.5 pF fT transition frequency VCE = 12 V; IC = 2 mA; f = 100 MHz 100 − MHz Note 1. Pulse test: tp ≤ 300 μs; δ ≤ 0.02. 2003 Jul 15 3 NXP Semiconductors Product data sheet NPN general purpose transistors 2PC4617M series PACKAGE OUTLINE Leadless ultra small plastic package; 3 solder lands; body 1.0 x 0.6 x 0.5 mm L SOT883 L1 2 b 3 e b1 1 e1 A A1 E D 0 0.5 1 mm scale DIMENSIONS (mm are the original dimensions) UNIT A (1) A1 max. b b1 D E e e1 L L1 mm 0.50 0.46 0.03 0.20 0.12 0.55 0.47 0.62 0.55 1.02 0.95 0.35 0.65 0.30 0.22 0.30 0.22 Note 1. Including plating thickness OUTLINE VERSION SOT883 2003 Jul 15 REFERENCES IEC JEDEC JEITA SC-101 4 EUROPEAN PROJECTION ISSUE DATE 03-02-05 03-04-03 NXP Semiconductors Product data sheet NPN general purpose transistors 2PC4617M series DATA SHEET STATUS DOCUMENT STATUS(1) PRODUCT STATUS(2) DEFINITION Objective data sheet Development This document contains data from the objective specification for product development. Preliminary data sheet Qualification This document contains data from the preliminary specification. Product data sheet Production This document contains the product specification. Notes 1. Please consult the most recently issued document before initiating or completing a design. 2. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. DISCLAIMERS above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. General ⎯ Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Terms and conditions of sale ⎯ NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. 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NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Export control ⎯ This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Quick reference data ⎯ The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Applications ⎯ Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values ⎯ Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions 2003 Jul 15 5 NXP Semiconductors Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors. No changes were made to the content, except for the legal definitions and disclaimers. Contact information For additional information please visit: http://www.nxp.com For sales offices addresses send e-mail to: [email protected] © NXP B.V. 2009 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 613514/01/pp6 Date of release: 2003 Jul 15 Document order number: 9397 750 11484