DISCRETE SEMICONDUCTORS DATA SHEET M3D883 BAT54CM Schottky barrier double diode Product data sheet 2003 Nov 11 NXP Semiconductors Product data sheet Schottky barrier double diode BAT54CM FEATURES PINNING • Low forward voltage PIN • Leadless ultra small plastic package (1.0 × 0.6 × 0.5 mm) • Boardspace 1.17 mm2 (approx. 10% of SOT23) • Power dissipation comparable to SOT23. DESCRIPTION 1 anode (a1) 2 anode (a2) 3 common cathode APPLICATIONS • Ultra high-speed switching • Voltage clamping handbook, halfpage 1 • Protection circuits 3 • Mobile communications, digital (still) cameras, PDAs and PCMCIA cards. 2 cathode mark DESCRIPTION Planar Schottky barrier double diode encapsulated in a SOT883 leadless ultra small plastic package. Top view MARKING 1 TYPE NUMBER MARKING CODE BAT54CM 3 2 S3 Bottom view Fig.1 MLE232 Simplified outline (SOT883) and symbol. ORDERING INFORMATION PACKAGE TYPE NUMBER NAME BAT54CM 2003 Nov 11 − DESCRIPTION leadless ultra small plastic package; 3 solder lands; body 1.0 × 0.6 × 0.5 mm 2 VERSION SOT883 NXP Semiconductors Product data sheet Schottky barrier double diode BAT54CM LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VR continuous reverse voltage − 30 V IF continuous forward current − 200 mA IFRM repetitive peak forward current tp ≤ 1 s; δ ≤ 0.5 − 300 mA IFSM non-repetitive peak forward current tp < 10 ms − 600 mA Tstg storage temperature −65 +150 °C Tj junction temperature − 150 °C Ptot total power dissipation (per package) Tamb ≤ 25 °C; note 1 − 250 mW Note 1. Refer to SOT883 standard mounting conditions (footprint); FR4 with 60 μm copper strip line. THERMAL CHARACTERISTICS SYMBOL Rth j-a PARAMETER thermal resistance from junction to ambient CONDITIONS note 1 VALUE UNIT 500 K/W Note 1. Refer to SOT883 standard mounting conditions (footprint), FR4 with 60 μm copper strip line. Soldering Reflow soldering is the only recommended soldering method. ELECTRICAL CHARACTERISTICS Tamb = 25 °C unless otherwise specified. SYMBOL PARAMETER CONDITIONS MAX. UNIT Per diode VF forward voltage see Fig.2; IF = 0.1 mA 240 mV IF = 1 mA 320 mV IF = 10 mA 400 mV IF = 30 mA 500 mV IF = 100 mA 800 mV IR continuous reverse current VR = 25 V; note 1; see Fig.3 2 μA Cd diode capacitance f = 1 MHz; VR = 1 V; see Fig.4 10 pF Note 1. Pulsed test: tp ≤ 300 μs; δ ≤ 0.02. 2003 Nov 11 3 NXP Semiconductors Product data sheet Schottky barrier double diode BAT54CM MSA892 IF (mA) MSA893 10 3 3 10halfpage handbook, I R (μA) (1) (2) (3) 10 2 (1) 10 2 (2) 10 10 1 10 1 (1) (2) (3) 1 (3) 10 1 0 0.4 0.8 VF (V) 0 1.2 10 (1) Tamb = 125 °C. (2) Tamb = 85 °C. (3) Tamb = 25 °C. (1) Tamb = 125 °C. (2) Tamb = 85 °C. (3) Tamb = 25 °C. Fig.2 Fig.3 Forward current as a function of forward voltage; typical values. MSA891 15 handbook, halfpage Cd (pF) 10 5 0 0 10 20 VR (V) 30 f = 1 MHz; Tamb = 25 °C. Fig.4 Diode capacitance as a function of reverse voltage; typical values. 2003 Nov 11 4 20 VR (V) 30 Reverse current as a function of reverse voltage; typical values. NXP Semiconductors Product data sheet Schottky barrier double diode BAT54CM PACKAGE OUTLINE Leadless ultra small plastic package; 3 solder lands; body 1.0 x 0.6 x 0.5 mm L SOT883 L1 2 b 3 e b1 1 e1 A A1 E D 0 0.5 1 mm scale DIMENSIONS (mm are the original dimensions) UNIT A (1) A1 max. b b1 D E e e1 L L1 mm 0.50 0.46 0.03 0.20 0.12 0.55 0.47 0.62 0.55 1.02 0.95 0.35 0.65 0.30 0.22 0.30 0.22 Note 1. Including plating thickness OUTLINE VERSION SOT883 2003 Nov 11 REFERENCES IEC JEDEC JEITA SC-101 5 EUROPEAN PROJECTION ISSUE DATE 03-02-05 03-04-03 NXP Semiconductors Product data sheet Schottky barrier double diode BAT54CM DATA SHEET STATUS DOCUMENT STATUS(1) PRODUCT STATUS(2) DEFINITION Objective data sheet Development This document contains data from the objective specification for product development. Preliminary data sheet Qualification This document contains data from the preliminary specification. Product data sheet Production This document contains the product specification. Notes 1. Please consult the most recently issued document before initiating or completing a design. 2. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. DISCLAIMERS above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. General ⎯ Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Terms and conditions of sale ⎯ NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. 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Limiting values ⎯ Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions 2003 Nov 11 6 NXP Semiconductors Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors. No changes were made to the content, except for the legal definitions and disclaimers. Contact information For additional information please visit: http://www.nxp.com For sales offices addresses send e-mail to: [email protected] © NXP B.V. 2009 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands R76/01/pp7 Date of release: 2003 Nov 11 Document order number: 9397 750 11909