1PS70SB10 Schottky barrier single diode 17 December 2012 Product data sheet 1. General description Planar Schottky barrier diode with an integrated guard ring for stress protection, encapsulated in a very small SOT323 Surface-Mounted Device (SMD) plastic package. 2. Features and benefits • • • Low forward voltage Low capacitance AEC-Q101 qualified 3. Applications • • • • Ultra high-speed switching Line termination Voltage clamping Reverse polarity protection 4. Quick reference data Table 1. Quick reference data Symbol Parameter IF Conditions Min Typ Max Unit forward current - - 200 mA VR reverse voltage - - 30 V VF forward voltage - - 400 mV IF = 10 mA; Tamb = 25 °C 5. Pinning information Table 2. Pinning information Pin Symbol Description 1 A anode 2 n.c. not connected 3 K cathode Simplified outline Graphic symbol K 3 A 1 2 SC-70 (SOT323) Scan or click this QR code to view the latest information for this product n.c. aaa-005805 1PS70SB10 NXP Semiconductors Schottky barrier single diode 6. Ordering information Table 3. Ordering information Type number Package 1PS70SB10 Name Description Version SC-70 plastic surface-mounted package; 3 leads SOT323 7. Marking Table 4. Marking codes Type number Marking code [1] 1PS70SB10 7%0 [1] % = placeholder for manufacturing site code 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VR Conditions Min Max Unit reverse voltage - 30 V IF forward current - 200 mA IFRM repetitive peak forward current tp ≤ 1 s; δ ≤ 0.5 - 300 mA IFSM non-repetitive peak forward current tp < 10 ms; Tj(init) = 25 °C - 600 mA Ptot total power dissipation Tamb < 25 °C - 200 mW Tj junction temperature - 150 °C Tamb ambient temperature -55 150 °C Tstg storage temperature -65 150 °C Min Typ Max Unit - - 625 K/W 9. Thermal characteristics Table 6. Thermal characteristics Symbol Parameter Conditions Rth(j-a) thermal resistance from junction to ambient in free air [1] 1PS70SB10 Product data sheet [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. All information provided in this document is subject to legal disclaimers. 17 December 2012 © NXP B.V. 2012. All rights reserved 2/9 1PS70SB10 NXP Semiconductors Schottky barrier single diode 10. Characteristics Table 7. Characteristics Symbol Parameter Conditions Min Typ Max Unit VF forward voltage IF = 0.1 mA; Tamb = 25 °C - - 240 mV IF = 1 mA; Tamb = 25 °C - - 320 mV IF = 10 mA; Tamb = 25 °C - - 400 mV IF = 30 mA; Tamb = 25 °C - - 500 mV IF = 100 mA; Tamb = 25 °C - - 800 mV VR = 25 V; pulsed; tp = 300 µs; - - 2 µA - - 10 pF IR reverse current δ = 0.02 ; Tamb = 25 °C Cd diode capacitance VR = 1 V; f = 1 MHz; Tamb = 25 °C 006aac829 103 IF (mA) (1) (3) (2) aaa-004515 103 IR (µA) 102 (1) 102 (2) 10 10 (1) (2) (3) 1 10-1 0.0 Fig. 1. 1 0.4 0.8 VF (V) 1.2 10-1 (3) 0 10 (1) Tamb = 125 °C (1) Tamb = 125 °C (2) Tamb = 85 °C (2) Tamb = 85 °C (3) Tamb = 25 °C (3) Tamb = 25 °C Forward current as a function of forward voltage; typical values 1PS70SB10 Product data sheet Fig. 2. VR (V) 30 Reverse current as a function of reverse voltage; typical values All information provided in this document is subject to legal disclaimers. 17 December 2012 20 © NXP B.V. 2012. All rights reserved 3/9 1PS70SB10 NXP Semiconductors Schottky barrier single diode 006aac891 10 Cd (pF) 8 6 4 2 0 0 10 20 30 VR (V) Tamb = 25 °C; f = 1 MHz Fig. 3. Diode capacitance as a function of reverse voltage; typical values 11. Test information 11.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications. 12. Package outline 2.2 1.8 1.1 0.8 0.45 0.15 3 2.2 1.35 2.0 1.15 1 2 1.3 0.4 0.3 0.25 0.10 Dimensions in mm Fig. 4. 04-11-04 Package outline SC-70 (SOT323) 1PS70SB10 Product data sheet All information provided in this document is subject to legal disclaimers. 17 December 2012 © NXP B.V. 2012. All rights reserved 4/9 1PS70SB10 NXP Semiconductors Schottky barrier single diode 13. Soldering 2.65 1.85 1.325 solder lands solder resist 2 2.35 0.6 (3×) 3 solder paste 1.3 occupied area 0.5 (3×) 1 Dimensions in mm 0.55 (3×) Fig. 5. sot323_fr Reflow soldering footprint for SC-70 (SOT323) 4.6 2.575 1.425 (3×) solder lands solder resist occupied area 1.8 3.65 2.1 Dimensions in mm preferred transport direction during soldering 09 (2×) sot323_fw Fig. 6. Wave soldering footprint for SC-70 (SOT323) 14. Revision history Table 8. Revision history Data sheet ID Release date Data sheet status Change notice Supersedes 1PS70SB10 v.2 20121217 Product data sheet - 1PS70SB10_14_15_16 v.1 1PS70SB10 Product data sheet All information provided in this document is subject to legal disclaimers. 17 December 2012 © NXP B.V. 2012. All rights reserved 5/9 1PS70SB10 NXP Semiconductors Schottky barrier single diode Data sheet ID Release date Modifications: • • • • • • • • • • • • Product data sheet Change notice Supersedes The format of this document has been redesigned to comply with the new identity guidelines of NXP Semiconductors. Legal texts have been adapted to the new company name where appropriate. Sections 1 to 3 updated Section 4 "Quick reference data" added Section 6 "Ordering information" added Section 7 "Marking" updated Table 5 "Limiting values": ambient temperature Tamb and junction temperature Tj minimum value updated Figues 1, 2 and 3 updated Section 11 "Test information" added Figure 4: superseded by minimized package outline drawing Section 13 "Soldering" added Section 14 "Legal information" updated 1PS70SB10_14_15_16 19990426 v.1 1PS70SB10 Data sheet status Product data sheet - All information provided in this document is subject to legal disclaimers. 17 December 2012 - © NXP B.V. 2012. All rights reserved 6/9 1PS70SB10 NXP Semiconductors Schottky barrier single diode In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. 15. Legal information 15.1 Data sheet status Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Document status [1][2] Product status [3] Objective [short] data sheet Development This document contains data from the objective specification for product development. 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Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. 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Contents 1 General description ............................................... 1 2 Features and benefits ............................................1 3 Applications ........................................................... 1 4 Quick reference data ............................................. 1 5 Pinning information ............................................... 1 6 Ordering information ............................................. 2 7 Marking ................................................................... 2 8 Limiting values .......................................................2 9 Thermal characteristics .........................................2 10 Characteristics ....................................................... 3 11 11.1 Test information ..................................................... 4 Quality information ......................................... 12 Package outline ..................................................... 4 13 Soldering ................................................................ 5 14 Revision history ..................................................... 5 15 15.1 15.2 15.3 15.4 Legal information ...................................................7 Data sheet status ................................................. 7 Definitions .............................................................7 Disclaimers ...........................................................7 Trademarks .......................................................... 8 © NXP B.V. 2012. All rights reserved For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 17 December 2012 1PS70SB10 Product data sheet All information provided in this document is subject to legal disclaimers. 17 December 2012 © NXP B.V. 2012. All rights reserved 9/9