SO T2 3 BF861A; BF861B; BF861C N-channel junction FETs Rev. 5 — 15 September 2011 Product data sheet 1. Product profile 1.1 General description N-channel symmetrical junction field effect transistors in a SOT23 package. CAUTION The device is supplied in an antistatic package. The gate-source input must be protected against static discharge during transport or handling. MSC895 1.2 Features and benefits High transfer admittance Low feedback capacitance Low input capacitance Low noise. 1.3 Applications Preamplifiers for AM tuners in car radios. 1.4 Quick reference data Table 1. Quick reference data Symbol Parameter VDS drain-source voltage (DC) IDSS drain current Conditions Min Typ Max Unit - - 25 V BF861A VGS = 0 V; VDS = 8 V 2 - 6.5 mA BF861B VGS = 0 V; VDS = 8 V 6 - 15 mA BF861C VGS = 0 V; VDS = 8 V 12 - 25 mA - - 250 mW Ptot total power dissipation up to Tamb = 25 C yfs forward transfer admittance; BF861A VGS = 0 V; VDS = 8 V 12 - 20 mS BF861B VGS = 0 V; VDS = 8 V 16 - 25 mS BF861C VGS = 0 V; VDS = 8 V 20 - 30 mS Ciss input capacitance f = 1 MHz - - 10 pF Crss reverse transfer capacitance f = 1 MHz - - 2.7 pF BF861A; BF861B; BF861C NXP Semiconductors N-channel junction FETs 2. Pinning information Table 2. Discrete pinning Pin Description 1 source 2 drain 3 gate Simplified outline Symbol 3 3 1 2 sym053 1 2 3. Ordering information Table 3. Ordering information Type number Package Name Description Version BF861A - plastic surface mounted package; 3 leads SOT23 BF861B - plastic surface mounted package; 3 leads SOT23 BF861C - plastic surface mounted package; 3 leads SOT23 4. Marking Table 4. Marking codes Type number Marking code[1] BF861A 28* BF861B 29* BF861C 30* [1] * = p: Made in Hong Kong. * = t: Made in Malaysia. * = W: Made in China. 5. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min VDS drain-source voltage (DC) VGSO - 25 V gate-source voltage open drain - 25 V VDGO drain-gate voltage (DC) open source - 25 V IG forward gate current (DC) - 10 mA Product data sheet Unit Ptot total power dissipation - 250 mW Tstg storage temperature 65 +150 C Tj operating junction temperature - 150 C [1] BF861A_BF861B_BF861C up to Tamb = 25 C [1] Max Device mounted on an FR4 printed-circuit board. All information provided in this document is subject to legal disclaimers. Rev. 5 — 15 September 2011 © NXP B.V. 2011. All rights reserved. 2 of 14 BF861A; BF861B; BF861C NXP Semiconductors N-channel junction FETs mrc166 300 Ptot (mW) 200 100 0 0 50 100 150 Tamb (°C) Fig 1. Power derating curve. 6. Thermal characteristics Table 6. Symbol Rth(j-a) [1] Thermal characteristics Parameter Conditions [1] thermal resistance from junction to ambient Typ Unit 500 K/W Device mounted on an FR4 printed-circuit board. 7. Characteristics Table 7. Characteristics Tj = 25 C; VDS = 8 V; VGS = 0 V unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit V(BR)GSS gate-source breakdown voltage IG = 1 A 25 - - V VGSoff gate-source cut-off voltage BF861A ID = 1 A 0.2 - 1 V BF861B ID = 1 A 0.5 - 1.5 V BF861C ID = 1 A 0.8 - 2 V VDS = 0 V; IG = 1 mA - - 1 V 2 - 6.5 mA VGSS gate-source forward voltage IDSS drain current BF861A IGSS BF861A_BF861B_BF861C Product data sheet BF861B 6 - 15 mA BF861C 12 - 25 mA - - 1 nA gate cut-off current VGS = 20 V; VDS = 0 V All information provided in this document is subject to legal disclaimers. Rev. 5 — 15 September 2011 © NXP B.V. 2011. All rights reserved. 3 of 14 BF861A; BF861B; BF861C NXP Semiconductors N-channel junction FETs Table 7. Characteristics …continued Tj = 25 C; VDS = 8 V; VGS = 0 V unless otherwise specified. Symbol Parameter yfs forward transfer admittance Conditions Min Typ Max Unit BF861A 12 - 20 mS BF861B 16 - 25 mS BF861C 20 - 30 mS BF861A - - 200 S BF861B - - 250 S BF861C - - 300 S common source output conductance gos Ciss input capacitance f = 1 MHz - - 10 pF Crss reverse transfer capacitance f = 1 MHz - 2.1 2.7 pF Vn/B equivalent input noise VGS = 0 V; f = 1 MHz voltage - 1.5 - nV/Hz mbd461 30 mbd462 300 g os (μS) IDSS (mA) 20 200 10 100 0 0 −0.5 −1 0 −1.5 −2 VGSoff (V) 0 VDS = 8 V. 5 10 15 20 25 IDSS (mA) VDS = 8 V. VGS = 0 V. Fig 2. Drain current as a function of gate-source cut-off voltage; typical values. BF861A_BF861B_BF861C Product data sheet Fig 3. Common-source output conductance as a function of drain current; typical values. All information provided in this document is subject to legal disclaimers. Rev. 5 — 15 September 2011 © NXP B.V. 2011. All rights reserved. 4 of 14 BF861A; BF861B; BF861C NXP Semiconductors N-channel junction FETs mbd463 30 mbd464 25 BF861C |yfs | (mS) 20 |yfs | (mS) BF861B 20 BF861A 15 10 10 5 0 0 5 10 15 0 20 25 IDSS (mA) 0 5 10 15 20 I D (mA) VDS = 8 V. VDS = 8 V. VGS = 0 V. Fig 4. Forward transfer admittance as a function of drain current; typical values. Fig 5. mbd465 5 Forward transfer admittance as a function of drain current; typical values. mbd466 5 ID (mA) ID (mA) 4 4 3 3 (1) (2) 2 2 (3) 1 1 (4) 0 −1 −0.8 −0.6 −0.4 0 −0.2 0 VGS (V) 0 VDS = 8 V. 2 4 6 8 10 VDS (V) VDS = 8 V. (1) VGS = 0 V. (2) VGS = 100 mV. (3) VGS = 200 mV. (4) VGS = 300 mV. Fig 6. Typical input characteristics; BF861A. BF861A_BF861B_BF861C Product data sheet Fig 7. Typical output characteristics: BF861A. All information provided in this document is subject to legal disclaimers. Rev. 5 — 15 September 2011 © NXP B.V. 2011. All rights reserved. 5 of 14 BF861A; BF861B; BF861C NXP Semiconductors N-channel junction FETs mbd467 10 mbd468 10 ID (mA) ID (mA) 8 8 (1) 6 6 4 4 (2) (3) (4) 2 (5) 2 (6) 0 −1 −0.8 −0.6 −0.4 0 −0.2 0 VGS (V) 0 VDS = 8 V. 2 4 6 8 10 VDS (V) VDS = 8 V. (1) VGS = 0 V. (2) VGS = 100 mV. (3) VGS = 200 mV. (4) VGS = 300 mV. (5) VGS = 400 mV. (6) VGS = 500 mV. Fig 8. Typical input characteristics; BF861B. BF861A_BF861B_BF861C Product data sheet Fig 9. Typical output characteristics; BF861B. All information provided in this document is subject to legal disclaimers. Rev. 5 — 15 September 2011 © NXP B.V. 2011. All rights reserved. 6 of 14 BF861A; BF861B; BF861C NXP Semiconductors N-channel junction FETs mbd469 20 ID (mA) 16 mbd470 20 ID (mA) 16 (1) (2) (3) 12 12 (4) (5) 8 8 (6) 4 4 0 −2.5 −2 −1.5 −1 0 −0.5 0 VGS (V) 0 VDS = 8 V. 2 4 6 8 10 VDS (V) VDS = 8 V. (1) VGS = 0 V. (2) VGS = 200 mV. (3) VGS = 400 mV. (4) VGS = 600 mV. (5) VGS = 800 mV. (6) VGS = 1 V. Fig 10. Typical input characteristics; BF861C. mbd471 10 Fig 11. Typical output characteristics; BF861C. Cis, Crs (pF) IG (nA) 8 6 mbd472 −102 (1) −10 (2) −1 (3) −10−1 C is −10−2 4 −10−3 C rs 2 (4) −10−4 0 −8 −6 −4 −2 −10−5 0 0 5 VGS (V) VDS = 8 V. 10 15 20 25 VDG (V) VDS = 8 V. (1) ID = 10 mA. f = 1 MHz. (2) ID = 1 mA. (3) ID = 0.1 mA. (4) ID = IGSS. Fig 12. Input and reverse transfer capacitance as functions of gate-source voltage; typical values. BF861A_BF861B_BF861C Product data sheet Fig 13. Gate current as a function of drain-gate voltage; typical values. All information provided in this document is subject to legal disclaimers. Rev. 5 — 15 September 2011 © NXP B.V. 2011. All rights reserved. 7 of 14 BF861A; BF861B; BF861C NXP Semiconductors N-channel junction FETs mbd473 8 Vn /√B mbd474 102 g is, b is (mS) (nV/√Hz) 6 b is 10 4 g is 1 2 0 10−2 10−1 1 10 102 103 f (kHz) 10−1 10 102 103 f (MHz) VDS = 8 V. VDS = 8 V. VGS = 0 V. VGS = 0 V. Tamb = 25 C. Fig 14. Equivalent input noise as a function of frequency; typical values. mbd475 102 Fig 15. Common-source input admittance; typical values. mbd476 102 grs, brs (mS) g fs, b fs (mS) 10 b rs 1 g fs 10 b fs g rs 10−1 10−2 10 102 103 1 10 f (MHz) VDS = 8 V. VGS = 0 V. VGS = 0 V. Tamb = 25 C. Tamb = 25 C. Fig 16. Common-source reverse admittance; typical values. Product data sheet 103 f (MHz) VDS = 8 V. BF861A_BF861B_BF861C 102 Fig 17. Common-source forward transfer admittance; typical values. All information provided in this document is subject to legal disclaimers. Rev. 5 — 15 September 2011 © NXP B.V. 2011. All rights reserved. 8 of 14 BF861A; BF861B; BF861C NXP Semiconductors N-channel junction FETs mbd477 102 g os, b os (mS) 10 b os 1 g os 10−1 10 102 103 f (MHz) VDS = 8 V. VGS = 0 V. Tamb = 25 C. Fig 18. Common-source output admittance; typical values. BF861A_BF861B_BF861C Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 15 September 2011 © NXP B.V. 2011. All rights reserved. 9 of 14 BF861A; BF861B; BF861C NXP Semiconductors N-channel junction FETs 8. Package outline Plastic surface-mounted package; 3 leads SOT23 D E B A X HE v M A 3 Q A A1 1 2 e1 bp c w M B Lp e detail X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 max. bp c D E e e1 HE Lp Q v w mm 1.1 0.9 0.1 0.48 0.38 0.15 0.09 3.0 2.8 1.4 1.2 1.9 0.95 2.5 2.1 0.45 0.15 0.55 0.45 0.2 0.1 OUTLINE VERSION SOT23 REFERENCES IEC JEDEC JEITA TO-236AB EUROPEAN PROJECTION ISSUE DATE 04-11-04 06-03-16 Fig 19. Package outline BF861A_BF861B_BF861C Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 15 September 2011 © NXP B.V. 2011. All rights reserved. 10 of 14 BF861A; BF861B; BF861C NXP Semiconductors N-channel junction FETs 9. Revision history Table 8. Revision history Document ID Release date BF861A_BF861B_BF861C v.5 20110915 Modifications: Data sheet status Change notice Supersedes Product data sheet - BF861A_BF861B_BF861C v.4 • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • • Legal texts have been adapted to the new company name where appropriate. Package outline drawings have been updated to the latest version. BF861A_BF861B_BF861C v.4 20040924 (9397 750 13395) Product data sheet - BF861 v.3 BF861 v.3 (9397 750 02667) 19970904 Product specification - BF861 v.2 BF861 v.2 19950414 - - BF861 v.1 BF861 v.1 19940829 - - - BF861A_BF861B_BF861C Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 15 September 2011 © NXP B.V. 2011. All rights reserved. 11 of 14 BF861A; BF861B; BF861C NXP Semiconductors N-channel junction FETs 10. Legal information 10.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 10.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 10.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. 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Export might require a prior authorization from national authorities. BF861A_BF861B_BF861C Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 15 September 2011 © NXP B.V. 2011. All rights reserved. 12 of 14 BF861A; BF861B; BF861C NXP Semiconductors N-channel junction FETs Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. 10.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 11. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] BF861A_BF861B_BF861C Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 15 September 2011 © NXP B.V. 2011. All rights reserved. 13 of 14 NXP Semiconductors BF861A; BF861B; BF861C N-channel junction FETs 12. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 10.1 10.2 10.3 10.4 11 12 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 Thermal characteristics . . . . . . . . . . . . . . . . . . 3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 11 Legal information. . . . . . . . . . . . . . . . . . . . . . . 12 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 12 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Contact information. . . . . . . . . . . . . . . . . . . . . 13 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2011. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 15 September 2011 Document identifier: BF861A_BF861B_BF861C