HEF4028B
BCD to decimal decoder
Rev. 9 — 23 March 2016
Product data sheet
1. General description
The HEF4028B is a 4-bit BCD to decimal decoder, a 4-bit BCO to octal decoder with
active LOW enable or an 8-output (Y0 to Y7) inverting demultiplexer. The outputs are fully
buffered for best performance.
When used as a BCD to decimal decoder a 1-2-4-8 BCD code applied to inputs A0 to A3
causes the selected output to be HIGH. The other nine outputs will be LOW.
To use the HEF4028B as a BCO to octal decoder, input A3 is an active LOW enable pin
and outputs Y8 and Y9 are not used. A 1-2-4 BCO code applied to inputs A0 to A2 causes
the selected output (Y0 to Y7) to be HIGH. The other seven outputs will be LOW. When
A3 is HIGH outputs (Y0 to Y7) will be forced LOW.
When used as an 8-output (Y0 to Y7) inverting demultiplexer A0 to A2 are used as
address inputs and A3 is the data input. Outputs Y8 and Y9 are not used.
It operates over a recommended VDD power supply range of 3 V to 15 V referenced to VSS
(usually ground). Unused inputs must be connected to VDD, VSS, or another input.
2. Features and benefits
Fully static operation
5 V, 10 V, and 15 V parametric ratings
Standardized symmetrical output characteristics
Specified from 40 C to +85 C
Complies with JEDEC standard JESD 13-B
3. Ordering information
Table 1.
Ordering information
All types operate from 40 C to +85 C.
Type number
HEF4028BT
Package
Name
Description
Version
SO16
plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
HEF4028B
NXP Semiconductors
BCD to decimal decoder
4. Functional diagram
$
$
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<
<
<
<
<
<
<
<
<
<
DDH
Fig 1.
Functional diagram
<
<
$
<
<
$
<
<
$
<
<
$
<
<
DDH
Fig 2.
Logic diagram
HEF4028B
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 9 — 23 March 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
2 of 12
HEF4028B
NXP Semiconductors
BCD to decimal decoder
5. Pinning information
5.1 Pinning
+()%
< 9''
< <
< <
< $
< $
< $
< $
966 <
DDH
Fig 3.
Pin configuration
5.2 Pin description
Table 2.
Pin description
Symbol
Pin
Description
Y0 to Y9
3, 14, 2, 15, 1, 6, 7, 4, 9, 5
output (active HIGH)
VSS
8
ground supply voltage
A0 to A3
10, 13, 12, 11
address input
VDD
16
supply voltage
6. Functional description
Function table [1]
Table 3.
Inputs
Outputs
A3
A2
A1
A0
Y0
Y1
Y2
Y3
Y4
Y5
Y6
Y7
Y8
Y9
L
L
L
L
H
L
L
L
L
L
L
L
L
L
L
L
L
H
L
H
L
L
L
L
L
L
L
L
L
L
H
L
L
L
H
L
L
L
L
L
L
L
L
L
H
H
L
L
L
H
L
L
L
L
L
L
L
H
L
L
L
L
L
L
H
L
L
L
L
L
L
H
L
H
L
L
L
L
L
H
L
L
L
L
L
H
H
L
L
L
L
L
L
L
H
L
L
L
L
H
H
H
L
L
L
L
L
L
L
H
L
L
H
L
L
L
L
L
L
L
L
L
L
L
H
L
HEF4028B
Product data sheet
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Rev. 9 — 23 March 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
3 of 12
HEF4028B
NXP Semiconductors
BCD to decimal decoder
Function table [1] …continued
Table 3.
Inputs
Outputs
A3
A2
A1
A0
Y0
Y1
Y2
Y3
Y4
Y5
Y6
Y7
Y8
Y9
H
L
L
H
L
L
L
L
L
L
L
L
L
H
H
L
H
X
L
L
L
L
L
L
L
L
L
L
[2]
H
H
X
X
L
L
L
L
L
L
L
L
L
L
[2]
[1]
H = HIGH voltage level; L = LOW voltage level; X = don’t care.
[2]
Extraordinary states.
7. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
VDD
supply voltage
IIK
input clamping current
VI
input voltage
IOK
output clamping current
Conditions
VI < 0.5 V or VI > VDD + 0.5 V
VO < 0.5 V or VO > VDD + 0.5 V
Min
Max
Unit
0.5
+18
V
-
10
mA
0.5
VDD + 0.5
-
10
mA
V
II/O
input/output current
-
10
mA
IDD
supply current
-
50
mA
Tstg
storage temperature
65
+150
C
Tamb
ambient temperature
40
+85
C
Ptot
total power dissipation
-
500
mW
-
100
mW
Tamb = 40 C to +85 C
SO16 package
P
[1]
power dissipation
[1]
per output
For SO16 package: Ptot derates linearly with 8 mW/K above 70 C.
8. Recommended operating conditions
Table 5.
Recommended operating conditions
Symbol
Parameter
VDD
supply voltage
VI
input voltage
Tamb
ambient temperature
in free air
t/V
input transition rise and fall rate
VDD = 5 V
HEF4028B
Product data sheet
Conditions
Min
Typ
Max
3
-
15
0
-
VDD
V
40
-
+85
C
-
-
6.25
ms/V
VDD = 10 V
-
-
0.5
ms/V
VDD = 15 V
-
-
0.08
ms/V
All information provided in this document is subject to legal disclaimers.
Rev. 9 — 23 March 2016
Unit
V
© NXP Semiconductors N.V. 2016. All rights reserved.
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HEF4028B
NXP Semiconductors
BCD to decimal decoder
9. Static characteristics
Table 6.
Static characteristics
VSS = 0 V; VI = VSS or VDD.
Symbol Parameter
VIH
VIL
VOH
VOL
IOH
IOL
HIGH-level input voltage
LOW-level input voltage
HIGH-level output voltage
LOW-level output voltage
HIGH-level output current
LOW-level output current
II
input leakage current
IDD
supply current
CI
Conditions
VDD
IO < 1 A
IO < 1 A
IO < 1 A
Tamb = 40 C
Tamb = 25 C
Tamb = 85 C
Unit
Min
Max
Min
Max
Min
Max
5V
3.5
-
3.5
-
3.5
-
V
10 V
7.0
-
7.0
-
7.0
-
V
15 V
11.0
-
11.0
-
11.0
-
V
5V
-
1.5
-
1.5
-
1.5
V
10 V
-
3.0
-
3.0
-
3.0
V
15 V
-
4.0
-
4.0
-
4.0
V
5V
4.95
-
4.95
-
4.95
-
V
10 V
9.95
-
9.95
-
9.95
-
V
15 V
14.95
-
14.95
-
14.95
-
V
5V
-
0.05
-
0.05
-
0.05
V
10 V
-
0.05
-
0.05
-
0.05
V
15 V
-
0.05
-
0.05
-
0.05
V
VO = 2.5 V
5V
-
1.7
-
1.4
-
1.1
mA
VO = 4.6 V
5V
-
0.52
-
0.44
-
0.36 mA
VO = 9.5 V
10 V
-
1.3
-
1.1
-
0.9
mA
VO = 13.5 V
15 V
-
3.6
-
3.0
-
2.4
mA
VO = 0.4 V
5V
0.52
-
0.44
-
0.36
-
mA
VO = 0.5 V
10 V
1.3
-
1.1
-
0.9
-
mA
VO = 1.5 V
15 V
3.6
-
3.0
-
2.4
-
mA
15 V
-
0.3
-
0.3
-
1.0
A
IO < 1 A
IO = 0 A
input capacitance
5V
-
20
-
20
-
150
A
10 V
-
40
-
40
-
300
A
15 V
-
80
-
80
-
600
A
-
-
-
7.5
-
-
pF
-
10. Dynamic characteristics
Table 7.
Dynamic characteristics
VSS = 0 V; Tamb = 25 C.
Symbol Parameter
tPHL
HIGH to LOW
propagation delay
Conditions
VDD
An to Yn;
see Figure 4
5V
[1]
10 V
15 V
tPLH
LOW to HIGH
propagation delay
HEF4028B
Product data sheet
An to Yn;
see Figure 4
5V
[1]
Extrapolation formula
Min
Typ
Max
Unit
73 ns + (0.55 ns/pF)CL
-
100
200
ns
29 ns + (0.23 ns/pF)CL
-
40
80
ns
22 ns + (0.16 ns/pF)CL
-
30
60
ns
63 ns + (0.55 ns/pF)CL
-
90
180
ns
10 V
29 ns + (0.23 ns/pF)CL
-
40
80
ns
15 V
22 ns + (0.16 ns/pF)CL
-
30
60
ns
All information provided in this document is subject to legal disclaimers.
Rev. 9 — 23 March 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
5 of 12
HEF4028B
NXP Semiconductors
BCD to decimal decoder
Table 7.
Dynamic characteristics …continued
VSS = 0 V; Tamb = 25 C.
Symbol Parameter
tt
[1]
Conditions
transition time
VDD
see Figure 4
Extrapolation formula
Min
Typ
Max
Unit
10 ns + (1.00 ns/pF)CL
-
60
120
ns
10 V
9 ns + (0.42 ns/pF)CL
-
30
60
ns
15 V
6 ns + (0.28 ns/pF)CL
-
20
40
ns
5V
[1]
The typical values of the propagation delay and transition times are calculated from the extrapolation formulas shown (CL in pF).
Table 8.
Dynamic power dissipation PD
PD can be calculated from the formulas shown. VSS = 0 V; tr = tf 20 ns; Tamb = 25 C.
Symbol
Parameter
dynamic power
dissipation
PD
VDD
Typical formula for PD (W)
5V
PD = 350 fi + (fo CL) VDD
10 V
15 V
where:
2
fi = input frequency in MHz;
PD = 2200 fi + (fo CL) VDD
2
fo = output frequency in MHz;
PD = 7350 fi + (fo CL) VDD
2
CL = output load capacitance in pF;
VDD = supply voltage in V;
(fo CL) = sum of the outputs.
11. Waveforms
9,
$QLQSXW
90
966
W3+/
92+
WW
W3/+
90
<QRXWSXW
92/
W7+/
W7/+
DDK
Output shown going high when address input goes low, see Table 3.
Measurement points are given in Table 9.
Logic levels: VOL and VOH are typical output voltage levels that occur with the output load.
Fig 4.
Input rise and fall times, propagation delays and output transition times
Table 9.
Measurement points
Supply voltage
Input
Output
VDD
VM
VM
5 V to 15 V
0.5VDD
0.5VDD
HEF4028B
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 9 — 23 March 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
6 of 12
HEF4028B
NXP Semiconductors
BCD to decimal decoder
W:
9,
QHJDWLYH
SXOVH
90
90
9
9,
WI
WU
WU
WI
SRVLWLYH
SXOVH
90
90
9
W:
DDM
a. Input waveforms
9''
*
9,
92
'87
&/
57
DDJ
b. Test circuit
Test data is given in Table 10.
Definitions for test circuit:
DUT = Device Under Test;
CL = load capacitance including jig and probe capacitance;
RT = termination resistance should be equal to the output impedance Zo of the pulse generator.
Fig 5.
Test circuit for measuring switching times
Table 10.
Test data
Supply voltage
Input
VDD
VI
tr, tf
CL
5 V to 15 V
VSS or VDD
20 ns
50 pF
HEF4028B
Product data sheet
Load
All information provided in this document is subject to legal disclaimers.
Rev. 9 — 23 March 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
7 of 12
HEF4028B
NXP Semiconductors
BCD to decimal decoder
12. Package outline
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Package outline SOT109-1 (SO16)
HEF4028B
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 9 — 23 March 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
8 of 12
HEF4028B
NXP Semiconductors
BCD to decimal decoder
13. Abbreviations
Table 11.
Abbreviations
Acronym
Description
BCD
Binary Coded Decimal
BCO
Binary Coded Octal
14. Revision history
Table 12.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
HEF4028B v.9
20160323
Product data sheet
-
HEF4028B v.8
Modifications:
HEF4028B v.8
Modifications:
•
Type number HEF4028BP (SOT38-4) removed.
20111117
•
•
•
Product data sheet
-
HEF4028B v.7
Legal pages updated.
Changes in “General description” and “Features and benefits”.
Section “Applications” removed.
HEF4028B v.7
20111010
Product data sheet
-
HEF4028B v.6
HEF4028B v.6
20091125
Product data sheet
-
HEF4028B v.5
HEF4028B v.5
20090707
Product data sheet
-
HEF4028B v.4
HEF4028B v.4
20090304
Product data sheet
-
HEF4028B_CNV v.3
HEF4028B_CNV v.3
19950101
Product specification
-
HEF4028B_CNV v.2
HEF4028B_CNV v.2
19950101
Product specification
-
-
HEF4028B
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 9 — 23 March 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
9 of 12
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NXP Semiconductors
BCD to decimal decoder
15. Legal information
15.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
15.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
15.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
HEF4028B
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 9 — 23 March 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
10 of 12
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BCD to decimal decoder
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
15.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
16. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
HEF4028B
Product data sheet
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Rev. 9 — 23 March 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
11 of 12
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NXP Semiconductors
BCD to decimal decoder
17. Contents
1
2
3
4
5
5.1
5.2
6
7
8
9
10
11
12
13
14
15
15.1
15.2
15.3
15.4
16
17
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 1
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
Functional description . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
Recommended operating conditions. . . . . . . . 4
Static characteristics. . . . . . . . . . . . . . . . . . . . . 5
Dynamic characteristics . . . . . . . . . . . . . . . . . . 5
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 9
Legal information. . . . . . . . . . . . . . . . . . . . . . . 10
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Contact information. . . . . . . . . . . . . . . . . . . . . 11
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP Semiconductors N.V. 2016.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 23 March 2016
Document identifier: HEF4028B