Reliability Report

AOS Semiconductor
Product Reliability Report
AON7200,
rev B
Plastic Encapsulated Device
ALPHA & OMEGA Semiconductor, Inc
www.aosmd.com
This AOS product reliability report summarizes the qualification result for AON7200.
Accelerated environmental tests are performed on a specific sample size, and then followed
by electrical test at end point. Review of final electrical test result confirms that AON7200
passes AOS quality and reliability requirements.
Table of Contents:
I.
II.
III.
IV.
Product Description
Package and Die information
Environmental Stress Test Summary and Result
Reliability Evaluation
I. Product Description:
General Description
The AON7200 uses trench MOSFET technology that is uniquely optimized to provide the
most efficient high frequency switching performance. Conduction and switching losses are
minimized due to an extremely low combination of RDS(ON) and Crss.
RoHS and Halogen-Free Compliant
Detailed information refers to datasheet.
II. Die / Package Information:
AON7200
Standard sub-micron
Low voltage N channel
Package Type
DFN 3x3 EP
Lead Frame
Cu
Die Attach
Ag epoxy
Bonding
Cu wire
Mold Material
Epoxy resin with silica filler
MSL (moisture sensitive level) Level 1 based on J-STD-020
Process
III. Result of Reliability Stress for AON7200
Test Item
Test Condition
Time
Point
Lot
Attribution
Total
Sample
size
Number
of
Failures
MSL
Precondition
168hr 85°c
/85%RH +3 cycle
reflow@260°c
HTGB
Standard
-
12 lots
2618pcs
0
JESD22A113
Temp = 150 c,
Vgs=100% of
Vgsmax
168hrs
500hrs
1000 hrs
3 lots
3 lots
3 lots
693pcs
0
JESD22A108
HTRB
Temp = 150 c,
Vds=80% of
Vdsmax
168hrs
500hrs
1000 hrs
(Note A*)
3 lots
3 lots
3 lots
77pcs / lot
693pcs
0
JESD22A108
HAST
130c, 85%RH,
33.3 psi, Vds =
80% of Vdsmax
96 hrs
(Note A*)
11 lots
77pcs / lot
847pcs
0
JESD22A110
Pressure Pot
121c, 29.7psi,
RH=100%
96 hrs
(Note A*)
11 lots
77pcs / lot
847pcs
0
JESD22A102
Temperature
Cycle
-65c to 150c,
air to air
250 / 500
cycles
(Note A*)
12 lots
77pcs / lot
924pcs
0
JESD22A104
(Note A*)
77pcs / lot
Note A: The reliability data presents total of available generic data up to the published date.
IV. Reliability Evaluation
FIT rate (per billion): 4.57
MTTF = 24953 years
The presentation of FIT rate for the individual product reliability is restricted by the actual
burn-in sample size of the selected product (AON7200). Failure Rate Determination is based
on JEDEC Standard JESD 85. FIT means one failure per billion hours.
2
9
Failure Rate = Chi x 10 / [2 (N) (H) (Af)]
9
= 1.83 x 10 / [2x (6x77x168 +6x77x500 +6x77x1000) x259] = 4.57
9
8
MTTF = 10 / FIT = 2.19 x 10 hrs = 24953 years
Chi²= Chi Squared Distribution, determined by the number of failures and confidence interval
N = Total Number of units from HTRB and HTGB tests
H = Duration of HTRB/HTGB testing
Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C)
Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)]
Acceleration Factor ratio list:
55 deg C
70 deg C
85 deg C
100 deg C
115 deg C
Af
259
87
32
13
5.64
Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16
Tj u = The use junction temperature in degree (Kelvin), K = C+273.16
-5
K = Boltzmann’s constant, 8.617164 X 10 eV / K
130 deg C
150 deg C
2.59
1