Material Content Data Sheet Umbrella Spec Date Revision Construction element chip Base plate and substrate including metallisation wire encapsulation housing lead, finish and plating Econo 2 C 2012-1-20 3.0 RoHS compliant Material group Materials Average CAS-Nr. Sum [%] if applicable mass [%]* inorganic material silicon 7440-21-3 0,2 0,2 non noble metal inorganic material non noble metal noble metal non noble metal non noble metal non noble metal non noble metal non noble metal polymers polymers inorganic material plastics plastics inorganic material non noble metal non noble metal noble metal non noble metal copper aluminium oxid tin silver nickel magnesium cobalt copper zink alloy aluminium silicone gel PBT antimonytrioxide brominated resin chlorinated resin silicondioxide / glasfiber copper tin silver nickel 7440-50-8 1344-28-1 7440-31-5 7440-22-4 7440-02-0 7439-95-4 7440-48-4 61 1,6 0,9 0,2 66 lead oxide copper tin silver 1317-36-8 7440-50-8 7440-31-5 7440-22-4 smd (including thermistors, resistors and shunts) inorganic material non noble metal non noble metal noble metal deviation <25% Weight range of product Fluctuation margin Yes Traces X X X 2,3 7429-90-5 1309-64-4 7440-50-8 7440-31-5 7440-22-4 7440-02-0 X 8,1 12,7 1,3 0,9 0,6 6,5 3,6 8,1 22 3,6 X X X 0,05 0,05 RoHS compliant X X X Sum in total 100 183,5 <25% *) related to component weight **) Weight of particular product, see technical product information Important Remarks: 1) This document provides full declaration of all materials present in Infineon products above a threshold of 0,1 % b.w. (1000 ppm). 2) Trace concentrations (i.e. < 0,1 % b.w) present in products are marked with an "X" as far as they represent substances-of-concern. A list of substances-of-concern can be found at http://www.infineon.com/soc. 3) All statements are based on our present knowledge and are subject to change at any time due to technical requirements and development. Company Address Internet Comment Infineon Technologies 81726 München www.infineon.com