Material Content Data Sheet Umbrella Spec Date Revision Construction element chip Base plate and substrate including metallisation wire encapsulation housing lead, finish and plating smd (including thermistors, resistors and shunts) deviation EconoDUAL 2012-08-28 4.0 TM 3 RoHS compliant Material group Materials CAS-Nr. Average if applicable mass [%]* Sum [%] inorganic material silicon 7440-21-3 0,3 0,3 non noble metal inorganic material non noble metal noble metal non noble metal non noble metal polymers polymers inorganic material plastics plastics inorganic material non noble metal ferrous metal non noble metal non noble metal noble metal non noble metal non noble metal copper aluminium oxid tin silver nickel aluminium silicone gel PBT antimonytrioxide brominated resin chlorinated resin silicondioxide / glasfiber copper steel zinc tin silver nickel aluminium 7440-50-8 1344-28-1 7440-31-5 7440-22-4 7440-02-0 7429-90-5 59,1 1,2 2,4 0,1 0,1 1,4 9,6 8,1 0,9 0,6 0,4 4,2 7,5 2,7 1,4 62,9 inorganic material non noble metal non noble metal noble metal <25% lead oxide copper tin silver 1317-36-8 7440-50-8 7440-31-5 7440-22-4 Weight range of product Fluctuation margin 1309-64-4 7440-50-8 7440-66-6 7440-31-5 7440-22-4 7440-02-0 7429-90-5 Yes Traces 1,4 9,6 14,2 11,6 X X X X 0,01 0,01 RoHS compliant X X X Sum in total 100,0 356 <25% *) related to component weight **) Weight of particular product, see technical product information Important Remarks: 1) This document provides full declaration of all materials present in Infineon products above a threshold of 0,1 % b.w. (1000 ppm). 2) Trace concentrations (i.e. < 0,1 % b.w) present in products are marked with an "X" as far as they represent substances-of-concern. A list of substances-of-concern can be found at http://www.infineon.com/soc. 3) All statements are based on our present knowledge and are subject to change at any time due to technical requirements and development. Company Address Internet Comment Infineon Technologies AG 81726 München www.infineon.com