Data Sheet

BAS16LD
Single high-speed switching diode
Rev. 1 — 12 October 2010
Product data sheet
1. Product profile
1.1 General description
Single high-speed switching diode, encapsulated in a SOD882D leadless ultra small
Surface-Mounted Device (SMD) plastic package with visible and solderable side pads.
1.2 Features and benefits
„ High switching speed: trr ≤ 4 ns
„ Low leakage current
„ Repetitive peak reverse voltage:
VRRM ≤ 100 V
„ AEC-Q101 qualified
„ Low capacitance
„ Reverse voltage: VR ≤ 100 V
„ Ultra small and leadless SMD plastic
package
„ Solderable side pads
1.3 Applications
„ High-speed switching
„ General-purpose switching
1.4 Quick reference data
Table 1.
Symbol
Quick reference data
Parameter
IF
forward current
IR
reverse current
VR
reverse voltage
trr
reverse recovery time
Conditions
[1]
VR = 80 V
[2]
Min
Typ
Max
Unit
-
-
215
mA
-
-
0.5
μA
-
-
100
V
-
-
4
ns
[1]
Device mounted on an FR4 Printed-Circuit Board (PCB) with 60 μm copper strip line.
[2]
When switched from IF = 10 mA to IR = 10 mA; RL = 100 Ω; measured at IR = 1 mA.
BAS16LD
NXP Semiconductors
Single high-speed switching diode
2. Pinning information
Table 2.
Pinning
Pin
Description
1
cathode
2
anode
Simplified outline
Graphic symbol
[1]
1
2
1
2
006aab040
Transparent
top view
[1]
The marking bar indicates the cathode.
3. Ordering information
Table 3.
Ordering information
Type number
BAS16LD
Package
Name
Description
Version
-
leadless ultra small plastic package; 2 terminals;
body 1.0 × 0.6 × 0.4 mm
SOD882D
4. Marking
Table 4.
Marking codes
Type number
Marking code[1]
BAS16LD
1000
0000
[1]
For SOD882D binary marking code description, see Figure 1.
4.1 Binary marking code description
CATHODE BAR
READING DIRECTION
VENDOR CODE
READING EXAMPLE:
0111
1011
MARKING CODE
(EXAMPLE)
READING DIRECTION
006aac477
Fig 1.
BAS16LD
Product data sheet
SOD882D binary marking code description
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 12 October 2010
© NXP B.V. 2010. All rights reserved.
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BAS16LD
NXP Semiconductors
Single high-speed switching diode
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
VRRM
repetitive peak reverse
voltage
VR
reverse voltage
Conditions
Min
Max
Unit
-
100
V
-
100
V
215
mA
-
500
mA
tp = 1 μs
-
4
A
tp = 1 ms
-
1
A
-
0.5
A
-
250
mW
[1]
IF
forward current
IFRM
repetitive peak forward
current
tp ≤ 0.5 μs;
δ ≤ 0.25
IFSM
non-repetitive peak forward
current
square wave
[2]
tp = 1 s
Tamb ≤ 25 °C
[1][3]
Ptot
total power dissipation
Tj
junction temperature
-
150
°C
Tamb
ambient temperature
−55
+150
°C
Tstg
storage temperature
−65
+150
°C
[1]
Device mounted on an FR4 PCB with 60 μm copper strip line.
[2]
Tj = 25 °C prior to surge.
[3]
Reflow soldering is the only recommended soldering method.
6. Thermal characteristics
Table 6.
Symbol
Rth(j-a)
BAS16LD
Product data sheet
Thermal characteristics
Parameter
thermal resistance from
junction to ambient
Conditions
in free air
[1]
Device mounted on an FR4 PCB with 60 μm copper strip line.
[2]
Reflow soldering is the only recommended soldering method.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 12 October 2010
[1][2]
Min
Typ
Max
Unit
-
-
500
K/W
© NXP B.V. 2010. All rights reserved.
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BAS16LD
NXP Semiconductors
Single high-speed switching diode
7. Characteristics
Table 7.
Characteristics
Tamb = 25 °C unless otherwise specified.
Symbol
VF
IR
Product data sheet
Conditions
Min
Typ
Max
IF = 1 mA
-
-
715
mV
IF = 10 mA
-
-
855
mV
IF = 50 mA
-
-
1
V
IF = 150 mA
-
-
1.25
V
VR = 25 V
-
-
30
nA
VR = 80 V
-
-
0.5
μA
VR = 25 V; Tj = 150 °C
-
-
30
μA
VR = 80 V; Tj = 150 °C
-
-
50
μA
forward voltage
reverse current
Unit
[1]
Cd
diode capacitance
-
-
1.5
pF
trr
reverse recovery time
[2]
-
-
4
ns
forward recovery voltage
[3]
-
-
1.75
V
VFR
BAS16LD
Parameter
f = 1 MHz; VR = 0 V
[1]
Pulse test: tp ≤ 300 μs; δ ≤ 0.02.
[2]
When switched from IF = 10 mA to IR = 10 mA; RL = 100 Ω; measured at IR = 1 mA.
[3]
When switched from IF = 10 mA; tr = 20 ns.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 12 October 2010
© NXP B.V. 2010. All rights reserved.
4 of 11
BAS16LD
NXP Semiconductors
Single high-speed switching diode
006aab132
103
IF
(mA)
mbg704
102
IFSM
(A)
102
10
10
1
(1)
(2)
(3)
(4)
1
10−1
10−1
0
0.2
0.4
0.6
0.8
1.0
1
1.2
1.4
VF (V)
10
102
103
104
tp (μs)
(1) Tamb = 150 °C
Based on square wave currents.
(2) Tamb = 85 °C
Tj = 25 °C; prior to surge
(3) Tamb = 25 °C
(4) Tamb = −40 °C
Fig 2.
Forward current as a function of forward
voltage; typical values
Fig 3.
006aab133
102
IR
(μA)
10
(1)
1
(2)
Non-repetitive peak forward current as a
function of pulse duration; maximum values
mbg446
0.8
Cd
(pF)
0.6
10−1
0.4
(3)
10−2
10−3
0.2
10−4
(4)
10−5
0
0
20
40
60
80
0
100
4
8
VR (V)
(1) Tamb = 150 °C
12
VR (V)
16
f = 1 MHz; Tamb = 25 °C
(2) Tamb = 85 °C
(3) Tamb = 25 °C
(4) Tamb = −40 °C
Fig 4.
Reverse current as a function of reverse
voltage; typical values
BAS16LD
Product data sheet
Fig 5.
Diode capacitance as a function of reverse
voltage; typical values
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 12 October 2010
© NXP B.V. 2010. All rights reserved.
5 of 11
BAS16LD
NXP Semiconductors
Single high-speed switching diode
8. Test information
tr
tp
t
D.U.T.
10 %
+ IF
IF
RS = 50 Ω
SAMPLING
OSCILLOSCOPE
trr
t
Ri = 50 Ω
V = VR + IF × RS
(1)
90 %
VR
mga881
input signal
output signal
(1) IR = 1 mA
Input signal: reverse pulse rise time tr = 0.6 ns; reverse voltage pulse duration tp = 100 ns; duty cycle δ = 0.05
Oscilloscope: rise time tr = 0.35 ns
Fig 6.
Reverse recovery time test circuit and waveforms
I
1 kΩ
RS = 50 Ω
D.U.T.
450 Ω
I
V
90 %
OSCILLOSCOPE
VFR
Ri = 50 Ω
10 %
t
tr
t
tp
input signal
output signal
mga882
Input signal: forward pulse rise time tr = 20 ns; forward current pulse duration tp ≥ 100 ns; duty cycle δ ≤ 0.005
Fig 7.
Forward recovery voltage test circuit and waveforms
BAS16LD
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 12 October 2010
© NXP B.V. 2010. All rights reserved.
6 of 11
BAS16LD
NXP Semiconductors
Single high-speed switching diode
9. Package outline
0.65
0.55
0.4
max
2
0.30
0.22
0.65
1.05
0.95
1
0.30
0.22
0.55
0.45
cathode marking on top side
Dimensions in mm
Fig 8.
10-08-06
Package outline BAS16LD (SOD882D)
10. Packing information
Table 8.
Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number
Package
Description
Packing quantity
10000
BAS16LD
[1]
SOD882D
2 mm pitch, 8 mm tape and reel
-315
For further information and the availability of packing methods, see Section 14.
11. Soldering
1.4
0.2
solder lands
0.8
(2×)
0.6
(2×)
0.7
(2×)
solder resist
solder paste
Dimensions in mm
0.3
0.4
1
1.3
sod882d_fr
Reflow soldering is the only recommended soldering method.
Fig 9.
BAS16LD
Product data sheet
Reflow soldering footprint BAS16LD (SOD882D)
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 12 October 2010
© NXP B.V. 2010. All rights reserved.
7 of 11
BAS16LD
NXP Semiconductors
Single high-speed switching diode
12. Revision history
Table 9.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
BAS16LD v.1
20101012
Product data sheet
-
-
BAS16LD
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 12 October 2010
© NXP B.V. 2010. All rights reserved.
8 of 11
BAS16LD
NXP Semiconductors
Single high-speed switching diode
13. Legal information
13.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
13.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
BAS16LD
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 12 October 2010
© NXP B.V. 2010. All rights reserved.
9 of 11
BAS16LD
NXP Semiconductors
Single high-speed switching diode
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
14. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
BAS16LD
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 12 October 2010
© NXP B.V. 2010. All rights reserved.
10 of 11
BAS16LD
NXP Semiconductors
Single high-speed switching diode
15. Contents
1
1.1
1.2
1.3
1.4
2
3
4
4.1
5
6
7
8
9
10
11
12
13
13.1
13.2
13.3
13.4
14
15
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Binary marking code description. . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Thermal characteristics . . . . . . . . . . . . . . . . . . 3
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Test information . . . . . . . . . . . . . . . . . . . . . . . . . 6
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7
Packing information . . . . . . . . . . . . . . . . . . . . . 7
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 8
Legal information. . . . . . . . . . . . . . . . . . . . . . . . 9
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Contact information. . . . . . . . . . . . . . . . . . . . . 10
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 12 October 2010
Document identifier: BAS16LD