PMBD914 Single high-speed switching diode Rev. 06 — 11 February 2009 Product data sheet 1. Product profile 1.1 General description Single high-speed switching diode, fabricated in planar technology, and encapsulated in a small Surface-Mounted Device (SMD) plastic package. Table 1. Product overview Type number[1] PMBD914 Package NXP JEDEC SOT23 TO-236AB PMBD914/DG [1] /DG: halogen-free 1.2 Features n High switching speed: trr ≤ 4 ns n Low leakage current n Repetitive peak reverse voltage: VRRM ≤ 100 V n Low capacitance: Cd ≤ 1.5 pF n Reverse voltage: VR ≤ 100 V n Small SMD plastic package 1.3 Applications n High-speed switching 1.4 Quick reference data Table 2. Quick reference data Symbol Parameter IF forward current VR reverse voltage trr reverse recovery time Conditions [1] [2] Min Typ Max Unit - - 215 mA - - 100 V - - 4 ns [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. [2] When switched from IF = 10 mA to IR = 10 mA; RL = 100 Ω; measured at IR = 1 mA. PMBD914 NXP Semiconductors Single high-speed switching diode 2. Pinning information Table 3. Pinning Pin Description 1 anode 2 not connected 3 cathode Simplified outline Graphic symbol 3 3 1 1 2 006aaa764 2 3. Ordering information Table 4. Ordering information Type number[1] PMBD914 Package Name Description Version - plastic surface-mounted package; 3 leads SOT23 PMBD914/DG [1] /DG: halogen-free 4. Marking Table 5. Marking codes Type number Marking code[1] PMBD914 *5D PMBD914/DG YB* [1] * = -: made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China 5. Limiting values Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VRRM repetitive peak reverse voltage VR reverse voltage IF forward current IFRM repetitive peak forward current IFSM non-repetitive peak forward current Conditions Min Max Unit - 100 V - 100 V - 215 mA - 500 mA tp = 1 µs - 4 A tp = 1 ms - 1 A tp = 1 s - 0.5 A [1] square wave PMBD914_6 Product data sheet [2] © NXP B.V. 2009. All rights reserved. Rev. 06 — 11 February 2009 2 of 10 PMBD914 NXP Semiconductors Single high-speed switching diode Table 6. Limiting values …continued In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit Ptot total power dissipation Tamb ≤ 25 °C - 250 mW Tj junction temperature - 150 °C Tstg storage temperature −65 +150 °C [1][3] [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Tj = 25 °C prior to surge. [3] Soldering point of cathode tab. 6. Thermal characteristics Table 7. Thermal characteristics Symbol Parameter Conditions Rth(j-a) thermal resistance from junction to ambient in free air Rth(j-t) thermal resistance from junction to tie-point Min Typ Max Unit [1] - - 500 K/W [2] - - 330 K/W [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Soldering point of cathode tab. 7. Characteristics Table 8. Characteristics Tamb = 25 °C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit VF forward voltage IF = 1 mA - - 715 mV IF = 10 mA - - 855 mV IF = 50 mA - - 1 V IF = 150 mA - - 1.25 V VR = 25 V - - 25 nA VR = 75 V - - 1 µA VR = 25 V; Tj = 150 °C - - 30 µA VR = 75 V; Tj = 150 °C - - 50 µA IR Cd trr VFR reverse current diode capacitance f = 1 MHz; VR = 0 V - - 1.5 pF reverse recovery time [1] - - 4 ns forward recovery voltage [2] - - 1.75 V [1] When switched from IF = 10 mA to IR = 10 mA; RL = 100 Ω; measured at IR = 1 mA. [2] When switched from IF = 10 mA; tr = 20 ns. PMBD914_6 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 06 — 11 February 2009 3 of 10 PMBD914 NXP Semiconductors Single high-speed switching diode mbg382 300 IF (mA) IFSM (A) (1) (2) (3) 200 10 100 1 0 mbg704 102 10−1 0 1 VF (V) 2 1 10 102 103 104 tp (µs) (1) Tamb = 150 °C; typical values Based on square wave currents. (2) Tamb = 25 °C; typical values Tj = 25 °C; prior to surge (3) Tamb = 25 °C; maximum values Fig 1. Forward current as a function of forward voltage Fig 2. mga884 105 Non-repetitive peak forward current as a function of pulse duration; maximum values mbg446 0.8 Cd (pF) IR (nA) (1) 104 0.6 (2) 103 0.4 (3) 102 10 0.2 0 0 100 Tj (°C) 0 200 4 8 12 VR (V) 16 f = 1 MHz; Tamb = 25 °C (1) VR = 75 V; maximum values (2) VR = 75 V; typical values (3) VR = 25 V; typical values Fig 3. Reverse current as a function of junction temperature Fig 4. Diode capacitance as a function of reverse voltage; typical values PMBD914_6 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 06 — 11 February 2009 4 of 10 PMBD914 NXP Semiconductors Single high-speed switching diode msa562 250 IF (mA) 200 150 100 50 0 0 50 100 150 200 Tamb (°C) FR4 PCB, standard footprint Fig 5. Forward current as a function of ambient temperature; derating curve 8. Test information tr tp t D.U.T. 10 % + IF IF RS = 50 Ω SAMPLING OSCILLOSCOPE V = VR + IF × RS trr t Ri = 50 Ω (1) 90 % VR mga881 input signal output signal (1) IR = 1 mA Fig 6. Reverse recovery time test circuit and waveforms I 1 kΩ RS = 50 Ω D.U.T. 450 Ω I V 90 % OSCILLOSCOPE VFR Ri = 50 Ω 10 % t tr t tp input signal output signal mga882 Fig 7. Forward recovery voltage test circuit and waveforms PMBD914_6 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 06 — 11 February 2009 5 of 10 PMBD914 NXP Semiconductors Single high-speed switching diode 9. Package outline 3.0 2.8 1.1 0.9 3 0.45 0.15 2.5 1.4 2.1 1.2 1 2 1.9 0.48 0.38 Dimensions in mm Fig 8. 0.15 0.09 04-11-04 Package outline SOT23 (TO-236AB) 10. Packing information Table 9. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number[2] Package PMBD914 SOT23 Description 4 mm pitch, 8 mm tape and reel Packing quantity 3000 10000 -215 -235 PMBD914/DG [1] For further information and the availability of packing methods, see Section 14. [2] /DG: halogen-free PMBD914_6 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 06 — 11 February 2009 6 of 10 PMBD914 NXP Semiconductors Single high-speed switching diode 11. Soldering 3.3 2.9 1.9 solder lands solder resist 3 2 1.7 solder paste 0.6 (3×) 0.7 (3×) occupied area Dimensions in mm 0.5 (3×) 0.6 (3×) 1 Fig 9. sot023_fr Reflow soldering footprint SOT23 (TO-236AB) 2.2 1.2 (2×) 1.4 (2×) solder lands 4.6 solder resist 2.6 occupied area Dimensions in mm 1.4 preferred transport direction during soldering 2.8 4.5 sot023_fw Fig 10. Wave soldering footprint SOT23 (TO-236AB) PMBD914_6 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 06 — 11 February 2009 7 of 10 PMBD914 NXP Semiconductors Single high-speed switching diode 12. Revision history Table 10. Revision history Document ID Release date Data sheet status Change notice Supersedes PMBD914_6 20090211 Product data sheet - PMBD914_5 Modifications: • • Type number PMBD914/DG added Section 13 “Legal information”: updated PMBD914_5 20071126 Product data sheet - PMBD914_4 PMBD914_4 20040106 Product specification - PMBD914_3 PMBD914_3 19990511 Product specification - PMBD914_2 PMBD914_2 19960918 Product specification - PMBD914_1 PMBD914_1 19960404 Product specification - - PMBD914_6 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 06 — 11 February 2009 8 of 10 PMBD914 NXP Semiconductors Single high-speed switching diode 13. Legal information 13.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 13.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 13.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 13.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 14. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] PMBD914_6 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 06 — 11 February 2009 9 of 10 PMBD914 NXP Semiconductors Single high-speed switching diode 15. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 11 12 13 13.1 13.2 13.3 13.4 14 15 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description. . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 Thermal characteristics. . . . . . . . . . . . . . . . . . . 3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 5 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6 Packing information. . . . . . . . . . . . . . . . . . . . . . 6 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 8 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 9 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Contact information. . . . . . . . . . . . . . . . . . . . . . 9 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2009. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 11 February 2009 Document identifier: PMBD914_6