MMBD4148 High-speed switching diode Rev. 01 — 4 June 2009 Product data sheet 1. Product profile 1.1 General description High-speed switching diode, encapsulated in a small SOT23 (TO-236AB) Surface-Mounted Device (SMD) plastic package. 1.2 Features n High switching speed: trr ≤ 4 ns n Low leakage current n Repetitive peak reverse voltage: VRRM ≤ 75 V n Low capacitance n Reverse voltage: VR ≤ 75 V n Small SMD plastic package 1.3 Applications n High-speed switching n General-purpose switching 1.4 Quick reference data Table 1. Quick reference data Symbol Parameter VR reverse voltage IR reverse current trr reverse recovery time [1] Conditions VR = 75 V [1] Min Typ Max Unit - - 75 V - - 0.5 µA - - 4 ns When switched from IF = 10 mA to IR = 10 mA; RL = 100 Ω; measured at IR = 1 mA. 2. Pinning information Table 2. Pinning Pin Description 1 anode 2 not connected 3 cathode Simplified outline Graphic symbol 3 3 1 1 2 2 006aaa764 MMBD4148 NXP Semiconductors High-speed switching diode 3. Ordering information Table 3. Ordering information Type number MMBD4148 Package Name Description Version - plastic surface-mounted package; 3 leads SOT23 4. Marking Table 4. Marking codes Type number Marking code[1] MMBD4148 A6* [1] * = -: made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China 5. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VRRM repetitive peak reverse voltage Conditions VR reverse voltage [1] IF forward current IFRM repetitive peak forward current tp ≤ 0.5 µs; δ ≤ 0.25 IFSM non-repetitive peak forward current square wave Max Unit 75 V - 75 V - 215 mA - 500 mA [2] tp = 1 µs - 4 A tp = 1 ms - 1 A - 0.5 A - 250 mW tp = 1 s Tamb ≤ 25 °C [1] Ptot total power dissipation Tj junction temperature - 150 °C Tamb ambient temperature −65 +150 °C Tstg storage temperature −65 +150 °C [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. [2] Tj = 25 °C prior to surge. MMBD4148_1 Product data sheet Min - © NXP B.V. 2009. All rights reserved. Rev. 01 — 4 June 2009 2 of 10 MMBD4148 NXP Semiconductors High-speed switching diode 6. Thermal characteristics Table 6. Symbol Thermal characteristics Parameter Conditions Rth(j-a) thermal resistance from junction to ambient Rth(j-t) thermal resistance from junction to tie-point [1] in free air [1] Min Typ Max Unit - - 500 K/W - - 330 K/W Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. 7. Characteristics Table 7. Characteristics Tamb = 25 °C unless otherwise specified. Symbol Parameter VF forward voltage IR Cd trr VFR Conditions reverse current diode capacitance Min Typ Max Unit IF = 1 mA - - 715 mV IF = 10 mA - - 855 mV IF = 50 mA - - 1 V IF = 150 mA - - 1.25 V VR = 25 V - - 30 nA VR = 75 V - - 0.5 µA VR = 25 V; Tj = 150 °C - - 30 µA VR = 75 V; Tj = 150 °C - - 50 µA [1] f = 1 MHz; VR = 0 V - - 1.5 pF reverse recovery time [2] - - 4 ns forward recovery voltage [3] - - 1.75 V [1] Pulse test: tp ≤ 300 µs; δ ≤ 0.02. [2] When switched from IF = 10 mA to IR = 10 mA; RL = 100 Ω; measured at IR = 1 mA. [3] When switched from IF = 10 mA; tr = 20 ns. MMBD4148_1 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 01 — 4 June 2009 3 of 10 MMBD4148 NXP Semiconductors High-speed switching diode 006aab132 103 mbg704 102 IF (mA) IFSM (A) 102 10 10 1 (1) (2) (3) (4) 1 10−1 10−1 0 0.2 0.4 0.6 0.8 1.0 1 1.2 1.4 VF (V) 10 102 103 104 tp (µs) (1) Tamb = 150 °C Based on square wave currents. (2) Tamb = 85 °C Tj = 25 °C; prior to surge (3) Tamb = 25 °C (4) Tamb = −40 °C Fig 1. Forward current as a function of forward voltage; typical values Fig 2. 006aab133 102 IR (µA) 10 (1) 1 (2) Non-repetitive peak forward current as a function of pulse duration; maximum values mbg446 0.8 Cd (pF) 0.6 10−1 0.4 (3) 10−2 10−3 0.2 10−4 (4) 10−5 0 0 20 40 60 80 0 100 4 8 VR (V) (1) Tamb = 150 °C 12 VR (V) 16 f = 1 MHz; Tamb = 25 °C (2) Tamb = 85 °C (3) Tamb = 25 °C (4) Tamb = −40 °C Fig 3. Reverse current as a function of reverse voltage; typical values Fig 4. Diode capacitance as a function of reverse voltage; typical values MMBD4148_1 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 01 — 4 June 2009 4 of 10 MMBD4148 NXP Semiconductors High-speed switching diode 8. Test information tr tp t D.U.T. 10 % + IF IF RS = 50 Ω SAMPLING OSCILLOSCOPE V = VR + IF × RS trr t Ri = 50 Ω (1) 90 % VR mga881 input signal output signal (1) IR = 1 mA Input signal: reverse pulse rise time tr = 0.6 ns; reverse voltage pulse duration tp = 100 ns; duty cycle δ = 0.05 Oscilloscope: rise time tr = 0.35 ns Fig 5. Reverse recovery time test circuit and waveforms I 1 kΩ RS = 50 Ω D.U.T. 450 Ω I V 90 % OSCILLOSCOPE VFR Ri = 50 Ω 10 % t tr t tp input signal output signal mga882 Input signal: forward pulse rise time tr = 20 ns; forward current pulse duration tp ≥ 100 ns; duty cycle δ ≤ 0.005 Fig 6. Forward recovery voltage test circuit and waveforms MMBD4148_1 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 01 — 4 June 2009 5 of 10 MMBD4148 NXP Semiconductors High-speed switching diode 9. Package outline 3.0 2.8 1.1 0.9 3 0.45 0.15 2.5 1.4 2.1 1.2 1 2 1.9 0.48 0.38 Dimensions in mm Fig 7. 0.15 0.09 04-11-04 Package outline MMBD4148 (SOT23/TO-236AB) 10. Packing information Table 8. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number MMBD4148 [1] Package Description SOT23 4 mm pitch, 8 mm tape and reel 3000 10000 -215 -235 For further information and the availability of packing methods, see Section 14. MMBD4148_1 Product data sheet Packing quantity © NXP B.V. 2009. All rights reserved. Rev. 01 — 4 June 2009 6 of 10 MMBD4148 NXP Semiconductors High-speed switching diode 11. Soldering 3.3 2.9 1.9 solder lands solder resist 3 2 1.7 solder paste occupied area 0.6 (3×) 0.7 (3×) Dimensions in mm 0.5 (3×) 0.6 (3×) 1 Fig 8. sot023_fr Reflow soldering footprint MMBD4148 (SOT23/TO-236AB) 2.2 1.2 (2×) 1.4 (2×) solder lands 4.6 solder resist 2.6 occupied area Dimensions in mm 1.4 preferred transport direction during soldering 2.8 4.5 Fig 9. Wave soldering footprint MMBD4148 (SOT23/TO-236AB) MMBD4148_1 Product data sheet sot023_fw © NXP B.V. 2009. All rights reserved. Rev. 01 — 4 June 2009 7 of 10 MMBD4148 NXP Semiconductors High-speed switching diode 12. Revision history Table 9. Revision history Document ID Release date Data sheet status Change notice Supersedes MMBD4148_1 20090604 Product data sheet - - MMBD4148_1 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 01 — 4 June 2009 8 of 10 MMBD4148 NXP Semiconductors High-speed switching diode 13. Legal information 13.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 13.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 13.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 13.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 14. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] MMBD4148_1 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 01 — 4 June 2009 9 of 10 MMBD4148 NXP Semiconductors High-speed switching diode 15. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 11 12 13 13.1 13.2 13.3 13.4 14 15 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description. . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 Thermal characteristics. . . . . . . . . . . . . . . . . . . 3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 5 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6 Packing information. . . . . . . . . . . . . . . . . . . . . . 6 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 8 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 9 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Contact information. . . . . . . . . . . . . . . . . . . . . . 9 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2009. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 4 June 2009 Document identifier: MMBD4148_1