Data Sheet

SO
T4
16
BAS116T
Single low leakage current switching diode
Rev. 2 — 9 July 2012
Product data sheet
1. Product profile
1.1 General description
Single low leakage current switching diode, encapsulated in an ultra small
SOT416 (SC-75) Surface-Mounted Device (SMD) plastic package.
1.2 Features and benefits
 High switching speed: trr = 0.8 s
 Low leakage current: 3 pA
 Repetitive peak reverse voltage:
VRRM  85 V
 AEC-Q101 qualified
 Low capacitance: Cd = 2 pF
 Reverse voltage: VR  75 V
 Ultra small SMD plastic package
1.3 Applications
 Low leakage current applications
 General-purpose switching
 Voltage clamping
 Reverse polarity protection
1.4 Quick reference data
Table 1.
Quick reference data
Symbol
Parameter
IF
forward current
IR
reverse current
VR
reverse voltage
trr
reverse recovery time
Conditions
[1]
VR = 75 V
[2]
Min
Typ
Max
Unit
-
-
215
mA
-
-
5
nA
-
-
75
V
-
-
3
s
[1]
Pulse test: tp  300 s;   0.02.
[2]
When switched from IF = 10 mA to IR = 10 mA; RL = 100 ; measured at IR = 1 mA.
2. Pinning information
Table 2.
Pinning
Pin
Description
1
anode
2
not connected
3
cathode
Simplified outline
Graphic symbol
3
3
1
2
006aaa764
1
2
BAS116T
NXP Semiconductors
Single low leakage current switching diode
3. Ordering information
Table 3.
Ordering information
Type number
BAS116T
Package
Name
Description
Version
SC-75
plastic surface-mounted package; 3 leads
SOT416
4. Marking
Table 4.
Marking codes
Type number
Marking code
BAS116T
ZY
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
BAS116T
Product data sheet
Symbol
Parameter
Conditions
VRRM
repetitive peak reverse
voltage
VR
reverse voltage
Min
Max
Unit
-
85
V
-
75
V
-
215
mA
-
500
mA
tp = 1 s
-
4
A
tp = 1 ms
-
1
A
tp = 1 s
-
0.5
A
-
150
mW
[1]
IF
forward current
IFRM
repetitive peak forward
current
IFSM
non-repetitive peak
forward current
square wave
Tamb  25 C
[2]
[3]
Ptot
total power dissipation
Tj
junction temperature
-
150
C
Tamb
ambient temperature
55
+150
C
Tstg
storage temperature
65
+150
C
[1]
Pulse test: tp  300 s;   0.02.
[2]
Tj = 25 C before surge.
[3]
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 9 July 2012
© NXP B.V. 2012. All rights reserved.
2 of 10
BAS116T
NXP Semiconductors
Single low leakage current switching diode
6. Thermal characteristics
Table 6.
Symbol
Thermal characteristics
Parameter
Conditions
Rth(j-a)
thermal resistance from
junction to ambient
Rth(j-sp)
thermal resistance from
junction to solder point
in free air
Min
Typ
Max
Unit
[1]
-
-
833
K/W
[2]
-
-
350
K/W
[1]
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2]
Soldering point of cathode tab.
7. Characteristics
Table 7.
Characteristics
Tamb = 25 C unless otherwise specified.
Symbol
VF
IR
BAS116T
Product data sheet
Parameter
Conditions
Min
Typ
Max
Unit
[1]
forward voltage
reverse current
trr
reverse recovery
time
Cd
diode capacitance
IF = 1 mA
-
-
0.9
V
IF = 10 mA
-
-
1
V
IF = 50 mA
-
-
1.1
V
IF = 150 mA
-
-
1.25
V
VR = 75 V
-
0.003 5
nA
VR = 75 V; Tj = 150 C
-
3
80
nA
-
0.8
3
s
-
2
-
pF
[2]
VR = 0 V; f = 1 MHz
[1]
Pulse test: tp  300 s;   0.02.
[2]
When switched from IF = 10 mA to IR = 10 mA; RL = 100 ; measured at IR = 1 mA.
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 9 July 2012
© NXP B.V. 2012. All rights reserved.
3 of 10
BAS116T
NXP Semiconductors
Single low leakage current switching diode
mlb755
300
mlb752
300
IF
(mA)
IF
(mA)
200
200
100
100
(1)
(2)
(3)
0
0
0
100
Tamb (°C)
0
200
0.4
0.8
1.2
VF (V)
1.6
(1) Tamb = 150 C; typical values
FR4 PCB, standard footprint
(2) Tamb = 25 C; typical values
(3) Tamb = 25 C; maximum values
Fig 1.
Forward current as a function of ambient
temperature; derating curve
Fig 2.
Forward current as a function of forward
voltage
mbg704
102
IFSM
(A)
10
1
10−1
1
10
102
103
104
tp (μs)
Based on square wave currents.
Tj = 25 C before surge
Fig 3.
Non-repetitive peak forward current as a function of pulse duration; maximum values
BAS116T
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 9 July 2012
© NXP B.V. 2012. All rights reserved.
4 of 10
BAS116T
NXP Semiconductors
Single low leakage current switching diode
mlb754
102
mbg526
2
IR
(nA)
(1)
10
Cd
(pF)
1
1
10−1
(2)
10−2
10−3
0
0
50
100
150
Tj (°C)
200
0
5
10
15
VR (V)
20
f = 1 MHz; Tamb = 25 C
VR = 75 V
(1) Maximum values
(2) Typical values
Fig 4.
Reverse current as a function of junction
temperature
Fig 5.
Diode capacitance as a function of reverse
voltage; typical values
8. Test information
tr
tp
t
D.U.T.
10 %
+ IF
IF
RS = 50 Ω
SAMPLING
OSCILLOSCOPE
V = VR + IF × RS
trr
t
Ri = 50 Ω
VR
(1)
90 %
mga881
input signal
output signal
(1) IR = 1 mA
Fig 6.
Reverse recovery time test circuit and waveforms
8.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is
suitable for use in automotive applications.
BAS116T
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 9 July 2012
© NXP B.V. 2012. All rights reserved.
5 of 10
BAS116T
NXP Semiconductors
Single low leakage current switching diode
9. Package outline
0.95
0.60
1.8
1.4
3
0.45
0.15
1.75 0.9
1.45 0.7
1
2
0.30
0.15
0.25
0.10
1
Dimensions in mm
Fig 7.
04-11-04
Package outline SOT416 (SC-75)
10. Packing information
Table 8.
Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number
BAS116T
[1]
Package Description
SOT416
Packing quantity
4 mm pitch, 8 mm tape and reel
3000
10000
-115
-135
For further information and the availability of packing methods, see Section 14.
11. Soldering
2.2
1.7
solder lands
solder resist
1
0.85
2
solder paste
0.5
(3×)
occupied area
Dimensions in mm
0.6
(3×)
1.3
Fig 8.
BAS116T
Product data sheet
sot416_fr
Reflow soldering footprint SOT416 (SC-75)
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 9 July 2012
© NXP B.V. 2012. All rights reserved.
6 of 10
BAS116T
NXP Semiconductors
Single low leakage current switching diode
12. Revision history
Table 9.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
BAS116T v.2
20120709
Product data sheet
-
BAS116T v.1
Modifications:
BAS116T v.1
BAS116T
Product data sheet
•
•
•
Section 2 “Pinning information”: corrected graphic symbol
Section 8.1 “Quality information”: added
Section 13 “Legal information”: updated
20091214
Product data sheet
-
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 9 July 2012
-
© NXP B.V. 2012. All rights reserved.
7 of 10
BAS116T
NXP Semiconductors
Single low leakage current switching diode
13. Legal information
13.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
13.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
BAS116T
Product data sheet
Suitability for use in automotive applications — This NXP
Semiconductors product has been qualified for use in automotive
applications. Unless otherwise agreed in writing, the product is not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer's own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 9 July 2012
© NXP B.V. 2012. All rights reserved.
8 of 10
BAS116T
NXP Semiconductors
Single low leakage current switching diode
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
14. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
BAS116T
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 9 July 2012
© NXP B.V. 2012. All rights reserved.
9 of 10
BAS116T
NXP Semiconductors
Single low leakage current switching diode
15. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
8.1
9
10
11
12
13
13.1
13.2
13.3
13.4
14
15
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
Thermal characteristics . . . . . . . . . . . . . . . . . . 3
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Test information . . . . . . . . . . . . . . . . . . . . . . . . . 5
Quality information . . . . . . . . . . . . . . . . . . . . . . 5
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6
Packing information . . . . . . . . . . . . . . . . . . . . . 6
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 7
Legal information. . . . . . . . . . . . . . . . . . . . . . . . 8
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 8
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Contact information. . . . . . . . . . . . . . . . . . . . . . 9
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2012.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 9 July 2012
Document identifier: BAS116T