LC87F1HC4B D

LC87F1HC4B
CMOS LSI
8-bit Microcontroller
with USB-host Controller
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128K-byte FROM / 12288-byte RAM / 48-pin
Overview
The LC87F1HC4B is an 8-bit microcomputer that, centered around a CPU
running at a minimum bus cycle time of 83.3ns, integrates on a single chip
a number of hardware features such as 128K-byte flash ROM (onboard
programmable), 12288-byte RAM, an on-chip debugger, a sophisticated
16-bit timer/counter (may be divided into 8-bit timers), a 16-bit timer (may
be divided into 8-bit timers or PWMs), four 8-bit timers with a prescaler, a
base timer serving as a time-of-day clock, 3 channels of synchronous SIO
interface
with
automatic
data
transfer
capabilities,
an
asynchronous/synchronous SIO interface, a UART interface (full duplex),
a full-speed USB interface (host control function), an 8-bit 12-channel AD
converter, 2 channels of 12-bit PWM, a system clock frequency divider, an
infrared remote control receiver circuit, and a 40-source 10-vector interrupt
feature.
Package Form
 SQFP48 : Pb-Free type
Bus Cycle Time
83.3ns (When CF=12MHz)
Note : The bus cycle time here refers to the ROM read speed.
P21/INT4
P20/INT4/INT6
P07/AN7/T7O/LRCK
P06/AN6/T6O/BCLK
P05/AN5/CKO/SDAT
P04/AN4/DBGP2
36
35
34
33
32
31
30
29
28
27
26
25
LC87F1HC4B
24
23
22
21
20
19
18
17
16
15
14
13
P03/AN3/DBGP1
P02/AN2/DBGP0
P01/AN1
P00/AN0
VSS2
VDD2
PWM0/MCLKO
PWM1/MCLKI
P17/T1PWMH/BUZ
P16/T1PWML
P15/SCK1
P14/SI1/SB1
1
2
3
4
5
6
7
8
9
10
11
12
P33/AFILT
P32
P31/URX1
P30/UTX1
P70/INT0/T0LCP/AN8
P71/INT1/T0HCP/AN9
P72/INT2/T0IN
37
38
39
40
41
42
43
44
45
46
47
48
P73/INT3/T0IN/RMIN
RES
XT1/AN10
XT2/AN11
VSS1
CF1
CF2
VDD1
P10/SO0
P11/SI0/SB0
P12/SCK0
P13/SO1
Flash ROM
131072 8 bits
Capable of on-board programming with a wide range of supply voltages
: 3.0 to 5.5V
Block-erasable in 128 byte units
Writes data in 2-byte units
UHDUHD+

VDD3
RAM
VSS3
P34/UFILT
12288  9 bits
P27/INT5/SCK9
P26/INT5/SI9/WR9
P25/INT5/SO9/RD9
Features
P24/INT5/INT7/SCK4
P23/INT4/SI4/WR
P22/INT4/SO4/RD
SPQFP48 7x7 / SQFP48
Top view
* This product is licensed from Silicon Storage Technology, Inc. (USA).
ORDERING INFORMATION
See detailed ordering and shipping information on page 28 of this data sheet.
© Semiconductor Components Industries, LLC, 2014
December 2014 - Rev. 0
1
Publication Order Number :
LC87F1HC4B/D
LC87F1HC4B
Minimum Instruction Cycle Time (tCYC)
250ns (When CF=12MHz)
Ports
I/O ports
Ports whose I/O direction can be designated in 1-bit units 28 (P10 to P17, P20 to P27, P30 to P34,
P70 to P73, PWM0, PWM1, XT2)
Ports whose I/O direction can be designated in 4-bit units 8 (P00 to P07)
USB ports
2 (UHD+, UHD-)
Dedicated oscillator ports
2 (CF1, CF2)
Input-only port (also used for oscillation)
1 (XT1)
Reset pins
1 (RES)
Power supply pins
6 (VSS1 to 3, VDD1 to 3)
Timers
Timer 0: 16-bit timer/counter with 2 capture registers.
Mode 0: 8-bit timer with an 8-bit programmable prescaler (with two 8-bit capture registers)  2 channels
Mode 1: 8-bit timer with an 8-bit programmable prescaler (with two 8-bit capture registers)
+ 8-bit counter (with two 8-bit capture registers)
Mode 2: 16-bit timer with an 8-bit programmable prescaler (with two 16-bit capture registers)
Mode 3: 16-bit counter (with two 16-bit capture registers)
Timer 1: 16-bit timer/counter that supports PWM/toggle outputs
Mode 0: 8-bit timer with an 8-bit prescaler (with toggle outputs) + 8-bit timer/
counter with an 8-bit prescaler (with toggle outputs)
Mode 1: 8-bit PWM with an 8-bit prescaler  2 channels
Mode 2: 16-bit timer/counter with an 8-bit prescaler (with toggle outputs)
(toggle outputs also possible from lower-order 8 bits)
Mode 3: 16-bit timer with an 8-bit prescaler (with toggle outputs)
(lower-order 8 bits may be used as a PWM output)
Timer 4: 8-bit timer with a 6-bit prescaler
Timer 5: 8-bit timer with a 6-bit prescaler
Timer 6: 8-bit timer with a 6-bit prescaler (with toggle outputs)
Timer 7: 8-bit timer with a 6-bit prescaler (with toggle outputs)
Base timer
1) The clock is selectable from the subclock (32.768kHz crystal oscillation), system clock, and timer 0 prescaler
output.
2) Interrupts programmable in 5 different time schemes
SIO
SIO0: Synchronous serial interface
1) LSB first/MSB first mode selectable
2) Transfer clock cycle: 4/3 to 512/3 tCYC
3) Automatic continuous data transmission (1 to 256 bits, specifiable in 1-bit units)
(Suspension and resumption of data transmission possible in 1 byte units)
SIO1: 8-bit asynchronous/synchronous serial interface
Mode 0: Synchronous 8-bit serial I/O (2- or 3-wire configuration, 2 to 512 tCYC transfer clocks)
Mode 1: Asynchronous serial I/O (half-duplex, 8 data bits, 1 stop bit, 8 to 2048 tCYC baudrates)
Mode 2: Bus mode 1 (start bit, 8 data bits, 2 to 512 tCYC transfer clocks)
Mode 3: Bus mode 2 (start detect, 8 data bits, stop detect)
SIO4: Synchronous serial interface
1) LSB first/MSB first mode selectable
2) Transfer clock cycle: 4/3 to 1020/3 tCYC
3) Automatic continuous data transmission (1 to 4096 bytes, specifiable in 1 byte units)
(Suspension and resumption of data transmission possible in 1 byte units or in word units)
4) Auto-start-on-falling-edge function
5) Clock polarity selectable
6) CRC16 calculator circuit built in
Continued on next page.
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LC87F1HC4B
Continued from preceding page.
SIO9: Synchronous serial interface
1) LSB first/MSB first mode selectable
2) Transfer clock cycle: 4/3 to 1020/3 tCYC
3) Automatic continuous data transmission (1 to 4096 bytes, specifiable in 1 byte units)
(Suspension and resumption of data transmission possible in 1 byte units or word units)
4) Auto-start-on-falling-edge function
5) Clock polarity selectable
6) CRC16 calculator circuit built in
Full Duplex UART
1) Data length : 7/8/9 bits selectable
2) Stop bits
: 1 bit (2 bits in continuous transmission mode)
3) Baud rate : 16/3 to 8192/3 tCYC
AD Converter: 8 bits  12 channels
PWM: Multifrequency 12-bit PWM  2 channels
Infrared Remote Control Receiver Circuit
1) Noise rejection function (noise filter time constant: Approx. 120s when the 32.768kHz crystal oscillator is
selected as the base clock)
2) Supports data encoding systems such as PPM (Pulse Position Modulation) and Manchester encoding.
3) X'tal HOLD mode reset function
USB Interface (host control function)
1) Compliant with full-speed (12M bps) specifications
2) Supports 4 transfer types (control transfer, bulk transfer, interrupt transfer, and isochronous transfer).
Audio Interface
1) Sampling frequency (fs)
: 32kHz, 44.1kHz, 48kHz
2) Master clock frequency (internal PLL) : 12.288MHz, 16.9344MHz, 18.432MHz
3) Bit clock selectable
: 48fs/64fs
4) Data bit length
: 16/18/20/24 bits
5) LSB first/MSB firsts selectable
6) Left-justification/right-justification selectable
Watchdog Timer
Watchdog timer using external RC circuitry
Interrupt and reset signals selectable

Clock Output Function
1) Can output a clock with a clock rate of 1/1, 1/2, 1/4, 1/8, 1/16, 1/32, or 1/64 of the source oscillator clock selected
as the system clock.
2) Can output the source oscillation clock for the subclock.
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LC87F1HC4B
Interrupts
40 sources, 10 vector addresses
1) Provides three levels (low (L), high (H), and highest (X)) of multiplex interrupt control. Any interrupt requests of
the level equal to or lower than the current interrupt are not accepted.
2) When interrupt requests to two or more vector addresses occur at the same time, the interrupt of the highest level
takes precedence over the other interrupts. For interrupts of the same level, the interrupt into the smallest vector
address takes precedence.
No.
Vector Address
Level
Interrupt Source
1
00003H
X or L
INT0
2
0000BH
X or L
INT1
3
00013H
H or L
INT2/T0L/INT4/UHC bus active/remote control signal receive
4
0001BH
H or L
INT3/INT5/base timer
5
00023H
H or L
T0H/INT6/UHC device connected/UHC disconnected/UHC resume
6
0002BH
H or L
T1L/T1H/INT7/SIO9/AIF start
7
00033H
H or L
SIO0/UART1 receive
8
0003BH
H or L
SIO1/SIO4/UART1 transmit/end of AIF
9
00043H
H or L
ADC/T6/T7/UHC-ACK/UHC-NAK/UHC error/UHC STALL
10
0004BH
H or L
Port 0/PWM0/PWM1/T4/T5/UHC-SOF/DMCOPY
Priority levels X > H > L
Of interrupts of the same level, the one with the smallest vector address takes precedence.
Subroutine Stack Levels: 6144 levels maximum (The stack is allocated in RAM.)
High-speed Multiplication/Division Instructions
16 bits  8 bits
(5 tCYC execution time)
24 bits  16 bits
(12 tCYC execution time)
16 bits  8 bits
(8 tCYC execution time)
24 bits  16 bits
(12 tCYC execution time)
Oscillation and PLL Circuits
RC oscillation circuit (internal):
CF oscillation circuit:
Crystal oscillation circuit:
PLL circuit (internal):
For system clock
For system clock
For system clock, time-of-day clock
For USB interface (see Fig.5) ), audio interface (see Fig. 6)
Standby Function
HALT mode: Halts instruction execution while allowing the peripheral circuits to continue operation.
1) Oscillation is not halted automatically.
2) Canceled by a system reset or occurrence of an interrupt.
HOLD mode: Suspends instruction execution and the operation of the peripheral circuits.
1) The PLL base clock generator, CF, RC and crystal oscillators automatically stop operation.
2) There are four ways of resetting the HOLD mode.
(1) Setting the reset pin to the lower level.
(2) Setting at least one of the INT0, INT1, INT2, INT4, and INT5 pins to the specified level
(3) Having an interrupt source established at port 0
(4) Having an bus active interrupt source established in the USB host controll circuit
X'tal HOLD mode: Suspends instruction execution and the operation of the peripheral circuits except the base timer.
1) The PLL base clock generator, CF and RC oscillator automatically stop operation.
2) The state of crystal oscillation established when the X'tal HOLD mode is entered is retained.
3) There are six ways of resetting the X'tal HOLD mode.
(1) Setting the reset pin to the low level
(2) Setting at least one of the INT0, INT1, INT2, INT4, and INT5 pins to the specified level
(3) Having an interrupt source established at port 0
(4) Having an interrupt source established in the base timer circuit
(5) Having an bus active interrupt source established in the USB host controll circuit
(6) Having an interrupt source established in the infrared remote controller receiver circuit
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LC87F1HC4B
Development Tools
On-chip debugger: TCB87- type-B + LC87F1HC4B

Flash ROM Programming Boards
Package
Programming boards
SQFP48(7  7)
W87F55256SQ
Recommended EPROM Programmer
Maker
Model
Flash Support Group, Inc.
Single
(FSG)
Programmer
Flash Support Group, Inc.
Device
AF9709/AF9709B/AF9709C
Rev 02.82 or later
LC87F1HC8A
(Note 2)
LC87F1HC8A
(Including Ando Electric Co., Ltd. models)
AF9101/AF9103(Main body)
(FSG)
Onboard
+
Single/Gang
ON Semiconductor
Programmer
(Note 1)
ON Semiconductor
Supported version
AF9708/
(FSG models)
SIB87(Inter Face Driver)
(ON Semiconductor model)
Single/Gang
SKK/SKK TypeB
Programmer
(SanyoFWS)
Onboard
Single/Gang
Programmer
Application Version
2.04 or later
SKK-DBG TypeB
Chip Data Version
(SanyoFWS)
2.11 or later
LC87F1HC8
Note 1: With the FSG onboard programmer (AF9101/AF9103) and the serial interface driver (SIB87) provided by
ON Semiconductor, PC-less standalone onboard programming is possible
Note 2: Depending on programming conditions, it is necessary to use a dedicated programming device and a program.
Please contact our company or FSG if you have any questions or difficulties regarding this matter.
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5
LC87F1HC4B
Package Dimensions
unit : mm
SPQFP48 7x7 / SQFP48
CASE 131AJ
ISSUE A
0.5 0.2
9.0 0.2
9.0 0.2
48
7.0 0.1
7.0 0.1
1 2
0.5
+0.08
0.03
0.18
0.15 0.05
0.10
(1.5)
0~10°
0.1±0.1
1.7 MAX
(0.75)
0.10
GENERIC
MARKING DIAGRAM*
SOLDERING FOOTPRINT*
8.40
XXXXXXXX
YDD
8.40
(Unit: mm)
XXXXX = Specific Device Code
Y = Year
DD = Additional Traceability Data
XXXXXXXX
YMDDD
XXXXX = Specific Device Code
Y = Year
M = Month
DDD = Additional Traceability Data
0.50
0.28
1.00
*This information is generic. Please refer to
device data sheet for actual part marking.
NOTE: The measurements are not to guarantee but for reference only.
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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LC87F1HC4B
37
38
39
40
41
42
43
44
45
46
47
48
24
23
22
21
20
19
18
17
16
15
14
13
LC87F1HC4B
P03/AN3/DBGP1
P02/AN2/DBGP0
P01/AN1
P00/AN0
VSS2
VDD2
PWM0/MCLKO
PWM1/MCLKI
P17/T1PWMH/BUZ
P16/T1PWML
P15/SCK1
P14/SI1/SB1
P73/INT3/T0IN/RMIN
RES
XT1/AN10
XT2/AN11
VSS1
CF1
CF2
VDD1
P10/SO0
P11/SI0/SB0
P12/SCK0
P13/SO1
1
2
3
4
5
6
7
8
9
10
11
12
UHDUHD+
VDD3
VSS3
P34/UFILT
P33/AFILT
P32
P31/URX1
P30/UTX1
P70/INT0/T0LCP/AN8
P71/INT1/T0HCP/AN9
P72/INT2/T0IN
36
35
34
33
32
31
30
29
28
27
26
25
P27/INT5/SCK9
P26/INT5/SI9/WR9
P25/INT5/SO9/RD9
P24/INT5/INT7/SCK4
P23/INT4/SI4/WR
P22/INT4/SO4/RD
P21/INT4
P20/INT4/INT6
P07/AN7/T7O/LRCK
P06/AN6/T6O/BCLK
P05/AN5/CKO/SDAT
P04/AN4/DBGP2
Pin Assignment
Top view
SQFP48(77) : Pb-Free
SQFP48
NAME
SQFP48
NAME
1
P73/INT3/T0IN/RMIN
25
P04/AN4/DBGP2
2
RES
26
P05/AN5/CKO/SDAT
3
XT1/AN10
27
P06/AN6/T6O/BCLK
4
XT2/AN11
28
P07/AN7/T7O/LRCK
5
VSS1
29
P20/INT4/INT6
6
CF1
30
P21/INT4
7
CF2
31
P22/INT4/SO4/RD
8
VDD1
32
P23/INT4/SI4/WR
9
P10/SO0
33
P24/INT5/INT7/SCK4
10
P11/SI0/SB0
34
P25/INT5/SO9/RD9
11
P12/SCK0
35
P26/INT5/SI9/WR9
12
P13/SO1
36
P27/INT5/SCK9
13
P14/SI1/SB1
37
UHD-
14
P15/SCK1
38
UHD+
15
P16/T1PWML
39
VDD3
16
P17/T1PWMH/BUZ
40
VSS3
17
PWM1/MCLKI
41
P34/UFILT
18
PWM0/MCLKO
42
P33/AFILT
19
VDD2
43
P32
20
VSS2
44
P31/URX1
21
P00/AN0
45
P30/UTX1
22
P01/AN1
46
P70/INT0/T0LCP/AN8
23
P02/AN2/DBGP0
47
P71/INT1/T0HCP/AN9
24
P03/AN3/DBGP1
48
P72/INT2/T0IN
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LC87F1HC4B
System Block Diagram
Interrupt control
Standby control
CF
USB PLL
RC
Clock
generator
X’tal
PLA
IR
FROM
PC
SIO0
Bus interface
ACC
SIO1
Port 0
B register
SIO4
Port 1
C register
SIO9
Port 2
Timer 0
Port 3
Timer 1
Port 7
Timer 4
INT0 to INT7
Noise filter
RAR
Timer 5
UART1
RAM
Timer 6
Audio interface
Stack pointer
Timer 7
ADC
Watchdog timer
Base timer
Infrared remote
control receiver circuit
ALU
PWM0
PWM1
USB host
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PSW
Onchip debugger
LC87F1HC4B
Pin Description
Pin Name
I/O
Description
Option
VSS1,VSS2,
VSS3
-
- power supply
No
VDD1, VDD2
-
+ power supply
No
VDD3
-
USB reference voltage
Yes
Port 0
I/O
 8-bit I/O ports
Yes
 I/O specifiable in 4-bit units
P00 to P07
 Pull-up resistors can be turned on and off in 4-bit units.
 HOLD reset input
 Port 0 interrupt input
 Pin functions
AD converter input ports: AN0 to AN7(P00 to P07)
Onchip debugger pins: DBGP0 to DBGP2(P02 to P04)
P05: System clock output/audio interface SDAT input/output
P06: Timer 6 toggle output/audio interface BCLK input/output
P07: Timer 7 toggle output/audio interface LRCK input/output
Port 1
I/O
 8-bit I/O ports
Yes
 I/O specifiable in 1-bit units
P10 to P17
 Pull-up resistors can be turned on and off in 1-bit units.
 Pin functions
Port 2
I/O
P10: SIO0 data output
P14: SIO1 data input/bus input/output
P11: SIO0 data input/bus input/output
P15: SIO1 clock input/output
P12: SIO0 clock input/output
P16: Timer 1 PWML output
P13: SIO1 data output
P17: Timer 1 PWMH output/beeper output
 8-bit I/O ports
Yes
 I/O specifiable in 1-bit units
P20 to P27
 Pull-up resistors can be turned on and off in 1-bit units.
 Pin functions
P20 to P23: INT4 input/HOLD reset input/timer 1 event input/timer 0L capture input/
timer 0H capture input
P24 to P27: INT5 input/HOLD reset input/timer 1 event input/timer 0L capture input/
timer 0H capture input
P20: INT6 input/timer 0L capture 1 input
P22: SIO4 data input/output/parallel interface RD output
P23: SIO4 data input/output/parallel interface WR output
P24: SIO4 clock input/output/INT7 input/timer 0H capture 1 input
P25: SIO9 data input/output/parallel interface RD9 output
P26: SIO9 data input/output/parallel interface WR9 output
P27: SIO9 clock input/output
Interrupt acknowledge types
Port 3
P30 to P34
I/O
Rising
Falling
INT4
enable
enable
INT5
enable
enable
INT6
enable
INT7
enable
Rising &
H level
L level
enable
disable
disable
enable
disable
disable
enable
enable
disable
disable
enable
enable
disable
disable
Falling
 5-bit I/O ports
Yes
 I/O specifiable in 1-bit units
 Pull-up resistors can be turned on and off in 1-bit units.
 Pin functions
P30: UART1 transmit
P31: UART1 receive
P33: Audio interface PLL filter pin (see Fig. 6.)
P34: USB interface PLL filter pin (see Fig. 5.)
Continued on next page.
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LC87F1HC4B
Continued from preceding page.
Pin Name
Port 7
I/O
I/O
Description
Option
 4-bit I/O port
No
 I/O specifiable in 1-bit units
P70 to P73
 Pull-up resistors can be turned on and off in 1-bit units.
 Pin functions
P70: INT0 input/HOLD reset input/timer 0L capture input/watchdog timer output
P71: INT1 input/HOLD reset input/timer 0H capture input
P72: INT2 input/HOLD reset input/timer 0 event input/timer 0L capture input/
high speed clock counter input
P73: INT3 input (input with noise filter)/timer 0 event input/timer 0H capture input/
IR remote controller receiver input
AD converter input ports: AN8(P70), AN9(P71)
Interrupt acknowledge types
PWM0
I/O
PWM1
Rising
Falling
INT0
enable
enable
INT1
enable
enable
INT2
enable
INT3
enable
Rising &
H level
L level
disable
enable
enable
disable
enable
enable
enable
enable
disable
disable
enable
enable
disable
disable
Falling
No
PWM0, PWM1 output port
General-purpose input port
 Pin functions
PWM0: Audio interface master clock output
PWM1: Audio interface master clock input
UHD-
I/O
USB data I/O pin UHD-/general-purpose I/O port
No
UHD+
I/O
USB data I/O pin UHD+/general-purpose I/O port
No
RES
Input
Reset pin
No
XT1
Input
 32.768kHz crystal oscillator input
No
 Pin functions
General-purpose input port
AD converter input ports: AN10
XT2
I/O
Must be connected to VDD1 when not to be used.
 32.768kHz crystal oscillator output
No
 Pin functions
General-purpose I/O
AD converter input port: AN11
Must be set for oscillation and kept open if not to be used.
CF1
Input
Ceramic/crystal resonator input
No
CF2
Output
Ceramic/crystal resonator output
No
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LC87F1HC4B
Port Output Types
The table below lists the types of port outputs and the presence/absence of a pull-up resistor.
Data can be read into any input port even if it is in the output mode.
Port Name
Option selected in
units of
P00 to P07
1 bit
P10 to P17
1 bit
Option type
Output type
1
P20 to P27
P30 to P34
Pull-up resistor
CMOS
Programmable (Note 1)
2
Nch-open drain
No
1
CMOS
Programmable
2
Nch-open drain
Programmable
Programmable
P70
-
No
Nch-open drain
P71 to P73
-
No
CMOS
Programmable
PWM0, PWM1
-
No
CMOS
No
UHD+, UHD-
-
No
CMOS
No
XT1
-
No
Input only
No
XT2
-
No
32.768kHz crystal resonator output (N channel open
No
drain when in general-purpose output mode)
Note 1: Programmable pull-up resistors for port 0 are controlled in 4 bit units (P00 to 03, P04 to 07).
Power Pin Treatment
Connect the IC as shown below to minimize the noise input to the VDD1 pin. and extend the backup period. Be sure to
electrically short the VSS1, VSS2, and VSS3 pins.
Example 1: When the microcontroller is in the backup state in the HOLD mode, the power to sustain the high level of
output ports is supplied by their backup capacitors.
LSI
Power
supply
For backup
VDD1
VDD2
VDD3
VSS1 VSS2 VSS3
Example 2: The high level output at ports is not sustained and unstable in the HOLD backup mode.
LSI
For backup
Power
supply
VDD1
VDD2
VDD3
VSS1 VSS2 VSS3
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11
LC87F1HC4B
USB Reference Power Option
When a voltage 4.5 to 5.5V is supplied to VDD1 and the internal USB reference voltage circuit is activated, the
reference voltage for USB port output is generated. The active/inactive state of the reference voltage circuit can be
switched by option select. The procedure for marking the option selection is described below.
(1)
Option settings
Reference voltage circuit state
(2)
(3)
(4)
USE
USE
NONUSE
NONUSE
NONUSE
NONUSE
USE
NONUSE
inactive
USB regulator
USE
USB regulator at HOLD mode
USE
USB regulator at HALT mode
USE
NONUSE
Normal mode
active
active
active
HOLD mode
active
inactive
inactive
inactive
HALT mode
active
inactive
active
inactive
 When the USB reference voltage circuit is made inactive, the level of the reference voltage for USB port output is
equal to VDD1.
Selection (2) or (3) can be used to set the reference voltage circuit inactive in HOLD or HALT mode.
When the reference voltage circuit is activated, the current drain increases by approximately 100A compared with
when the reference voltage circuit is inactive.
Example 1: VDD1=VDD2=3.3V
Inactivating the reference voltage circuit (selection (4)).
Connecting VDD3 to VDD1 and VDD2.
LSI
Power Supply
3.3V
For backup
VDD1
UHD+
33
To USB connector
UHDVDD2
15k
5pF
VDD3
UFILT
0
VSS1 VSS2 VSS3
2.2F
Example 2: VDD1=VDD2=5.0V
Activating the reference voltage circuit (selection (1)).
Isolating VDD3 from VDD1 and VDD2, and connecting capacitor between VDD3 and VSS.
LSI
For backup
VDD1
Power Supply
5V
UHD+
33
To USB connector
UHDVDD2
15k
5pF
VDD3
2.2F
0.1F
UFILT
0
VSS1 VSS2 VSS3
2.2F
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12
LC87F1HC4B
Absolute Maximum Ratings at Ta = 25°C, VSS1 = VSS2 = VSS3 = 0V
Parameter
Maximum supply
Symbol
Pin/Remarks
VDD max
VDD1, VDD2, VDD3
Input voltage
VI(1)
XT1, CF1
Input/output
VIO(1)
Ports 0, 1, 2, 3, 7
Conditions
VDD1= VDD2= VDD3
voltage
voltage
PWM0, PWM1
Specification
VDD [V]
min
typ
max
0.3
+6.5
0.3
VDD+0.3
0.3
VDD+0.3
unit
V
XT2
Peak output
IOPH(1)
Ports 0, 1, 2
current
• When CMOS output
type is selected
10
• Per 1 applicable pin
IOPH(2)
PWM0, PWM1
Per 1 applicable pin
IOPH(3)
Port 3
• When CMOS output
P71 to P73
type is selected
20
5
• Per 1 applicable pin
High level output current
Average
IOMH(1)
Ports 0, 1, 2
output current
• When CMOS output
type is selected
(Note 1-1)
7.5
• Per 1 applicable pin
IOMH(2)
PWM0, PWM1
Per 1 applicable pin
IOMH(3)
Port 3
• When CMOS output
P71 to P73
type is selected
15
3
• Per 1 applicable pin
Total output
IOAH(1)
Ports 0, 2
current
Total current of all
applicable pins
IOAH(2)
IOAH(3)
IOAH(4)
IOAH(5)
Port 1
Total current of all
PWM0, PWM1
applicable pins
Ports 0, 1, 2
Total current of all
PWM0, PWM1
applicable pins
Port 3
Total current of all
P71 to P73
applicable pins
UHD+, UHD
Total current of all
applicable pins
Peak output
IOPL(1)
current
P02 to P07
25
25
45
10
25
mA
Per 1 applicable pin
Ports 1, 2
20
PWM0, PWM1
IOPL(2)
P00, P01
Per 1 applicable pin
IOPL(3)
Ports 3, 7
Per 1 applicable pin
30
10
XT2
Low level output current
Average
IOML(1)
P02 to P07
output current
Ports 1, 2
(Note 1-1)
PWM0, PWM1
Per 1 applicable pin
15
IOML(2)
P00, P01
Per 1 applicable pin
IOML(3)
Ports 3, 7
Per 1 applicable pin
20
7.5
XT2
Total output
IOAL(1)
Ports 0, 2
current
Total current of all
45
applicable pins
IOAL(2)
IOAL(3)
IOAL(4)
IOAL(5)
Port 1
Total current of all
PWM0, PWM1
applicable pins
Ports 0, 1, 2
Total current of all
PWM0, PWM1
applicable pins
Ports 3, 7
Total current of all
XT2
applicable pins
UHD+, UHD
45
80
15
Total current of all
25
applicable pins
Allowable power
Pd max
SQFP48(77)
Ta=40 to +85C
140
Dissipation
Operating ambient
Topr
Temperature
Storage ambient
40
+85
55
+125
mW
C
Tstg
temperature
Note 1-1: The average output current is an average of current values measured over 100 ms intervals.
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed,
damage may occur and reliability may be affected.
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13
LC87F1HC4B
Allowable Operating Conditions at Ta = 40°C to +85°C, VSS1 = VSS2 = VSS3 = 0V
Parameter
Operating
Symbol
VDD(1)
Pin/Remarks
VDD1=VDD2=VDD3
Conditions
0.245µs  tCYC  200µs
supply voltage
0.490µs  tCYC  200µs Except
(Note 2-1)
in onboard programming mode
Memory
VHD
VDD1=VDD2=VDD3
sustaining
Specification
VDD [V]
min
typ
unit
max
3.0
5.5
2.7
5.5
2.0
5.5
RAM and register contents
sustained in HOLD mode.
supply voltage
High level
VIH(1)
input voltage
Port 0, 1, 2, 3
P71 to P73
2.7 to 5.5
P70 port input/
0.3VDD
+0.7
VDD
2.7 to 5.5
0.9VDD
VDD
2.7 to 5.5
0.75VDD
4.0 to 5.5
VSS
VDD
0.1VDD
2.7 to 4.0
VSS
4.0 to 5.5
VSS
2.7 to 4.0
VSS
2.7 to 5.5
VSS
2.7 to 5.5
VSS
0.25VDD
3.0 to 5.5
0.245
200
2.7 to 5.5
0.490
200
3.0 to 5.5
0.1
12
interrupt side
PWM0, PWM1
VIH(2)
Port 70 watchdog
timer side
VIH(3)
Low level
VIL(1)
input voltage
XT1, XT2, CF1, RES
Port 1, 2, 3
P71 to P73
VIL(2)
P70 port input/
interrupt side
VIL(3)
Port 0
PWM0, PWM1
VIL(4)
VIL(5)
Port 70 watchdog
timer side
VIL(6)
Instruction
XT1, XT2, CF1, RES
tCYC
cycle time
Except for onboard programming
(Note 2-2)
mode
External
FEXCF(1)
CF1
V
+0.4
0.2VDD
0.15VDD
+0.4
0.2VDD
0.8VDD
-1.0
s
 CF2 pin open
 System clock frequency
system clock
frequency
division ratio=1/1
 External system clock duty
=505%
MHz
 CF2 pin open
 System clock frequency
division ratio=1/1
2.7 to 5.5
0.1
6
 External system clock duty
=505%
Oscillation
FmCF(1)
CF1, CF2
frequency
range
When 12MHz ceramic oscillation
See Fig. 1.
FmCF(2)
CF1, CF2
(Note 2-3)
When 6MHz ceramic oscillation
See Fig. 1.
FmRC
FsX’tal
Internal RC oscillation
XT1, XT2
32.768kHz crystal oscillation
See Fig. 2.
3.0 to 5.5
12
2.7 to 5.5
6
2.7 to 5.5
2.7 to 5.5
0.3
1.0
MHz
2.0
32.768
kHz
Note 2-1: VDD must be held greater than or equal to 3.0V in the flash ROM onboard programming mode.
Note 2-2: Relationship between tCYC and oscillation frequency is 3/FmCF at a division ratio of 1/1 and 6/FmCF at
a division ratio of 1/2.
Note 2-3: See Tables 1 and 2 for the oscillation constants.
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended
Operating Ranges limits may affect device reliability.
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14
LC87F1HC4B
Electrical Characteristics at Ta = 40°C to +85°C, VSS1 = VSS2 = VSS3 = 0V
Parameter
High level input
Symbol
IIH(1)
current
IIH(2)
Pin/Remarks
Conditions
Ports 0, 1, 2, 3
Output disabled
Port 7
Pull-up resistor off
RES
PWM0, PWM1
VIN=VDD
(Including output Tr's off leakage
UHD+, UHD-
current)
XT1, XT2
Input port configuration
VIN=VDD
Low level input
IIH(3)
CF1
VIN=VDD
IIL(1)
Ports 0, 1, 2, 3
Output disabled
Port 7
Pull-up resistor off
RES
PWM0, PWM1
VIN=VSS
(Including output Tr's off leakage
UHD+, UHD
current)
current
IIL(2)
Specification
VDD [V]
min
typ
1
2.7 to 5.5
1
2.7 to 5.5
15
2.7 to 5.5
1
2.7 to 5.5
1
2.7 to 5.5
15
Input port configuration
IIL(3)
CF1
VIN=VSS
VIN=VSS
High level output
VOH(1)
Ports 0, 1, 2, 3
IOH=1mA
4.5 to 5.5
VDD1
voltage
VOH(2)
P71 to P73
IOH=0.4mA
3.0 to 5.5
VDD0.4
IOH=0.2mA
2.7 to 5.5
VDD0.4
VOH(4)
PWM0, WM1
IOH=10mA
4.5 to 5.5
VDD1.5
VOH(5)
P05 to P07
IOH=1.6mA
3.0 to 5.5
VDD0.4
IOH=1mA
2.7 to 5.5
VDD0.4
VOH(6)
Low level output
VOL(1)
voltage
VOL(2)
(Note 3-1)
P00, P01
VOL(3)
IOL=30mA
4.5 to 5.5
1.5
IOL=5mA
3.0 to 5.5
0.4
IOL=2.5mA
2.7 to 5.5
0.4
VOL(4)
Ports 0, 1, 2
IOL=10mA
4.5 to 5.5
1.5
VOL(5)
PWM0, PWM1
IOL=1.6mA
3.0 to 5.5
0.4
IOL=1mA
2.7 to 5.5
0.4
VOL(6)
VOL(7)
XT2
Ports 3, 7
VOL(8)
Pull-up resistance
unit
2.7 to 5.5
XT1, XT2
VOH(3)
max
IOL=1.6mA
3.0 to 5.5
0.4
IOL=1mA
2.7 to 5.5
0.4
VOH=0.9VDD
A
V
Rpu(1)
Ports 0, 1, 2, 3
4.5 to 5.5
15
35
80
Rpu(2)
Port 7
2.7 to 5.5
18
50
150
Hysteresis voltage
VHYS
RES
Port 1, 2, 3, 7
2.7 to 5.5
0.1VDD
V
Pin capacitance
CP
All pins
2.7 to 5.5
10
pF
k
For pins other than that under test:
VIN=VSS
f=1MHz
Ta=25C
Note 3-1: When the CKO system clock output function (P05) or audio interface output function (P05 to P07)is used.
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be
indicated by the Electrical Characteristics if operated under different conditions.
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15
LC87F1HC4B
Serial I/O Characteristics at Ta = 40°C to +85°C, VSS1 = VSS2 = VSS3 = 0V
1. SIO0 Serial I/O Characteristics (Note 4-1-1)
Parameter
Symbol
Frequency
tSCK(1)
Low level
tSCKL(1)
Pin/
Conditions
Remarks
SCK0(P12)
Specification
VDD [V]
See Fig. 8.
typ
max
unit
2
1
pulse width
High level
min
tSCKH(1)
1
pulse width
 Continuous data transfer mode
tSCKHA(1a)
 USB, AIF, SIO4, SIO9, and
DMCOPY not used at the same
4
time.
Input clock
 See Fig. 8.
 (Note 4-1-2)
 Continuous data transfer mode
tSCKHA(1b)
2.7 to 5.5
tCYC
 USB used at the same time.
 AIF, SIO4, SIO9, and DMCOPY
7
not used at the same time.
 See Fig. 8.
 (Note 4-1-2)
 Continuous data transfer mode
tSCKHA(1c)
 USB, AIF, SIO4, SIO9, and
DMCOPY used at the same
9
time.
 See Fig. 8.
Serial clock
 (Note 4-1-2)
Frequency
tSCK(2)
SCK0(P12)
 When CMOS output type is
4/3
selected
Low level
tSCKL(2)
 See Fig. 8.
1/2
pulse width
High level
tSCK
tSCKH(2)
1/2
pulse width
tSCKHA(2a)
 Continuous data transfer mode
 USB, AIF, SIO4, SIO9, and
DMCOPY not used at the same
tSCKH(2)
time.
+2tCYC
Output clock
 When CMOS output type is
tSCKH(2)
+
(10/3)tCYC
selected
 See Fig. 8.
tSCKHA(2b)
 Continuous data transfer mode
2.7 to 5.5
 USB used at the same time.
 AIF, SIO4, SIO9, and DMCOPY
not used at the same time.
 When CMOS output type is
tSCKH(2)
+2tCYC
tSCKH(2)
+
tCYC
(19/3)tCYC
selected.
 See Fig. 8.
tSCKHA(2c)
 Continuous data transfer mode
 USB, AIF, SIO4, SIO9, and
DMCOPY used at the same time
 When CMOS output type is
selected
tSCKH(2)
+2tCYC
tSCKH(2)
+
(25/3)tCYC
 See Fig. 8.
Note 4-1-1: These specifications are theoretical values. Margins must be allowed according to the actual operating
conditions.
Note 4-1-2: In an application where the serial clock input is to be used in the continuous data transfer mode, the time
from SI0RUN being set when serial clock is high to the falling edge of the first serial clock must be longer
than tSCKHA.
Continued on next page.
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16
LC87F1HC4B
Continued from preceding page.
Parameter
Serial input
Data setup time
tsDI(1)
Pin/
Conditions
Remarks
SB0(P11),
SI0(P11)
Data hold time
Specification
VDD [V]
min
typ
max
unit
 Must be specified with respect
to rising edge of SIOCLK.
 See Fig. 8.
0.03
2.7 to 5.5
thDI(1)
0.03
Input clock
Output delay
tdD0(1)
time
SO0(P10),
 Continuous data transfer mode
SB0(P11)
 (Note 4-1-3)
(1/3)tCYC
+0.05
 Synchronous 8-bit mode
tdD0(2)
+0.05
2.7 to 5.5
tdD0(3)
s
1tCYC
 (Note 4-1-3)
(Note 4-1-3)
Output clock
Serial output
Symbol
(1/3)tCYC
+0.05
Note 4-1-3: Must be specified with respect to falling edge of SIOCLK.
Must be specified as the time to the beginning of output state change in open drain output mode. See Fig. 8.
2. SIO1 Serial I/O Characteristics (Note 4-2-1)
Input clock
Symbol
Frequency
tSCK(3)
Low level
tSCKL(3)
Pin/
Conditions
Remarks
SCK1(P15)
VDD [V]
See Fig. 8.
Frequency
2.7 to 5.5
SCK1(P15)
 When CMOS output type is
 See Fig. 8.
tSCKL(4)
2
1/2
tSCK
tSCKH(4)
1/2
pulse width
Serial input
Data setup time
SB1(P14),
SI1(P14)
 Must be specified with respect
to rising edge of SIOCLK.
 See Fig. 8.
Data hold time
0.03
2.7 to 5.5
thDI(2)
0.03
Output delay time
Serial output
tsDI(2)
unit
1
2.7 to 5.5
pulse width
High level
max
1
selected
Low level
typ
tCYC
tSCKH(3)
tSCK(4)
min
2
pulse width
High level
Specification
pulse width
Output clock
Serial clock
Parameter
tdD0(4)
SO1(P13),
SB1(P14)
s
 Must be specified with respect
to falling edge of SIOCLK.
 Must be specified as the time
to the beginning of output state
change in open drain output
2.7 to 5.5
(1/3)tCYC
+0.05
mode.
 See Fig. 8.
Note 4-2-1: These specifications are theoretical values. Margins must be allowed according to the actual operating
conditions.
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17
LC87F1HC4B
3. SIO4 Serial I/O Characteristics (Note 4-3-1)
Parameter
Symbol
Frequency
tSCK(5)
Low level
tSCKL(5)
Pin/
Conditions
Remarks
SCK4(P24)
Specification
VDD [V]
See Fig. 8.
tSCKH(5)
pulse width
tSCKHA(5a)
typ
max
unit
2
1
pulse width
High level
min
1
 USB, SIO0 continuous transfer
mode, AIF, SIO9, and DMCOPY
not used at the same time.
4
 See Fig. 8.
 (Note 4-3-2)
 USB used at the same time
Input clock
tSCKHA(5b)
 SIO0 continuous transfer mode,
2.7 to 5.5
AIF, SIO9, DMCOPY not used at
tCYC
7
the same time.
 See Fig. 8.
 (Note 4-3-2)
 USB, SIO0 continuous transfer
tSCKHA(5c)
mode, SIO9,
and DMCOPY used at the same
time.
12
 AIF not used at the same time.
 See Fig. 8.
 (Note 4-3-2)
Serial clock
Frequency
Low level
tSCK(6)
tSCKL(6)
 When CMOS output type is
4/3
selected.
1/2
 See Fig. 8.
pulse width
High level
SCK4(P24)
tSCK
tSCKH(6)
1/2
pulse width
(Note 4-3-3)
tSCKHA(6a)
 USB, SIO0 continuous transfer
mode, AIF, SIO9, and
DMCOPY not used at the same
tSCKH(6)
time.
 When CMOS output type is
tSCKH(6)
+
+
(5/3)tCYC
(10/3)tCYC
tSCKH(6)
tSCKH(6)
Output clock
selected.
 See Fig. 8.
tSCKHA(6b)
 USB used at the same time.
 SIO0 continuous transfer mode,
AIF, SIO9, and DMCOPY not
used at the same time.
 When CMOS output type is
2.7 to 5.5
+
+
(5/3)tCYC
(19/3)tCYC
tSCKH(6)
tSCKH(6)
tCYC
selected.
 See Fig. 8.
tSCKHA(6c)
 USB, SIO0 continuous transfer
mode, SIO9, and DMCOPY used
at the same time.
 AIF not used at the same time.
 When CMOS output type is
+
+
(5/3)tCYC
(34/3)tCYC
selected.
 See Fig. 8.
Note 4-3-1: These specifications are theoretical values. Margins must be allowed according to the actual operating
conditions.
Note 4-3-2: In an application where the serial clock input is to be used in the continuous data transfer mode, the period
from the time SI4RUN is set with the serial clock set high to the falling edge of the first serial clock must
be longer than tSCKHA.
Note 4-3-3: When using the serial clock output, make sure that the load at the SCK4 (P24) pin meets the following
conditions:
Clock rise time tSCKR < 0.037s (see Figure 12.) at Ta=+25C, VDD=3.3V
Continued on next page.
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18
LC87F1HC4B
Continued from preceding page.
Parameter
Serial input
Data setup time
Symbol
tsDI(3)
Pin/
Conditions
Remarks
SO4(P22),
SI4(P23)
VDD [V]
min
typ
max
unit
 Must be specified with respect
to falling edge of SIOCLK.
 See Fig. 8
Data hold time
Specification
0.03
2.7 to 5.5
thDI(3)
0.03
Output delay time
tdD0(5)
SO4(P22),
Serial output
SI4(P23)
s
 Must be specified with respect
to rising edge of SIOCLK.
 Must be specified as the time to
the beginning of output state
(1/3)tCYC
2.7 to 5.5
+0.05
change in open drain output
mode.
 See Fig. 8.
4. SIO9 Serial I/O Characteristics (Note 4-4-1)
Parameter
Symbol
Frequency
tSCK(7)
Low level
tSCKL(7)
Pin/
Conditions
Remarks
SCK9(P27)
Specification
VDD [V]
See Fig. 8.
tSCKH(7)
unit
1
 USB, SIO0 continuous transfer
mode, AIF, SIO4 and DMCOPY
4
not used at the same time.
 See Fig. 8.
Input clock
Serial clock
max
1
pulse width
tSCKHA(7a)
typ
2
pulse width
High level
min
 (Note 4-4-2)
tSCKHA(7b)
 USB used at the same time.
2.7 to 5.5
tCYC
 SIO0 continuous transfer mode,
AIF, SIO4, and DMCOPY not
used at the same time.
7
 See Fig. 8.
 (Note 4-4-2)
tSCKHA(7c)
 USB, SIO0 continuous transfer
mode, SIO4 and DMCOPY used
at the same time.
 AIF not used at the same time.
15
 See Fig. 8.
 (Note 4-4-2)
Note 4-4-1: These specifications are theoretical values. Margins must be allowed according to the actual operating
conditions.
Note 4-4-2: In an application where the serial clock input is to be used in the continuous data transfer mode, the period
from the time SI9RUN is set with the serial clock set high to the falling edge of the first serial clock must
be longer than tSCKHA.
Continued on next page
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19
LC87F1HC4B
Continued from preceding page
Parameter
Frequency
Symbol
tSCK(8)
Pin/
Conditions
Remarks
SCK9(P27)
Specification
VDD [V]
 When CMOS output type is
typ
1/2
pulse width
High level
tSCK
tSCKH(8)
1/2
pulse width
(Note 4-4-3)
 USB, SIO0 continuous transfer
tSCKHA(8a)
mode, AIF SIO4 DMCOPY not
tSCKH(8)
used at the same time.
 When CMOS output type is
Output clock
selected.
Serial clock
unit
tCYC
 See Fig. 8.
tSCKL(8)
max
4/3
selected.
Low level
min
tSCKH(8)
+
+
(5/3)tCYC
(10/3)tCYC
tSCKH(8)
tSCKH(8)
 See Fig. 8.
 USB used at the same time.
tSCKHA(8b)
 SIO0 continuous transfer mode,
2.7 to 5.5
AIF, SIO4, and DMCOPY not
used at the same time.
 When CMOS output type is
+
+
(5/3)tCYC
(19/3)tCYC
tSCKH(8)
tSCKH(8)
tCYC
selected
 See Fig. 8.
 USB, SIO0 continuous transfer
tSCKHA(8c)
mode , SIO4, and DMCOPY
used at the same time.
 AIF not used at the same time.
 When CMOS output type is
+
+
(5/3)tCYC
(43/3)tCYC
selected.
 See Fig. 8.
Serial input
Data setup time
SO9(P25),
SI9(P26)
 Must be specified with respect
to rising edge of SIOCLK.
 See Fig. 8.
Data hold time
0.03
2.7 to 5.5
thDI(4)
0.03
Output delay time
Serial output
tsDI(4)
tdDO(6)
SO9(P25),
SI9(P26)
s
 Must be specified with respect
to falling edge of SIOCLK.
 Must be specified as the time to
the beginning of output state
change in open drain output
2.7 to 5.5
(1/3)tCYC
+0.05
mode
 See Fig. 8.
Note 4-4-3: When using the serial clock output, make sure that the load at the SCK9 (P27) pin meets the following
conditions:
Clock rise time tSCKR < 0.037s (see Figure 12.) at Ta=+25C, VDD=3.3V
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20
LC87F1HC4B
Pulse Input Conditions at Ta = 40°C to +85°C, VSS1 = VSS2 = VSS3 = 0V
Parameter
Symbol
Pin/Remarks
High/low level
tP1H(1)
INT0(P70), INT1(P71),
 Interrupt source flag can be set.
pulse width
tP1L(1)
INT2(P72),
 Event inputs for timer 0 or 1 are
INT4(P20 to P23),
Specification
Conditions
VDD [V]
enabled.
INT5(P24 to P27),
min
typ
2.7 to 5.5
1
2.7 to 5.5
2
2.7 to 5.5
64
2.7 to 5.5
256
2.7 to 5.5
4
2.7 to 5.5
200
max
unit
INT6(P20),
INT7(P24)
tPIH(2)
INT3(P73) when noise
 Interrupt source flag can be set.
tPIL(2)
filter time constant is
 Event inputs for timer 0 are
1/1
tPIH(3)
INT3(P73) when noise
 Interrupt source flag can be set.
tPIL(3)
filter time constant is
 Event inputs for timer 0 are
1/32
nabled.
tPIH(4)
INT3(P73) when noise
 Interrupt source flag can be set.
tPIL(4)
filter time constant is
 Event inputs for timer 0 are
1/128
tPIL(5)
RMIN(P73)
enabled.
Recognized by the infrared remote
control receiver circuit as a signal
tPIL(6)
tCYC
enabled.
RES
Resetting is enabled.
RMCK
(Note 5-1)
s
Note 5-1: Represents the period of the reference clock (1 tCYC to 128 tCYC or the source frequency of the subclock)
for the infrared remote control receiver circuit.
AD Converter Characteristics at Ta = 40°C to +85°C, VSS1 = VSS2 = VSS3 = 0V
Parameter
Symbol
Pin/Remarks
Resolution
N
AN0(P00) to
Absolute
ET
AN7(P07),
TCAD
Specification
VDD [V]
typ
AN9(P71),
AD conversion time=32tCYC
AN10(XT1),
(when ADCR2=0) (Note 6-2)
4.5 to 5.5
3.0 to 5.5
AD conversion time=64tCYC
(when ADCR2=1) (Note 6-2)
4.5 to 5.5
3.0 to 5.5
VAIN
3.0 to 5.5
voltage range
Analog port
IAINH
VAIN=VDD
3.0 to 5.5
input current
IAINL
VAIN=VSS
3.0 to 5.5
max
unit
8
bit
1.5
3.0 to 5.5
AN11(XT2)
Analog input
min
3.0 to 5.5
(Note 6-1)
AN8(P70),
accuracy
Conversion time
Conditions
15.68
97.92
(tCYC=
(tCYC=
0.490µs)
3.06µs)
23.52
97.92
(tCYC=
(tCYC=
0.735µs)
3.06µs)
18.82
97.92
(tCYC=
(tCYC=
0. 294µs)
1.53µs)
47.04
97.92
(tCYC=
(tCYC=
0.735µs)
1.53µs)
VSS
VDD
1
1
LSB
s
V
A
Note 6-1: The quantization error (1/2LSB) is excluded from the absolute accuracy.
Note 6-2: The conversion time refers to the period from the time when an instruction for starting a conversion process is
issued to the time the conversion results register(s) are loaded with a complete digital conversion value
corresponding to the analog input value.
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21
LC87F1HC4B
Consumption Current Characteristics at Ta = 40°C to +85°C, VSS1 = VSS2 = VSS3 = 0V
Parameter
Symbol
Pin/
Conditions
Remarks
 FmCF=12MHz ceramic oscillation mode
consumption
VDD1
=VDD2
current
=VDD3
 System clock set to 12MHz side
Normal mode
(Note 7-1)
IDDOP(1)
IDDOP(2)
 FsX'tal=32.768kHz crystal oscillation mode
Specification
VDD [V]
min
typ
max
4.5 to 5.5
9.8
24
3.0 to 3.6
5.7
14
4.5 to 5.5
15
35
3.0 to 3.6
7.7
20
4.5 to 5.5
6.7
16
3.0 to 3.6
3.9
9.0
unit
 Internal PLL oscillation stopped
 Internal RC oscillation stopped
 USB circuit stopped
 1/1 frequency division ratio
IDDOP(3)
 FmCF=12MHz ceramic oscillation mode
 FsX'tal=32.768kHz crystal oscillation mode
 System clock set to 12MHz side
IDDOP(4)
 Internal PLL oscillation mode active
 Internal RC oscillation stopped
 USB circuit active
mA
 1/1 frequency division ratio
IDDOP(5)
IDDOP(6)
 FmCF=12MHz ceramic oscillation mode
 FsX'tal=32.768kHz crystal oscillation mode
 System clock set to 6MHz side
IDDOP(7)
 Internal RC oscillation stopped
 1/2 frequency division ratio
2.7 to 3.0
3.2
7.3
IDDOP(8)
 FmCF=0Hz(oscillation stopped)
4.5 to 5.5
0.72
3.4
3.0 to 3.6
0.41
1.9
2.7 to 3.0
0.35
1.5
4.5 to 5.5
45
184
3.0 to 3.6
18
65
2.7 to 3.0
14
47
4.5 to 5.5
4.9
12
3.0 to 3.6
2.7
6.4
4.5 to 5.5
9.5
23
3.0 to 3.6
4.7
12
4.5 to 5.5
3.0
7.3
3.0 to 3.6
1.6
3.8
2.7 to 3.0
1.3
2.9
4.5 to 5.5
0.41
2.0
3.0 to 3.6
0.20
0.95
2.7 to 3.0
0.17
0.70
IDDOP(9)
 FsX'tal=32.768kHz crystal oscillation mode
 System clock set to internal RC oscillation.
IDDOP(10)
 1/2 frequency division ratio
IDDOP(11)
 FmCF=0Hz(oscillation stopped)
 FsX'tal=32.768kHz crystal oscillation mode
IDDOP(12)
 System clock set to crystal oscillation.
(32.768kHz)
IDDOP(13)
 Internal RC oscillation stopped
 1/2 frequency division ratio
HALT mode
IDDHALT(1)
A
 HALT mode
consumption
 FmCF=12MHz ceramic oscillation mode
current
 FsX'tal=32.768kHz crystal oscillation mode
 System clock set to 12MHz side
(Note7-1)
IDDHALT(2)
 Internal PLL oscillation stopped
 Internal RC oscillation stopped
 USB circuit stopped
 1/1 frequency division ratio
IDDHALT(3)
 HALT mode
 FmCF=12MHz ceramic oscillation mode
 FsX'tal=32.768kHz crystal oscillation mode
 System clock set to 12MHz side
IDDHALT(4)
 Internal PLL oscillation mode active
 Internal RC oscillation stopped
 USB circuit active
mA
 1/1 frequency division ratio
IDDHALT(5)
 HALT mode
 FmCF=12MHz ceramic oscillation mode
IDDHALT(6)
 FsX'tal=32.768kHz crystal oscillation mode
 System clock set to 6MHz side
IDDHALT(7)
 Internal RC oscillation stopped
 1/2 frequency division ratio
IDDHALT(8)
 HALT mode
 FmCF=0Hz(oscillation stopped)
IDDHALT(9)
IDDHALT(10)
 FsX'tal=32.768kHz crystal oscillation mode
 System clock set to internal RC oscillation.
 1/2 frequency division ratio
Note 7-1: The consumption current value includes none of the currents that flow into the output Tr and internal pull-up
resistors.
Continued on next page.
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22
LC87F1HC4B
Continued from preceding page.
Parameter
Symbol
HALT mode
Specification
Conditions
VDD [V]
IDDHALT(11)
VDD1
 HALT mode
 FmCF=0MHz (oscillation stopped)
IDDHALT(12)
=VDD2
=VDD3
consumption
current
Pin/
Remarks
typ
max
unit
4.5 to 5.5
31
132
3.0 to 3.6
9.1
39
2.7 to 3.0
6.3
27
 HOLD mode
4.5 to 5.5
0.14
39
 CF1=VDD or open (External clock mode)
3.0 to 3.6
0.04
19
 FsX'tal=32.768kHz crystal oscillation mode
 System clock set to crystal oscillation.
(Note 7-1)
min
mA
(32.768kHz)
IDDHALT(13)
 Internal RC oscillation stopped
 1/2 frequency division ratio
HOLD mode
IDDHOLD(1)
consumption
IDDHOLD(2)
current
VDD1
IDDHOLD(3)
2.7 to 3.0
0.04
17
Timer HOLD
IDDHOLD(4)
 Timer HOLD mode
4.5 to 5.5
25
115
mode
IDDHOLD(5)
 CF1=VDD or open (External clock mode)
3.0 to 3.6
6.0
32
2.7 to 3.0
3.7
20
consumption
 FsX’tal=32.768kHz crystal oscillation mode
IDDHOLD(6)
current
A
Note 7-1: The consumption current value includes none of the currents that flow into the output Tr and internal pull-up
resistors
USB Characteristics and Timing at Ta = 40°C to +85°C, VSS1 = VSS2 = VSS3 = 0V
Parameter
Symbol
Conditions
Specification
min
typ
max
unit
High level output
VOH(USB)
 15k  5% to GND
2.8
3.6
V
Low level output
VOL(USB)
 1.5k  5% to 3.6V
0.0
0.3
V
1.3
2.0
Output signal crossover voltage
VCRS
Differential input sensitivity
VDI
 (UHD+)-(UHD-)
0.2
Differential input common mode range
VCM
0.8
High level input
VIH(USB)
2.0
Low level input
VIL(USB)
USB data rise time
tR
 RS=33, CL=50pF
USB data fall time
tF
 RS=33, CL=50pF
V
V
2.5
V
V
0.8
V
4
20
ns
4
20
ns
F-ROM Programming Characteristics at Ta = +10°C to +55°C, VSS1 = 0V
Parameter
Onboard programming
Symbol
IDDFW(1)
current
Programming time
Pin/
Remarks
VDD1
Conditions
 Excluding power dissipation in the
microcontroller block
tFW(1)
 Erase operation
tFW(2)
 Write operation
Specification
VDD [V]
3.0 to 5.5
3.0 to 5.5
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23
min
typ
max
unit
10
mA
20
30
ms
40
60
s
5
LC87F1HC4B
Characteristics of a Sample Main System Clock Oscillation Circuit
Given below are the characteristics of a sample main system clock oscillation circuit that are measured using an our
company-designated oscillation characteristics evaluation board and external components with circuit constant values
with which the oscillator vendor confirmed normal and stable oscillation.
Table 1 shows the characteristics of a oscillation circuit when USB host function is not used.
If USB host function is to be used, it is absolutely recommended to use an oscillator that satisfies the precision and
stability according to the USB standards.
Table 1 Characteristics of a Sample Main System Clock Oscillator Circuit with a Ceramic Oscillator
Circuit Constant
Nominal
Vendor
Frequency
Name
6MHz
MURATA
CSTCR6M00GH5L**-R0
8MHz
MURATA
CSTCE8M00GH5L**-R0
10MHz
MURATA
12MHz
MURATA
Oscillator Name
Operating
Oscillation
Voltage
Stabilization Time
Range
typ
max
[]
[V]
[ms]
[ms]
1k
2.7 to 5.5
0.1
0.5
(33)
470
3.0 to 5.5
0.1
0.5
(33)
(33)
330
3.0 to 5.5
0.1
0.5
(33)
(33)
330
3.0 to 5.5
0.1
0.5
C1
C2
Rd1
[pF]
[pF]
(39)
(39)
(33)
CSTCE10M0GH5L**-R0
CSTCE12M0GH5L**-R0
Remarks
C1 and C2
integrated
SMD type
The oscillation stabilization time refers to the time interval that is required for the oscillation to get stabilized in the
following cases (see Figure 4):
Till the oscillation gets stabilized after VDD goes above the operating voltage lower limit.
Till the oscillation gets stabilized after the instruction for starting the main clock oscillation circuit is executed
Till the oscillation gets stabilized after the HOLD mode is reset.
Till the oscillation gets stabilized after the X'tal HOLD mode is reset with CFSTOP (OCR register, bit 0) set to 0
Characteristics of a Sample Subsystem Clock Oscillator Circuit
Given below are the characteristics of a sample subsystem clock oscillation circuit that are measured using an our
company-designated oscillation characteristics evaluation board and external components with circuit constant values
with which the oscillator vendor confirmed normal and stable oscillation.
Table 2 Characteristics of a Sample Subsystem Clock Oscillator Circuit with a Crystal Oscillator
Nominal
Vendor
Frequency
Name
EPSON
32.768kHz
TOYOCOM
Circuit Constant
Oscillator Name
Operating
Oscillation
Voltage
Stabilization Time
C3
C4
Rf
Rd2
Range
typ
max
[pF]
[pF]
[]
[]
[V]
[s]
[s]
18
18
OPEN
560k
2.7 to 5.5
1.1
3.0
Remarks
Applicable
MC-306
CL value=12.5pF
SMD type
The oscillation stabilization time refers to the time interval that is required for the oscillation to get stabilized in the
following cases (see Figure 4):
Till the oscillation gets stabilized after the instruction for starting the subclock oscillation circuit is executed
Till the oscillation gets stabilized after the HOLD mode is reset with EXTOSC (OCR register, bit 6) set to 1
Note: The components that are involved in oscillation should be placed as close to the IC and to one another as possible
because they are vulnerable to the influences of the circuit pattern.
CF1
CF2
XT1
Rf
Rd1
C1
CF
XT2
Rd2
C2
C3
Figure 1. CF Oscillator Circuit
X’tal
C4
Figure 2. Crystal Oscillator Circuit
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24
LC87F1HC4B
0.5VDD
Figure 3. AC Timing Measurement Point
VDD
Operating VDD
lower limit
GND
Power supply
Reset time
RES
Internal RC
oscillation
tmsCF
CF1, CF2
tmsX’tal
XT1, XT2
Operating
mode
Unpredictable
Reset
Instruction execution
Reset Time and Oscillation Stabilization Time
HOLD reset signal
HOLD reset signal valid
Internal RC
oscillation
tmsCF
CF1,CF2
tmsX’tal
XT1, XT2
Operating mode
HOLD
HALT
HOLD Reset Signal and Oscillation Stabilization Time
Figure 4. Oscillation Stabilization Time
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25
LC87F1HC4B
P34/UFILT
When using the internal PLL circuit to generate the
48MHz clock for USB , it is necessary to connect a filter
circuit such to the P34/UFILT pin such as that shown in
the left Fig.
Rd
0k
+
Cd
- 2.2F
Figure 5. External Filter Circuit for the Internal USB-dedicated PLL Circuit
P33/AFILT
+ Cp
1F
-
Rd
150
+
-
Cd
4.7F
To generate the master clock for the audio
interface using the internal PLL circuit, it is
necessary to connect a filter circuit to the
P33/AFILT pin that is shown in the left Fig.
Figure 6. External Filter Circuit for Audio Interface (Used with Internal PLL Circuit)
33
UHD+
5pF
It’s necessary to adjust the Circuit Constant
of the USB Port Peripheral Circuit for each
mounting board.
15k
33
UHD5pF
15k
Figure 7. USB Port Peripheral Circuit
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26
LC87F1HC4B
VDD
Note:
Determine the value of CRES and RRES so
that the reset signal is present for a period of
200µs after the supply voltage goes beyond the
lower limit of the IC's operating voltage.
RRES
RES
CRES
Figure 8. Reset Circuit
SIOCLK:
DATAIN:
DI0
DI1
DI2
DI3
DI4
DI5
DI6
DI7
DI8
DATAOUT:
DO0
DO1
DO2
DO3
DO4
DO5
DO6
DO7
DO8
Data RAM transfer
period (SIO0, 4, 9 only)
tSCK
tSCKL
tSCKH
SIOCLK:
thDI
tsDI
DATAIN:
tdDO
DATAOUT:
Data RAM transfer
period (SIO0, 4, 9 only)
tSCKL
tSCKHA
SIOCLK:
tsDI
thDI
DATAIN:
tdDO
DATAOUT:
Figure 9. Serial Input/Output Waveform
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27
LC87F1HC4B
tPIL
tPIH
Figure 10. Pulse Input Timing Signal Waveform
Voh
tr
D+
tr
90%
90%
Vcrs
10%
Vol
10%
D-
Figure 11. USB Data Signal Timing and Voltage Level
VIH(1)min.=0.3VDD+0.7V
tSCKR
tSCKR:
Defined as the time period from the time the
state of the output starts changing till the
time it reaches the minimum value of
VIH(1).
Figure 12. Serial Clock Output Timing Signal Waveform
ORDERING INFORMATION
Device
LC87F1HC4BUWA-2H
Package
SPQFP48 7x7 / SQFP48
(Pb-Free)
Shipping (Qty / Packing)
2500 / Tray JEDEC
ON Semiconductor and the ON logo are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States
and/or other countries. SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of
SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf . SCILLC reserves the right to make changes without
further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose,
nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including
without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can
and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each
customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are
not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or
sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers,
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directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was
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