LC709203F D

LC709203F
Smart LiB Gauge
Battery Fuel Gauge LSI
for 1-Cell Lithium-ion (Li+)
Overview
LC709203F is a Fuel Gauge for a single lithium ion battery. It is part of
our Smart LiB Gauge family of Fuel Gauges which measure the
battery RSOC (Relative State Of Charge) using its unique algorithm
called HG-CVR. The HG-CVR algorithm eliminates the use of a sense
resistor and provides accurate RSOC information even under unstable
conditions (e.g. changes of battery; temperature, loading, aging and selfdischarge). An accurate RSOC contributes to the operating time of
portable devices.
LC709203F is available in two small packages realizing the industries
smallest PCB footprint for the complete solution. It has minimal
parameters to be set by the user enabling simple, quick setup and
operation.
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WDFN8 3x4, 0.65P
Pb-Free, Halogen Free type
Features
 HG-CVR algorithm technology
 No external sense resistor
 2.8% accuracy of RSOC
 Accurate RSOC of aging battery
 Automatic convergence of error
 Adjustment for the parasitic impedance around the battery
 Simple and Quick Setup
 Low power consumption
 3μA Operational mode
 Precision Voltage measurement
 ±7.5mV
 Precision Timer
 ±3.5%
 Alerts for Low RSOC and / or Low Voltage
 Temperature compensation
 Sense Thermistor input
 Via I2C
 Detect Battery insertion
 I2C Interface (up to 400 kHz supported)
WLCSP9, 1.60x1.76
Pb-Free, Halogen Free type
ORDERING INFORMATION
See detailed ordering and shipping information in the
package dimensions section on page 22 of this data sheet
Applications
 Wireless Handsets
 Smartphones / PDA devices
 MP3 players
 Digital cameras
 Portable Game Players
 USB-related devices
* I2C Bus is a trademark of Philips Corporation.
© Semiconductor Components Industries, LLC, 2016
June 2016 - Rev. 9
1
Publication Order Number:
LC709203F/D
LC709203F
Application Circuit Example
System Vdd
10kΩ
10kΩ
Vdd
I2C Bus
Master
TSW
TSENSE
Battery
Pack
SDA
SCL
T
ASIC
ALARMB
VDD
VSS
TEST
LC709203F
10kΩ
Interrupt Input
1uF
PACK-
Vss
PACK+
System
System Vss
Figure 1. Example of an application schematic using LC709203F
(Temperature input via I2C.)
System Vdd
10kΩ
10kΩ
Vdd
I2C Bus
Master
Battery
Pack
10KΩ (s a me as thermistor resistance value)
T
TSW
SDA
SCL
thermistor
TSENSE
100Ω
10kΩ
ASIC
ALARMB
VDD
VSS
TEST
LC709203F
10kΩ
Interrupt Input
1uF
PACK-
Vss
PACK+
System
System Vss
Figure 2. Example of an application schematic using LC709203F
(The temperature is measured directly by a thermistor.)
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LC709203F
Figure 3. Simplified Block Diagram
TSW
Bottom view
TSENSE
Top view
SDA
WLCSP9, 1.60x1.76
“Pb-Free, Halogen Free Type”
SCL
WDFN8 3x4, 0.65P
“Pb-Free, Halogen Free Type”
8
7
6
5
VDD
3
4
SCL
NC
SDA
TEST
VSS
C
B
A
ALARMB
2
VSS
TEST
1
VDD
Figure 4. Pin Assignment
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3
2
1
LC709203F
Table 1. Pin Function
Pin Name
I/O
Description
WDFN8
WLP9
1
1B
TEST
I
Connect this pin to VSS.
2
1A
VSS
-
Connect this pin to the battery’s negative () pin.
3
3A
VDD
-
Connect this pin to the battery’s positive (+) pin.
This pin indicates alarm by low output(open drain). Pull-up must be done externally.
4
2A
ALARMB
O
Alarm conditions are specified by registers (0x13 or 0x14).
Connect this pin to VSS when not in use.
Power supply output for thermistor. This pin goes HIGH during temperature read operation.
5
3B
TSW
O
Resistance value of TSW (for thermistor pull-up) must be the same value as the thermistor.
(Note 1)
I
Thermistor sense input. If you connect this pin to thermistor, insert 100 resistance between them
6
3C
TSENSE
7
1C
SDA
I/O
I2C Data pin (open drain). Pull-up must be done externally.
8
2C
SCL
I/O
I2C Clock pin (open drain). Pull-up must be done externally.
-
2B
NC
-
for ESD. (Note 1)
Connect this pin to VSS.
Note 1: TSW and TSENSE must be disconnected as figure 1 when not in use.
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LC709203F
Table 2. Absolute Maximum Ratings at Ta = 25C, VSS = 0V
Specification
Parameter
Symbol
Pin/Remarks
Conditions
Unit
VDD [ V ]
Maximum supply
VDD max
VDD
Input voltage
VI (1)
TSENSE
Output voltage
Vo (1)
TSW
Vo (2)
ALARMB
VIO (1)
SDA, SCL
Pd max
WDFN8
voltage
Input/output
dissipation
Operating ambient
max
0.3
+6.5
0.3
VDD
+0.3
0.3
VDD
+0.3
0.3
V
+5.5
Ta = 40 to +85C
480
mW
WLP9
210
Topr
temperature
Storage ambient
typ
0.3
voltage
Allowable power
min
40
+85
55
+125
C
Tstg
temperature
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed,
damage may occur and reliability may be affected.
Table 3. Allowable Operating Conditions at Ta = 40 to +85C, VSS = 0V
Specification
Parameter
Symbol
Pin/Remarks
Conditions
VDD [ V ]
Operating supply
VDD (1)
VDD
VIH (1)
TSENSE
VIH (2)
ALARMB, SDA, SCL
voltage
Low level input
VIL (1)
TSENSE
VIL (2)
ALARMB, SDA, SCL
voltage
typ
max
2.5
4.5
2.5 to 4.5
0.7VDD
VDD
2.5 to 4.5
1.4
2.5 to 4.5
VSS
voltage
High level input
min
2.5 to 4.5
Unit
V
0.25VDD
0.5
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended
Operating Ranges limits may affect device reliability.
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LC709203F
Table 4. Electrical Characteristics at Ta = 40 to +85C, VSS = 0V
Specification
Parameter
Symbol
Pin/Remarks
Conditions
Unit
VDD [V]
High level input
IIH (1)
SDA, SCL
current
VIN = VDD
(including output transistor off
min
typ
max
2.5 to 4.5
1
leakage current)
Low level input
IIL (1)
SDA, SCL
current
VIN = VSS
(including output transistor off
A
2.5 to 4.5
1
IOH = 0.4 mA
3.0 to 4.5
VDD0.4
IOH = 0.2 mA
2.5 to 4.5
VDD0.4
IOL = 3.0 mA
3.0 to 4.5
0.4
IOL = 1.3 mA
2.5 to 4.5
0.4
leakage current)
High level output
VOH (1)
TSW
voltage
VOH (2)
Low level output
voltage
Hysteresis
VOL (1)
VOL (2)
TSW,
ALARMB,
SDA, SCL
VHYS(1)
SDA, SCL
CP
All pins
voltage
Pin capacitance
Ta = 25C
VRR
0.1VDD
2.5 to 4.5
10
Pins other than the pin under test
VIN = VSS
Reset Release
2.5 to 4.5
VDD
Voltage(Note 2)
Initialization
V
pF
2.4
V
90
ms
1.2
s
+3.5
%
TINIT
Time after Reset
2.4 to 4.5
release(Note 2)
Auto sleep set
TATS
2.4 to 4.5
time
Time
1
Ta = 20C to +70C
TME
measurement
2.5 to 4.5
3.5
accuracy
Consumption
IDD (1)
current
IDD (2)
(Note 3)
Voltage
VME (1)
measurement
VME (2)
accuracy
VDD
Operational mode
Sleep mode
VDD
2.5 to 4.5
3
4.5
2.5 to 4.5
1
2
Ta = +25C
Ta = 20C to +70C
3.6
7.5
+7.5
2.5 to 4.5
20
+20
A
mV/cell
Note 2: Once VDD voltage exceeds over the VRR, this LSI will release RESET status. And the LSI goes into Sleep mode TINIT after it.
Note 3: Consumption current is a value in the range of 20C to +70C.
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be
indicated by the Electrical Characteristics if operated under different conditions.
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LC709203F
Table 5. I2C Slave Characteristics at Ta = 40 to +85C, VSS = 0V
Specification
Parameter
Symbol
Pin/Remarks
Conditions
unit
VDD [V]
min
Max
Clock frequency
TSCL
SCL
400
kHz
Bus free time between STOP
TBUF
SCL, SDA
See Fig. 5.
1.3
s
THD:STA
SCL, SDA
See Fig. 5.
0.6
s
SCL, SDA
See Fig. 5.
0.6
s
s
condition and START
condition
Hold time (repeated) START
condition
First clock pulse is generated
after this interval
Repeated START condition
setup time
TSU:STA
STOP condition setup time
TSU:STO
SCL, SDA
See Fig. 5.
0.6
Data hold time
THD:DAT
SCL, SDA
See Fig. 5.
0
Data setup time
TSU:DAT
SCL, SDA
See Fig. 5.
Clock low period
TLOW
SCL
Clock high period
THIGH
SCL
Clock/data fall time
TF
SCL, SDA
20 + 0.1CB
300
ns
Clock/data rise time
TR
SCL, SDA
20 + 0.1CB
300
ns
400
s
Wake up time from Sleep
mode
SDA low pulse width to wake
up
Wake up retention time from
the falling edge of SDA
Wake up retention time from
STOP condition
TWU
TSP
TWR1
TWR2
0.9
s
100
ns
See Fig. 5.
1.3
s
See Fig. 5.
0.6
s
2.5 to 4.5
SDA
See Fig. 6.
SDA
See Fig. 6.
0.6
s
SDA
See Fig. 6.
500
ms
SCL, SDA
See Fig. 6.
500
ms
tR
tF
t LOW
t HD:STA
SCL
t HD:STA
t HD:DAT
t HIGH
t SU:DAT
t SU:STA
t SU:STO
SDA
t BUF
P
S
S
Figure 5. I2C Timing Diagram
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P
LC709203F
I2C Communication Protocol
2
Communication protocol type : I C
Frequency : Supported up to 400kHz
IC address [Slave Address] : 0x16 (It becomes "0001011X" when you write a binary, because the slave address is 7 bits. [X]=Rd/Wr.)
Bus Protocols
S
:
Start Condition
Sr
:
Repeated Start Condition
Rd
:
Read (bit value of 1)
Wr
:
Write (bit value of 0)
A
:
ACK (bit value of 0)
N
:
NACK (bit value of 1)
P
:
Stop Condition
CRC-8
:
Slave Address to Last Data (CRC-8-ATM : ex.3778mV : 0x16, 0x09, 0x17, 0xC2, 0x0E  0x86)
:
Master-to-Slave
:
Slave-to-Master
:
Continuation of protocol
…
Read Word Protocol
S
Slave Address
Wr
A
Command Code
A
Sr
Slave Address
Rd
A
Data Byte Low
A
A
CRC-8
N
P
…
Data Byte High
…
* When you do not read CRC-8, there is not the reliability of data. CRC-8-ATM ex : (5 bytes) 0x16, 0x09, 0x17, 0xC2, 0x0E  0x86
Write Word Protocol
S
Slave Address
Data Byte Low
Wr
A
A
Command Code
Data Byte High
A
A
CRC-8
* When you do not add CRC-8, the Written data (Data byte Low/High) become invalid.
CRC-8-ATM ex : (4 bytes) 0x16, 0x09, 0x55, 0xAA  0x3B
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…
A
P
LC709203F
Wake up from Sleep mode
Sleep mode
2
Disable I C communication
Enable I2C
communication
2
Disable I C
communication
TSP
SDA
TWU
TWR1
(Not to scale)
Sleep mode
2
Enable I C communication
SCL
Disable I2C communication
TWR2
SDA
(Not to scale)
STOP condition
Figure 6. I2C Wake up Timing Diagram
To wake up from Sleep mode, and to start I2C communication, Host side must set SDA low prior to the I2C communication.
The Fuel Gauge LSI enables I2C communication after the TWU time period which is measured from the falling edge of
SDA, as above timing chart. This “Wake up condition” is invalid for the following two cases.
1) After TWR1 timing following the falling edge of SDA, the Fuel Gauge LSI “Wake up condition” goes into autonomous
disable. Once I2C communication is started, the operation doesn’t go into disable until the TWR2 timing has elapsed
after STOP condition (below case).
2) After TWR2 timing following I2C Bus STOP condition, the Fuel gauge LSI “Wake up condition” goes into
autonomous disable.
If the “Wake up condition” goes into disable, set SDA low to once again wake up from the Sleep mode prior to the I2C
communication. If Operational mode is set, it is possible to start I2C communication without this “Wake up operation”.
Notice for I2C communication shared with another device
When the I2C Bus (on which the Fuel Gauge LSI is connected) is shared with another device the Fuel Gauge LSI must be in
its operation mode before the other Device starts I2C communication.
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LC709203F
Table 6. Function of Registers
Command
Code
Register Name
R/W
Range
Unit
Executes RSOC initialization with sampled
maximum voltage when 0xAA55 is set.
Sets B-constant of the
1K thermistor to be measured.
0x04
Before RSOC
W
0xAA55: Initialize RSOC
0x06
Thermistor B
R/W
0x0000 to 0xFFFF
0x07
Initial RSOC
W
0xAA55: Initialize RSOC
R
0x0000 to 0xFFFF
0x08
Cell Temperature
W
0x09E4 to 0x0D04
2
(I C mode)
0.1K
(0.0℃ =
0x0AAC)
0x09
Cell Voltage
R
0x0000 to 0xFFFF
1mV
0x0A
Current Direction
R/W
0x0000: Auto mode
0x0001: Charge mode
0xFFFF: Discharge mode
R/W
0x0000 to 0x00FF
R/W
0x0000 to 0xFFFF
0x0B
0x0C
APA
(Adjustment Pack
Application)
APT
(Adjustment Pack
Thermistor)
Initial
Value
Description
Executes RSOC initialization when 0xAA55
is set.
Displays Cell Temperature.
2
Sets Cell Temperature in I C
mode.
Displays Cell Voltage.
Selects Auto/Charge/Discharge mode.
1m
Sets Parasitic impedance.
Sets a value to adjust temperature
measurement delay timing.
0x0D
RSOC
R
0x0000 to 0x0064
0x0F
ITE (Indicator to Empty)
R
0x0000 to 0x03E8
0x11
IC Version
R
0x0000 to 0xFFFF
Displays RSOC value based on
a 0-100 scale
Displays RSOC value based on
0.1%
a 0-1000 scale
Displays an ID number of an IC.
0x12
Change Of The
Parameter
R/W
0x0000 or 0x0001
Selects a battery profile.
0x13
Alarm Low RSOC
R/W
0x14
Alarm Low Cell Voltage
R/W
0x15
IC Power Mode
R/W
0x16
Status Bit
R/W
0x1A
Number of The
Parameter
R
0x0000: Disable
0x0001to0x0064: Threshold
0x0000: Disable
0x0001to0xFFFF: Threshold
0x0001: Operational mode
0x0002: Sleep mode
2
0x0000: I C mode
0x0001: Thermistor mode
0x0301 or 0x0504
1%
1%
1mV
0x0D34
0x0BA6
(25℃)
0x0000
0x001E
0x0000
0x0008
0x0000
Selects Power mode.
(Note4)
Selects Temperature obtaining method.
0x0000
Displays Battery profile code.
0xXXXX=Hexadecimal notation
Note 4: See “Power-on Reset / Battery Insertion Detection” and figure 16.
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Sets RSOC threshold to
generate Alarm signal.
Sets Voltage threshold to
generate Alarm signal.
-
-
LC709203F
Before RSOC (0x04)
This LSI obtains Open Circuit Voltage (OCV) reading 10 ms
after Power-on reset to initialize RSOC (See figure 7).
Or the LSI can be forced to initialize RSOC by sending the
Before RSOC Command (004 = AA55) or the Initial RSOC
Command (007 = AA55). The accuracy of the Initialization
requires the OCV reading to be taken with minimal load or
charge, under 0.025C, on the battery. (i.e. less than 75mA for
3000mAh design capacity battery.).
The LSI initializes RSOC by the maximum voltage between
initialize after Power-on reset and setting the command when the
Before RSOC command is written. (See figure 8).
Thermistor B (0x06)
Sets B-constant of the thermistor to be measured. Refer to the
specification sheet of the thermistor for the set value to use.
Initial RSOC (0x07)
The LSI can be forced to initialize RSOC by sending the Before
RSOC Command (004 = AA55) or the Initial RSOC Command
(007 = AA55).
The LSI initializes RSOC by the measured voltage at that
time when the Initial RSOC command is written. (See
figure 9). The maximum time to initialize RSOC after the
command is written is 1.5 ms.
Cell Temperature (0x08)
This register contains the cell temperature from 20C (009E4)
to +60C (00D04) measured in 0.1C units.
In the Thermistor mode (016 = 01) the LSI measures the
attached thermistor and loads the temperature into the Cell
Temperature register. In the Thermistor mode, the thermistor
shall be connected to the LSI as shown in figure 2. The
temperature is measured by having TSW pin to provide power
into the thermistor and TSENSE pin to sense the output voltage
from the thermistor. Temperature measurement timing is
controlled by the LSI, and the power to the thermistor is not
supplied for other reasons except to measure the temperature.
In the I2C mode (016 = 00) the temperature is provided by the
host processor. During discharge/charge the register should be
updates when the temperature changes more than 1C
Cell Voltage (0x09)
This register contains the voltage on VDD 1mV units.
Current Direction (0x0A)
This register is used to control the reporting of RSOC. In Auto
mode the RSOC is reported as it increases or decreases. In
Charge mode the RSOC is not permitted to decrease. In
Discharge mode the RSOC is not permitted to increase.
With consideration of capacity influence by temperature, we
recommend operating in Auto because RSOC is affected by the
cell temperature. A warm cell has more capacity than a cold cell.
Be sure not to charge in the Discharge mode and discharge in the
Charge mode; it will create an error.
An example of RSOC reporting is shown in Figures 10 and 11.
Figure 7. RSOC automatic initialization
Figure 9. Initial RSOC command
Figure 8. Before RSOC command
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LC709203F
Typical APA (Decimal number)
Figure 10. Discharge Mode
(An example with increasing in temperature. A warm cell has
more capacity than a cold cell. Therefore RSOC increases
without charging in Auto mode.)
Figure 11. Charge mode
(An example with decreasing in temperature. A cold cell has less
capacity than a warm cell. Therefore RSOC decreases without
discharging in Auto mode.)
Adjustment Pack Application (0x0B)
Adjustment Pack Thermistor (0x0C)
This register contains the adjustment value for a battery type to
improve the RSOC precision. Figure 12 and Table 7 show
typical values of APA according to the design capacities.
Please contact ON Semiconductor if you don’t satisfy the RSOC
precision. The deeper adjustment of APA may improve the
accuracy.
This is used to compensate for the delay of the thermistor
measurement caused by a capacitor across the thermistor. The
default value has been found to meet most of circuits where a
capacitor like showing in figure13 is not put.
Please contact ON Semiconductor if you have an unusual circuit
implementation.
60
50
40
30
20
10
0
0
500
1000
1500
2000
2500
3000
3500
Design capacity (mAh)
Figure 12. Typical APA
Figure 13. An example of a capacitor across the thermistor
Table 7. Typical APA
Design capacity
of battery
APA(0x0B)
100mAh
0x08
200mAh
0x0B
500mAh
0x10
Indicator to Empty (0x0F)
1000mAh
0x19
This is the same as RSOC with a resolution of 0.1% over the
range 0.0% to 100.0%.
2000mAh
0x2D
3000mAh
0x36
RSOC (0x0D)
RSOC is reported in 1% units over the range 0% to 100%.
IC Version (0x11)
This is an ID number of an LSI.
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LC709203F
Change of the Parameter (0x12)
The LSI contains a data file comprised of two battery profiles.
This register is used to select the battery profile to be used. See
Table 8. Register Number of the Parameter (0x1A) contains
identity of the data file.
The Data file is loaded during final test depending on the part
number ordered.
Most of the time, battery nominal/rated voltage or charging
voltage values are used to determine which profile data shall be
used. Please contact ON Semi if you cannot identify which
profile to select.
calculation and tracking of RSOC during charge and discharge.
If the battery is significantly charged or discharged during sleep
mode, the RSOC will not be accurate. Moved charge is counted
continuously to measure the RSOC in Operational mode. If
battery is discharged or charged in the Sleep mode, the count
breaks off.
When it is switched from Sleep mode to Operational mode,
RSOC calculation is continued by using the data which was
measured in the previous Operational mode.
Alarm Low RSOC (0x13)
The ALARMB pin will be set low when the RSOC value falls
below this value, will be released from low when RSOC value
rises than this value. Set to Zero to disable. Figure 14.
Figure 15. Alarm Low Cell Voltage
Status Bit (0x16)
This selects the Thermistor mode. Thermistor mode (0x16 = 01)
the LSI measures the attached thermistor and loads the
temperature into the Cell Temperature register.
I2C mode (0x16 = 00) the temperature is provided by the host
processor.
Figure 14. Alarm Low RSOC
Alarm Low Cell Voltage (0x14)
Number of the Parameter (0x1A)
The ALARMB pin will be set low if VDD falls below this value,
will be released from low if VDD rises than this value. Set to
Zero to disable. Figure 15.
The LSI contains a data file comprised of two battery profiles.
This register contains identity of the data file. Please see register
Change of the Parameter (0x12) to select the battery profile
to be used. See Table 8.
The Data file is loaded during final test depending on the part
number ordered. This file can be loaded in the field if required.
Please contact ON Semi if you cannot identify which profile to
select.
IC Power Mode (0x15)
The LSI has two power modes. Sleep (0x15 = 02) or Operational
mode (0x15 = 01). In the Sleep mode only I2C communication
functions. In the Operational mode all functions operate with full
Table 8. Battery profile vs register
IC Type
LC709203Fxx-01xx
LC709203Fxx-04xx
Battery
Type
Nominal/Rated
Voltage
Charging Voltage
03
3.8 V
4.35V
01
3.7V
4.2V
05
ICR18650-26H (SAMSUNG)
04
UR18650ZY (Panasonic)
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Number Of The
Parameter(0x1A)
0x0301
0x0504
Change Of The
Parameter(0x12)
0x0000
0x0001
0x0000
0x0001
LC709203F
HG-CVR
Hybrid Gauging by Current-Voltage tracking with internal Resistance
HG-CVR is ON Semiconductor’s unique method which is used
to calculate accurate RSOC. HG-CVR first measures battery
voltage and temperature. Precise reference voltage is essential
for accurate voltage measurement. LC709203F has accurate
internal reference voltage circuit with little temperature
dependency.
It also uses the measured battery voltage and internal impedance
and Open Circuit Voltage (OCV) of a battery for the current
measurement. OCV is battery voltage without load current. The
measured battery voltage is separated into OCV and varied
voltage by load current. The varied voltage is the product of load
current and internal impedance. Then the current is determined
by the following formulas.
Automatic Convergence of the Error
A problem of coulomb counting method is the fact that the error
is accumulated over time - This error must be corrected. The
general gauges using coulomb counting method must find an
opportunity to correct it.
This LSI with HG-CVR has the feature that the error of RSOC
converges, doesn’t emit without such an opportunity. The error
constantly converges in the value estimated from the Open
Circuit Voltage. Figure 25 shows the convergent characteristic
from the initialize error.
Also, coulomb counting method cannot detect accurate residual
change because the amount of the current from self-discharge is
too small but HG-CVR is capable to deal with such detection by
using the voltage information.
V(VARIED) = V(MEASURED)OCV (1)
I=
Simple and Quick Setup
V(VARIED)
R(INTERNAL)
(2)
Where V(VARIED) is varied voltage by load current,
V(MEASURED) is measured voltage, R(INTERNAL) is internal
impedance of a battery. Detailed information about the internal
impedance and OCV is installed in the LSI. The internal
impedance is affected by remaining capacity, load-current,
temperature, and more. Then the LSI has the information as look
up table. HG-CVR accumulates battery coulomb using the
information of the current and a steady period by a high accuracy
internal timer. The remaining capacity of a battery is calculated
with the accumulated coulomb.
In general, it is necessary to obtain multiple parameters for a fuel
gauge and it takes a lot of resource and additional development
time of the users. One of the unique features of LC709203F is
very small number of parameters to be prepared by the beginning
of battery measurement – the minimum amount of parameter
which users may make is one because Adjustment pack
application register has to have one.
Such simple and quick start-up is realized by having multiple
profile data in the LSI to support various types of batteries.
Please contact your local sales office to learn more information
on how to measure a battery that cannot use already-prepared
profile data.
Low Power Consumption
How to identify Aging
By repeating discharge/charge, internal impedance of a battery
will gradually increase, and the Full Charge Capacity (FCC) will
decrease. In coulomb counting method RSOC is generally
calculated using the FCC and the Remaining Capacity (RM).
RSOC =
RM
FCC
 100%
Low power consumption of 3A is realized in the Operation
mode. This LSI monitors charge/discharge condition of a battery
and changes the sampling rate according to its change of current.
Power consumption reduction without deteriorating its RSOC
accuracy was enabled by utilizing this method.
Power-on Reset / Battery Insertion Detection
(3)
Then the decreased FCC must be preliminarily measured with
learning cycle. But HG-CVR can measure the RSOC of
deteriorated battery without learning cycle. The internal battery
impedance that HG-CVR uses to calculate the current correlates
highly with FCC. The correlation is based on battery chemistry.
The RSOC that this LSI reports using the correlation is not
affected by aging.
Figure 22-24 show RSOC measurement result of a battery with
decreased FCC due to its aging. The shown RSOC is based on
the decreased FCC even with a battery with 80% FCC after
executing 300 times of discharge/charge.
When this LSI detects battery insertion, it starts Power-on reset
automatically. Once the battery voltage exceeds over the VRR,
it will release RESET status and will complete LSI initialization
within TINIT to enter into Operational mode. All registers are
initialized after Power-on reset. Then I2C communication can be
started.
LC709203FXE-0xMH sets itself into Sleep mode automatically
after TATS from the end of initialization. Therefore set to
operational mode manually after it enters into Sleep mode.
LC709203FQH-0xTWG doesn’t set itself into Sleep mode
automatically. Figure 16.
This LSI will also execute system reset automatically if a battery
voltage exceeds under the VRR during operation.
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LC709203F
Parasitic resistance
The LSI measures RSOC by using internal impedance of a
battery. Therefore, the parasitic resistance which exists in
VDD/VSS Lines between measured Battery or Battery Pack to
the LSI can become an error factor. But the resistance of Lines
which is not connected other than the LSI is not included. Figure
17.
The lower resistance may improve the RSOC precision. Please
see LC709203F Application note for information about layout
method of VDD/VSS Lines to reduce it.
Measurement Starting Flow
After Reset release, users can start battery measurement by
writing appropriate value into the registers by following the flow
shown in Figure 18-19. Please refer to Register function section
for more information about each register.
Timing diagram at power on
LC709203FQH‐0xTWG
VDD
Reset
Initialization
VRR
Operational mode
TINIT
LC709203FXE‐0xMH
VDD
Reset
VRR
Initialization
Operational mode
TINIT
TATS
(Not to scale)
Figure 16. Power on Timing Diagram
Figure 17. An example of parasitic resistance
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15
Sleep mode
LC709203F
Starting flow
Set 0xAA55
Power On
Initial RSOC
to register
0x04 or 0x07
(Note 6)
Input SDA pulse
(Note 5)
Set 0x0001
to register 0x15
(Note 5)
Wake up from
Sleep mode
Set Thermistor
mode
Set Operational
mode
Set B-constant of
thermistor
Set 0x0001
to register 0x16
Set 0xZZZZ
to register 0x06
Set 0xZZZZ
to register 0x0B
Set APA
Initialization End
Note 5 : It's unnecessary if initial power mode is
Set 0x000Z
to register 0x12
Operational mode.
SDA pulse can be substituded in some
Set Battery profile
kind of commands.
Ex: Input "Set Operational mode" twice.
Note 6 : It's unnecessary if OCV can be get
at automatic initialization.
Figure 18. Starting flow at Thermistor mode
Set 0xAA55
Power On
Initial RSOC
to register
0x04 or 0x07
(Note 6)
Input SDA pulse
(Note 5)
Set 0x0001
to register 0x15
(Note 5)
Wake up from
Sleep mode
Set 0x0000
Set Via I2C mode
Set Operational
mode
to register 0x16
Set 0xZZZZ
Set Temperature
to register 0x08
Set 0xZZZZ
to register 0x0B
Set APA
Initialization End
Note 5 : It's unnecessary if initial power mode is
Set 0x000Z
to register 0x12
Operational mode.
SDA pulse can be substituded in some
Set Battery profile
kind of commands.
Ex: Input "Set Operational mode" twice.
Note 6 : It's unnecessary if OCV can be get
at automatic initialization.
Figure 19. Starting flow at I2C mode
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LC709203F
TYPICAL CHARACTERISTICS
Figure 20. Discharge Characteristics by Temperature Change
Figure 21. Discharge Characteristics by Load Change
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LC709203F
TYPICAL CHARACTERISTICS
Figure 22. Discharge/Charge cycle
Figure 23. Battery capacity deterioration
Figure 24. 1 Discharge characteristics of deterioration battery
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LC709203F
TYPICAL CHARACTERISTICS
Figure 25. Convergent characteristic from the initialize error
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LC709203F
PACKAGE DIMENSIONS
unit : mm
WDFN8 3x4, 0.65P
CASE 509AF
ISSUE C
L
A
B
D
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30mm FROM THE TERMINAL TIP.
4. PROFILE TOLERANCE APPLIES TO THE
EXPOSED PAD AS WELL AS THE LEADS.
L1
DETAIL A
ALTERNATE
CONSTRUCTIONS
DIM
A
A1
A3
b
D
D2
E
E2
e
L
L1
E
PIN ONE
REFERENCE
2X
EXPOSED Cu
MOLD CMPD
0.10 C
DETAIL B
0.10 C
2X
ALTERNATE
CONSTRUCTIONS
TOP VIEW
A
(A3)
DETAIL B
0.10 C
SIDE VIEW
A1
C
XXXXX
XXXXX
AYWW
SEATING
PLANE
0.10 C A B
A
= Assembly Location
Y
= Year
WW = Work Week
= Pb-Free Package
(Note: Microdot may be in either location)
D2
DETAIL A
1
4
0.10 C A B
8X
0.00
0.05
0.20 REF
0.20
0.30
3.00 BSC
1.70
1.90
4.00 BSC
2.30
2.50
0.65 BSC
0.45
0.55
GENERIC
MARKING DIAGRAM*
0.08 C
NOTE 4
MILLIMETERS
MIN
MAX
L
*This information is generic. Please refer to
device data sheet for actual part marking.
E2
may or may not be present.
8
5
e/2
e
8X
RECOMMENDED
SOLDERING FOOTPRINT*
b
1.96
0.10 C A B
0.05 C
8X
0.70
NOTE 3
BOTTOM VIEW
2.56 4.30
1
0.65
PITCH
8X
0.35
DIMENSIONS: MILLIMETERS
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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20
LC709203F
PACKAGE DIMENSIONS
unit : mm
WLCSP9, 1.60x1.76
CASE 567JH
ISSUE B
E
A B
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO THE SPHERICAL
CROWNS OF THE SOLDER BALLS.
PIN A1
REFERENCE
D
DIM
A
A1
b
D
E
e
0.05 C
2X
0.05 C
2X
TOP VIEW
BACKCOAT
0.10 C
MILLIMETERS
MIN
MAX
0.51
−−−
0.09
0.19
0.20
0.30
1.60 BSC
1.76 BSC
0.50 BSC
A
RECOMMENDED
SOLDERING FOOTPRINT*
0.08 C
A1
A1
NOTE 3
C
SIDE VIEW
PACKAGE
OUTLINE
SEATING
PLANE
e
9X
b
0.05 C A B
e
0.50
PITCH
C
0.03 C
B
9X
0.25
0.50
PITCH
DIMENSIONS: MILLIMETERS
A
1
2
3
BOTTOM VIEW
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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21
LC709203F
ORDERING INFORMATION
Device
Package
Shipping (Qty / Packing)
LC709203FQH-01TWG
WDFN8 3x4, 0.65P
(Pb-Free / Halogen Free)
2000 / Tape & Reel
LC709203FQH-02TWG
WDFN8 3x4, 0.65P
(Pb-Free / Halogen Free)
2000 / Tape & Reel
LC709203FQH-03TWG
WDFN8 3x4, 0.65P
(Pb-Free / Halogen Free)
2000 / Tape & Reel
LC709203FQH-04TWG
WDFN8 3x4, 0.65P
(Pb-Free / Halogen Free)
2000 / Tape & Reel
LC709203FXE-01MH
WLCSP9, 1.60x1.76
(Pb-Free / Halogen Free)
5000 / Tape & Reel
LC709203FXE-02MH
WLCSP9, 1.60x1.76
(Pb-Free / Halogen Free)
5000 / Tape & Reel
LC709203FXE-03MH
WLCSP9, 1.60x1.76
(Pb-Free / Halogen Free)
5000 / Tape & Reel
LC709203FXE-04MH
WLCSP9, 1.60x1.76
(Pb-Free / Halogen Free)
5000 / Tape & Reel
† For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel
Packaging Specifications Brochure, BRD8011/D. http://www.onsemi.com/pub_link/Collateral/BRD8011-D.PDF
(Note)
IC performance may vary depend on the types of battery to be in use. Contact your local sales office for assistance in
choosing the correct model.
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