48-FBGA (6 x 8 mm) Stack Die Pb-Free Package PACKAGE MATERIAL DECLARATION DATASHEET Cypress Package Code Package Weight – Site 1 BK 99.1681 mg Body Size (mil/mm) Package Weight – Site 2 6 x 8 mm N/A SUMMARY The 48-BGA Stack Die Pb-Free package is compliant to RoHS. Cypress Ordering Part Numbers containing an “X” (e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meet the Directive 2002/95/EC (RoHS) requirement. ASSEMBLY Site 1: Advanced Semiconductor Engineering Taiwan (ASET) Package Qualification Report #s 052502 / 092602 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note2) CoA-BK48KASET As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-84077 Rev. *B Page 1 of 4 48-FBGA (6 x 8 mm) Stack Die Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Material Purpose of Use SiO2 60676-86-0 2.5478 % weight of substance per Homogenous material 10.4900% 25,692 2.5692% Acrylic 2.2345 9.2000% 22,532 2.2532% 1.4913 6.1400% 15,038 1.5038% Bisphenol Triazol Cu Trade Secret 29690-82-2, 68541-56-0, 25068-38-6 13676-54-5 25722-66-1 7440-50-8 3.6383 4.3670 9.5525 14.9800% 17.9800% 39.3300% 36,689 44,036 96,326 3.6689% 4.4036% 9.6326% Ni 7440-02-0 0.3376 1.3900% 3,404 0.3404% Au Sn Ag Cu Epoxy Resin Diester Functionalized esters Polymeric resin Fused silica Poly(tetrafluoro ethylene) Bismaleimide Resin Synthetic resin Additive Substituded silane Initiator 1 Initiator 2 Si Au Ion Impurities Silica Fused Epoxy Resin (1) Epoxy Resin (2) Phenol resin 7440-57-5 7440-31-5 7440-22-4 7440-50-8 Trade Secret Trade Secret 0.1190 5.4531 0.2284 0.0286 0.6886 2.7051 0.4900% 95.5000% 4.0000% 0.5000% 7.0000% 27.5000% 1,200 54,988 2,303 288 6,944 27,278 0.1200% 5.4988% 0.2303% 0.0288% 0.6944% 2.7278% Trade Secret 0.9837 10.0000% 9,919 0.9919% Trade Secret 60676-86-0 0.2951 5.1643 3.0000% 52.5000% 2,976 52,077 0.2976% 5.2077% 9002-84-0 0.6925 40.0000% 6,983 0.6983% Trade Secret 0.6925 40.0000% 6,983 0.6983% Trade Secret Trade Secret 0.1731 0.0866 10.0000% 5.0000% 1,746 873 0.1746% 0.0873% Trade Secret 0.0173 1.0000% 175 0.0175% Trade Secret Trade Secret 7440-21-3 7440-57-5 Trade Secret 60676-86-0 93705-66-9 Trade Secret 106466-55-1 0.0346 0.0346 7.6780 2.0998 0.0002 42.5633 2.1521 0.9565 2.1521 2.0000% 2.0000% 100.0000% 99.9900% 0.0100% 89.0000% 4.5000% 2.0000% 4.5000% 349 349 77,424 21,174 2 429,205 21,701 9,645 21,701 0.0349% 0.0349% 7.7424% 2.1174% 0.0002% 42.9205% 2.1701% 0.9645% 2.1701% % Total: 100.0000 Substance Composition Epoxy Substrate Base Material Solder Ball External Plating Die Attach 1 Adhesive Die attach 2 Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation CAS Number Package Weight (mg): Weight by mg 99.1681 PPM % weight of substance per package Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-84077 Rev. *B Page 2 of 4 48-FBGA (6 x 8 mm) Stack Die Pb-Free Package II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tray Others Material Cover tape Carrier tape Plastic Reel Tray Moisture Barrier bag Shielding bag Protective Band Shipping and inner/ pizza box Lead PPM Cadmium PPM Cr VI PPM Mercury PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 PBB PPM PBDE PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-MBBG-R CoA-SBAG-R CoA-PROB-R CoA-ABOX-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-84077 Rev. *B Page 3 of 4 48-FBGA (6 x 8 mm) Stack Die Pb-Free Package Document History Page Document Title: Document Number: Rev. 48 - FBGA (6X8MM) STACK DIE PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET 001-84077 ** *A ECN No. Orig. of Change 3782969 JARG 4066975 YUM *B 4995803 MRB Description of Change New document Added assembly site name in the assembly heading. Changed Assembly code to assembly site name. No Change Removed “Distribution: WEB” and “Posting: NONE” from the document history page. Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-84077 Rev. *B Page 4 of 4