LC898119XC CMOS LSI Optical Image Stabilization (OIS) Controller & Driver www.onsemi.com Overview LC898119XC is a system LSI (WLP type) integrating a digital signal processing function for Optical Image Stabilization (OIS) control and a saturation-driven H bridge driver function. WLCSP25, 2.0x2.0 Function Motor Driver Saturation-drive H bridge 2ch IO max : 220mA Digital signal processing Built-in digital servo circuit Built-in Gyro filter AD converter 12bit Input 2ch Equipped with a sample-hold circuit DA converter 8bit Output 2ch Built-in Serial I/F circuit (2-wire I2C-Bus) Built-in Hall Bias circuit Built-in Hall Amp (Gain of Op-amp : 60, 90, 130, 200) Built-in OSC (Oscillator) Typ. 36MHz Built-in LDO (Low Drop-Out regulator) Digital Gyro I/F for the companies (SPI Bus) (Please refer for the details) Package WLCSP25, 2.00mm 2.00mm, thickness Max. 0.675mm, with B/C Pb-free / Halogen Free Power Supply Voltage AD/DA/VGA/LDO/OSC Digital I/O Driver Core Logic : AVDD30 = 2.6V to 3.6V : DVDD18 = 1.8V±10% : VM = 2.6V to 3.6V : Generation in LDO DVDD12 = typ 1.2V output * I2C Bus is a trademark of Philips Corporation. ORDERING INFORMATION See detailed ordering and shipping information on page 5 of this data sheet. © Semiconductor Components Industries, LLC, 2015 March 2015 - Rev. 1 1 Publication Order Number : LC898119XC/D LC898119XC Block Diagram 8bit DA I2CCK OIS I2C I/F IOP0 Command Sequencer HLXBO I2CDT IOPORT Control IOP1 IOP2 HLYBO M X Sys clock typ 36Mhz SRAM OSC register AVDD30 OPINPX DGDATA Digial Gyro I/F Hall-X OPINMX DGSCLK - + DGSSB AVDD30 OPINPY AVSS Hall-Y OPINMY - + DVDD18 typ 1.2V Sys_Reset Power On Reset DVS S LDO AVDD30 DVDD12 12bit ADC Hall-EQ OUT1 OIS PWM OUT2 Gyro-EQ H-Bridge Driver OUT3 OUT4 PGND VM Example of wiring diagram (Hall) in LC898119XC www.onsemi.com 2 Digial Gyro LC898119XC Package Dimensions unit : mm WLCSP25, 2.0x2.0 CASE 567HK ISSUE O D A NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. B PIN A1 REFERENCE DIM A A1 b D E e E 0.10 C 2X 0.10 C 2X MILLIMETERS MIN MAX 0.675 0.15 0.25 0.21 0.31 2.00 BSC 2.00 BSC 0.40 BSC TOP VIEW A 0.10 C A1 RECOMMENDED SOLDERING FOOTPRINT* 0.05 C 25X C SIDE VIEW NOTE 3 SEATING PLANE A1 PACKAGE OUTLINE e b 0.05 C A B 0.03 C E e 0.40 PITCH D C 25X 0.40 PITCH B 0.22 DIMENSIONS: MILLIMETERS A 1 2 3 4 *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 5 BOTTOM VIEW www.onsemi.com 3 LC898119XC Pin Assignment Bottom View A B C D E DVDD12 AVDD30 AVSS OPINPY OPINPX IOP0 OPINMY OPINMX HLXBO HLYBO IOP1 IOP2 DVDD18 DVSS DGSCLK I2CCK I2CDT VM DGSSB DGDATA OUT1 OUT2 PGND OUT3 OUT4 1 2 3 4 5 Driver Analog VDD Analog GND Digital GND IO VDD Logic Core VDD (Output) <typ> I : INPUT, O : OUTPUT, B : BIDIRECTION, P : Power, GND Ball No Pin Name type Description A1 DVDD12 P LDO Power supply out (Logic Core VDD (typ 1.2V)) A2 IOP0 B General-purpose IOPORT A3 IOP1 B General-purpose IOPORT A4 I2CCK I I2C_IF clock A5 OUT1 O Driver Output B1 AVDD30 P Analog Power(2.6V to 3.6V) B2 OPINMY I Hall-Y OpAmp input- B3 IOP2 B General-purpose IOPORT / External Clock input (change at Register) B4 I2CDT B I2C_IF Data B5 OUT2 O Driver Output C1 AVSS P Analog GND C2 OPINMX I Hall-X OpAmp input- C3 DVDD18 P IO Power (1.62V to 1.98V) C4 VM P Driver Power C5 PGND P Driver GND D1 OPINPY I Hall-Y OpAmp input+ D2 HLXBO O Hall-X Bias (Current Drive) D3 DVSS P Logic GND D4 DGSSB B Digital Gyro IF Chip Select (O) D5 OUT3 O Driver Output E1 OPINPX I Hall-X OpAmp input+ E2 HLYBO O Hall-X Bias (Current Driver) E3 DGSCLK O Digital Gyro IF clock E4 DGDATA B Digital Gyro IF data E5 OUT4 O Driver Output www.onsemi.com 4 LC898119XC ORDERING INFORMATION Device LC898119XC-MH Package Shipping (Qty / Packing) WLCSP25 2.0x2.0 (Pb-Free / Halogen Free) 4000 / Tape & Reel † For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://www.onsemi.com/pub_link/Collateral/BRD8011-D.PDF ON Semiconductor and the ON logo are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf . SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. 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