MC74HCT132A D

MC74HCT132A
Quad 2-Input NAND Gate
with Schmitt-Trigger Inputs
with LSTTL Compatible
Inputs
High−Performance Silicon−Gate CMOS
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MARKING
DIAGRAMS
The MC74HCT132A is identical in pinout to the LS132. The device
inputs are compatible with standard CMOS outputs; with pull−up
resistors, they are compatible with LSTTL outputs.
The MC74HCT132A can be used to enhance noise immunity or to
square up slowly changing waveforms.
14
PDIP−14
N SUFFIX
CASE 646
MC74HCT132AN
AWLYYWWG
1
Features
•
•
•
•
•
•
•
•
Output Drive Capability: 10 LSTTL Loads
Outputs Directly Interface to CMOS, NMOS, and TTL
Operating Voltage Range: 2.0 to 6.0 V
Low Input Current: 1.0 mA
High Noise Immunity Characteristic of CMOS Devices
In Compliance with the Requirements as Defined by JEDEC
Standard No. 7A
Chip Complexity: 72 FETs or 18 Equivalent Gates
These are Pb−Free Devices
14
SOIC−14
D SUFFIX
CASE 751A
HCT132AG
AWLYWW
1
14
HCT
132A
ALYWG
G
TSSOP−14
DT SUFFIX
CASE 948G
1
A1
1
14
VCC
B1
2
13
B4
Y1
3
12
A4
A2
4
11
Y4
B2
5
10
B3
Y2
6
9
A3
GND
7
8
Y3
14
74HCT132A
ALYWG
SOEIAJ−14
F SUFFIX
CASE 965
1
A
= Assembly Location
L, WL = Wafer Lot
Y, YY
= Year
W, WW = Work Week
G or G = Pb−Free Package
(Note: Microdot may be in either location)
Figure 1. Pin Assignment
FUNCTION TABLE
Inputs
Output
A
B
Y
L
L
H
H
L
H
L
H
H
H
H
L
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
© Semiconductor Components Industries, LLC, 2009
November, 2009 − Rev. 1
1
Publication Order Number:
MC74HCT132A/D
MC74HCT132A
A1
1
3
B1
A2
2
4
6
B2
A3
Y2
5
Y = AB
9
8
B3
Y1
Y3
10
A4 12
11
B4
Y4
13
PIN 14 = VCC
PIN 7 = GND
Figure 2. Logic Diagram
ORDERING INFORMATION
Device
Package
Shipping†
MC74HCT132ANG
PDIP−14
(Pb−Free)
25 / Tape & Ammo Box
MC74HCT132ADG
SOIC−14
(Pb−Free)
55 Units / Rail
MC74HCT132ADR2G
SOIC−14
(Pb−Free)
2500 / Tape & Reel
MC74HCT132ADTR2G
TSSOP−14*
2500 / Tape & Reel
MC74HCT132AFELG
SOEIAJ−14
(Pb−Free)
2000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*This package is inherently Pb−Free.
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2
MC74HCT132A
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
VCC
Positive DC Supply Voltage
0.5 to 7.0
V
VIN
Digital Input Voltage
0.5 to 7.0
V
VOUT
DC Output Voltage
0.5 to 7.0
0.5 to VCC 0.5
V
IIK
Input Diode Current
20
mA
IOK
Output Diode Current
20
mA
IOUT
DC Output Current, per Pin
25
mA
ICC
Output in 3−State
High or Low State
DC Supply Current, VCC and GND Pins
75
mA
IGND
DC Ground Current per Ground Pin
75
mA
TSTG
Storage Temperature Range
65 to 150
_C
260
_C
150
_C
14−PDIP
14−SOIC
14−TSSOP
78
125
170
_C/W
PDIP
SOIC
TSSOP
750
500
450
mW
TL
Lead Temperature, 1 mm from Case for 10 Seconds
TJ
Junction Temperature Under Bias
qJA
Thermal Resistance
PD
Power Dissipation in Still Air at 85_C
MSL
Moisture Sensitivity
FR
Flammability Rating
Level 1
Oxygen Index: 30% − 35%
UL 94 V0 @ 0.125 in
VESD
ESD Withstand Voltage
Human Body Model (Note 1)
Machine Model (Note 2)
Charged Device Model (Note 3)
2000
100
500
V
ILatch−Up
Latch−Up Performance
Above VCC and Below GND at 85_C (Note 4)
300
mA
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Tested to EIA/JESD22−A114−A.
2. Tested to EIA/JESD22−A115−A.
3. Tested to JESD22−C101−A.
4. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
VCC
VIN, VOUT
Parameter
DC Supply Voltage (Referenced to GND)
DC Input Voltage, Output Voltage (Referenced to GND)
TA
Operating Temperature, All Package Types
tr, tf
Input Rise and Fall Time (Figure 3)
Min
Max
Unit
2.0
6.0
V
0
VCC
V
55
125
_C
−
No Limit
(Note 5)
ns
5. When VIN 0.5 VCC, ICC >> quiescent current.
6. Unused inputs may not be left open. All inputs must be tied to a high−logic voltage level or a low−logic input voltage level.
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3
MC74HCT132A
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
VCC
Symbol
Parameter
VT+max
Maximum Positive−Going
Input Threshold Voltage
VT+min
V
*55_C to 25_C
85_C
125_C
Unit
VOUT = 0.1 V
|IOUT| 20 mA
4.5
5.5
1.9
2.1
1.9
2.1
1.9
2.1
V
Minimum Positive−Going
Input Threshold Voltage
VOUT = 0.1 V
|IOUT| 20 mA
4.5
5.5
1.2
1.4
1.2
1.4
1.2
1.4
V
VT–max
Maximum Negative−Going
Input Threshold Voltage
VOUT = VCC – 0.1 V
|IOUT| 20 mA
4.5
5.5
1.2
1.4
1.2
1.4
1.2
1.4
V
VT–min
Minimum Negative−Going
Input Threshold Voltage
VOUT = VCC – 0.1 V
|IOUT| 20 mA
4.5
5.5
0.5
0.6
0.5
0.6
0.5
0.6
V
VHmin
(Note 7)
Minimum Hysteresis
Voltage
VOUT = 0.1 V or VCC – 0.1 V
|IOUT| 20 mA
4.5
5.5
0.4
0.4
0.4
0.4
0.4
0.4
V
VOH
Minimum High−Level
Output Voltage
VIN VT−min or VT+max
|IOUT| 20 mA
4.5
5.5
4.4
5.4
4.4
5.4
4.4
5.4
V
VIN −VT−min or VT+max
|IOUT| 4.0 mA
4.5
3.98
3.84
3.7
VIN ≥ VT+max
|IOUT| 20 mA
4.5
5.5
0.1
0.1
0.1
0.1
0.1
0.1
4.5
0.26
0.33
0.4
VOL
Test Conditions
Guaranteed Limit
Maximum Low−Level
Output Voltage
VIN ≥ VT+max
|IOUT| 4.0 mA
V
IIN
Maximum Input Leakage
Current
VIN = VCC or GND
5.5
0.1
1.0
1.0
mA
ICC
Maximum Quiescent
Supply Current
(per Package)
VIN = VCC or GND
IOUT = 0 mA
5.5
1.0
10
40
mA
7. VHmin (VT+min) (VT−max); VHmax = (VT+max) (VT−min).
AC ELECTRICAL CHARACTERISTICS (CL = 50 pF, Input tr = tf = 6.0 ns, VCC = 5.0 V ± 10%)
VCC
Symbol
Parameter
Guaranteed Limit
V
*55_C to 25_C
85_C
125_C
Unit
tPLH,
tPHL
Maximum Propagation Delay, Input A or B to Output Y
(Figures 3 and 4)
5.0
25
31
38
ns
tTLH,
tTHL
Maximum Output Transition Time, Any Output
(Figures 3 and 4)
5.0
15
19
22
ns
Cin
Maximum Input Capacitance
—
10
10
10
pF
CPD
Power Dissipation Capacitance (per Gate) (Note 8)
Typical @ 25°C, VCC = 5.0 V
24
8. Used to determine the no−load dynamic power consumption: P D = CPD VCC
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4
2f
+ ICC VCC .
pF
MC74HCT132A
tr
INPUT
A OR B
(VI)
TEST POINT
tf
VCC
90%
VM
10%
tPLH
tPHL
OUTPUT
DEVICE
UNDER
TEST
GND
90%
VM
10%
Y
tTHL
tTLH
CL *
*Includes all probe and jig capacitance
VI = GND to 3.0 V
VM = 1.3 V
Figure 3. Switching Waveforms
Figure 4. Test Circuit
VCC
VCC
VH
VH
VIN
VT+
VT-
VIN
VT+
VTGND
GND
VOH
VOH
VOUT
VOUT
VOL
VOL
VCC
VOUT
VIN
(a)A SCHMITT TRIGGER SQUARES UP INPUTS
(a)WITH SLOW RISE AND FALL TIMES
(b)A SCHMITT TRIGGER OFFERS MAXIMUM
NOISE IMMUNITY
Figure 5. Typical Schmitt−Trigger Applications
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5
MC74HCT132A
PACKAGE DIMENSIONS
PDIP−14
CASE 646−06
ISSUE P
14
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
8
B
1
7
A
F
L
N
C
−T−
SEATING
PLANE
H
G
D 14 PL
J
K
0.13 (0.005)
M
M
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6
DIM
A
B
C
D
F
G
H
J
K
L
M
N
INCHES
MIN
MAX
0.715
0.770
0.240
0.260
0.145
0.185
0.015
0.021
0.040
0.070
0.100 BSC
0.052
0.095
0.008
0.015
0.115
0.135
0.290
0.310
−−−
10 _
0.015
0.039
MILLIMETERS
MIN
MAX
18.16
19.56
6.10
6.60
3.69
4.69
0.38
0.53
1.02
1.78
2.54 BSC
1.32
2.41
0.20
0.38
2.92
3.43
7.37
7.87
−−−
10 _
0.38
1.01
MC74HCT132A
PACKAGE DIMENSIONS
SOIC−14
CASE 751A−03
ISSUE J
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.127
(0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
−A−
14
8
−B−
P 7 PL
0.25 (0.010)
M
7
1
G
−T−
D 14 PL
0.25 (0.010)
T B
S
A
DIM
A
B
C
D
F
G
J
K
M
P
R
J
M
K
M
F
R X 45 _
C
SEATING
PLANE
B
M
S
SOLDERING FOOTPRINT*
7X
7.04
14X
1.52
1
14X
0.58
1.27
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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7
MILLIMETERS
MIN
MAX
8.55
8.75
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.337 0.344
0.150 0.157
0.054 0.068
0.014 0.019
0.016 0.049
0.050 BSC
0.008 0.009
0.004 0.009
0_
7_
0.228 0.244
0.010 0.019
MC74HCT132A
PACKAGE DIMENSIONS
TSSOP−14
CASE 948G−01
ISSUE B
14X K REF
0.10 (0.004)
0.15 (0.006) T U
M
T U
V
S
S
N
2X
14
L/2
0.25 (0.010)
8
M
B
−U−
L
PIN 1
IDENT.
N
F
7
1
0.15 (0.006) T U
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
S
S
DETAIL E
K
A
−V−
ÉÉÉ
ÇÇÇ
ÇÇÇ
ÉÉÉ
K1
J J1
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
SECTION N−N
−W−
C
0.10 (0.004)
−T− SEATING
PLANE
D
H
G
DETAIL E
SOLDERING FOOTPRINT*
7.06
1
0.65
PITCH
14X
0.36
14X
1.26
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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8
MILLIMETERS
INCHES
MIN
MAX
MIN MAX
4.90
5.10 0.193 0.200
4.30
4.50 0.169 0.177
−−−
1.20
−−− 0.047
0.05
0.15 0.002 0.006
0.50
0.75 0.020 0.030
0.65 BSC
0.026 BSC
0.50
0.60 0.020 0.024
0.09
0.20 0.004 0.008
0.09
0.16 0.004 0.006
0.19
0.30 0.007 0.012
0.19
0.25 0.007 0.010
6.40 BSC
0.252 BSC
0_
8_
0_
8_
MC74HCT132A
PACKAGE DIMENSIONS
SOEIAJ−14
CASE 965−01
ISSUE B
14
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS AND ARE
MEASURED AT THE PARTING LINE. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
LE
8
Q1
E HE
M_
L
7
1
DETAIL P
Z
D
VIEW P
A
e
A1
b
0.13 (0.005)
c
M
0.10 (0.004)
DIM
A
A1
b
c
D
E
e
HE
L
LE
M
Q1
Z
MILLIMETERS
MIN
MAX
--2.05
0.05
0.20
0.35
0.50
0.10
0.20
9.90
10.50
5.10
5.45
1.27 BSC
7.40
8.20
0.50
0.85
1.10
1.50
10 _
0_
0.70
0.90
--1.42
INCHES
MIN
MAX
--0.081
0.002
0.008
0.014
0.020
0.004
0.008
0.390
0.413
0.201
0.215
0.050 BSC
0.291
0.323
0.020
0.033
0.043
0.059
10 _
0_
0.028
0.035
--0.056
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MC74HCT132A/D