NCV8154 D

NCV8154
Dual 300 mA, Low IQ, Low
Dropout, Dual Input Voltage
Regulator
The NCV8154 is 300 mA, Dual Output Linear Voltage Regulator
that offers two independent input pins and provides a very stable and
accurate voltage with ultra low noise and very high Power Supply
Rejection Ratio (PSRR) suitable for RF applications. The NCV8154 is
suitable for powering RF blocks of automotive infotainment systems
and other power sensitive device. Due to low power consumption the
NCV8154 offers high efficiency and low thermal dissipation.
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DFN10, 3x3
CASE 485C
WDFN6, 1.5x1.5
CASE 511BJ
Features
• Operating Input Voltage Range: 1.9 V to 5.25 V
• Two Independent Input Voltage Pins
• Two Independent Output Voltage (for detail please refer to Ordering
•
•
•
•
•
•
•
•
•
PIN CONNECTIONS
Information)
Low IQ of typ. 55 mA per Channel
High PSRR: 75 dB at 1 kHz
Very Low Dropout: 140 mV Typical at 300 mA
Thermal Shutdown and Current Limit Protections
Stable with a 1 mF Ceramic Output Capacitor
Available in DFN10 3x3mm and WDFN6 1.5x1.5mm Packages
Active Output Discharge for Fast Output Turn-Off
NCV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable; Device Temperature Grade 1: −40°C to
+125°C Ambient Operating Temperature Range
These are Pb-free Devices
GND
1
10 EN1
OUT1
2
9 IN1
OUT2
3
GND
4
7 EN2
N/C
5
6 N/C
DFN10
(Top View)
EN1
1
6
OUT1
IN
2
5
OUT2
EN2
3
4
GND
WDFN6
(Top View)
Typical Applications
• Applications Requiring Wettable Flanks for Enhanced Visual
•
•
MARKING DIAGRAMS
Inspection
Wireless LAN, Bluetooth®, ZigBee® Interfaces
Automotive Infotainment Systems
NCV8154x
VVVVV
ALYWG
G
NCV8154
VIN1
VOUT1
IN1
VIN2
OUT1
IN2
VOUT2
OUT2
EN1
CIN1
1 mF
CIN2
1 mF
EN2
GND
COUT2
1 mF
COUT1
1 mF
Figure 1. Typical Application Schematic
8 IN2
EP
1
X MG
G
x
= NCV8154N − Non wettable flank
= NCV8154W − Wettable flank
VVVVV = Voltage Option
A
= Assembly Location
L
= Wafer Lot
Y
= Year
W
= Work Week
X
= Specific Device Code
M
= Month Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering, marking and shipping information on
page 16 of this data sheet.
© Semiconductor Components Industries, LLC, 2016
June, 2016 − Rev. 6
1
Publication Order Number:
NCV8154/D
NCV8154
IN1*
ENABLE
LOGIC
EN1
THERMAL
SHUTDOWN
BANDGAP
REFERENCE
MOSFET
DRIVER WITH
CURRENT LIMIT
OUT1
ACTIVE
DISCHARGE
EN1
GND
IN2*
ENABLE
LOGIC
EN2
THERMAL
SHUTDOWN
BANDGAP
REFERENCE
MOSFET
DRIVER WITH
CURRENT LIMIT
OUT2
ACTIVE
DISCHARGE
EN2
GND
*Dual IN available only for DFN10
Figure 2. Simplified Schematic Block Diagram
Table 1. PIN FUNCTION DESCRIPTION − DFN10
Pin No.
Pin Name
Description
1
GND
Power supply ground. Soldered to the copper plane allows for effective heat dissipation.
2
OUT1
Regulated output voltage of the first channel. A small 1 mF ceramic capacitor is needed from this pin to
ground to assure stability.
3
OUT2
Regulated output voltage of the second channel. A small 1 mF ceramic capacitor is needed from this pin to
ground to assure stability.
4
GND
Power supply ground. Soldered to the copper plane allows for effective heat dissipation.
5,6
N/C
Not connected, can be tied to ground plane to improve thermal dissipation.
7
EN2
Driving EN2 over 0.9 V turns-on OUT2. Driving EN below 0.4 V turns-off the OUT2 and activates the active
discharge.
8
IN2
Inputs pin for second channel. It is recommended to connect 1 mF ceramic capacitor close to the device pin.
9
IN1
Inputs pin for first channel. It is recommended to connect 1 mF ceramic capacitor close to the device pin.
10
EN1
Driving EN1 over 0.9 V turns-on OUT1. Driving EN below 0.4 V turns-off the OUT1 and activates the active
discharge.
−
EXP
Exposed pad must be tied to ground. Soldered to the copper plane allows for effective thermal dissipation.
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NCV8154
Table 2. PIN FUNCTION DESCRIPTION − WDFN6
Pin No.
Pin Name
1
EN1
2
IN
Description
Driving EN1 over 0.9 V turns-on OUT1. Driving EN below 0.4 V turns-off the OUT1.
Inputs pin. It is recommended to connect at least 1 mF ceramic capacitor close to the device pin.
3
EN2
Driving EN2 over 0.9 V turns-on OUT2. Driving EN below 0.4 V turns-off the OUT2.
4
GND
Power supply ground. Soldered to the copper plane allows for effective heat dissipation.
5
OUT2
Regulated output voltage of the second channel. A small 1 mF ceramic capacitor is needed from this pin to
ground to assure stability.
6
OUT1
Regulated output voltage of the first channel. A small 1 mF ceramic capacitor is needed from this pin to
ground to assure stability.
Table 3. ABSOLUTE MAXIMUM RATINGS
Rating
Symbol
Value
Unit
VIN1, VIN2
−0.3 V to 6 V
V
Output Voltage
VOUT1, VOUT2
−0.3 V to VIN + 0.3 V or 6 V
V
Enable Inputs
VEN1, VEN2
−0.3 V to VIN + 0.3 V or 6 V
V
Input Voltage (Note 1)
Output Short Circuit Duration
tSC
Indefinite
s
Operating Ambient Temperature Range
TA
−40 to +125
°C
TJ(MAX)
150
°C
Maximum Junction Temperature
TSTG
−55 to 150
°C
ESD Capability, Human Body Model (Note 2)
ESDHBM
2,000
V
ESD Capability, Machine Model (Note 2)
ESDMM
200
V
Storage Temperature
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
2. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114)
ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115)
Latchup Current Maximum Rating tested per JEDEC standard: JESD78.
Table 4. THERMAL CHARACTERISTICS (Note 3)
Rating
Symbol
Value
Thermal Characteristics, DFN10 3 × 3 mm,
Thermal Resistance, Junction-to-Air
qJA
109
Thermal Characteristics, WDFN6 1.5 × 1.5 mm,
Thermal Resistance, Junction-to-Air
qJA
207
Unit
°C/W
°C/W
3. Single component mounted on 1 oz, FR4 PCB with 645 mm2 Cu area.
RECOMMENDED OPERATING CONDITIONS
Parameter
Symbol
Min
Max
Unit
Input Voltage
VIN
1.9
5.25
V
Junction Temperature
TJ
−40
125
°C
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
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NCV8154
Table 5. ELECTRICAL CHARACTERISTICS
(−40°C ≤ TJ ≤ 125°C; VIN = VOUT(NOM) + 1 V or 2.5 V, whichever is greater; VEN = 0.9 V, IOUT = 1 mA, CIN = COUT = 1 mF.
Typical values are at TJ = +25°C. Min/Max values are specified for TJ = −40°C and TJ = 125°C respectively.) (Note 4)
Test Conditions
Parameter
Operating Input Voltage
VOUT > 2 V
Output Voltage Accuracy
−40°C ≤ TJ ≤ 125°C
Line Regulation
VOUT + 0.5 V ≤ VIN ≤ 5 V
Load Regulation
IOUT = 1 mA to 300 mA
Symbol
Min
VIN
VOUT
VOUT ≤ 2 V
Max
Unit
1.9
5.25
V
−3
+3
%
−60
RegLINE
DFN10
WDFN6
RegLOAD
VOUT(nom) = 1.8 V
VOUT(nom) = 2.8 V
Typ
VDO
+60
mV
0.02
0.2
%/V
15
40
25
45
335
430
160
290
140
270
Dropout Voltage (Note 5)
IOUT = 300 mA
Output Current Limit
VOUT = 90% VOUT(nom)
ICL
400
IOUT = 0 mA, EN1 = VIN, EN2 = 0 V or EN2 = VIN,
EN1 = 0 V
IQ
55
100
IOUT1 = IOUT2 = 0 mA, VEN1 = VEN2 = VIN
IQ
110
200
IDIS
0.1
1
VOUT(nom) = 3.3 V
Quiescent Current
mV
mV
mA
mA
Shutdown current (Note 6)
VEN ≤ 0.4 V, VIN = 5.25 V
EN Pin Threshold Voltage
High Threshold
Low Threshold
VEN Voltage increasing
VEN Voltage decreasing
EN Pin Input Current
VEN = VIN = 5.25 V
Power Supply Rejection Ratio
VIN = VOUT + 1 V for VOUT > 2 V, VIN =
2.5 V, for VOUT ≤ 2 V, IOUT = 10 mA
Output Noise Voltage
f = 10 Hz to 100 kHz
Active Discharge Resistance
VIN = 4 V, VEN < 0.4 V
RDIS
50
W
Thermal Shutdown Temperature
Temperature increasing from TJ = +25°C
TSD
160
°C
Thermal Shutdown Hysteresis
Temperature falling from TSD
TSDH
mA
V
VEN_HI
VEN_LO
f = 1 kHz
0.9
0.4
0.3
PSRR
75
dB
VN
75
mVrms
−
20
1.0
mA
IEN
−
°C
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
4. Performance guaranteed over the indicated operating temperature range by design and/or characterization. Production tested at
TJ = TA = 25°C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
5. Characterized when VOUT falls 100 mV below the regulated voltage at VIN = VOUT(NOM) + 1 V.
6. Shutdown Current is the current flowing into the IN pin when the device is in the disable state.
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4
NCV8154
3.35
3.34
1.83
1.82
1.81
IOUT = 1 mA
1.80
IOUT = 300 mA
1.79
1.78
1.77
1.76
1.75
−40
IGND, GROUND CURRENT (mA)
VIN = 2.8 V
VOUT = 1.8 V
CIN = COUT = 1 mF
−20
0
20
40
60
80
100
VOUT, OUTPUT VOLTAGE (V)
1.85
1.84
3.33
3.32
3.29
3.28
3.26
3.25
−40
120 140
−20
0
20
40
60
80
100
120 140
TJ, JUNCTION TEMPERATURE (°C)
TJ, JUNCTION TEMPERATURE (°C)
Figure 3. Output Voltage vs. Temperature
VOUT = 1.8 V
Figure 4. Output Voltage vs. Temperature
VOUT = 3.3 V
60
54
TJ = 125°C
480
TJ = 25°C
420
TJ = −40°C
360
300
240
180
120
VIN = 4.3 V
VOUT = 3.3 V
CIN = COUT = 1 mF
60
0
60
120
180
240
TJ = 125°C
48
TJ = −40°C
52
TJ = 25°C
36
30
24
18
12
VIN = 4.3 V
VOUT = 3.3 V
CIN = COUT = 1 mF
6
0
0
300
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
IOUT, OUTPUT CURRENT (mA)
VIN, INPUT VOLTAGE (V)
Figure 5. Ground Current vs. Output Current
Figure 6. Quiescent Current vs. Input Voltage
5.5
0.1
LINEREG, LINE REGULATION (%/V)
60
IQ, QUIESCENT CURRENT (mA)
VIN = 4.3 V
VOUT = 3.3 V
CIN = COUT = 1 mF
3.27
540
58
56
54
52
50
0.08
0.06
0.04
0.02
0
−0.02
48
−0.04
46
44
−0.06
VIN = 4.3 V
VOUT = 3.3 V
CIN = COUT = 1 mF
42
40
−40
IOUT = 300 mA
3.30
600
0
IOUT = 1 mA
3.31
IQ, QUIESCENT CURRENT (mA)
VOUT, OUTPUT VOLTAGE (V)
TYPICAL CHARACTERISTICS
−20
0
20
40
60
80
100
120 140
VIN = 2.8 V
VOUT = 1.8 V
CIN = COUT = 1 mF
0.08
−0.1
−40
−20
0
20
40
60
80
100
120 140
TJ, JUNCTION TEMPERATURE (°C)
TJ, JUNCTION TEMPERATURE (°C)
Figure 7. Quiescent Current vs. Temperature
Figure 8. Line Regulation vs. Temperature
VOUT = 1.8 V
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NCV8154
TYPICAL CHARACTERISTICS
30
REGLOAD, LOAD REGULATION (mV)
LINEREG, LINE REGULATION (%/V)
0.1
0.08
0.06
0.04
0.02
0
−0.02
−0.04
−0.06
VIN = 4.3 V
VOUT = 3.3 V
CIN = COUT = 1 mF
−0.08
−0.1
−40
−20
0
20
40
60
80
100
21
18
15
12
9
6
VIN = 3.3 V
VOUT = 2.8 V
CIN = COUT = 1 mF
3
−20
0
20
40
60
80
100
120 140
TJ, JUNCTION TEMPERATURE (°C)
TJ, JUNCTION TEMPERATURE (°C)
Figure 9. Line Regulation vs. Temperature
VOUT = 3.3 V
Figure 10. Load Regulation vs. Temperature
VOUT = 2.8 V
225
VDROP, DROPOUT VOLTAGE (mV)
27
24
21
18
15
12
9
6
VIN = 4.3 V
VOUT = 3.3 V
CIN = COUT = 1 mF
3
−20
0
20
40
60
80
100
200
175
150
TJ = 125°C
125
100
50
25
0
120 140
TJ = −40°C
75
TJ = 25°C
0
30
60
80
120 150
VIN = 4.3 V
VOUT = 3.3 V
CIN = COUT = 1 mF
180 210
240 270 300
TJ, JUNCTION TEMPERATURE (°C)
IOUT, OUTPUT CURRENT (mA)
Figure 11. Load Regulation vs. Temperature
VOUT = 3.3 V
Figure 12. Dropout Voltage vs. Output Current
225
VDROP, DROPOUT VOLTAGE (mV)
REGLOAD, LOAD REGULATION (mV)
24
0
−40
120 140
30
0
−40
27
200
IOUT = 300 mA
175
150
125
100
IOUT = 150 mA
75
50
IOUT = 0 mA
25
0
−40
−20
0
20
40
60
80
100
120 140
TJ, JUNCTION TEMPERATURE (°C)
Figure 13. Dropout Voltage vs. Temperature
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NCV8154
TYPICAL CHARACTERISTICS
600
ISC, SHORT−CIRCUIT CURRENT
(mA)
600
550
525
VIN = 3.8 V
500
475
450
VIN = 5.25 V
425
400
VOUT = 90% VOUT(NOM)
CIN = COUT = 1 mF
375
0
20
40
60
80
100
575
550
525
475
VIN = 5.25 V
450
425
400
350
−40
120 140
VOUT = 0 V
CIN = COUT = 1 mF
375
−20
0
20
40
60
80
100
TJ, JUNCTION TEMPERATURE (°C)
TJ, JUNCTION TEMPERATURE (°C)
Figure 14. Current Limit vs. Temperature
Figure 15. Short−Circuit Current vs.
Temperature
100
520
90
510
500
490
480
470
460
450
VOUT = 0 V
CIN = COUT = 1 mF
440
2.8
3.1
3.4
3.7
4.0
4.3
4.6
4.9
5.2
5.5
80
70
120 140
VIN = 4.3 V
VOUT = 0 V
VEN = 0 V
CIN = COUT = 1 mF
60
50
40
30
20
10
0
−40
−20
0
20
40
60
80
100
120 140
VIN, INPUT VOLTAGE (V)
TJ, JUNCTION TEMPERATURE (°C)
Figure 16. Short−Circuit Current vs. Input
Voltage
Figure 17. Disable Current vs. Temperature
1.0
500
0.9
450
0.8
OFF −> ON
0.7
ON −> OFF
0.6
0.5
0.4
0.3
VIN = 4.3 V
VOUT = 0 V
CIN = COUT = 1 mF
0.2
0.1
0
−40
VIN = 3.8 V
500
530
430
2.5
VEN, ENABLE VOLTAGE (V)
−20
IDIS, DISABLE CURRENT (nA)
ISC, SHORT−CIRCUIT CURRENT
(mA)
350
−40
−20
0
20
40
60
80
100
IEN, ENABLE CURRENT (nA)
ICL, CURRENT LIMIT (mA)
575
400
350
300
250
200
150
VIN = 4.3 V
VOUT = 3.3 V
CIN = COUT = 1 mF
100
50
0
−40
120 140
−20
0
20
40
60
80
100
TJ, JUNCTION TEMPERATURE (°C)
TJ, JUNCTION TEMPERATURE (°C)
Figure 18. Enable Thresholds vs. Temperature
Figure 19. Current to Enable Pin vs.
Temperature
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120 140
NCV8154
TYPICAL CHARACTERISTICS
100
90
80
70
60
50
40
30
20
VIN = 4.3 V
VOUT = 1.8 V
CIN = COUT = 1 mF
10
0
−40
−20
0
20
40
60
80
100
VIN = 2.8 V + 100 mVPP
VOUT = 1.8 V
CIN = none
COUT = 1 mF, MLCC
90
80
70
60
50
40
1 mA
10 mA
100 mA
150 mA
300 mA
30
20
10
0
0.1
120 140
1
10
100
1k
TJ, JUNCTION TEMPERATURE (°C)
FREQUENCY (kHz)
Figure 20. Discharge Resistivity vs.
Temperature
Figure 21. Power Supply Rejection Ratio,
VOUT = 1.8 V
100
100
VIN = 4.3 V + 100 mVPP
VOUT = 3.3 V
CIN = none
COUT = 1 mF, MLCC
90
80
70
VOUT = 1.8 V
VOUT = 3.3 V
10
60
50
40
1
1 mA
10 mA
100 mA
150 mA
300 mA
30
20
10
0
0.1
VIN = VOUT = 1 V
CIN = COUT = 1 mF, MLCC,
size 1206
1
10
100
1k
0.1
0
10k
60
120
180
240
300
FREQUENCY (kHz)
IOUT, OUTPUT CURRENT (mA)
Figure 22. Power Supply Rejection Ratio,
VOUT = 3.3 V
Figure 23. Output Capacitor ESR vs. Output
Current
10
OUTPUT VOLTAGE NOISE (mV/rtHz)
10k
ESR (W)
RR, RIPPLE REJECTION (dB)
RR, RIPPLE REJECTION (dB)
RDIS, DISCHARGE RESISTIVITY (W)
100
1 mA
10 mA
150 mA
300 mA
1
IOUT
0.1
0.01
VIN = 2.8 V
VOUT = 1.8 V
CIN = COUT = 1 mF
0.001
0.01
0.1
1
10
100
RMS Output Noise (mV)
10 Hz − 100 kHz
100 Hz − 100 kHz
1 mA
77.84
77.28
10 mA
71.71
70.48
150 mA
71.95
70.88
300 mA
72.71
71.67
1000
FREQUENCY (kHz)
Figure 24. Output Voltage Noise Spectral Density for VOUT = 2.8 V, COUT = 1 mF
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NCV8154
TYPICAL CHARACTERISTICS
1 mA
10 mA
150 mA
300 mA
1
RMS Output Noise (mV)
IOUT
10 Hz − 100 kHz
100 Hz − 100 kHz
1 mA
119.7
117.87
10 mA
113.47
111.47
150 mA
113.84
112.05
300 mA
115.95
114.03
0.1
0.01
VIN = 4.3 V
VOUT = 3.3 V
CIN = COUT = 1 mF
0.001
0.01
0.1
1
10
100
1000
FREQUENCY (kHz)
500 mV/div
500 mV/div 200 mA/div
VEN
IIN
VOUT
VIN = 2.8 V
VOUT = 1.8 V
IOUT = 10 mA
COUT = COUT = 1 mF
VEN
IIN
VOUT
VIN = 2.8 V
VOUT = 1.8 V
IOUT = 10 mA
COUT = COUT = 4.7 mF
40 ms/div
Figure 27. Enable Turn−on Response −
VOUT = 1.8 V, COUT = 4.7 mF
IIN
VIN = 3.8 V
VOUT = 3.3 V
IOUT = 10 mA
COUT = COUT = 1 mF
VOUT
VEN
50 mA/div
200 mA/div
VEN
500 mV/div
40 ms/div
Figure 26. Enable Turn−on Response −
VOUT = 1.8 V, COUT = 1 mF
1 V/div
1 V/div
100 mA/div
500 mV/div
500 mV/div
100 mA/div
500 mV/div
Figure 25. Output Voltage Noise Spectral Density for VOUT = 3.3 V, COUT = 1 mF
50 mA/div
OUTPUT VOLTAGE NOISE (mV/rtHz)
10
IIN
VOUT
VIN = 4.3 V
VOUT = 3.3 V
IOUT = 10 mA
COUT = COUT = 4.7 mF
40 ms/div
40 ms/div
Figure 28. Enable Turn−on Response −
VOUT = 3.3 V, COUT = 1 mF
Figure 29. Enable Turn−on Response −
VOUT = 3.3 V, COUT = 4.7 mF
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NCV8154
500 mV/div
tRISE = 1 ms
VIN
tFALL = 1 ms
20 mV/div
VIN
VOUT
VIN = 3.8 V to 4.8 V
IOUT = 10 mA
CIN = none
COUT = 1 mF
VOUT
VIN = 4.8 V to 3.8 V
IOUT = 10 mA
CIN = none
COUT = 1 mF
8 ms/div
Figure 31. Line Transient Response − Falling
Edge, VOUT = 3.3 V, IOUT = 10 mA
tRISE = 1 ms
VIN = 3.8 V to 4.8 V
IOUT = 300 mA
CIN = none
COUT = 1 mF
20 mV/div
VIN
500 mV/div
8 ms/div
Figure 30. Line Transient Response − Rising
Edge, VOUT = 3.3 V, IOUT = 10 mA
VOUT
VIN = 4.8 V to 3.8 V
IOUT = 300 mA
CIN = none
COUT = 1 mF
VIN
tFALL = 1 ms
VOUT
4 ms/div
Figure 33. Line Transient Response − Falling
Edge, VOUT = 3.3 V, IOUT = 300 mA
VIN
500 mV/div
4 ms/div
Figure 32. Line Transient Response − Rising
Edge, VOUT = 3.3 V, IOUT = 300 mA
tRISE = 1 ms
20 mV/div
20 mV/div
500 mV/div
20 mV/div
500 mV/div
20 mV/div 500 mV/div
TYPICAL CHARACTERISTICS
VOUT
VIN = 3.8 V to 4.8 V
IOUT = 10 mA
CIN = none
COUT = 4.7 mF
VIN = 4.8 V to 3.8 V
IOUT = 10 mA
CIN = none
COUT = 4.7 mF
VIN
tFALL = 1 ms
VOUT
4 ms/div
4 ms/div
Figure 34. Line Transient Response − Rising
Edge, VOUT = 3.3 V, IOUT = 10 mA,
COUT = 4.7 mF
Figure 35. Line Transient Response − Falling
Edge, VOUT = 3.3 V, IOUT = 10 mA,
COUT = 4.7 mF
www.onsemi.com
10
NCV8154
IOUT1
VOUT1
100 mA/div
VIN = VOUT + 1 V
VOUT1 = 3.3 V
tRISE = 1 ms V
OUT2 = 1.8 V
IOUT2 = 10 mA
COUT1 = 1 mF
COUT2 = 1 mF
50 mV/div 50 mV/div
50 mV/div 50 mV/div 100 mA/div
TYPICAL CHARACTERISTICS
VOUT2
IOUT1
tFALL = 1 ms
VOUT1
VIN = VOUT + 1 V
VOUT1 = 3.3 V
VOUT2 = 1.8 V
IOUT2 = 10 mA
COUT1 = 1 mF
COUT2 = 1 mF
VOUT2
4 ms/div
100 ms/div
Figure 36. Load Transient Response − 1.8 V −
Rising Edge, IOUT1 = 100 mA to 300 mA
Figure 37. Load Transient Response − 1.8 V −
Falling Edge, IOUT1 = 300 mA to 100 mA
tRISE = 500 ns
VOUT1
50 mV/div 50 mV/div 100 mA/div
IOUT1
VIN = VOUT + 1 V
VOUT1 = 3.3 V
VOUT2 = 1.8 V
IOUT2 = 10 mA
COUT1 = 1 mF
COUT2 = 1 mF
VOUT2
tFALL = 500 ns
VIN = VOUT + 1 V
VOUT1 = 3.3 V
VOUT2 = 1.8 V
IOUT2 = 10 mA
COUT1 = 1 mF
COUT2 = 1 mF
VOUT1
VOUT2
10 ms/div
Figure 39. Load Transient Response − 1.8 V −
Falling Edge, IOUT1 = 300 mA to 1 mA
IOUT1
VOUT1
100 mA/div
4 ms/div
Figure 38. Load Transient Response − 1.8 V −
Rising Edge, IOUT1 = 1 mA to 300 mA
VIN = VOUT + 1 V
VOUT1 = 3.3 V
tRISE = 500 ns V
OUT2 = 1.8 V
IOUT2 = 10 mA
COUT1 = 1 mF
COUT2 = 1 mF
50 mV/div 50 mV/div
50 mV/div 50 mV/div 100 mA/div
50 mV/div 50 mV/div 100 mA/div
IOUT1
VOUT2
IOUT1
tFALL = 500 ns
VOUT1
VIN = VOUT + 1 V
VOUT1 = 3.3 V
VOUT2 = 1.8 V
IOUT2 = 10 mA
COUT1 = 1 mF
COUT2 = 1 mF
VOUT2
4 ms/div
4 ms/div
Figure 40. Load Transient Response − 1.8 V −
Rising Edge, IOUT = 50 mA to 300 mA
Figure 41. Load Transient Response − Falling
Edge, IOUT = 300 mA to 50 mA
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11
NCV8154
VOUT1
100 mA/div
50 mV/div 50 mV/div
IOUT1
VIN = VOUT + 1 V
VOUT1 = 3.3 V
tRISE = 500 ns VOUT2 = 1.8 V
IOUT2 = 10 mA
COUT1 = 1 mF
COUT2 = 1 mF
VOUT2
IOUT1
tFALL = 500 ns
VOUT1
VIN = VOUT + 1 V
VOUT1 = 3.3 V
VOUT2 = 1.8 V
IOUT2 = 10 mA
COUT1 = 1 mF
COUT2 = 1 mF
VOUT2
100 ms/div
Figure 43. Load Transient Response − 3.3 V −
Falling Edge, IOUT1 = 300 mA to 100 mA
tRISE = 500 ns
VOUT1
VIN = VOUT + 1 V
VOUT1 = 3.3 V
VOUT2 = 1.8 V
IOUT2 = 10 mA
COUT1 = 1 mF
COUT2 = 1 mF
50 mV/div 50 mV/div
IOUT1
100 mA/div
4 ms/div
Figure 42. Load Transient Response − 3.3 V −
Rising Edge, IOUT1 = 100 mA to 300 mA
VOUT2
IOUT1
tFALL = 500 ns
VIN = VOUT + 1 V
VOUT1 = 3.3 V
VOUT2 = 1.8 V
IOUT2 = 10 mA
COUT1 = 1 mF
COUT2 = 1 mF
VOUT1
VOUT2
10 ms/div
Figure 45. Load Transient Response − 3.3 V −
Falling Edge, IOUT1 = 300 mA to 1 mA
IOUT1
tRISE = 500 ns
VOUT1
100 mA/div
4 ms/div
Figure 44. Load Transient Response − 3.3 V −
Rising Edge, IOUT1 = 1 mA to 300 mA
VIN = VOUT + 1 V
VOUT1 = 3.3 V
VOUT2 = 1.8 V
IOUT2 = 10 mA
COUT1 = 1 mF
COUT2 = 1 mF
50 mV/div 50 mV/div
50 mV/div 50 mV/div 100 mA/div
50 mV/div 50 mV/div 100 mA/div
50 mV/div 50 mV/div 100 mA/div
TYPICAL CHARACTERISTICS
VOUT2
IOUT1
tFALL = 500 ns
VOUT1
VOUT2
VIN = VOUT + 1 V
VOUT1 = 3.3 V
VOUT2 = 1.8 V
IOUT2 = 10 mA
COUT1 = 1 mF
COUT2 = 1 mF
4 ms/div
4 ms/div
Figure 46. Load Transient Response − 3.3 V −
Rising Edge, IOUT = 50 mA to 300 mA
Figure 47. Load Transient Response − Falling
Edge, IOUT = 300 mA to 50 mA
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12
NCV8154
VOUT
COUT = 4.7 mF
500 mV/div
1 V/div
VIN = 2.8 V
VOUT = 1.8 V
IOUT = 0 mA
COUT = 1 mF, 4.7 mF
VEN
COUT = 1 mF
VIN = 4.3 V
VOUT = 3.3 V
IOUT = 0 mA
COUT = 1 mF, 4.7 mF
VEN
COUT = 4.7 mF
VOUT
COUT = 1 mF
200 ms/div
200 ms/div
Figure 48. Enable Turn−off,
VOUT = 1.8 V
Figure 49. Enable Turn−off,
VOUT = 3.3 V
VIN
VOUT1
VIN = 4.3 V
VOUT1 = 3.3 V
IOUT1 = 10 mA
IOUT2 = 10 mA
CIN = COUT1 =
COUT2 = 1 mF
50 mA/div
1 V/div
500 mV/div
TYPICAL CHARACTERISTICS
1 V/div
1 V/div
VOUT2
Short−Circuit
Current
Overheating
VIN = 5.25 V
VOUT = 3.3 V
CIN = COUT = 1 mF
IOUT
VOUT
Thermal Shutdown
TSD Cycling
Short−Circuit
Event
20 ms/div
10 ms/div
Figure 50. Turn−on/off − Slow Rising VIN
Figure 51. Short−Circuit and Thermal
Shutdown
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13
NCV8154
General
If the EN pin voltage >0.9 V the device is guaranteed to
be enabled. The NCV8154 regulates the output voltage and
the active discharge transistor is turned−off.
The both EN pin has internal pull−down current source
with typ. value of 300 nA which assures that the device is
turned−off when the EN pin is not connected. In the case
where the EN function isn’t required the EN should be tied
directly to IN.
The NCV8154 is a dual output high performance 300 mA
Low Dropout Linear Regulator. This device delivers very
high PSRR (75 dB at 1 kHz) and excellent dynamic
performance as load/line transients. In connection with low
quiescent current this device is very suitable for various
battery powered applications such as tablets, cellular phones,
wireless and many others. Each output is fully protected in
case of output overload, output short circuit condition and
overheating, assuring a very robust design. The NCV8154
device is housed in DFN10 3 x3 mm package which is
useful for space constrains application.
Output Current Limit
Output Current is internally limited within the IC to a
typical 400 mA. The NCV8154 will source this amount of
current measured with a voltage drops on the 90% of the
nominal VOUT. If the Output Voltage is directly shorted to
ground (VOUT = 0 V), the short circuit protection will limit
the output current to 520 mA (typ). The current limit and
short circuit protection will work properly over whole
temperature range and also input voltage range. There is no
limitation for the short circuit duration. This protection
works separately for each channel. Short circuit on the one
channel do not influence second channel which will work
according to specification.
Input Capacitor Selection (CIN)
It is recommended to connect at least a 1 mF Ceramic X5R
or X7R capacitor as close as possible to the IN pin of the
device. This capacitor will provide a low impedance path for
unwanted AC signals or noise modulated onto constant
input voltage. There is no requirement for the min. or max.
ESR of the input capacitor but it is recommended to use
ceramic capacitors for their low ESR and ESL. A good input
capacitor will limit the influence of input trace inductance
and source resistance during sudden load current changes.
Larger input capacitor may be necessary if fast and large
load transients are encountered in the application.
Thermal Shutdown
When the die temperature exceeds the Thermal Shutdown
threshold (TSD − 160°C typical), Thermal Shutdown event
is detected and the affected channel is turn−off. Second
channel still working. The channel which is overheated will
remain in this state until the die temperature decreases below
the Thermal Shutdown Reset threshold (TSDU − 140°C
typical). Once the device temperature falls below the 140°C
the appropriate channel is enabled again. The thermal
shutdown feature provides the protection from a
catastrophic device failure due to accidental overheating.
This protection is not intended to be used as a substitute for
proper heat sinking. The long duration of the short circuit
condition to some output channel could cause turn−off other
output when heat sinking is not enough and temperature of
the other output reach TSD temperature.
Output Decoupling (COUT)
The NCV8154 requires an output capacitor for each
output connected as close as possible to the output pin of the
regulator. The recommended capacitor value is 1 mF and
X7R or X5R dielectric due to its low capacitance variations
over the specified temperature range. The NCV8154 is
designed to remain stable with minimum effective
capacitance of 0.33 mF to account for changes with
temperature, DC bias and package size. Especially for small
package size capacitors such as 0201 the effective
capacitance drops rapidly with the applied DC bias.
There is no requirement for the minimum value of
Equivalent Series Resistance (ESR) for the COUT but the
maximum value of ESR should be less than 3 W. Larger
output capacitors and lower ESR could improve the load
transient response or high frequency PSRR. It is not
recommended to use tantalum capacitors on the output due
to their large ESR. The equivalent series resistance of
tantalum capacitors is also strongly dependent on the
temperature, increasing at low temperature.
Power Dissipation
As power dissipated in the NCV8154 increases, it might
become necessary to provide some thermal relief. The
maximum power dissipation supported by the device is
dependent upon board design and layout. Mounting pad
configuration on the PCB, the board material, and the
ambient temperature affect the rate of junction temperature
rise for the part. For reliable operation, junction temperature
should be limited to +125°C.
The maximum power dissipation the NCV8154 can
handle is given by:
Enable Operation
The NCV8154 uses the dedicated EN pin for each output
channel. This feature allows driving outputs separately.
If the EN pin voltage is <0.4 V the device is guaranteed to
be disabled. The pass transistor is turned−off so that there is
virtually no current flow between the IN and OUT. The active
discharge transistor is active so that the output voltage VOUT
is pulled to GND through a 50 W resistor. In the disable state
the device consumes as low as typ. 10 nA from the VIN.
P D(MAX) +
ƪTJ(MAX) * TAƫ
q JA
(eq. 1)
The power dissipated by the NCV8154 for given
application conditions can be calculated from the following
equations:
www.onsemi.com
14
NCV8154
P D [ ǒV IN1 @ I GND1Ǔ ) ǒV IN2 @ I GND2Ǔ )
) I OUT1ǒV IN1 * V OUT1Ǔ ) I OUT2ǒV IN2 * V OUT2Ǔ
(eq. 2)
1.2
PD(MAX), TA = 25°C, 2 oz Cu
230
1.1
1.0
210
0.9
190
PD(MAX), TA = 25°C, 1 oz Cu
170
0.8
0.7
150
qJA, 1 oz Cu
130
110
0.5
qJA, 2 oz Cu
90
0.6
0.4
PD(MAX), MAXIMUM POWER
DISSIPATION (W)
qJA, JUNCTION TO AMBIENT
THERMAL RESISTANCE (°C/W)
250
0.3
70
50
0
100
200
300
400
500
600
0.2
700
COPPER HEAT SPREADER AREA (mm2)
Figure 52. qJA and PD(MAX) vs. Copper Area − DFN10
0.70
315
PD(MAX), TA = 25°C, 2 oz Cu
290
0.65
0.60
PD(MAX), TA = 25°C, 1 oz Cu
0.55
265
240
qJA, 1 oz Cu
215
190
0.45
0.40
qJA, 2 oz Cu
165
0.50
0.35
140
0.30
115
0.25
90
0
100
200
300
400
500
600
PD(MAX), MAXIMUM POWER
DISSIPATION (W)
qJA, JUNCTION TO AMBIENT
THERMAL RESISTANCE (°C/W)
340
0.20
700
COPPER HEAT SPREADER AREA (mm2)
Figure 53. qJA and PD(MAX) vs. Copper Area − WDFN6
Reverse Current
Turn−On Time
The PMOS pass transistor has an inherent body diode
which will be forward biased in the case that VOUT > VIN.
Due to this fact in cases, where the extended reverse current
condition can be anticipated the device may require
additional external protection.
The turn−on time is defined as the time period from EN
assertion to the point in which VOUT will reach 98% of its
nominal value. This time is dependent on various
application conditions such as VOUT(NOM), COUT, TA.
Power Supply Rejection Ratio
To obtain good transient performance and good regulation
characteristics place input and output capacitors close to the
device pins and make the PCB traces wide. In order to
minimize the solution size, use 0402 capacitors. Larger
copper area connected to the pins will also improve the
device thermal resistance. The actual power dissipation can
be calculated from the equation above (Equation 2). Expose
pad should be tied the shortest path to the GND pin.
PCB Layout Recommendations
The NCV8154 features very good Power Supply
Rejection ratio. If desired the PSRR at higher frequencies in
the range 100 kHz – 10 MHz can be tuned by the selection
of COUT capacitor and proper PCB layout.
www.onsemi.com
15
NCV8154
Table 6. ORDERING INFORMATION
Device
Marking
Voltage Option
(OUT1/OUT2)
NCV8154MW180280TBG
8154W
1828
NCV8154MN300300TBG
8154N
3030
NCV8154MW300300TBG
8154W
3030
NCV8154MN330180TBG
8154N
3318
NCV8154MW330180TBG
8154W
3318
NCV8154MW330280TBG
8154W
3328
3.3 V / 2.8 V
NCV8154MW330330TBG
8154W
3333
3.3 V / 3.3 V
NCV8154MTW180280TCG
DA
1.8 V / 2.8 V
Active
Discharge
Features
Yes
Wettable Flank
Yes
Non−wettable
Flank
Yes
Wettable Flank
Yes
Non−wettable
Flank
Package
Shipping†
DFN10
(Pb-Free)
3000 / Tape &
Reel
WDFN6
(Pb-Free)
3000 / Tape &
Reel
3.0 V / 3.0 V
3.3 V / 1.8 V
Yes
Yes
Wettable Flank
Yes
1.8 V / 2.8 V
No
Wettable Flank
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
www.onsemi.com
16
NCV8154
PACKAGE DIMENSIONS
DFN10 3x3, 0.5P
CASE 485C
ISSUE C
D
PIN 1
REFERENCE
EDGE OF PACKAGE
A
B
L1
ÇÇÇ
ÇÇÇ
ÇÇÇ
E
DETAIL A
Bottom View
(Optional)
0.15 C
2X
EXPOSED Cu
TOP VIEW
MOLD CMPD
0.15 C
2X
(A3)
DETAIL B
0.10 C
A1
ÉÉÉ
ÉÉÉ
A
10X
SIDE VIEW
A1
D2
A3
DETAIL B
Side View
(Optional)
SEATING
PLANE
0.08 C
10X
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
5. TERMINAL b MAY HAVE MOLD COMPOUND
MATERIAL ALONG SIDE EDGE. MOLD
FLASHING MAY NOT EXCEED 30 MICRONS
ONTO BOTTOM SURFACE OF TERMINAL b.
6. DETAILS A AND B SHOW OPTIONAL VIEWS
FOR END OF TERMINAL LEAD AT EDGE OF
PACKAGE.
7. FOR DEVICE OPN CONTAINING W OPTION,
DETAIL B ALTERNATE CONSTRUCTION IS
NOT APPLICABLE.
C
SOLDERING FOOTPRINT*
DETAIL A
e
L
1
5
2.6016
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
L1
MILLIMETERS
MIN
MAX
0.80
1.00
0.00
0.05
0.20 REF
0.18
0.30
3.00 BSC
2.40
2.60
3.00 BSC
1.70
1.90
0.50 BSC
0.19 TYP
0.35
0.45
0.00
0.03
E2
10X
K
1.8508
2.1746
10
10X
b
0.10 C A B
0.05 C
3.3048
6
NOTE 3
BOTTOM VIEW
10X
0.5651
10X
0.5000 PITCH
0.3008
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
17
NCV8154
PACKAGE DIMENSIONS
WDFN6 1.5x1.5, 0.5P
CASE 511BJ
ISSUE B
D
L
A
B
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30mm FROM TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
L1
PIN ONE
REFERENCE
0.10 C
2X
0.10 C
2X
0.05 C
ÍÍÍ
ÍÍÍ
ÍÍÍ
ÍÍÍ
DETAIL A
ALTERNATE TERMINAL
CONSTRUCTIONS
E
ÉÉÉ
ÉÉÉ
EXPOSED Cu
TOP VIEW
DETAIL B
A3
MOLD CMPD
DETAIL B
ÉÉÉ
ÇÇÇ
ÇÇÇ
A3
A1
ALTERNATE
CONSTRUCTIONS
DIM
A
A1
A3
b
D
E
e
L
L1
L2
MILLIMETERS
MIN
MAX
0.70
0.80
0.00
0.05
0.20 REF
0.20
0.30
1.50 BSC
1.50 BSC
0.50 BSC
0.40
0.60
--0.15
0.50
0.70
A
0.05 C
A1
NOTE 4
C
SIDE VIEW
RECOMMENDED
MOUNTING FOOTPRINT*
SEATING
PLANE
5X
6X
DETAIL A
0.73
5X
e
1
0.35
L
3
L2
1.80
0.83
6
4
6X
DIMENSIONS: MILLIMETERS
b
0.10 C A
BOTTOM VIEW
0.50
PITCH
0.05 C
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
B
NOTE 3
Bluetooth is a registered trademark of Bluetooth SIG.
ZigBee is a registered trademark of ZigBee Alliance.
ON Semiconductor and the
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed
at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation
or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets
and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each
customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended,
or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which
the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or
unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim
alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable
copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
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Phone: 421 33 790 2910
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Phone: 81−3−5817−1050
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18
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
NCV8154/D