Plastic Packages for Integrated Circuits Package Outline Drawing L16.5x5D 16 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (PUNCH QFN WITH WETTABLE FLANK) Rev 2, 5/14 0.10 M C A B 2.8 A 0.10 C A (2X) 5.00 0.60 MAX. (4X) PIN 1 ID R0.20 4.75 16 16 0.10 C B (2X) 0.60 MAX. (4X) 0.45 0.10 M C B A 1 5 0.50 DIA 1 5.00 2 2 2.8 4.75 3 3 (0.70) CC (2X) 0.10 C B (2X) 0.40±0.10 0.15±0.10 0.10 C A B TOP VIEW TERMINAL TIP 4 0.30±0.05 0.10 M C A B 0.05 M C (0.70) 0.08 C // 0.10 C 0.85 ± 0.05 0.80 5 BOTTOM VIEW + 0.04 0.01 - 0.01 0.65 ± 0.05 (0.20) 0.20 0.10 4 SEE DETAIL “A” (0.01) SECTION “C-C” SCALE: NONE 12° MAX 4 DETAIL “A” (DIMPLE DEPTH) SCALE: NONE SEATING PLANE C SIDE VIEW NOTES: 12X (0.80) 1. Dimensions are in millimeters. Dimensions in ( ) are for Reference Only. 2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994. (2.80) SQ 3. Unless otherwise specified, tolerance: Decimal ± 0.05 (4.80) SQ 4. Dimension applies to the plated terminal and is measured between 0.15mm and 0.30mm from the terminal tip. 16X (0.30) 16X (0.60) TYPICAL RECOMMENDED LAND PATTERN 1 5. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature. 6. Reference document: JEDEC M0220.