Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
L16.5x5D
16 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (PUNCH QFN WITH WETTABLE FLANK)
Rev 2, 5/14
0.10 M C A B
2.8
A
0.10 C A (2X)
5.00
0.60 MAX. (4X)
PIN 1 ID
R0.20
4.75
16
16
0.10 C B (2X)
0.60 MAX. (4X)
0.45
0.10 M C B A
1
5
0.50 DIA
1
5.00
2
2
2.8
4.75
3
3
(0.70)
CC
(2X)
0.10 C B
(2X)
0.40±0.10
0.15±0.10
0.10 C A
B
TOP VIEW
TERMINAL TIP 4
0.30±0.05
0.10 M C A B
0.05 M C
(0.70)
0.08 C
// 0.10 C
0.85 ± 0.05
0.80
5
BOTTOM VIEW
+ 0.04
0.01 - 0.01
0.65 ± 0.05
(0.20)
0.20
0.10
4
SEE DETAIL “A”
(0.01)
SECTION “C-C”
SCALE: NONE
12° MAX
4
DETAIL “A” (DIMPLE DEPTH)
SCALE: NONE
SEATING PLANE
C
SIDE VIEW
NOTES:
12X (0.80)
1. Dimensions are in millimeters.
Dimensions in ( ) are for Reference Only.
2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
(2.80) SQ
3. Unless otherwise specified, tolerance: Decimal ± 0.05
(4.80) SQ
4. Dimension applies to the plated terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
16X (0.30)
16X (0.60)
TYPICAL RECOMMENDED LAND PATTERN
1
5. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
6.
Reference document: JEDEC M0220.