NB6L572M D

NB6L572M
2.5V / 3.3V Differential 4:1
Mux to 1:2 CML Clock/Data
Fanout / Translator
Multi−Level Inputs w/ Internal Termination
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Description
The NB6L572M is a high performance differential 4:1 Clock / Data
input multiplexer and a 1:2 CML Clock / Data fanout buffer that
operates up to 6 GHz / 8 Gbps respectively with a 2.5 V or 3.3 V
power supply.
The differential Clock / Data inputs have internal 50 W termination
resistors and will accept differential LVPECL, CML, or LVDS logic
levels. The NB6L572M incorporates a pair of Select pins that will
choose one of four differential inputs and will produce two identical
CML output copies of Clock or Data.
As such, the NB6L572M is ideal for SONET, GigE, Fiber Channel,
Backplane and other Clock/Data distribution applications.
The two differential CML outputs will swing 400 mV when
externally loaded and terminated with a 50 W resistor to VCC and are
optimized for low skew and minimal jitter.
The NB6L572M is offered in a low profile 5x5mm 32−pin QFN
Pb−Free package. Application notes, models, and support
documentation are available at www.onsemi.com. The NB6L572M is
a member of the ECLinPS MAX™ family of high performance clock
products.
Features
•
•
•
•
•
•
•
•
November, 2009 − Rev. 1
1
1
32
QFN32
MN SUFFIX
CASE 488AM
NB6L
572M
AWLYYWWG
G
A
= Assembly Location
WL
= Wafer Lot
YY
= Year
WW
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information on page 8 of
this data sheet.
• Differential CML Outputs, 400 mV Peak−to−Peak,
Input Data Rate > 8 Gb/s Typical
Data Dependent Jitter < 10 ps
Maximum Input Clock Frequency > 6 GHz Typical
Random Clock Jitter < 0.8 ps RMS
Low Skew 1:2 CML Outputs, < 15 ps max
4:1 Multi−Level Mux Inputs, accepts LVPECL, CML
LVDS
200 ps Typical Propagation Delay
35 ps Typical Rise and Fall Times
© Semiconductor Components Industries, LLC, 2009
MARKING
DIAGRAM
•
•
•
•
•
•
1
Typical
Operating Range: VCC = 2.375 V to 3.6 V with
GND = 0 V
Internal 50 W Input Termination Resistors
VREFAC Reference Output
QFN−32 Package, 5mm x 5mm
40°C to +85°C Ambient Operating Temperature
These are Pb−Free Devices
Publication Order Number:
NB6L572M/D
NB6L572M
Multilevel Inputs
LVPECL, LVDS, CML
IN0
VT0
IN0
50 W
0
50 W
VREFAC0
IN1
VT1
IN1
CML Outputs
50 W
IN2
IN2
Q0
4:1 MUX
VREFAC1
VT2
Q0
1
50 W
50 W
Q1
2
50 W
Q1
VREFAC2
IN3
VT3
IN3
50 W
3
50 W
VREFAC3
SEL0
SEL1
IN3
VREFAC3
VT3
IN3
IN2
VREFAC2
VT2
IN2
Figure 1. Simplified Block Diagram
32
31
30
29
28
27
26
25
Table 1. INPUT SELECT FUNCTION TABLE
Exposed
Pad (EP)
SEL1*
SEL0*
Clock / Data Input Selected
0
0
IN0 Input Selected
IN0
1
24
GND
0
1
IN1 Input Selected
VT0
2
23
VCC
1
0
IN2 Input Selected
VREFAC0
3
22
Q1
1
1
IN3 Input Selected
IN0
4
21
Q1
IN1
5
20
VCC
VT1
6
19
NC
VREFAC1
7
18
SEL1
IN1
8
17
VCC
9
10
11
12
13
14
15
16
GND
VCC
Q0
Q0
VCC
NC
SEL0
VCC
NB6L572M
*Defaults HIGH when left open.
Figure 2. Pinout: QFN−32 (Top View)
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2
NB6L572M
Table 2. PIN DESCRIPTION
Pin Number
Pin Name
I/O
1, 4
5, 8
25, 28
29, 32
IN0, IN0
IN1, IN1
IN2, IN2
IN3, IN3
LVPECL, CML,
LVDS Input
Pin Description
2, 6
26, 30
VT0, VT1
VT2, VT3
15
18
SEL0
SEL1
LVTTL/LVCMOS
Input
14, 19
NC
−
No Connect
10, 13, 16
17, 20, 23
VCC
−
Positive Supply Voltage. All VCC pins must be connected to the positive power
supply for correct DC and AC operation.
11, 12
21, 22
Q0, Q0
Q1, Q1
CML Output
9, 24
GND
3
7
27
31
VREF−AC0
VREF−AC1
VREF−AC2
VREF−AC3
−
Output Voltage Reference for Capacitor−Coupled Inputs
−
EP
−
The Exposed Pad (EP) on the QFN−32 package bottom is thermally connected to
the die for improved heat transfer out of package. The exposed pad must be attached to a heat−sinking conduit. The pad is electrically connected to the die, and
must be electrically connected to GND.
Non−inverted, Inverted, Differential Clock or Data Inputs
Internal 100 W Center−tapped Termination Pin for INx/INx
Input Select pins, default HIGH when left open through a 131 kW pullup resistor.
Input logic threshold is VCC/2. See Select Function, Table 1.
Non−inverted, Inverted Differential Outputs.
Negative Supply Voltage, connected to Ground
1. In the differential configuration when the input termination pins (VT0, VT1, VT2, VT3) are connected to a common termination voltage or left
open, and if no signal is applied on INx/INx input, then the device will be susceptible to self−oscillation.
2. All VCC, and GND pins must be externally connected to a power supply for proper operation.
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NB6L572M
Table 3. ATTRIBUTES
Characteristics
Value
ESD Protection
Human Body Model
Machine Model
> 2 kV
> 200 V
RPU − SELx Input Pull−up Resistor
131 kW
Moisture Sensitivity (Note 3)
Flammability Rating
QFN−32
Oxygen Index: 28 to 34
Level 1
UL 94 V−0 @ 0.125 in
Transistor Count
275
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
3. For additional information, see Application Note AND8003/D.
Table 4. MAXIMUM RATINGS
Symbol
Parameter
Condition 1
Condition 2
Rating
Unit
VCC
Positive Power Supply
GND = 0 V
−0.5 V to +4.0
V
VIN
Positive Input Voltage
GND = 0 V
−0.5 to VCC +0.5
V
VINPP
Differential Input Voltage |IN – INx|
1.89
V
Iout
Output Current Through RT (50 W Resistor)
$40
mA
IIN
Input current Through RT (50 W resistor)
$40
mA
IVREFAC
VREFAC Sink or Source Current
$1.5
mA
TA
Operating Temperature Range
−40 to +85
°C
Tstg
Storage Temperature Range
−65 to +150
°C
qJA
Thermal Resistance (Junction−to−Ambient) (Note 4)
QFN32
QFN32
31
27
°C/W
qJC
Thermal Resistance (Junction−to−Case) (Note 4)
QFN32
12
°C/W
Tsol
Wave Solder
265
°C
0 lfpm
500 lfpm
v 20 sec
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
4. JEDEC standard multilayer board – 2S2P (2 signal, 2 power) with 8 filled thermal vias under exposed pad.
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NB6L572M
Table 5. DC CHARACTERISTICS CML OUTPUT VCC = 2.375 V to 3.6 V , GND = 0 V, TA = −40°C to +85°C (Note 5)
Symbol
Characteristic
Min
Typ
Max
Unit
3.0
2.375
3.3
2.5
3.6
2.625
V
130
115
165
150
mA
VCC – 30
3270
2470
VCC – 10
3290
2490
VCC
3300
2500
mV
VCC – 650
2650
VCC – 650
1850
VCC – 450
2850
VCC – 450
2050
VCC – 300
3000
VCC – 300
2200
mV
POWER SUPPLY
VCC
Power Supply Voltage
VCC = 3.3 V
VCC = 2.5 V
ICC
Power Supply Current for VCC
(Inputs and Outputs Open)
VCC = 3.3 V
VCC = 2.5 V
CML OUTPUTS (Note 6)
VOH
Output HIGH Voltage
VOL
Output LOW Voltage
VCC = 3.3 V
VCC = 2.5 V
VCC = 3.3 V
VCC = 2.5 V
DIFFERENTIAL CLOCK INPUTS DRIVEN SINGLE−ENDED (Figures 5 & 6) (Note 8)
VIH
Single−ended Input HIGH Voltage
Vth + 100
VCC
mV
VIL
Single−ended Input LOW Voltage
GND
Vth – 100
mV
Vth
Input Threshold Reference Voltage Range (Note 8)
1100
VCC – 100
mV
VISE
Single−ended Input Voltage (VIH – VIL)
200
1200
mV
Output Reference Voltage (100 mA Load)
1050
VCC – 1050
mV
VREFAC
VREF−AC
VCC – 1250
DIFFERENTIAL INPUTS DRIVEN DIFFERENTIALLY (Figures 7 & 8) (Note 9)
VIHD
Differential Input HIGH Voltage (IN, IN)
1200
VCC
mV
VILD
Differential Input LOW Voltage (IN, IN)
0
VIHD – 100
mV
VID
Differential Input Voltage (IN, IN) (VIHD – VILD)
100
1200
mV
VCMR
Input Common Mode Range (Differential Configuration,
Note 10) (Figure 9)
1050
VCC – 50
mV
IIH
Input HIGH Current IN / INx (VTIN / VTINx Open)
−150
150
mA
IIL
Input LOW Current IN / INx (VTIN / VTINx Open)
−150
150
mA
CONTROL INPUT (SELx Pin)
VIH
Input HIGH Voltage for Control Pin
VCC x 0.65
VCC
V
VIL
Input LOW Voltage for Control Pin
GND
VCC x 0.35
V
IIH
Input HIGH Current
−150
150
mA
IIL
Input LOW Current
−150
150
mA
TERMINATION RESISTORS
RTIN
Internal Input Termination Resistor (Measured from INx to VTx)
45
50
55
W
RTOUT
Internal Output Termination Resistor
45
50
55
W
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
5. Input and Output parameters vary 1:1 with VCC.
6. CML outputs loaded with 50 W to VCC for proper operation.
7. Vth is applied to the complementary input when operating in single−ended mode.
8. Vth, VIH, VIL,, and VISE parameters must be complied with simultaneously.
9. VIHD, VILD, VID and VCMR parameters must be complied with simultaneously.
10. VCMR min varies 1:1 with GND, VCMR max varies 1:1 with VCC. The VCMR range is referenced to the most positive side of the differential
input signal.
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NB6L572M
Table 6. AC CHARACTERISTICS VCC = 2.375 V to 3.6 V, GND = 0 V, TA = −40°C to +85°C (Note 11)
Symbol
Characteristic
Min
Typ
5
6
GHz
Maximum Operating Data Rate NRZ, (PRBS23)
6.5
8
Gbps
fSEL
Maximum Toggle Frequency, SELx
20
40
MHz
VOUTPP
Output Voltage Amplitude (@ VINPPmin) fin ≤ 5 GHz
(Note 12) (Figure 10)
250
400
mV
tPLH,
tPHL
Propagation Delay to Differential Outputs
Measured at Differential Crosspoint
125
200
4
tPD
Tempco
Differential Propagation Delay Temperature Coefficient
tskew
Output – Output skew (within device) (Note 13)
Device – Device skew (tpdmax – tpdmin)
tDC
Output Clock Duty Cycle (Reference Duty Cycle = 50%) fin = 1 GHz
FN
Phase Noise, fin = 1 GHz
tŐFN
tJITTER
fMAX
Maximum Input Clock Frequency VOUT w 250 mV
fDATAMAX
@ 1 GHz INx/INx to Qx/Qx
@ 50 MHz SELx to Qx
Max
250
10
100
45
10 kHz
100 kHz
1 MHz
10 MHz
20 MHz
40 MHz
Unit
ps
ns
Dfs/°C
0
5
15
25
ps
50
55
%
−134
−136
−149
−150
−150
−150
dBc
Integrated Phase Jitter (Figure x) fin = 1 GHz, 12 kHz * 20 MHz Offset
(RMS)
35
fs
Random Clock Jitter, RJ(RMS) (Note 14)
Deterministic Jitter, DJ (Note 15) (FR4 ≤ 12’)
0.2
1
0.8
5
ps RMS
ps pk−pk
0.35
0.7
ps RMS
1200
mV
50
ps
fin ≤ 5 GHz
fin ≤ 6.5 Gbps
Crosstalk Induced Jitter (Adjacent Channel) (Note 16)
VINPP
Input Voltage Swing (Differential Configuration) (Note 17)
100
tr,, tf
Output Rise/Fall Times @ 1 GHz; (20% − 80%), VIN = 400 mV Qx, Qx
20
35
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
11. Measured using a 100 mVpk−pk source, 50% duty cycle clock source. All output loading with external 50 W to VCC. Input edge rates
40 ps (20% − 80%).
12. Output voltage swing is a single−ended measurement operating in differential mode.
13. Skew is measured between outputs under identical transitions and conditions. Duty cycle skew is defined only for differential operation when
the delays are measured from cross−point of the inputs to the cross−point of the outputs.
14. Additive RMS jitter with 50% duty cycle clock signal.
15. Additive Peak−to−Peak data dependent jitter with input NRZ data at PRBS23.
16. Crosstalk is measured at the output while applying two similar clock frequencies that are asynchronous with respect to each other at the
inputs.
17. Input voltage swing is a single−ended measurement operating in differential mode.
OUTPUT VOLTAGE AMPLITUDE
(mV)
600
Q AMP (mV)
500
400
300
200
100
0
0
1
2
3
4
5
6
7
fin, CLOCK INPUT FREQUENCY (GHz)
8
Figure 3. Clock Output Voltage Amplitude (VOUTPP) vs. Input Frequency (fin) at Ambient Temperature (Typical)
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NB6L572M
VCC
IN
VIH
Vth
INx
VIL
50 W
IN
VTx
Vth
50 W
INx
Figure 5. Differential Input Driven Single−Ended
Figure 4. Input Structure
VCC
VIHmax
Vthmax
Vth
VILmax
IN
VIH
Vth
VIL
IN
IN
VIHmin
Vthmin
VILmin
GND
Figure 6. Vth Diagram
Figure 7. Differential Inputs Driven Differentially
VCC
VIHDmax
VILDmax
VCMmax
IN
IN
IN
VID = |VIHD(IN) − VILD(IN)|
VCMR
VIHD
VIHDtyp
VILDtyp
IN
VILD
VID = VIHD − VILD
VIHDmin
VCMmin
VILDmin
GND
Figure 9. VCMR Diagram
Figure 8. Differential Inputs Driven Differentially
IN
VCC / 2
VINPP = VIH(IN) − VIL(IN)
IN
VCC / 2
SELx
tpd
Q
VOUTPP = VOH(Q) − VOL(Q)
Q
tpd
Q
Q
tPHL
tPLH
Figure 11. SELx to Qx Timing Diagram
Figure 10. AC Reference Measurement
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NB6L572M
VCC
VCC
VCC
NB6L572M
IN
Zo = 50 W
50 W
LVDS
Driver
50 W
Zo = 50 W
VT = OPEN
50 W
Zo = 50 W
IN
CLKx
GND
IN
CLKx
Figure 12. LVPECL Interface
VCC
GND
GND
VCC
VCC
VCC
NB6L572M
IN
Zo = 50 W
50 W
CML
Driver
50 W
Differential
Driver
VT = VCC
50 W
Zo = 50 W
Zo = 50 W
NB6L572M
VCC (Receiver)
50 W
Q
GND
*VREFAC bypassed to ground with a 0.01 mF capacitor.
Receiver
VCCO
IN
Figure 15. Capacitor−Coupled Differential
Interface (VT Connected to External VREFAC)
Figure 14. Standard 50 W Load CML Interface
NB6L572M
50 W
GND
GND
50 W
VT =
VREFAC*
IN
GND
GND
Figure 13. LVDS Interface
NB6L572M
IN
Zo = 50 W
NB6L572M
IN
Zo = 50 W
50 W
VT = VCC − 2.0 V
LVPECL
Driver
VCC
50 W
VCC = 2.5 V
50 W
50 W
50 W
Q
Q
Q
50 W
16 mA
16 mA
GND
GND
Figure 16. Typical CML Output Structure
and Termination (VCC = 2.5 V or 3.3 V)
50 W
50 W
GND
Figure 17. Alternative Output Termination
(VCC = 2.5 V, Only)
DEVICE ORDERING INFORMATION
Package
Shipping†
NB6L572MMNG
QFN−32
(Pb−Free)
74 Units / Rail
NB6L572MMNR4G
QFN−32
(Pb−Free)
1000 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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NB6L572M
PACKAGE DIMENSIONS
PIN ONE
LOCATION
2X
ÉÉ
ÉÉ
0.15 C
2X
QFN32 5*5*1 0.5 P
CASE 488AM−01
ISSUE O
A
B
D
NOTES:
1. DIMENSIONS AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM TERMINAL
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
E
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
TOP VIEW
0.15 C
(A3)
0.10 C
A
32 X
0.08 C
C
L
32 X
9
D2
SEATING
PLANE
A1
SIDE VIEW
MILLIMETERS
MIN
NOM MAX
0.800 0.900 1.000
0.000 0.025 0.050
0.200 REF
0.180 0.250 0.300
5.00 BSC
2.950 3.100 3.250
5.00 BSC
2.950 3.100 3.250
0.500 BSC
0.200
−−−
−−−
0.300 0.400 0.500
SOLDERING FOOTPRINT*
EXPOSED PAD
16
K
5.30
32 X
17
8
3.20
E2
1
32 X
0.63
24
32
25
32 X b
0.10 C A B
3.20
e
5.30
0.05 C
BOTTOM VIEW
32 X
0.28
28 X
0.50 PITCH
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ECLinPS MAX is a trademark of Semiconductor Component Industries, LLC (SCILLC).
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
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For additional information, please contact your local
Sales Representative
NB6L572M/D