NTMFS6B03N D

NTMFS6B03N
Power MOSFET
100 V, 4.8 mW, 132 A, Single N−Channel
Features
•
•
•
•
Small Footprint (5x6 mm) for Compact Design
Low RDS(on) to Minimize Conduction Losses
Low QG and Capacitance to Minimize Driver Losses
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Symbol
Value
Unit
Drain−to−Source Voltage
VDSS
100
V
Gate−to−Source Voltage
VGS
±20
V
ID
132
A
Parameter
Continuous Drain
Current RqJC
(Notes 1, 2, 3)
TC = 25°C
Power Dissipation
RqJC (Notes 1, 2)
Continuous Drain
Current RqJA
(Notes 1, 2, 3)
Steady
State
TC = 100°C
TC = 25°C
Power Dissipation
RqJA (Notes 1 & 2)
Pulsed Drain Current
Steady
State
PD
ID
Operating Junction and Storage Temperature
Source Current (Body Diode)
ID MAX
100 V
4.8 mW @ 10 V
132 A
D (5)
W
165
G (4)
A
19
S (1,2,3)
12
PD
TA = 100°C
TA = 25°C, tp = 10 ms
RDS(ON) MAX
65
TA = 100°C
TA = 25°C
V(BR)DSS
83
TC = 100°C
TA = 25°C
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N−CHANNEL MOSFET
W
3.4
MARKING
DIAGRAM
1.4
IDM
470
A
TJ, Tstg
−55 to
+ 150
°C
IS
160
A
Single Pulse Drain−to−Source Avalanche
Energy (IL(pk) = 60 A)
EAS
180
mJ
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
TL
°C
260
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
D
1
DFN5
(SO−8FL)
CASE 488AA
STYLE 1
A
Y
W
ZZ
S
S
S
G
D
6B03N
AYWZZ
D
D
= Assembly Location
= Year
= Work Week
= Lot Traceability
THERMAL RESISTANCE MAXIMUM RATINGS
Symbol
Value
Unit
Junction−to−Case − Steady State
Parameter
RqJC
0.76
°C/W
Junction−to−Ambient − Steady State (Note 2)
RqJA
38
ORDERING INFORMATION
See detailed ordering, marking and shipping information on
page 5 of this data sheet.
1. The entire application environment impacts the thermal resistance values shown,
they are not constants and are only valid for the particular conditions noted.
2. Surface−mounted on FR4 board using a 650 mm2, 2 oz. Cu pad.
3. Maximum current for pulses as long as 1 second is higher but is dependent
on pulse duration and duty cycle.
© Semiconductor Components Industries, LLC, 2015
February, 2015 − Rev. 1
1
Publication Order Number:
NTMFS6B03N/D
NTMFS6B03N
ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise specified)
Parameter
Symbol
Test Condition
Min
Drain−to−Source Breakdown Voltage
V(BR)DSS
VGS = 0 V, ID = 250 mA
100
Drain−to−Source Breakdown Voltage
Temperature Coefficient
V(BR)DSS/
TJ
Typ
Max
Unit
OFF CHARACTERISTICS
Zero Gate Voltage Drain Current
IDSS
Gate−to−Source Leakage Current
V
67.3
VGS = 0 V,
VDS = 80 V
mV/°C
TJ = 25 °C
10
TJ = 125°C
100
IGSS
VDS = 0 V, VGS = 20 V
VGS(TH)
VGS = VDS, ID = 250 mA
100
mA
nA
ON CHARACTERISTICS (Note 4)
Gate Threshold Voltage
Threshold Temperature Coefficient
VGS(TH)/TJ
Drain−to−Source On Resistance
RDS(on)
2.0
4.0
−8.1
V
mV/°C
VGS = 10 V
ID = 20 A
3.8
4.8
VGS = 6.0 V
ID = 10 A
6.0
7.8
mW
CHARGES, CAPACITANCES & GATE RESISTANCE
Input Capacitance
CISS
4200
Output Capacitance
COSS
Reverse Transfer Capacitance
CRSS
31
Total Gate Charge
QG(TOT)
58
Threshold Gate Charge
QG(TH)
6.2
Gate−to−Source Charge
QGS
Gate−to−Drain Charge
QGD
17
Plateau Voltage
VGP
5.4
V
Gate Resistance
RG
1.0
W
VGS = 0 V, f = 1 MHz, VDS = 50 V
VGS = 10 V, VDS = 50 V; ID = 50 A
TJ = 25 °C
760
pF
nC
19
SWITCHING CHARACTERISTICS (Note 5)
Turn−On Delay Time
Rise Time
Turn−Off Delay Time
Fall Time
td(ON)
tr
td(OFF)
16
VGS = 10 V, VDS = 50 V,
ID = 50 A, RG = 1.0 W
tf
46
ns
29
11
DRAIN−SOURCE DIODE CHARACTERISTICS
Forward Diode Voltage
Reverse Recovery Time
VSD
TJ = 25°C
0.9
TJ = 125°C
0.8
tRR
Charge Time
ta
Discharge Time
tb
Reverse Recovery Charge
VGS = 0 V,
IS = 50 A
1.2
V
67
VGS = 0 V, dIS/dt = 100 A/ms,
IS = 25 A
QRR
35
ns
31
120
nC
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
4. Pulse Test: pulse width v 300 ms, duty cycle v 2%.
5. Switching characteristics are independent of operating junction temperatures.
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2
NTMFS6B03N
TYPICAL CHARACTERISTICS
140
120
VDS ≤ 10 V
120
5.5 V
ID, DRAIN CURRENT (A)
ID, DRAIN CURRENT (A)
140
VGS = 6 V to 10 V
100
80
5.0 V
60
40
4.5 V
100
80
60
TJ = 125°C
40
TJ = 25°C
20
20
4.0 V
0
0.5
2.0
1.5
1.0
2.5
3.0
0
4
5
Figure 1. On−Region Characteristics
Figure 2. Transfer Characteristics
ID = 20 A
TJ = 25°C
10
9
8
7
6
5
4
3
4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0
8.5 9.0 9.5 10
VGS, GATE VOLTAGE (V)
6
8.0
7.5
TJ = 25°C
7.0
6.5
VGS = 6.0 V
6.0
5.5
5.0
4.5
VGS = 10 V
4.0
3.5
3.0
10
15
20
25
35
30
40
45
50
ID, DRAIN CURRENT (A)
Figure 3. On−Resistance vs. Gate−to−Source
Voltage
Figure 4. On−Resistance vs. Drain Current and
Gate Voltage
100K
2.2
ID = 20 A
VGS = 10 V
TJ = 150°C
10K
1.8
IDSS, LEAKAGE (nA)
RDS(on), NORMALIZED DRAIN−TO−
SOURCE RESISTANCE
3
2
VGS, GATE−TO−SOURCE VOLTAGE (V)
11
2.0
1
VDS, DRAIN−TO−SOURCE VOLTAGE (V)
RDS(on), DRAIN−TO−SOURCE RESISTANCE (mW)
0
RDS(on), DRAIN−TO−SOURCE RESISTANCE (mW)
TJ = −55°C
0
1.6
1.4
1.2
1.0
0.8
TJ = 125°C
1K
100
TJ = 25°C
10
0.6
0.4
−50
1
−25
0
25
50
75
100
125
150
10
20
30
40
50
60
70
80
90
100
TJ, JUNCTION TEMPERATURE (°C)
VDS, DRAIN−TO−SOURCE VOLTAGE (V)
Figure 5. On−Resistance Variation with
Temperature
Figure 6. Drain−to−Source Leakage Current
vs. Voltage
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3
NTMFS6B03N
10,000
VGS, GATE−TO−SOURCE VOLTAGE (V)
TYPICAL CHARACTERISTICS
Ciss
C, CAPACITANCE (pF)
Coss
1000
Crss
100
VGS = 0 V
TJ = 25°C
f = 1 MHz
10
1
1
10
QT
10
8
Qgd
Qgs
6
4
TJ = 25°C
VDS = 50 V
ID = 50 A
2
0
0
100
5
10
15
20
25
30 35
40
45
50
55 60
VDS, DRAIN−TO−SOURCE VOLTAGE (V)
Qg, TOTAL GATE CHARGE (nC)
Figure 7. Capacitance Variation
Figure 8. Gate−to−Source and
Drain−to−Source Voltage vs. Total Charge
200
1000
VDS = 50 V
ID = 50 A
VGS = 10 V
180
IS, SOURCE CURRENT (A)
td(off)
td(on)
100
tr
10
tf
TJ = 25°C
160
140
120
100
80
60
40
20
1
1
10
0
100
0.3 0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
RG, GATE RESISTANCE (W)
VSD, SOURCE−TO−DRAIN VOLTAGE (V)
Figure 9. Resistive Switching Time Variation
vs. Gate Resistance
Figure 10. Diode Forward Voltage vs. Current
1000
ID, DRAIN CURRENT (A)
t, TIME (ns)
12
100
VGS ≤ 10 V
Single Pulse
TC = 25°C
500 ms
10
1 ms
1
10 ms
RDS(on) Limit
Thermal Limit
Package Limit
0.1
0.01
0.1
1
10
100
VDS, DRAIN−TO−SOURCE VOLTAGE (V)
Figure 11. Maximum Rated Forward Biased
Safe Operating Area
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4
NTMFS6B03N
TYPICAL CHARACTERISTICS
100
120
IPEAK, DRAIN CURRENT (A)
GFS, SMALL−SIGNAL FORWARD
TRANSFER CONDUCTANCE (S)
140
100
80
60
40
20
0
25°C
10
100°C
1
0
40
20
60
80
100
120
140
100E−6
1E−3
10E−3
ID, DRAIN CURRENT (A)
TAV, TIME IN AVALANCHE (sec)
Figure 12. GFS vs. ID
Figure 13. IPEAK vs. TAV
100
50% Duty Cycle
R(t) (°C/W)
10
1
20%
10%
5%
2%
1%
0.1
NTMFS6B03N, 650 mm2, 2 oz, Cu Single Layer Pad
0.01 Single Pulse
0.001
0.000001
0.00001
0.0001
0.001
0.01
0.1
1
10
100
1000
PULSE TIME (sec)
Figure 14. Thermal Response
DEVICE ORDERING INFORMATION
Marking
Package
Shipping†
NTMFS6B03NT1G
6B03N
DFN5
(Pb−Free)
1500 / Tape & Reel
NTMFS6B03NT3G
6B03N
DFN5
(Pb−Free)
5000 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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5
NTMFS6B03N
PACKAGE DIMENSIONS
DFN5 5x6, 1.27P
(SO−8FL)
CASE 488AA
ISSUE L
2X
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION D1 AND E1 DO NOT INCLUDE
MOLD FLASH PROTRUSIONS OR GATE
BURRS.
0.20 C
D
A
2
B
D1
2X
0.20 C
4X
E1
q
E
2
c
1
2
3
DIM
A
A1
b
c
D
D1
D2
E
E1
E2
e
G
K
L
L1
M
q
A1
4
TOP VIEW
0.10 C
3X
C
e
SEATING
PLANE
DETAIL A
A
0.10 C
RECOMMENDED
SOLDERING FOOTPRINT*
SIDE VIEW
DETAIL A
8X
4.560
2X
b
C A B
0.05
c
STYLE 1:
PIN 1. SOURCE
2. SOURCE
3. SOURCE
4. GATE
5. DRAIN
2X
0.495
0.10
MILLIMETERS
MIN
NOM
MAX
0.90
1.00
1.10
0.00
−−−
0.05
0.33
0.41
0.51
0.23
0.28
0.33
5.15
5.00
5.30
4.70
4.90
5.10
3.80
4.00
4.20
6.15
6.00
6.30
5.70
5.90
6.10
3.45
3.65
3.85
1.27 BSC
0.51
0.61
0.71
1.20
1.35
1.50
0.51
0.61
0.71
0.125 REF
3.00
3.40
3.80
0_
−−−
12 _
1.530
e/2
L
1
4
3.200
4.530
K
E2
PIN 5
(EXPOSED PAD)
L1
M
1.330
2X
0.905
1
0.965
G
D2
BOTTOM VIEW
4X
1.000
4X 0.750
1.270
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and the
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
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or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets
and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each
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For additional information, please contact your local
Sales Representative
NTMFS6B03N/D