TEMD6010FX01 Datasheet

TEMD6010FX01
www.vishay.com
Vishay Semiconductors
Ambient Light Sensor
FEATURES
• Package type: surface mount
• Package form: 1206
• Dimensions (L x W x H in mm): 4 x 2 x 1.05
• Radiant sensitive area (in mm2): 0.27
• AEC-Q101 qualified
• High photo sensitivity
• Adapted to human eye responsivity
• Supression filter for near infrared radiation
• Angle of half sensitivity: ϕ = ± 60°
18527-1
• Floor life: 168 h, MSL 3, acc. J-STD-020
• Lead (Pb)-free reflow soldering
• Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
DESCRIPTION
TEMD6010FX01 ambient light sensor is a PIN photodiode
with high speed and high photo sensitivity in a clear, surface
mount plastic package. The detector chip has 0.27 mm2
sensitive area. It is sensitive to visible light much like the
human eye and has peak sensitivity at 540 nm.
APPLICATIONS
• Automotive sensors
• Ambient light sensors
• Backlight dimming
• Mobil phones
• Notebooks
• Computers
PRODUCT SUMMARY
COMPONENT
TEMD6010FX01
Ira (μA)
ϕ (deg)
λ0.5 (nm)
0.04
± 60
430 to 610
Note
• Test conditions see table “Basic Characteristics”
ORDERING INFORMATION
ORDERING CODE
PACKAGING
REMARKS
PACKAGE FORM
TEMD6010FX01
Tape and reel
MOQ: 3000 pcs, 3000 pcs/reel
1206
Note
• MOQ: minimum order quantity
ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
SYMBOL
VALUE
Reverse voltage
TEST CONDITION
VR
16
V
Power dissipation
PV
100
mW
Junction temperature
UNIT
Tj
100
°C
Operating temperature range
Tamb
- 40 to + 100
°C
Storage temperature range
Tstg
- 40 to + 100
°C
Acc. reflow solder profile fig. 7
Tsd
260
°C
Soldered on PCB with pad dimensions: 4 mm x 4 mm
RthJA
450
K/W
Soldering temperature
Thermal resistance junction/ambient
Rev. 1.8, 20-Aug-12
Document Number: 81308
1
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TEMD6010FX01
www.vishay.com
Vishay Semiconductors
BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
TEST CONDITION
SYMBOL
MIN.
Breakdown voltage
IR = 100 μA, E = 0 lx
V(BR)
16
TYP.
MAX.
UNIT
V
VCE = 10 V, E = 0 lx
Iro
0.1
VR = 0 V, f = 1 MHz, E = 0 lx
CD
60
pF
VR = 5 V, f = 1 MHz, E = 0 lx
CD
24
pF
Ee = 1 mW/cm2, λ = 550 nm,
VR = 5 V
Ira
1
μA
EV = 100 lx, CIE illuminant A,
VR = 5 V
Ira
EV = 100 lx, CIE illuminant A,
VR = 5 V
TKIra
0.2
%/K
Angle of half sensitivity
ϕ
± 60
deg
Wavelength of peak sensitivity
λp
540
nm
Range of spectral bandwidth
λ0.5
430 to 610
nm
Reverse dark current
Diode capacitance
Reverse light current
Temperature coefficient of Ira
0.03
5
0.04
nA
0.09
μA
BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
70
CD - Diode Capacitance (pF)
Iro - Reverse Dark Current (nA)
1000
100
10
1
VR = 5 V
0.1
0.01
0
50
40
30
20
10
0
20
40
60
80
100
0
20094
Tamb - Ambient Temperature (°C)
18818
E0 = 0
f = 1 MHz
60
Fig. 1 - Reverse Dark Current vs. Ambient Temperature
10
20
30
VR - Reverse Voltage (V)
Fig. 3 - Diode Capacitance vs. Reverse Voltage
1
0.1
CIE illuminant A
VR = 5 V
0.01
0.001
10
20093
100
1000
10000
EV - Illuminance (lx)
Fig. 2 - Reverse Light Current vs. Illuminance
Rev. 1.8, 20-Aug-12
Relative Spectral Sensitivity
Ira - Photocurrent (µA)
10
1.0
0.8
Photodiode
human eye
0.6
0.4
0.2
0.0
400
20047
600
800
1000
Wavelength (nm)
Fig. 4 - Relative Spectral Sensitivity vs. Wavelength
Document Number: 81308
2
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TEMD6010FX01
www.vishay.com
0°
Vishay Semiconductors
10°
DRYPACK
20°
40°
1.0
0.9
50°
0.8
60°
70°
0.7
Devices are packed in moisture barrier bags (MBB) to
prevent the products from moisture absorption during
transportation and storage. Each bag contains a desiccant.
ϕ - Angular Displacement
Srel - Relative Sensitivity
30°
FLOOR LIFE
Time between soldering and removing from MBB must not
exceed the time indicated in J-STD-020:
Moisture sensitivity: level 3
Floor life: 168 h
Conditions: Tamb < 30 °C, RH < 60 %
80°
0.6
0.4
0.2
0
DRYING
94 8318
In case of moisture absorption devices should be baked
before soldering. Conditions see J-STD-020 or label.
Devices taped on reel dry using recommended conditions:
Fig. 1 - Relative Radiant Sensitivity vs. Angular Displacement
REFLOW SOLDER PROFILE
192 h at 40 °C (+ 5 °C), RH < 5 %
or
96 h at 60 °C (+ 5 °C), RH < 5 %.
300
255 °C
240 °C
217 °C
250
Temperature (°C)
max. 260 °C
245 °C
200
max. 30 s
150
max. 100 s
max. 120 s
100
max. ramp up 3 °C/s max. ramp down 6 °C/s
50
0
0
50
100
19841
150
200
250
300
Time (s)
Fig. 5 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020D
PACKAGE DIMENSIONS in millimeters
7 °
0.45
1.05 ± 0.15
2.4 ± 0.15
Anode
4 ± 0.15
technical drawings
according to DIN
specifications
Not indicated tolerances ± 0.1
1 ± 0.15
1
2 ± 0.15
0.75
0.6
Cathode
Recommended solder pad
Footprint
2 ± 0.15
1.1
0.3
0.8
1.1
0.8
Issue: 1; 31.08.09
1
Drawing-No.: 6.541-5080.01-4
21884
2.45
Rev. 1.8, 20-Aug-12
Document Number: 81308
3
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TEMD6010FX01
www.vishay.com
Vishay Semiconductors
BLISTER TAPE DIMENSIONS in millimeters
4
0.3 ± 0.05
Ø 1.55 ± 0.05
Anode
12 ± 0.3
4.26
3°
5.5
1.75
2
Ø 1.5 min.
1.35
2.26
Cathode
4
Reel off direction
Not indicated tolerances ±0.1
Drawing-No.: 9.700-5329.02-4
Issue: 2; 31.08.09
technical drawings
according to DIN
specifications
20877
REEL DIMENSIONS in millimeters
Volume: 3000 pcs/reel
20874
Rev. 1.8, 20-Aug-12
Document Number: 81308
4
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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www.vishay.com
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Revision: 02-Oct-12
1
Document Number: 91000