TEMD6200FX01 www.vishay.com Vishay Semiconductors Ambient Light Sensor FEATURES • • • • Package type: Surface mount Package form: 0805 Dimensions (L x W x H in mm): 2 x 1.25 x 0.85 Radiant sensitive area (in mm2): 0.27 • AEC-Q101 qualified • High photo sensitivity • Adapted to human eye responsivity • Angle of half sensitivity: ϕ = ± 60° • Floor life: 168 h, MSL 3, acc. J-STD-020 • Material categorization: For definitions of compliance please see www.vishay.com/doc?99912 APPLICATIONS DESCRIPTION • Automotive sensors TEMD6200FX01 is a high speed and high sensitive PIN photodiode in a miniature flat plastic package. It is spectral sensitivity is closely matched to the human eye. • Ambient light sensors • Backlight dimming • Mobil phones • Notebooks • Computers PRODUCT SUMMARY COMPONENT TEMD6200FX01 Ira (μA) ϕ (deg) λ0.5 (nm) 0.04 ± 60 430 to 610 Note • Test condition see table “Basic Characteristics” ORDERING INFORMATION ORDERING CODE PACKAGING REMARKS PACKAGE FORM TEMD6200FX01 Tape and reel MOQ: 3000 pcs, 3000 pcs/reel 0805 Note • MOQ: Minimum order quantity ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified) PARAMETER TEST CONDITION Reverse voltage Power dissipation Tamb ≤ 55 °C Junction temperature Operating temperature range Storage temperature range Soldering temperature Thermal resistance junction/ambient Rev. 1.5, 08-Apr-14 In accordance with fig. 6 SYMBOL VALUE UNIT VR 16 V PV 100 mW Tj 100 °C Tamb -40 to +100 °C Tstg -40 to +100 °C Tsd 260 °C RthJA 270 K/W Document Number: 81812 1 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TEMD6200FX01 www.vishay.com Vishay Semiconductors BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL MIN. Breakdown voltage IR = 100 μA, E = 0 lx V(BR) 16 Reverse light current MAX. UNIT V VR = 10 V, E = 0 lx Iro 0.1 VR = 0 V, f = 1 MHz, E = 0 lx CD 60 pF VR = 5 V, f = 1 MHz, E = 0 lx CD 24 pF Ee = 1 mW/cm2, λ = 550 nm, VR = 5 V Ira 1 μA EV = 100 lx, CIE illuminant A Ira Reverse dark current Diode capacitance TYP. 0.03 5 0.04 nA 0.09 μA Angle of half sensitivity ϕ ± 60 Wavelength of peak sensitivity λp 540 nm Range of spectral bandwidth λ0.5 430 to 610 nm deg Rise time UR = 5 V, RL = 50 Ω, TLMW3300 tr 150 ns Fall time UR = 5 V, RL = 50 Ω, TLMW3300 tf 150 ns BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) 70 100 CD - Diode Capacitance (pF) Iro - Reverse Dark Current (nA) 1000 10 1 VR = 5 V 0.1 0.01 0 20 40 60 80 Fig. 1 - Reverse Dark Current vs. Ambient Temperature 50 40 30 20 10 0 100 0 Tamb - Ambient Temperature (°C) 18818 E0 = 0 f = 1 MHz 60 20094 10 20 30 VR - Reverse Voltage (V) Fig. 3 - Diode Capacitance vs. Reverse Voltage 1 0.1 CIE illuminant A VR = 5 V 0.01 0.001 10 20093 100 1000 10000 EV - Illuminance (lx) Fig. 2 - Reverse Light Current vs. Illuminance Rev. 1.5, 08-Apr-14 Relative Spectral Sensitivity Ira - Photocurrent (µA) 10 1.0 0.8 Photodiode human eye 0.6 0.4 0.2 0.0 400 20047 600 800 1000 Wavelength (nm) Fig. 4 - Relative Spectral Sensitivity vs. Wavelength Document Number: 81812 2 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TEMD6200FX01 www.vishay.com 0° Vishay Semiconductors 10° 20° 40° 1.0 0.9 50° 0.8 60° 70° 0.7 ϕ - Angular Displacement Srel - Relative Sensitivity 30° 80° 0.6 0.4 0.2 0 94 8318 Fig. 5 - Relative Radiant Sensitivity vs. Angular Displacement SOLDER PROFILE DRYPACK Devices are packed in moisture barrier bags (MBB) to prevent the products from moisture absorption during transportation and storage. Each bag contains a desiccant. 300 Temperature (°C) max. 260 °C 245 °C 255 °C 240 °C 217 °C 250 Time between soldering and removing from MBB must not exceed the time indicated in J-STD-020: Moisture sensitivity: Level 3 Floor life: 168 h Conditions: Tamb < 30 °C, RH < 60 % 200 max. 30 s 150 max. 100 s max. 120 s 100 max. ramp up 3 °C/s max. ramp down 6 °C/s 50 0 0 19841 50 100 150 200 250 300 Time (s) Fig. 6 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020 Rev. 1.5, 08-Apr-14 FLOOR LIFE DRYING In case of moisture absorption devices should be baked before soldering. Conditions see J-STD-020 or label. Devices taped on reel dry using recommended conditions: 192 h at 40 °C (+ 5 °C), RH < 5 % or 96 h at 60 °C (+ 5 °C), RH < 5 %. Document Number: 81812 3 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TEMD6200FX01 www.vishay.com Vishay Semiconductors PACKAGE DIMENSIONS in millimeters 20018 BLISTER TAPE DIMENSIONS in millimeters 21501 Rev. 1.5, 08-Apr-14 Document Number: 81812 4 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TEMD6200FX01 www.vishay.com Vishay Semiconductors REEL DIMENSIONS in millimeters 8.4 +2.5 Ø 177.8 max. Ø 55 min. 8.4 +0.15 Z Form of the leave open of the wheel is supplier specific. 14.4 max. Ø 20.2 min. 1.5 min. Ø 13 - 0.2 + 0.5 Z 2:1 Drawing-No.: 9.800-5096.01-4 Issue: 2; 26.04.10 20875 Rev. 1.5, 08-Apr-14 technical drawings according to DIN specifications Document Number: 81812 5 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Legal Disclaimer Notice www.vishay.com Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. 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We confirm that all the products identified as being compliant to IEC 61249-2-21 conform to JEDEC JS709A standards. Revision: 02-Oct-12 1 Document Number: 91000