MUR550APFG, MURD550PFG, MUR550PFG, MURF550PFG, NRVUD550PFT4G SWITCHMODE Power Rectifier http://onsemi.com ULTRAFAST RECTIFIER 5.0 AMPERES, 520 VOLTS These state−of−the−art devices are designed for power factor correction in discontinuous and critical conduction mode. MARKING DIAGRAMS Features AXIAL LEAD CASE 267 STYLE 1 520 V Rating Meets 80% Derating Requirements of Major OEMs Low Forward Voltage Drop Low Leakage Ultrafast 95 Nanosecond Recovery Time Reduces Forward Conduction Loss AEC−Q101 Qualified and PPAP Capable NRVUD Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements All Packages are Pb−Free* Applications A MUR 550APF YYWW G G 1 2 DCM PFC Designs Switching Power Supplies Power Inverters DPAK CASE 369C STYLE 8 4 1 3 Pin 1: No Connect 4 TO−220AC CASE 221B STYLE 1 Case: Epoxy, Molded Epoxy Meets UL 94 V−0 @ 0.125 in Weight: MUR550APFG: 1.1 Gram (Approximately) 4 3 Mechanical Characteristics: AYWW U 550G AY WWG MUR550PF KA 1 MURD550PFG, NRVUD550PFT4G: 0.4 Gram (Approximately) MUR550PFG, MURF550PFG: 1.9 Gram (Approximately) Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable Lead and Mounting Surface Temperature for Soldering Purposes: 260C Max. for 10 Seconds 4 3 1 3 4 TO−220FP CASE 221E STYLE 1 1 4 3 1 AYWWG MURF550PF KA 3 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Semiconductor Components Industries, LLC, 2012 January, 2012 − Rev. 8 1 A YY, Y WW G or G KA = Assembly Location = Year = Work Week = Pb−Free Package = Diode Polarity (Note: Microdot may be in either location) Publication Order Number: MUR550/D MUR550APFG, MURD550PFG, MUR550PFG, MURF550PFG, NRVUD550PFT4G ORDERING INFORMATION Device Shipping† Package MUR550APFG Axial 500 Units/Bag MUR550APFRLG Axial 1,500 Tape & Reel MURD550PFT4G DPAK (Pb−Free) 2,500 Tape & Reel NRVUD550PFT4G DPAK (Pb−Free) 2,500 Tape & Reel MUR550PFG TO−220AC (Pb−Free) 50 Units/Rail MURF550PFG TO−220FP (Pb−Free) 50 Units / Rail †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. MAXIMUM RATINGS Rating Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Average Rectified Forward Current (Rated VR) TC = 65C (Rated VR) TC = 160C MUR550APFG MURD550PFG, NRVUD550PFT4G, MUR550PFG, MURF550PFG Non−Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, 60 Hz) MUR550APFG NRVUD550PFT4G, MURD550PFG MUR550PFG, MURF550PFG Operating Junction Temperature Range Symbol Value Unit VRRM VRWM VR 520 V IF(AV) IFSM 5.0 5.0 85 75 100 A A TJ −65 to +175 C Storage Temperature Range Tstg −65 to +175 C ESD Ratings: ESD > 400 > 8000 V Machine Model = C Human Body Model = 3B Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. THERMAL CHARACTERISTICS Characteristic Symbol Thermal Resistance, Junction−to−Case (Note 1) MURD550PG, MUR550PFG, NRVUD550PFT4G MURF550PFG RqJC Thermal Resistance, Junction−to−Ambient RqJA Note 2 62 75 C/W Symbol Value Unit MUR550APFG NRVUD550PFT4G, MURD550PFG (Note 3), MURF550PFG Value 2.8 5.75 Unit C/W 1. Rating applies when surface mounted on the minimum pad sizes recommended. 2. See Note 2, Ambient Mounting Data. 3. 1 inch square pad size on FR4 board. ELECTRICAL CHARACTERISTICS Characteristic Maximum Instantaneous Forward Voltage Drop (Note 4) (IF = 5.0 A, TJ = 25C) (IF = 5.0 A, TJ = 150C) VF Maximum Instantaneous Reverse Current (Note 4) (VR = 520 V, TJ = 25C) (VR = 520 V, TJ = 150C) IR Maximum Reverse Recovery Time (IF = 1.0 A, di/dt = 50 A/ms, VR = 30 V, TJ = 25C) trr 4. Pulse Test: Pulse Width = 300 ms, Duty Cycle 2.0%. http://onsemi.com 2 1.15 0.98 5.0 400 95 V mA ns MUR550APFG, MURD550PFG, MUR550PFG, MURF550PFG, NRVUD550PFT4G NOTE 2 — AMBIENT MOUNTING DATA Data shown for thermal resistance junction−to−ambient (RqJA) for the mountings shown is to be used as typical guideline values for preliminary engineering or in case the tie point temperature cannot be measured. TYPICAL VALUES FOR RqJA IN STILL AIR Mounting Method 1 2 RqJA Lead Length, L (IN) 1/8 1/4 1/2 3/4 55 50 51 53 63 58 59 61 Units C/W C/W 28 C/W 3 MOUNTING METHOD 1 P.C. Board Where Available Copper Surface area is small. L L ÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉ MOUNTING METHOD 2 Vector Push−In Terminals T−28 L L ÉÉÉÉÉÉÉÉÉÉÉÉ MOUNTING METHOD 3 P.C. Board with 1−1/2 x 1−1/2 Copper Surface ÉÉ ÉÉ ÉÉ ÉÉ ÉÉ ÉÉ ÉÉ ÉÉ L = 1/2 Board Ground Plane http://onsemi.com 3 IF, INSTANTANEOUS FORWARD CURRENT (AMPS) iF, INSTANTANEOUS FORWARD CURRENT (AMPS) MUR550APFG, MURD550PFG, MUR550PFG, MURF550PFG, NRVUD550PFT4G 100 100 10 150C 1.0 0.1 125C 0.2 0 25C 0.4 0.6 0.8 1.0 1.4 1.2 1.6 vF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS) 10 150C 1.0 0.1 125C 0 0.2 0.4 1.4 1.2 1.6 IR, MAXIMUM REVERSE CURRENT (AMPS) 1.0E−3 IR, REVERSE CURRENT (AMPS) 1.0E−4 150C 1.0E−4 150C 125C 1.0E−5 1.0E−5 125C 1.0E−6 1.0E−6 1.0E−7 1.0E−7 25C 1.0E−8 0 100 200 25C 1.0E−8 400 300 500 1.0E−9 0 100 200 300 500 400 VR, REVERSE VOLTAGE (VOLTS) VR, REVERSE VOLTAGE (VOLTS) Figure 3. Typical Reverse Current Figure 4. Maximum Reverse Current 10 10 PFO, AVERAGE POWER DISSIPATION (WATTS) IF, AVERAGE FORWARD CURRENT (AMPS) 1.0 0.8 Figure 2. Maximum Forward Voltage 1.0E−3 dc SQUARE WAVE 5 0 100 0.6 VF, MAXIMUM INSTANTANEOUS FORWARD VOLTAGE (VOLTS) Figure 1. Typical Forward Voltage 1.0E−9 25C 110 120 130 140 150 160 170 180 9 8 SQUARE WAVE 7 6 dc 5 4 3 2 1 0 0 1 2 3 4 5 6 7 8 9 TC, CASE TEMPERATURE (C) IO, AVERAGE FORWARD CURRENT (AMPS) Figure 5. Current Derating Figure 6. Forward Power Dissipation http://onsemi.com 4 10 MUR550APFG, MURD550PFG, MUR550PFG, MURF550PFG, NRVUD550PFT4G C, CAPACITANCE (pF) 100 25C 10 1 0 50 100 200 150 VR, REVERSE VOLTAGE (VOLTS) R(t), TRANSIENT THERMAL RESISTANCE Figure 7. Capacitance 100 10 0.5 0.2 0.1 0.05 1 0.01 P(pk) t1 0.1 t2 Single Pulse 0.01 0.000001 0.00001 DUTY CYCLE, D = t1/t2 0.0001 0.001 0.01 0.1 1.0 100 10 1000 t, TIME (s) R(t), TRANSIENT THERMAL RESISTANCE Figure 8. Thermal Response for MUR550APFG 10 0.5 1 0.1 0.2 0.1 0.05 0.01 P(pk) t1 Single Pulse t2 DUTY CYCLE, D = t1/t2 0.01 0.000001 0.00001 0.0001 0.001 0.01 0.1 1.0 10 t, TIME (s) Figure 9. Thermal Response for MURD550PFG, NRVUD550PFT4G http://onsemi.com 5 100 1000 R(t), TRANSIENT THERMAL RESISTANCE MUR550APFG, MURD550PFG, MUR550PFG, MURF550PFG, NRVUD550PFT4G 10 0.5 1 0.2 0.1 0.05 0.1 0.01 P(pk) t1 Single Pulse t2 DUTY CYCLE, D = t1/t2 0.01 0.000001 0.00001 0.0001 0.001 0.01 1.0 0.1 10 100 1000 t, TIME (s) Figure 10. Thermal Response for MUR550PFG r(t), TRANSIENT THERMAL RESPONSE (NORMALIZED) (C/W) 10 D = 0.5 1.0 0.1 0.2 0.1 0.05 0.02 P(pk) 0.01 SINGLE PULSE 0.01 t1 t2 DUTY CYCLE, D = t1/t2 0.001 0.000001 0.00001 0.0001 0.001 0.01 t, TIME (s) 0.1 1.0 ZqJC(t) = r(t) RqJC RqJC = 1.6C/W MAX D CURVES APPLY FOR POWER PULSE TRAIN SHOWN READ TIME AT t1 TJ(pk) - TC = P(pk) ZqJC(t) 10 100 1000 Figure 11. Thermal Response, (MURF550PFG) Junction−to−Case (RqJC) r(t), TRANSIENT THERMAL RESPONSE (NORMALIZED) (C/W) 100 10 D = 0.5 0.2 0.1 0.05 0.02 1.0 0.01 P(pk) 0.1 0.01 0.001 0.000001 t1 SINGLE PULSE 0.00001 t2 DUTY CYCLE, D = t1/t2 0.0001 0.001 0.01 t, TIME (s) 0.1 1.0 ZqJC(t) = r(t) RqJC RqJC = 1.6C/W MAX D CURVES APPLY FOR POWER PULSE TRAIN SHOWN READ TIME AT t1 TJ(pk) - TC = P(pk) ZqJC(t) 10 Figure 12. Thermal Response, (MURF550PFG) Junction−to−Ambient (RqJA) http://onsemi.com 6 100 1000 MUR550APFG, MURD550PFG, MUR550PFG, MURF550PFG, NRVUD550PFT4G PACKAGE DIMENSIONS AXIAL LEAD CASE 267−05 ISSUE G NOTES: 1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 267-04 OBSOLETE, NEW STANDARD 267-05. A K D 1 2 B INCHES MIN MAX 0.287 0.374 0.189 0.209 0.047 0.051 1.000 --- DIM A B D K K MILLIMETERS MIN MAX 7.30 9.50 4.80 5.30 1.20 1.30 25.40 --- STYLE 1: PIN 1. CATHODE (POLARITY BAND) 2. ANODE DPAK (SINGLE GAUGE) CASE 369C−01 ISSUE D A E b3 c2 B Z D 1 L4 A 4 L3 b2 e 2 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCHES. 3. THERMAL PAD CONTOUR OPTIONAL WITHIN DIMENSIONS b3, L3 and Z. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.006 INCHES PER SIDE. 5. DIMENSIONS D AND E ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY. 6. DATUMS A AND B ARE DETERMINED AT DATUM PLANE H. C H DETAIL A 3 c b 0.005 (0.13) M H C L2 GAUGE PLANE C L SEATING PLANE A1 L1 DETAIL A ROTATED 905 CW DIM A A1 b b2 b3 c c2 D E e H L L1 L2 L3 L4 Z INCHES MIN MAX 0.086 0.094 0.000 0.005 0.025 0.035 0.030 0.045 0.180 0.215 0.018 0.024 0.018 0.024 0.235 0.245 0.250 0.265 0.090 BSC 0.370 0.410 0.055 0.070 0.108 REF 0.020 BSC 0.035 0.050 −−− 0.040 0.155 −−− SOLDERING FOOTPRINT* 6.20 0.244 2.58 0.102 5.80 0.228 3.00 0.118 1.60 0.063 6.17 0.243 SCALE 3:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 7 MILLIMETERS MIN MAX 2.18 2.38 0.00 0.13 0.63 0.89 0.76 1.14 4.57 5.46 0.46 0.61 0.46 0.61 5.97 6.22 6.35 6.73 2.29 BSC 9.40 10.41 1.40 1.78 2.74 REF 0.51 BSC 0.89 1.27 −−− 1.01 3.93 −−− MUR550APFG, MURD550PFG, MUR550PFG, MURF550PFG, NRVUD550PFT4G PACKAGE DIMENSIONS TO−220 TWO−LEAD CASE 221B−04 ISSUE E C B Q F T S DIM A B C D F G H J K L Q R S T U 4 A 1 U 3 H K L R D J G NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. INCHES MIN MAX 0.595 0.620 0.380 0.405 0.160 0.190 0.025 0.035 0.142 0.161 0.190 0.210 0.110 0.130 0.014 0.025 0.500 0.562 0.045 0.060 0.100 0.120 0.080 0.110 0.045 0.055 0.235 0.255 0.000 0.050 STYLE 1: PIN 1. 2. 3. 4. MILLIMETERS MIN MAX 15.11 15.75 9.65 10.29 4.06 4.82 0.64 0.89 3.61 4.09 4.83 5.33 2.79 3.30 0.36 0.64 12.70 14.27 1.14 1.52 2.54 3.04 2.04 2.79 1.14 1.39 5.97 6.48 0.000 1.27 CATHODE N/A ANODE CATHODE TO−220 FULLPAK, 2−LEAD CASE 221E−01 ISSUE A SEATING PLANE −T− −B− F NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. C DIM A B C D F G H J K L N Q R S U S Q U A 1 2 3 H −Y− K G N L J R M B M MILLIMETERS MIN MAX 15.67 16.07 9.96 10.36 4.50 4.90 0.60 1.00 3.08 3.28 2.54 BSC 2.98 3.38 0.45 0.64 12.68 14.27 1.14 1.52 5.08 BSC 3.10 3.50 2.56 2.96 2.34 2.74 6.48 6.88 STYLE 1: PIN 1. CATHODE 2. N/A 3. ANODE D 2 PL 0.25 (0.010) INCHES MIN MAX 0.617 0.633 0.392 0.408 0.177 0.193 0.024 0.039 0.121 0.129 0.100 BSC 0.117 0.133 0.018 0.025 0.499 0.562 0.045 0.060 0.200 BSC 0.122 0.138 0.101 0.117 0.092 0.108 0.255 0.271 Y ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 http://onsemi.com 8 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative MUR550/D