MUR550 D

MUR550APFG,
MURD550PFG,
MUR550PFG,
MURF550PFG,
NRVUD550PFT4G
SWITCHMODE
Power Rectifier
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ULTRAFAST RECTIFIER
5.0 AMPERES, 520 VOLTS
These state−of−the−art devices are designed for power factor
correction in discontinuous and critical conduction mode.
MARKING DIAGRAMS
Features








AXIAL LEAD
CASE 267
STYLE 1
520 V Rating Meets 80% Derating Requirements of Major OEMs
Low Forward Voltage Drop
Low Leakage
Ultrafast 95 Nanosecond Recovery Time
Reduces Forward Conduction Loss
AEC−Q101 Qualified and PPAP Capable
NRVUD Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements
All Packages are Pb−Free*
Applications
A
MUR
550APF
YYWW G
G
1 2
 DCM PFC Designs
 Switching Power Supplies
 Power Inverters
DPAK
CASE 369C
STYLE 8
4
1
3
Pin 1: No Connect
4
TO−220AC
CASE 221B
STYLE 1
 Case: Epoxy, Molded
 Epoxy Meets UL 94 V−0 @ 0.125 in
 Weight: MUR550APFG: 1.1 Gram (Approximately)

4
3
Mechanical Characteristics:

AYWW
U
550G
AY WWG
MUR550PF
KA
1
MURD550PFG, NRVUD550PFT4G: 0.4 Gram
(Approximately)
MUR550PFG, MURF550PFG: 1.9 Gram
(Approximately)
Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
Lead and Mounting Surface Temperature for Soldering Purposes:
260C Max. for 10 Seconds
4
3
1
3
4
TO−220FP
CASE 221E
STYLE 1
1
4
3
1
AYWWG
MURF550PF
KA
3
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
 Semiconductor Components Industries, LLC, 2012
January, 2012 − Rev. 8
1
A
YY, Y
WW
G or G
KA
= Assembly Location
= Year
= Work Week
= Pb−Free Package
= Diode Polarity
(Note: Microdot may be in either location)
Publication Order Number:
MUR550/D
MUR550APFG, MURD550PFG, MUR550PFG, MURF550PFG, NRVUD550PFT4G
ORDERING INFORMATION
Device
Shipping†
Package
MUR550APFG
Axial
500 Units/Bag
MUR550APFRLG
Axial
1,500 Tape & Reel
MURD550PFT4G
DPAK
(Pb−Free)
2,500 Tape & Reel
NRVUD550PFT4G
DPAK
(Pb−Free)
2,500 Tape & Reel
MUR550PFG
TO−220AC
(Pb−Free)
50 Units/Rail
MURF550PFG
TO−220FP
(Pb−Free)
50 Units / Rail
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specification Brochure, BRD8011/D.
MAXIMUM RATINGS
Rating
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Average Rectified Forward Current
(Rated VR) TC = 65C
(Rated VR) TC = 160C
MUR550APFG
MURD550PFG, NRVUD550PFT4G,
MUR550PFG, MURF550PFG
Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions Halfwave, 60 Hz)
MUR550APFG
NRVUD550PFT4G, MURD550PFG
MUR550PFG, MURF550PFG
Operating Junction Temperature Range
Symbol
Value
Unit
VRRM
VRWM
VR
520
V
IF(AV)
IFSM
5.0
5.0
85
75
100
A
A
TJ
−65 to +175
C
Storage Temperature Range
Tstg
−65 to +175
C
ESD Ratings:
ESD
> 400
> 8000
V
Machine Model = C
Human Body Model = 3B
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
THERMAL CHARACTERISTICS
Characteristic
Symbol
Thermal Resistance, Junction−to−Case (Note 1)
MURD550PG, MUR550PFG, NRVUD550PFT4G
MURF550PFG
RqJC
Thermal Resistance, Junction−to−Ambient
RqJA
Note 2
62
75
C/W
Symbol
Value
Unit
MUR550APFG
NRVUD550PFT4G, MURD550PFG (Note 3), MURF550PFG
Value
2.8
5.75
Unit
C/W
1. Rating applies when surface mounted on the minimum pad sizes recommended.
2. See Note 2, Ambient Mounting Data.
3. 1 inch square pad size on FR4 board.
ELECTRICAL CHARACTERISTICS
Characteristic
Maximum Instantaneous Forward Voltage Drop (Note 4)
(IF = 5.0 A, TJ = 25C)
(IF = 5.0 A, TJ = 150C)
VF
Maximum Instantaneous Reverse Current (Note 4)
(VR = 520 V, TJ = 25C)
(VR = 520 V, TJ = 150C)
IR
Maximum Reverse Recovery Time (IF = 1.0 A, di/dt = 50 A/ms, VR = 30 V, TJ = 25C)
trr
4. Pulse Test: Pulse Width = 300 ms, Duty Cycle  2.0%.
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2
1.15
0.98
5.0
400
95
V
mA
ns
MUR550APFG, MURD550PFG, MUR550PFG, MURF550PFG, NRVUD550PFT4G
NOTE 2 — AMBIENT MOUNTING DATA
Data shown for thermal resistance junction−to−ambient
(RqJA) for the mountings shown is to be used as typical
guideline values for preliminary engineering or in case the
tie point temperature cannot be measured.
TYPICAL VALUES FOR RqJA IN STILL AIR
Mounting
Method
1
2
RqJA
Lead Length, L (IN)
1/8
1/4
1/2
3/4
55
50
51
53
63
58
59
61
Units
C/W
C/W
28
C/W
3
MOUNTING METHOD 1
P.C. Board Where Available Copper
Surface area is small.
L
L
ÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉ
MOUNTING METHOD 2
Vector Push−In Terminals T−28
L
L
ÉÉÉÉÉÉÉÉÉÉÉÉ
MOUNTING METHOD 3
P.C. Board with
1−1/2  x 1−1/2  Copper Surface
ÉÉ
ÉÉ
ÉÉ
ÉÉ
ÉÉ
ÉÉ
ÉÉ
ÉÉ
L = 1/2 
Board Ground Plane
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3
IF, INSTANTANEOUS FORWARD CURRENT (AMPS)
iF, INSTANTANEOUS FORWARD CURRENT (AMPS)
MUR550APFG, MURD550PFG, MUR550PFG, MURF550PFG, NRVUD550PFT4G
100
100
10
150C
1.0
0.1
125C
0.2
0
25C
0.4
0.6
0.8
1.0
1.4
1.2
1.6
vF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
10
150C
1.0
0.1
125C
0
0.2
0.4
1.4
1.2
1.6
IR, MAXIMUM REVERSE CURRENT (AMPS)
1.0E−3
IR, REVERSE CURRENT (AMPS)
1.0E−4
150C
1.0E−4
150C
125C
1.0E−5
1.0E−5
125C
1.0E−6
1.0E−6
1.0E−7
1.0E−7
25C
1.0E−8
0
100
200
25C
1.0E−8
400
300
500
1.0E−9
0
100
200
300
500
400
VR, REVERSE VOLTAGE (VOLTS)
VR, REVERSE VOLTAGE (VOLTS)
Figure 3. Typical Reverse Current
Figure 4. Maximum Reverse Current
10
10
PFO, AVERAGE POWER DISSIPATION
(WATTS)
IF, AVERAGE FORWARD CURRENT (AMPS)
1.0
0.8
Figure 2. Maximum Forward Voltage
1.0E−3
dc
SQUARE WAVE
5
0
100
0.6
VF, MAXIMUM INSTANTANEOUS FORWARD VOLTAGE
(VOLTS)
Figure 1. Typical Forward Voltage
1.0E−9
25C
110
120
130
140
150
160
170
180
9
8
SQUARE
WAVE
7
6
dc
5
4
3
2
1
0
0
1
2
3
4
5
6
7
8
9
TC, CASE TEMPERATURE (C)
IO, AVERAGE FORWARD CURRENT (AMPS)
Figure 5. Current Derating
Figure 6. Forward Power Dissipation
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4
10
MUR550APFG, MURD550PFG, MUR550PFG, MURF550PFG, NRVUD550PFT4G
C, CAPACITANCE (pF)
100
25C
10
1
0
50
100
200
150
VR, REVERSE VOLTAGE (VOLTS)
R(t), TRANSIENT THERMAL RESISTANCE
Figure 7. Capacitance
100
10
0.5
0.2
0.1
0.05
1
0.01
P(pk)
t1
0.1
t2
Single Pulse
0.01
0.000001
0.00001
DUTY CYCLE, D = t1/t2
0.0001
0.001
0.01
0.1
1.0
100
10
1000
t, TIME (s)
R(t), TRANSIENT THERMAL RESISTANCE
Figure 8. Thermal Response for MUR550APFG
10
0.5
1
0.1
0.2
0.1
0.05
0.01
P(pk)
t1
Single Pulse
t2
DUTY CYCLE, D = t1/t2
0.01
0.000001
0.00001
0.0001
0.001
0.01
0.1
1.0
10
t, TIME (s)
Figure 9. Thermal Response for MURD550PFG, NRVUD550PFT4G
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5
100
1000
R(t), TRANSIENT THERMAL RESISTANCE
MUR550APFG, MURD550PFG, MUR550PFG, MURF550PFG, NRVUD550PFT4G
10
0.5
1
0.2
0.1
0.05
0.1
0.01
P(pk)
t1
Single Pulse
t2
DUTY CYCLE, D = t1/t2
0.01
0.000001
0.00001
0.0001
0.001
0.01
1.0
0.1
10
100
1000
t, TIME (s)
Figure 10. Thermal Response for MUR550PFG
r(t), TRANSIENT THERMAL RESPONSE
(NORMALIZED) (C/W)
10
D = 0.5
1.0
0.1
0.2
0.1
0.05
0.02
P(pk)
0.01
SINGLE PULSE
0.01
t1
t2
DUTY CYCLE, D = t1/t2
0.001
0.000001
0.00001
0.0001
0.001
0.01
t, TIME (s)
0.1
1.0
ZqJC(t) = r(t) RqJC
RqJC = 1.6C/W MAX
D CURVES APPLY FOR POWER
PULSE TRAIN SHOWN
READ TIME AT t1
TJ(pk) - TC = P(pk) ZqJC(t)
10
100
1000
Figure 11. Thermal Response, (MURF550PFG) Junction−to−Case (RqJC)
r(t), TRANSIENT THERMAL RESPONSE
(NORMALIZED) (C/W)
100
10
D = 0.5
0.2
0.1
0.05
0.02
1.0
0.01
P(pk)
0.1
0.01
0.001
0.000001
t1
SINGLE PULSE
0.00001
t2
DUTY CYCLE, D = t1/t2
0.0001
0.001
0.01
t, TIME (s)
0.1
1.0
ZqJC(t) = r(t) RqJC
RqJC = 1.6C/W MAX
D CURVES APPLY FOR POWER
PULSE TRAIN SHOWN
READ TIME AT t1
TJ(pk) - TC = P(pk) ZqJC(t)
10
Figure 12. Thermal Response, (MURF550PFG) Junction−to−Ambient (RqJA)
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6
100
1000
MUR550APFG, MURD550PFG, MUR550PFG, MURF550PFG, NRVUD550PFT4G
PACKAGE DIMENSIONS
AXIAL LEAD
CASE 267−05
ISSUE G
NOTES:
1. DIMENSIONS AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 267-04 OBSOLETE, NEW STANDARD 267-05.
A
K
D
1
2
B
INCHES
MIN
MAX
0.287
0.374
0.189
0.209
0.047
0.051
1.000
---
DIM
A
B
D
K
K
MILLIMETERS
MIN
MAX
7.30
9.50
4.80
5.30
1.20
1.30
25.40
---
STYLE 1:
PIN 1. CATHODE (POLARITY BAND)
2. ANODE
DPAK (SINGLE GAUGE)
CASE 369C−01
ISSUE D
A
E
b3
c2
B
Z
D
1
L4
A
4
L3
b2
e
2
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. THERMAL PAD CONTOUR OPTIONAL WITHIN DIMENSIONS b3, L3 and Z.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL
NOT EXCEED 0.006 INCHES PER SIDE.
5. DIMENSIONS D AND E ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY.
6. DATUMS A AND B ARE DETERMINED AT DATUM
PLANE H.
C
H
DETAIL A
3
c
b
0.005 (0.13)
M
H
C
L2
GAUGE
PLANE
C
L
SEATING
PLANE
A1
L1
DETAIL A
ROTATED 905 CW
DIM
A
A1
b
b2
b3
c
c2
D
E
e
H
L
L1
L2
L3
L4
Z
INCHES
MIN
MAX
0.086 0.094
0.000 0.005
0.025 0.035
0.030 0.045
0.180 0.215
0.018 0.024
0.018 0.024
0.235 0.245
0.250 0.265
0.090 BSC
0.370 0.410
0.055 0.070
0.108 REF
0.020 BSC
0.035 0.050
−−− 0.040
0.155
−−−
SOLDERING FOOTPRINT*
6.20
0.244
2.58
0.102
5.80
0.228
3.00
0.118
1.60
0.063
6.17
0.243
SCALE 3:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
7
MILLIMETERS
MIN
MAX
2.18
2.38
0.00
0.13
0.63
0.89
0.76
1.14
4.57
5.46
0.46
0.61
0.46
0.61
5.97
6.22
6.35
6.73
2.29 BSC
9.40 10.41
1.40
1.78
2.74 REF
0.51 BSC
0.89
1.27
−−−
1.01
3.93
−−−
MUR550APFG, MURD550PFG, MUR550PFG, MURF550PFG, NRVUD550PFT4G
PACKAGE DIMENSIONS
TO−220 TWO−LEAD
CASE 221B−04
ISSUE E
C
B
Q
F
T
S
DIM
A
B
C
D
F
G
H
J
K
L
Q
R
S
T
U
4
A
1
U
3
H
K
L
R
D
J
G
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
INCHES
MIN
MAX
0.595
0.620
0.380
0.405
0.160
0.190
0.025
0.035
0.142
0.161
0.190
0.210
0.110
0.130
0.014
0.025
0.500
0.562
0.045
0.060
0.100
0.120
0.080
0.110
0.045
0.055
0.235
0.255
0.000
0.050
STYLE 1:
PIN 1.
2.
3.
4.
MILLIMETERS
MIN
MAX
15.11
15.75
9.65
10.29
4.06
4.82
0.64
0.89
3.61
4.09
4.83
5.33
2.79
3.30
0.36
0.64
12.70
14.27
1.14
1.52
2.54
3.04
2.04
2.79
1.14
1.39
5.97
6.48
0.000
1.27
CATHODE
N/A
ANODE
CATHODE
TO−220 FULLPAK, 2−LEAD
CASE 221E−01
ISSUE A
SEATING
PLANE
−T−
−B−
F
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
C
DIM
A
B
C
D
F
G
H
J
K
L
N
Q
R
S
U
S
Q
U
A
1 2 3
H
−Y−
K
G
N
L
J
R
M
B
M
MILLIMETERS
MIN
MAX
15.67
16.07
9.96
10.36
4.50
4.90
0.60
1.00
3.08
3.28
2.54 BSC
2.98
3.38
0.45
0.64
12.68
14.27
1.14
1.52
5.08 BSC
3.10
3.50
2.56
2.96
2.34
2.74
6.48
6.88
STYLE 1:
PIN 1. CATHODE
2. N/A
3. ANODE
D 2 PL
0.25 (0.010)
INCHES
MIN
MAX
0.617
0.633
0.392
0.408
0.177
0.193
0.024
0.039
0.121
0.129
0.100 BSC
0.117
0.133
0.018
0.025
0.499
0.562
0.045
0.060
0.200 BSC
0.122
0.138
0.101
0.117
0.092
0.108
0.255
0.271
Y
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are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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8
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MUR550/D