MURD550PF Preferred Device SWITCHMODE Power Rectifier DPAK Surface Mount Package http://onsemi.com These state−of−the−art devices are designed for power factor correction in discontinuous and critical conduction mode. ULTRAFAST RECTIFIER 5.0 AMPERES, 500 VOLTS Features • • • • • Low Forward Voltage Drop Low Leakage Ultrafast 95 Nanosecond Recovery Time Reduces Forward Conduction Loss Pb−Free Package is Available 1 4 3 Pin 1: No Connect MARKING DIAGRAM Mechanical Characteristics • • • • • • Case: Epoxy, Molded Epoxy Meets UL 94 V−0 @ 0.125 in Weight: 0.4 Gram (Approximately) Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds Available in 16 mm Tape and Reel, 2500 Units Per Reel, by Adding a “T4’’ Suffix to the Part Number 4 YWW U 550 DPAK CASE 369C 1 2 3 Y = Year WW = Work Week ORDERING INFORMATION Device Package Shipping† DPAK 2500/Tape & Reel MAXIMUM RATINGS Rating Symbol Value Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage VRRM VRWM VR 500 V Average Rectified Forward Current (Rated VR, TC = 160°C) IF(AV) 5.0 A Non−Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, 60 Hz) IFSM 75 A TJ −65 to +175 °C Storage Temperature Range Tstg −65 to +175 °C ESD Ratings: Machine Model = C Human Body Model = 3B ESD Operating Junction Temperature Range MURD550PFT4 MURD550PFT4G DPAK 2500/Tape & Reel (Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Preferred devices are recommended choices for future use and best overall value. V > 400 >8000 Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. Semiconductor Components Industries, LLC, 2005 January, 2005 − Rev. 0 1 Publication Order Number: MURD550PF/D MURD550PF THERMAL CHARACTERISTICS Rating Symbol Value Unit Thermal Resistance − Junction−to−Case (Note 1) RJC 2.8 °C/W Thermal Resistance − Junction−to−Ambient (Note 2) RJA 62 °C/W ELECTRICAL CHARACTERISTICS Maximum Instantaneous Forward Voltage Drop (Note 3) (IF = 5 Amps, TJ = 25°C) (IF = 5 Amps, TJ = 150°C) VF Maximum Instantaneous Reverse Current (Note 3) (VR = 500 V, TJ = 25°C) (VR = 500 V, TJ = 150°C) IR Maximum Reverse Recovery Time (IF = 1 Amp, di/dt = 50 Amps/s, VR = 30 V, TJ = 25°C) trr V 1.15 0.98 A 5.0 400 ns 95 IF, INSTANTANEOUS FORWARD CURRENT (AMPS) iF, INSTANTANEOUS FORWARD CURRENT (AMPS) 1. Rating applies when surface mounted on the minimum pad sizes recommended. 2. 1 inch square pad size on FR4 board. 3. Pulse Test: Pulse Width = 300 s, Duty Cycle ≤ 2.0%. 100 100 10 150°C 1.0 125°C 25°C 0.1 0.2 0 0.4 0.8 0.6 1.0 1.2 1.4 1.6 vF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS) 10 150°C 1.0 125°C 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 VF, MAXIMUM INSTANTANEOUS FORWARD VOLTAGE (VOLTS) Figure 2. Maximum Forward Voltage 1.0E−3 IR, MAXIMUM REVERSE CURRENT (AMPS) Figure 1. Typical Forward Voltage IR, REVERSE CURRENT (AMPS) 25°C 0.1 1.0E−3 1.0E−4 150°C 1.0E−4 150°C 125°C 1.0E−5 1.0E−5 125°C 1.0E−6 1.0E−6 1.0E−7 25°C 1.0E−7 1.0E−8 1.0E−8 25°C 1.0E−9 0 100 200 300 400 500 1.0E−9 0 100 200 300 400 VR, REVERSE VOLTAGE (VOLTS) VR, REVERSE VOLTAGE (VOLTS) Figure 3. Typical Reverse Current Figure 4. Maximum Reverse Current http://onsemi.com 2 500 10 10 PFO, AVERAGE POWER DISSIPATION (WATTS) IF, AVERAGE FORWARD CURRENT (AMPS) MURD550PF dc SQUARE WAVE 5 0 100 110 120 130 140 150 160 170 180 9 8 SQUARE WAVE 7 6 dc 5 4 3 2 1 0 0 1 2 4 3 5 6 7 8 9 TC, CASE TEMPERATURE (°C) IO, AVERAGE FORWARD CURRENT (AMPS) Figure 5. Current Derating Figure 6. Forward Power Dissipation 10 C, CAPACITANCE (pF) 100 25°C 10 1 0 50 100 150 200 VR, REVERSE VOLTAGE (VOLTS) R(t), TRANSIENT THERMAL RESISTANCE Figure 7. Capacitance 10 0.5 1 0.2 0.1 0.05 0.01 P(pk) 0.1 t1 Single Pulse t2 DUTY CYCLE, D = t1/t2 0.01 0.000001 0.00001 0.0001 0.001 0.01 0.1 t, TIME (s) Figure 8. Thermal Response http://onsemi.com 3 1.0 10 100 1000 MURD550PF PACKAGE DIMENSIONS DPAK CASE 369C−01 ISSUE O −T− C B V NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. SEATING PLANE E R 4 Z A S 1 2 DIM A B C D E F G H J K L R S U V Z 3 U K F J L H D G 2 PL 0.13 (0.005) M T INCHES MIN MAX 0.235 0.245 0.250 0.265 0.086 0.094 0.027 0.035 0.018 0.023 0.037 0.045 0.180 BSC 0.034 0.040 0.018 0.023 0.102 0.114 0.090 BSC 0.180 0.215 0.025 0.040 0.020 −−− 0.035 0.050 0.155 −−− MILLIMETERS MIN MAX 5.97 6.22 6.35 6.73 2.19 2.38 0.69 0.88 0.46 0.58 0.94 1.14 4.58 BSC 0.87 1.01 0.46 0.58 2.60 2.89 2.29 BSC 4.57 5.45 0.63 1.01 0.51 −−− 0.89 1.27 3.93 −−− SOLDERING FOOTPRINT* 6.20 0.244 3.0 0.118 2.58 0.101 5.80 0.228 1.6 0.063 6.172 0.243 SCALE 3:1 mm inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SWITCHMODE is a trademark of Semiconductor Components Industries, LLC (SCILLC). ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 61312, Phoenix, Arizona 85082−1312 USA Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 http://onsemi.com 4 For additional information, please contact your local Sales Representative. MURD550PF/D