CM1624 EMI Filter for T-Flash / MicroSD Interfaces Description The CM1624 is a combination EMI filter and line termination device with integrated TVS diodes for use on Multimedia Card interfaces. This state−of−the−art device utilizes solid−state, silicon− avalanche technology for superior clamping performance and DC electrical characteristics. The CM1624 has been optimized for protection of T−Flash/MicroSD interfaces in cellular phones and other portable electronics. The CM1624 consists of six circuits that includes series impedance matching resistors and pull−up resistors as required by the SD specification. TVS diodes are included on each line for ESD protection. An additional TVS diode connection is included for protection of the voltage (Vcc) bus. Termination resistor value of 40 W is provided on the SDData0, SDData1, SDData2, SDData3, CMD, and CLK lines. Pull−up resistors of 25 kW are included on the SDData0, SDData1, SDData2, SDData3 and CMD lines, as well. These may be configured for devices operating in SD or SPI mode. The TVS diodes provide effective suppression of ESD voltages in excess of ±15 kV (contact discharge) per IEC 61000−4−2, level 4. The CM1624 is in a 16−pin, RoHS/WEEE compliant, UDFN 16−pin package. It measures 3.30 x 1.35 x 0.50 mm. The leads are spaced at a pitch of 0.4 mm and are finished with lead−free NiPd. http://onsemi.com 16 1 UDFN16 DE SUFFIX CASE 517BE MARKING DIAGRAM 1624 MG G 1 1624 = Specific Device Code M = Single Character Date Code G = Pb−Free Package (*Note: Microdot may be in either location) PINOUT DIAGRAM Features • Bidirectional EMI/RFI Filtering and Line Termination with • SDData1 Data1 SDData0 Data0 SDCLK ESD1 ESD3 GND PAD • • • • • • Integrated ESD Protection Provides ESD Protection to IEC61000−4−2: ±15 kV Contact Discharge TVS Working Voltage: 5 V Termination Resistors: 40 W Pull−up Resistors: 25 kW Typical Capacitance per Line: 12 pF (VIN = 2.5 V) Protection and Termination for Six Lines + Vcc Solid−state Technology CLK ESD1 VCC SDCMD CMD SDData3 Data3 SDData2 Data2 (Top View) Applications • T−Flash / MicroSD Interfaces • MMC Interfaces • CDMA, GSM, 3G Cell Phones ORDERING INFORMATION Mechanical Characteristics • • • • • 0.40 mm, uDFN 16−pin Package Nominal Dimensions: 3.30 x 1.35 x 0.50 mm Pitch: 0.4 mm Pin−lead Finish: NiPd RoHS/WEEE Compliance, Lead−free Finish © Semiconductor Components Industries, LLC, 2013 April, 2013 − Rev. 3 Device Package Shipping† CM1624−08DE UDFN16 (Pb−Free) 3000/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. 1 Publication Order Number: CM1624/D CM1624 ELECTRICAL SCHEMATIC Table 1. PIN DESCRIPTIONS Pin Name Description 1 SDData1 Data line #1 input/output with pull−up resistor 2 SDData0 Data line #0 input/output with pull−up resistor 3 SDCLK Clock line Input/Output 4 ESD1 Single ESD 5 ESD3 Single ESD 6 SDCMD Command Line Input/Output 7 SDData3 Data line #3 input/output with pull−up resistor 8 SDData2 Data line #2 input/output with pull−up resistor 9 Data2 Data line #2 input/output with pull−up resistor 10 Data3 Data line #3 input/output with pull−up resistor 11 CMD Command Line Input/Output 12 VCC Power Supply ESD Protection 13 ESD1 Single ESD 14 CLK Clock line Input/Output 15 Data0 Data line #0 input/output with pull−up resistor 16 Data1 Data line #1 input/output with pull−up resistor GND PAD GND Ground return to shield http://onsemi.com 2 CM1624 SPECIFICATIONS Table 2. ABSOLUTE MAXIMUM RATINGS Parameter Rating Units Operating Temperature Range −40 to +85 °C Storage Temperature Range −55 to +150 °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. Table 3. ELECTRICAL OPERATING CHARACTERISTICS (Note 1) Symbol Parameter RCH Channel Resistance (R1 to R6) LCH Channel Inductance C Conditions Min Typ Max Units 34 40 46 W 20 Capacitance per Channel VIN = 0 V; 1 MHz; 30 mVRMS 16 VIN = 2.5 V; 1 MHz; 30 mVRMS; (Note 2) RUP Pull−up Resistance (R7 to R11) ILEAK Diode Leakage Current per Channel VIN = 3 V VSIG Signal Clamp Voltage Positive Clamp Negative Clamp ILOAD = 10 mA ILOAD = −10 mA VESD fC 20 nH 24 12 21 pF pF 25 29 kW 0.1 0.5 mA 6.8 −0.8 9.0 −0.4 V ESD Protection − Peak Discharge Voltage at any channel input, in system: a) Contact discharge per IEC 61000−4−2 Standard and b) Air discharge per IEC 61000−4−2 Standard 5.6 −1.5 kV (Note 2) ±15 (Note 2) ±15 Cut−off frequency ZSOURCE = 50 W, ZLOAD = 50 W 300 1. All parameters specified at TA = 25°C unless otherwise noted. 2. This parameter is guaranteed by design and verified by device characterization http://onsemi.com 3 MHz CM1624 PERFORMANCE INFORMATION Typical Filter Performance (nominal conditions unless specified otherwise, 50 W Environment) Figure 1. Insertion Loss vs. Frequency (Pins 1 and 16) Figure 2. Insertion Loss vs. Frequency (Pins 2 and 15) http://onsemi.com 4 CM1624 PERFORMANCE INFORMATION (cont’d) Typical Filter Performance (nominal conditions unless specified otherwise, 50 W Environment) Figure 3. Insertion Loss vs. Frequency (Pins 3 and 14) Figure 4. Insertion Loss vs. Frequency (Pins 6 and 11) http://onsemi.com 5 CM1624 PERFORMANCE INFORMATION (cont’d) Typical Filter Performance (nominal conditions unless specified otherwise, 50 W Environment) Figure 5. Insertion Loss vs. Frequency (Pins 7 and 10) Figure 6. Insertion Loss vs. Frequency (Pins 8 and 9) http://onsemi.com 6 CM1624 PACKAGE DIMENSIONS UDFN16, 3.3x1.35, 0.4P CASE 517BE−01 ISSUE O A B D 2X 0.10 C PIN ONE REFERENCE 2X 0.10 C L1 ÉÉÉ ÉÉÉ DETAIL A E OPTIONAL CONSTRUCTIONS TOP VIEW EXPOSED Cu A DETAIL B 0.05 C (A3) 16X A1 0.05 C NOTE 4 16X A1 SIDE VIEW K 1 8 16 9 e C SEATING PLANE ÇÇ ÇÇ ÉÉ NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.25 mm FROM THE TERMINAL TIP. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. MOLD CMPD A3 DETAIL B OPTIONAL CONSTRUCTION DIM A A1 A3 b D D2 E E2 e K L L1 MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.13 REF 0.15 0.25 3.30 BSC 2.70 2.90 1.35 BSC 0.30 0.50 0.40 BSC 0.15 −−− 0.20 0.30 −−− 0.05 DETAIL A D2 L L L E2 16X RECOMMENDED SOLDERING FOOTPRINT* PACKAGE OUTLINE b BOTTOM VIEW 3.00 16X 0.40 0.10 C A B 0.05 C NOTE 3 1.55 0.50 16X 0.40 PITCH 0.25 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. 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