NUF2101M D

NUF2101M
USB Filter with ESD
Protection
This device is designed for applications requiring Line
Termination, EMI Filtering and ESD Protection. It is intended for
use in downstream USB 1.1 ports, Cellular phones, Wireless
equipment and computer applications. This device offers an integrated
solution in a small package (TSOP−6, Case 318G) reducing PCB
space and cost.
Features:
• Provides USB Line Termination, Filtering and ESD Protection
• Single IC Offers Cost Savings by Replacing 4 Resistors,
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SCHEMATIC
RS
D+OUT
1
6
2 Capacitors, and 5 TVs diodes
15 k
• EMI Filtering Prevents Noise from Entering/Leaving the System
• IEC61000−4−2 (Level 4)
•
•
D+IN
8 kV (Contact)
15 kV (Air)
ESD Ratings: Machine Model = C
Human Body Model = 3B
Pb−Free Package is Available
VBUS
2
5
15 k
D−OUT
D−IN
4
3
Benefits:
• TSOP−6 Package Minimizes PCB Space
• Integrated Circuit Increases System Reliability versus Discrete
1
Component Implementation
TSOP−6
CASE 318G
STYLE 10
• TVs Devices Provide ESD Protection That is Better than a Discrete
Implementation because the Small IC minimizes Parasitic
Inductances
MARKING DIAGRAM
Typical Applications:
• USB Hubs
• Computer Motherboards
6VMG
G
1
MAXIMUM RATINGS (TA = 25°C)
Rating
Steady State Power
Maximum Junction Temperature
Symbol
Value
Unit
PD
225
mW
TJ(max)
125
°C
Operating Temperature Range
TJ
−55 to +125
°C
Storage Temperature Range
Tstg
−55 to +125
°C
Lead Solder Temperature
(10 second duration)
TL
260
°C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
© Semiconductor Components Industries, LLC, 2005
August, 2005 − Rev. 1
1
6V
= Specific Device Code
= Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
M
ORDERING INFORMATION
Device
NUF2101MT1
NUF2101MT1G
Package
Shipping †
TSOP−6
3000/Tape & Reel
TSOP−6
(Pb−Free)
3000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Publication Order Number:
NUF2101M/D
NUF2101M
ELECTRICAL CHARACTERISTICS (TA = 25°C)
Device
Device
Marking
VRWM
(Volts)
Min
Max
Max IR
@ VRWM
= 5.25 V
VBUS to
GND
(mA)
NUF2101MT1
6V
5.25
6.0
8.0
1.0
0.1
55
26.3
30
33.7
13
15
17
NUF2101MT1G
6V
5.25
6.0
8.0
1.0
0.1
55
26.3
30
33.7
13
15
17
VBR @
1 mA
(Volts)
Pulldown
Resistor
Rpd (kW)
Max IR
@ VRWM
= 3.3 V
VBUS Pin
(mA)
Typical Line
Capacitance
(pF)
(Notes 2, 3)
Min
Nom
Max
Min
Nom
Max
Series Resistor
RS (W) (Note 1)
1. For other RS values (i.e. RS = 30 W) contact your local ON Semiconductor sales representative.
2. Measured at 25°C, VR = 0 V, f = 1 MHz, Pins 2, 3, 4 or 5 to GND with Pin 1 also grounded.
3. For other capacitance values contact your local ON Semiconductor sales representative.
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2
NUF2101M
TYPICAL CHARACTERISTICS
0
0
−5
−10
S41 (dB)
S21 (dB)
−10
−15
−20
−30
−40
−25
−50
−30
−35
−20
1
10
100
1000
FREQUENCY (MHz)
−60
10
10000
100
32
16000
31
15500
Rpd
16500
30
15000
29
14500
28
14000
27
−35
10000
Figure 2. Analog Cross−Talk
33
−15
5
45
25
TEMPERATURE (°C)
65
13500
−35
85
−15
Figure 3. RS vs. Temperature
5
45
25
TEMPERATURE (°C)
Figure 4. Rpd vs. Temperature
58
56
CAPACITANCE (pF)
RS
Figure 1. Insertion Loss Characteristics
1000
FREQUENCY (MHz)
54
52
50
48
46
44
42
40
0
1
2
3
Vr, REVERSE VOLTAGE (V)
Figure 5. Typical Capacitance
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3
4
65
85
NUF2101M
PACKAGE DIMENSIONS
TSOP−6
CASE 318G−02
ISSUE P
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
D
6
HE
1
5
4
2
3
E
b
e
c
A
0.05 (0.002)
q
L
A1
DIM
A
A1
b
c
D
E
e
L
HE
q
MIN
0.90
0.01
0.25
0.10
2.90
1.30
0.85
0.20
2.50
0°
MILLIMETERS
NOM
MAX
1.00
1.10
0.06
0.10
0.38
0.50
0.18
0.26
3.00
3.10
1.50
1.70
0.95
1.05
0.40
0.60
2.75
3.00
10°
−
MIN
0.035
0.001
0.010
0.004
0.114
0.051
0.034
0.008
0.099
0°
INCHES
NOM
0.039
0.002
0.014
0.007
0.118
0.059
0.037
0.016
0.108
−
MAX
0.043
0.004
0.020
0.010
0.122
0.067
0.041
0.024
0.118
10°
STYLE 10:
PIN 1. D(OUT)+
2. GND
3. D(OUT)−
4. D(IN)−
5. VBUS
6. D(IN)+
SOLDERING FOOTPRINT*
2.4
0.094
1.9
0.075
0.95
0.037
0.95
0.037
0.7
0.028
1.0
0.039
SCALE 10:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
N. American Technical Support: 800−282−9855 Toll Free
Literature Distribution Center for ON Semiconductor
USA/Canada
P.O. Box 61312, Phoenix, Arizona 85082−1312 USA
Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051
Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada
Phone: 81−3−5773−3850
Email: [email protected]
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ON Semiconductor Website: http://onsemi.com
Order Literature: http://www.onsemi.com/litorder
For additional information, please contact your
local Sales Representative.
NUF2101M/D