NUF2101M USB Filter with ESD Protection This device is designed for applications requiring Line Termination, EMI Filtering and ESD Protection. It is intended for use in downstream USB 1.1 ports, Cellular phones, Wireless equipment and computer applications. This device offers an integrated solution in a small package (TSOP−6, Case 318G) reducing PCB space and cost. Features: • Provides USB Line Termination, Filtering and ESD Protection • Single IC Offers Cost Savings by Replacing 4 Resistors, http://onsemi.com SCHEMATIC RS D+OUT 1 6 2 Capacitors, and 5 TVs diodes 15 k • EMI Filtering Prevents Noise from Entering/Leaving the System • IEC61000−4−2 (Level 4) • • D+IN 8 kV (Contact) 15 kV (Air) ESD Ratings: Machine Model = C Human Body Model = 3B Pb−Free Package is Available VBUS 2 5 15 k D−OUT D−IN 4 3 Benefits: • TSOP−6 Package Minimizes PCB Space • Integrated Circuit Increases System Reliability versus Discrete 1 Component Implementation TSOP−6 CASE 318G STYLE 10 • TVs Devices Provide ESD Protection That is Better than a Discrete Implementation because the Small IC minimizes Parasitic Inductances MARKING DIAGRAM Typical Applications: • USB Hubs • Computer Motherboards 6VMG G 1 MAXIMUM RATINGS (TA = 25°C) Rating Steady State Power Maximum Junction Temperature Symbol Value Unit PD 225 mW TJ(max) 125 °C Operating Temperature Range TJ −55 to +125 °C Storage Temperature Range Tstg −55 to +125 °C Lead Solder Temperature (10 second duration) TL 260 °C Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. © Semiconductor Components Industries, LLC, 2005 August, 2005 − Rev. 1 1 6V = Specific Device Code = Date Code G = Pb−Free Package (Note: Microdot may be in either location) M ORDERING INFORMATION Device NUF2101MT1 NUF2101MT1G Package Shipping † TSOP−6 3000/Tape & Reel TSOP−6 (Pb−Free) 3000/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. Publication Order Number: NUF2101M/D NUF2101M ELECTRICAL CHARACTERISTICS (TA = 25°C) Device Device Marking VRWM (Volts) Min Max Max IR @ VRWM = 5.25 V VBUS to GND (mA) NUF2101MT1 6V 5.25 6.0 8.0 1.0 0.1 55 26.3 30 33.7 13 15 17 NUF2101MT1G 6V 5.25 6.0 8.0 1.0 0.1 55 26.3 30 33.7 13 15 17 VBR @ 1 mA (Volts) Pulldown Resistor Rpd (kW) Max IR @ VRWM = 3.3 V VBUS Pin (mA) Typical Line Capacitance (pF) (Notes 2, 3) Min Nom Max Min Nom Max Series Resistor RS (W) (Note 1) 1. For other RS values (i.e. RS = 30 W) contact your local ON Semiconductor sales representative. 2. Measured at 25°C, VR = 0 V, f = 1 MHz, Pins 2, 3, 4 or 5 to GND with Pin 1 also grounded. 3. For other capacitance values contact your local ON Semiconductor sales representative. http://onsemi.com 2 NUF2101M TYPICAL CHARACTERISTICS 0 0 −5 −10 S41 (dB) S21 (dB) −10 −15 −20 −30 −40 −25 −50 −30 −35 −20 1 10 100 1000 FREQUENCY (MHz) −60 10 10000 100 32 16000 31 15500 Rpd 16500 30 15000 29 14500 28 14000 27 −35 10000 Figure 2. Analog Cross−Talk 33 −15 5 45 25 TEMPERATURE (°C) 65 13500 −35 85 −15 Figure 3. RS vs. Temperature 5 45 25 TEMPERATURE (°C) Figure 4. Rpd vs. Temperature 58 56 CAPACITANCE (pF) RS Figure 1. Insertion Loss Characteristics 1000 FREQUENCY (MHz) 54 52 50 48 46 44 42 40 0 1 2 3 Vr, REVERSE VOLTAGE (V) Figure 5. Typical Capacitance http://onsemi.com 3 4 65 85 NUF2101M PACKAGE DIMENSIONS TSOP−6 CASE 318G−02 ISSUE P NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. D 6 HE 1 5 4 2 3 E b e c A 0.05 (0.002) q L A1 DIM A A1 b c D E e L HE q MIN 0.90 0.01 0.25 0.10 2.90 1.30 0.85 0.20 2.50 0° MILLIMETERS NOM MAX 1.00 1.10 0.06 0.10 0.38 0.50 0.18 0.26 3.00 3.10 1.50 1.70 0.95 1.05 0.40 0.60 2.75 3.00 10° − MIN 0.035 0.001 0.010 0.004 0.114 0.051 0.034 0.008 0.099 0° INCHES NOM 0.039 0.002 0.014 0.007 0.118 0.059 0.037 0.016 0.108 − MAX 0.043 0.004 0.020 0.010 0.122 0.067 0.041 0.024 0.118 10° STYLE 10: PIN 1. D(OUT)+ 2. GND 3. D(OUT)− 4. D(IN)− 5. VBUS 6. D(IN)+ SOLDERING FOOTPRINT* 2.4 0.094 1.9 0.075 0.95 0.037 0.95 0.037 0.7 0.028 1.0 0.039 SCALE 10:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: N. American Technical Support: 800−282−9855 Toll Free Literature Distribution Center for ON Semiconductor USA/Canada P.O. Box 61312, Phoenix, Arizona 85082−1312 USA Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada Phone: 81−3−5773−3850 Email: [email protected] http://onsemi.com 4 ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative. NUF2101M/D