MC74VHC1G50 D

MC74VHC1G50
Buffer
The MC74VHC1G50 is an advanced high speed CMOS buffer
fabricated with silicon gate CMOS technology. It achieves high speed
operation similar to equivalent Bipolar Schottky TTL while maintaining
CMOS low power dissipation.
The internal circuit is composed of three stages, including a buffered
output which provides high noise immunity and stable output.
The MC74VHC1G50 input structure provides protection when
voltages up to 7.0 V are applied, regardless of the supply voltage. This
allows the MC74VHC1G50 to be used to interface 5.0 V circuits to 3.0 V
circuits.
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MARKING
DIAGRAMS
SC--88A / SOT--353/SC--70
DF SUFFIX
CASE 419A
High Speed: tPD = 3.5 ns (Typ) at VCC = 5 V
Low Power Dissipation: ICC = 1 mA (Max) at TA = 25°C
Pin 1
d = Date Code
Power Down Protection Provided on Inputs
Balanced Propagation Delays
Pin and Function Compatible with Other Standard Logic Families
TSOP--5/SOT--23/SC--59
DT SUFFIX
CASE 483
Chip Complexity: FET = 104; Equivalent Gate = 26
These devices are available in Pb--free package(s). Specifications herein
apply to both standard and Pb--free devices. Please see our website at
www.onsemi.com for specific Pb--free orderable part numbers, or
contact your local ON Semiconductor sales office or representative.
PIN ASSIGNMENT
1
IN A
2
3
GND
4
VRd
Pin 1
d = Date Code
VCC
5
1
NC
VRd
OUT Y
NC
2
IN A
3
GND
4
OUT Y
5
VCC
FUNCTION TABLE
Figure 1. Pinout (Top View)
IN A
1
OUT Y
A Input
Y Output
L
H
L
H
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
Figure 2. Logic Symbol
© Semiconductor Components Industries, LLC, 2006
March, 2006 -- Rev. 12
1
Publication Order Number:
MC74VHC1G50/D
MC74VHC1G50
MAXIMUM RATINGS (Note 1)
Symbol
Value
Unit
VCC
DC Supply Voltage
Characteristics
--0.5 to +7.0
V
VIN
DC Input Voltage
--0.5 to +7.0
V
VOUT
DC Output Voltage
--0.5 to 7.0
--0.5 to VCC + 0.5
V
IIK
Input Diode Current
--20
mA
IOK
Output Diode Current
+20
mA
IOUT
DC Output Current, per Pin
+25
mA
ICC
DC Supply Current, VCC and GND
+50
mA
PD
Power dissipation in still air
SC--88A, TSOP--5
200
mW
θJA
Thermal resistance
SC--88A, TSOP--5
333
°C/W
TL
Lead temperature, 1 mm from case for 10 s
260
°C
TJ
Junction temperature under bias
+150
°C
Tstg
Storage temperature
--65 to +150
°C
VESD
ESD Withstand Voltage
Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
> 2000
> 200
N/A
V
ILatch--Up
Latch--Up Performance
Above VCC and Below GND at 125°C (Note 5)
±500
mA
VCC = 0
High or Low State
VOUT < GND; VOUT > VCC
1. Maximum Ratings are those values beyond which damage to the device may occur. Exposure to these conditions or conditions beyond those
indicated may adversely affect device reliability. Functional operation under absolute--maximum--rated conditions is not implied. Functional
operation should be restricted to the Recommended Operating Conditions.
2. Tested to EIA/JESD22--A114--A
3. Tested to EIA/JESD22--A115--A
4. Tested to JESD22--C101--A
5. Tested to EIA/JESD78
RECOMMENDED OPERATING CONDITIONS
Min
Max
Unit
VCC
Symbol
DC Supply Voltage
Characteristics
2.0
5.5
V
VIN
DC Input Voltage
0.0
5.5
V
VOUT
DC Output Voltage
0.0
VCC
V
TA
Operating Temperature Range
--55
+125
°C
tr , tf
Input Rise and Fall Time
0
0
100
20
ns/V
VCC = 3.3 V ± 0.3 V
VCC = 5.0 V ± 0.5 V
Device Junction Temperature versus
Time to 0.1% Bond Failures
419,300
47.9
100
178,700
20.4
110
79,600
9.4
120
37,000
4.2
130
17,800
2.0
140
8,900
1.0
TJ = 80 ° C
90
TJ = 90 ° C
117.8
TJ = 100 ° C
1,032,200
TJ = 110° C
80
FAILURE RATE OF PLASTIC = CERAMIC
UNTIL INTERMETALLICS OCCUR
TJ = 120° C
Time, Years
TJ = 130 ° C
Time, Hours
NORMALIZED FAILURE RATE
Junction
Temperature °C
1
1
10
100
TIME, YEARS
Figure 3. Failure Rate vs. Time
Junction Temperature
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2
1000
MC74VHC1G50
DC ELECTRICAL CHARACTERISTICS
Symbol
Parameter
Test Conditions
Min
1.5
2.1
3.15
3.85
VIH
Minimum High--Level
Input Voltage
2.0
3.0
4.5
5.5
VIL
Maximum Low--Level
Input Voltage
2.0
3.0
4.5
5.5
VOH
Minimum High--Level
Output Voltage
VIN = VIH or VIL
VOL
Maximum Low--Level
Output Voltage
VIN = VIH or VIL
TA = 25°C
VCC
(V)
Typ
TA ≤ 85°C
Max
Min
1.5
2.1
3.15
3.85
0.5
0.9
1.35
1.65
VIN = VIH or VIL
IOH = --50 mA
2.0
3.0
4.5
1.9
2.9
4.4
VIN = VIH or VIL
IOH = --4 mA
IOH = --8 mA
3.0
4.5
2.58
3.94
VIN = VIH or VIL
IOL = 50 mA
2.0
3.0
4.5
VIN = VIH or VIL
IOL = 4 mA
IOL = 8 mA
Max
Min
Max
1.5
2.1
3.15
3.85
0.5
0.9
1.35
1.65
2.0
3.0
4.5
0.0
0.0
0.0
--55 ≤ TA ≤ 125°C
V
0.5
0.9
1.35
1.65
1.9
2.9
4.4
1.9
2.9
4.4
2.48
3.80
2.34
3.66
Unit
V
V
V
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
3.0
4.5
0.36
0.36
0.44
0.44
0.52
0.52
V
V
IIN
Maximum Input
Leakage Current
VIN = 5.5 V or GND
0 to
5.5
±0.1
±1.0
±1.0
mA
ICC
Maximum Quiescent
Supply Current
VIN = VCC or GND
5.5
1.0
20
40
mA
AC ELECTRICAL CHARACTERISTICS Cload = 50 pF, Input tr = tf = 3.0 ns
TA = 25°C
Symbol
tPLH,
tPHL
CIN
Parameter
Maximum Propagation Delay,
Input A to Y
Min
Test Conditions
TA ≤ 85°C
Typ
Max
Min
Max
--55 ≤ TA ≤ 125°C
Min
Max
Unit
ns
VCC = 3.3 ± 0.3 V
CL = 15 pF
CL = 50 pF
4.5
6.4
7.1
10.6
8.5
12.0
10.0
14.5
VCC = 5.0 ± 0.5 V
CL = 15 pF
CL = 50 pF
3.5
4.5
5.5
7.5
6.5
8.5
8.0
10.0
4
10
10
10
Maximum Input Capacitance
pF
Typical @ 25°C, VCC = 5.0 V
CPD
8.0
Power Dissipation Capacitance (Note 6)
pF
6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: ICC(OPR) = CPD ¯ VCC ¯ fin + ICC. CPD is used to determine the no--load dynamic
power consumption; PD = CPD ¯ VCC2 ¯ fin + ICC ¯ VCC.
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3
MC74VHC1G50
TEST POINT
A or B
VCC
50%
tPHL
Y
DEVICE
UNDER
TEST
GND
tPLH
OUTPUT
CL*
50% VCC
*Includes all probe and jig capacitance
Figure 4. Switching Waveforms
Figure 5. Test Circuit
DEVICE ORDERING INFORMATION
Device Nomenclature
Device Order Number
Circuit
Indicator
Temp
Range
Identifier
Technology
Device
Function
Package
Suffix
Tape &
Reel
Suffix
Package Type
Tape and
Reel Size†
MC74VHC1G50DFT1
MC
74
VHC1G
50
DF
T1
SC--88A /
SOT--353 / SC--70
178 mm (7”)
3000 Unit
MC74VHC1G50DFT2
MC
74
VHC1G
50
DF
T2
SC--88A /
SOT--353 / SC--70
178 mm (7”)
3000 Unit
MC74VHC1G50DTT1
MC
74
VHC1G
50
DT
T1
TSOP--5 / SOT--23
/ SC--59
178 mm (7”)
3000 Unit
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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4
MC74VHC1G50
CAVITY
TAPE
TAPE TRAILER
(Connected to Reel Hub)
NO COMPONENTS
160 mm MIN
TOP TAPE
COMPONENTS
TAPE LEADER
NO COMPONENTS
400 mm MIN
DIRECTION OF FEED
Figure 6. Tape Ends for Finished Goods
TAPE DIMENSIONS mm
4.00
4.00
2.00
∅1.50 TYP
1.75
3.50 ±0.50
8.00 ±0.30
1
∅1.00 MIN
DIRECTION OF FEED
Figure 7. SC--70--5/SC--88A/SOT--353 DFT1 Reel Configuration/Orientation
TAPE DIMENSIONS mm
4.00
2.00
4.00
∅1.50 TYP
1.75
3.50 ±0.50
8.00 ±0.30
1
∅1.00 MIN
DIRECTION OF FEED
Figure 8. SC--70/SC--88A/SOT--353 DFT2 and SOT23--5/TSOP--5/SC59--5 DTT1 Reel Configuration/Orientation
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5
MC74VHC1G50
t MAX
1.5 mm MIN
(0.06 in)
A
13.0 mm ±0.2 mm
(0.512 in ±0.008 in)
50 mm MIN
(1.969 in)
20.2 mm MIN
(0.795 in)
FULL RADIUS
G
Figure 9. Reel Dimensions
REEL DIMENSIONS
Tape Size
T and R Suffix
A Max
G
t Max
8 mm
T1, T2
178 mm
(7 in)
8.4 mm, + 1.5 mm, --0.0
(0.33 in + 0.059 in, --0.00)
14.4 mm
(0.56 in)
DIRECTION OF FEED
BARCODE LABEL
POCKET
Figure 10. Reel Winding Direction
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6
HOLE
MC74VHC1G50
PACKAGE DIMENSIONS
SC70--5/SC--88A/SOT--353
DF SUFFIX
5--LEAD PACKAGE
CASE 419A--02
ISSUE G
A
G
5
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419A--01 OBSOLETE. NEW STANDARD
419A--02.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
4
DIM
A
B
C
D
G
H
J
K
N
S
--B--
S
1
2
3
D 5 PL
0.2 (0.008)
B
M
M
N
INCHES
MIN
MAX
0.071
0.087
0.045
0.053
0.031
0.043
0.004
0.012
0.026 BSC
-----0.004
0.004
0.010
0.004
0.012
0.008 REF
0.079
0.087
J
K
SOLDERING FOOTPRINT*
0.50
0.0197
0.65
0.025
0.65
0.025
0.40
0.0157
1.9
0.0748
SCALE 20:1
mm 
inches
Figure 11. SC--88A/SC70--5/SOT--353
*For additional information on our Pb--Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
7
MILLIMETERS
MIN
MAX
1.80
2.20
1.15
1.35
0.80
1.10
0.10
0.30
0.65 BSC
-----0.10
0.10
0.25
0.10
0.30
0.20 REF
2.00
2.20
MC74VHC1G50
PACKAGE DIMENSIONS
SOT23--5/TSOP--5/SC59--5
DT SUFFIX
5--LEAD PACKAGE
CASE 483--01
ISSUE C
D
S
5
4
1
2
L
A
3
B
MILLIMETERS
INCHES
DIM MIN
MAX
MIN
MAX
A
2.90
3.10 0.1142 0.1220
B
1.30
1.70 0.0512 0.0669
C
0.90
1.10 0.0354 0.0433
D
0.25
0.50 0.0098 0.0197
G
0.85
1.05 0.0335 0.0413
H 0.013 0.100 0.0005 0.0040
J
0.10
0.26 0.0040 0.0102
K
0.20
0.60 0.0079 0.0236
L
1.25
1.55 0.0493 0.0610
M
0_
10 _
0_
10 _
S
2.50
3.00 0.0985 0.1181
G
J
C
0.05 (0.002)
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. MAXIMUM LEAD THICKNESS INCLUDES
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
4. A AND B DIMENSIONS DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
H
M
K
SOLDERING FOOTPRINT*
0.95
0.037
1.9
0.074
2.4
0.094
1.0
0.039
0.7
0.028
SCALE 10:1
mm 
inches
Figure 12. THIN SOT23--5/TSOP--5/SC59--5
*For additional information on our Pb--Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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For additional information, please contact your
local Sales Representative.
MC74VHC1G50/D