NL17SG00 Single 2-Input NAND Gate The NL17SG00 MiniGatet is an advanced high−speed CMOS 2−input NAND gate in ultra−small footprint. The NL17SG00 input structures provides protection when voltages up to 4.6 V are applied. http://onsemi.com Features Wide Operating VCC Range: 0.9 V to 3.6 V MARKING DIAGRAMS High Speed: tPD = 2.5 ns (Typ) at VCC = 3.0 V, CL = 15 pF Low Power Dissipation: ICC = 0.5 mA (Max) at TA = 25°C 4.6 V Overvoltage Tolerant (OVT) Input Pins SOT−953 CASE 527AE Ultra−Small Packages These are Pb−Free and Halide−Free Devices UDFN6 1.0 x 1.0 CASE 517BX IN A IN A 1 GND 2 IN B 3 TM 1 5 6 1 VCC M P • • • • • • 1 UDFN6 1.45 x 1.0 CASE 517AQ VCC 3M 5 OUT Y 2 5 NC GND 3 4 OUT Y SOT−953 IN B IN A GND 5 4 1 = Date Code* = Pb−Free Package PIN ASSIGNMENT VCC 2 3 M G AW M G G (Note: Microdot may be in either location) *Date Code orientation and/or position may vary depending upon manufacturing location. UDFN6 1 SC−88A DF SUFFIX CASE 419A M 4 IN B OUT Y SOT−953 SC−88A UDFN6 1 IN A IN B IN A 2 GND IN A IN B 3 IN B GND GND 4 OUT Y OUT Y OUT Y 5 VCC VCC NC 6 VCC SC−88A FUNCTION TABLE Figure 1. Pinout (Top View) Input Output A B Y L L H L H H H L H H H L ORDERING INFORMATION See detailed ordering and shipping information on page 5 of this data sheet. © Semiconductor Components Industries, LLC, 2014 March, 2014 − Rev. 4 1 Publication Order Number: NL17SG00/D NL17SG00 MAXIMUM RATINGS Symbol Parameter VCC DC Supply Voltage VIN DC Input Voltage VOUT DC Output Voltage IIK DC Input Diode Current Value Unit −0.5 to +5.5 V −0.5 to +4.6 V −0.5 to VCC +0.5 −0.5 to +4.6 V VIN < GND −20 mA VOUT < GND Output at High or Low State Power−Down Mode (VCC = 0 V) IOK DC Output Diode Current −20 mA IOUT DC Output Source/Sink Current ±20 mA ICC DC Supply Current per Supply Pin ±20 mA IGND DC Ground Current per Ground Pin ±20 mA TSTG Storage Temperature Range −65 to +150 °C 260 °C +150 °C TL Lead Temperature, 1 mm from Case for 10 Seconds TJ Junction Temperature Under Bias MSL Moisture Sensitivity FR Flammability Rating VESD ILATCHUP Level 1 Oxygen Index: 28 to 34 ESD Withstand Voltage UL 94 V−0 @ 0.125 in Human Body Model (Note 2) Machine Model (Note 3) Latchup Performance Above VCC and Below GND at 125°C (Note 4) >1500 >100 V ±100 mA Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow. 2. Tested to EIA/JESD22−A114−A. 3. Tested to EIA/JESD22−A115−A. 4. Tested to EIA/JESD78. RECOMMENDED OPERATING CONDITIONS Symbol Min Max Unit VCC Positive DC Supply Voltage 0.9 3.6 V VIN Digital Input Voltage 0.0 3.6 V 0.0 0.0 VCC 3.6 V −55 +125 °C 0 10 ns/V VOUT TA Dt / DV Characteristics Output Voltage Output at High or Low State Power−Down Mode (VCC = 0 V) Operating Temperature Range VCC = 3.3 V ± 0.3 V Input Transition Rise or Fail Rate Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. http://onsemi.com 2 NL17SG00 DC ELECTRICAL CHARACTERISTICS TA = 255C Symbol Parameter VIH High-Level Input Voltage VIL VOH VOL Conditions Low-Level Input Voltage High-Level Output Voltage Low-Level Output Voltage VIN = VIH or VIL VIN = VIH or VIL Min VCC (V) Max TA = -555C to +1255C Min 0.9 VCC VCC 1.1 to 1.3 0.7xVCC 0.7xVCC 1.4 to 1.6 0.65xVCC 0.65xVCC 1.65 to 1.95 0.65xVCC 0.65xVCC 2.3 to 2.7 1.7 1.7 3.0 to 3.6 2.0 2.0 Max Unit V 0.9 GND GND 1.1 to 1.3 0.3xVCC 0.3xVCC 1.4 to 1.6 0.35xVCC 0.35xVCC 1.65 to 1.95 0.35xVCC 0.35xVCC 2.3 to 2.7 0.7 0.7 3.0 to 3.6 0.8 0.8 IOH = −20 mA 0.9 0.75 0.75 IOH = -0.3 mA 1.1 to 1.3 0.75xVCC 0.75xVCC IOH = -1.7 mA 1.4 to 1.6 0.75xVCC 0.75xVCC IOH = -3.0 mA 1.65 to 1.95 Vcc-0.45 Vcc-0.45 IOH = -4.0 mA 2.3 to 2.7 2.0 2.0 IOH = -8.0 mA 3.0 to 3.6 2.48 2.48 IOL = 20 mA 0.9 0.1 0.1 IOL = 0.3 mA 1.1 to 1.3 0.25xVCC 0.25xVCC IOL = 1.7 mA 1.4 to 1.6 0.25xVCC 0.25xVCC IOL = 3.0 mA 1.65 to 1.95 0.45 0.45 IOL = 4.0 mA 2.3 to 2.7 0.4 0.4 IOL = 8.0 mA 3.0 to 3.6 0.4 0.4 V V V IIN Input Leakage Current 0 ≤ VIN ≤ 3.6 V 0 to 3.6 $0.1 $1.0 mA ICC Quiescent Supply Current VIN = VCC or GND 3.6 0.5 10.0 mA Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. http://onsemi.com 3 NL17SG00 ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 ns) Symbol tPLH, tPHL Parameter Propagation Delay, A or B to Y Test Condition CL = 10 pF, RL = 1 MW CL = 15 pF, RL = 1 MW CL = 30 pF, RL = 1 MW CIN Input Capacitance CPD Power Dissipation Capacitance (Note 5) Min Typ Max Min Max Unit 0.9 - 11.0 13.7 - 19.6 ns 1.1 to 1.3 - 8.6 10.8 - 17.1 1.4 to 1.6 - 5.9 9.6 - 11.3 1.65 to 1.95 - 4.5 7.0 - 7.5 2.3 to 2.7 - 2.9 4.4 - 4.9 3.0 to 3.6 - 2.2 3.5 - 4.1 0.9 - 13.75 16.7 - 20.0 1.1 to 1.3 - 9.0 11.2 - 17.4 1.4 to 1.6 - 6.5 10.5 - 12.6 1.65 to 1.95 - 5.0 7.7 - 8.0 2.3 to 2.7 - 3.2 4.9 - 5.6 3.0 to 3.6 - 2.5 3.8 - 4.4 0.9 - 17.0 21.0 - 24.4 1.1 to 1.3 - 11.2 14.8 - 20.5 1.4 to 1.6 - 8.6 10.3 - 17.9 1.65 to 1.95 - 5.0 7.5 - 10.8 2.3 to 2.7 - 4.4 6.4 - 6.8 3.0 to 3.6 - 3.5 4.9 - 5.4 3 - - - pF 4 - - - pF 0 to 3.6 f = 10 MHz TA = -555C to +1255C TA = 255 C VCC (V) 0.9 to 3.6 - ns ns Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 5. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic power consumption; PD = CPD VCC2 fin + ICC VCC. http://onsemi.com 4 NL17SG00 VCC A or B 50% 50% GND tPLH Y tPHL 50% VCC Figure 2. Switching Waveforms VCC OUTPUT INPUT CL* *Includes all probe and jig capacitance. A 1−MHz square input wave is recommended for propagation delay tests. Figure 3. Test Circuit ORDERING INFORMATION Package Shipping† NL17SG00P5T5G SOT−953 (Pb−Free) 8000 / Tape & Reel NL17SG00DFT2G SC−88A (Pb−Free) 3000 / Tape & Reel NL17SG00AMUTCG* UDFN6 1.45x1 mm (Pb−Free) 3000 / Tape & Reel NL17SG00CMUTCG* UDFN6 1x1 mm (Pb−Free) 3000 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *In Development. http://onsemi.com 5 NL17SG00 PACKAGE DIMENSIONS SOT−953 CASE 527AE ISSUE E X D NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF THE BASE MATERIAL. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. A Y 5 4 PIN ONE INDICATOR HE E 1 2 3 DIM A b C D E e HE L L2 L3 C TOP VIEW SIDE VIEW e L 5X 5X MILLIMETERS MIN NOM MAX 0.34 0.37 0.40 0.10 0.15 0.20 0.07 0.12 0.17 0.95 1.00 1.05 0.75 0.80 0.85 0.35 BSC 0.95 1.00 1.05 0.175 REF 0.05 0.10 0.15 −−− −−− 0.15 L3 SOLDERING FOOTPRINT* 5X 5X L2 5X BOTTOM VIEW 0.35 5X b 0.20 0.08 X Y PACKAGE OUTLINE 1.20 1 0.35 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 6 NL17SG00 PACKAGE DIMENSIONS UDFN6 1.0x1.0, 0.35P CASE 517BX ISSUE O PIN ONE REFERENCE NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.20 MM FROM TERMINAL TIP. 4. PACKAGE DIMENSIONS EXCLUSIVE OF BURRS AND MOLD FLASH. A B D ÉÉÉ ÉÉÉ E 0.10 C 2X 2X 0.10 C DIM A A1 A3 b D E e L L1 TOP VIEW A3 0.05 C A MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.13 REF 0.12 0.22 1.00 BSC 1.00 BSC 0.35 BSC 0.25 0.35 0.30 0.40 0.05 C SIDE VIEW A1 C SEATING PLANE RECOMMENDED SOLDERING FOOTPRINT* e 5X 5X L 0.48 3 1 6X 0.22 L1 1.18 6 4 BOTTOM VIEW 6X b 0.10 M 0.05 M C A B C 0.53 1 PKG OUTLINE NOTE 3 0.35 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 7 NL17SG00 PACKAGE DIMENSIONS UDFN6 1.45x1.0, 0.5P CASE 517AQ ISSUE O A B D L L L1 PIN ONE REFERENCE 0.10 C ÉÉÉ ÉÉÉ DETAIL A E OPTIONAL CONSTRUCTIONS DETAIL B MOLD CMPD DETAIL B 0.05 C 6X DIM A A1 A2 b D E e L L1 ÉÉ ÉÉ EXPOSED Cu TOP VIEW 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. OPTIONAL CONSTRUCTIONS A MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.07 REF 0.20 0.30 1.45 BSC 1.00 BSC 0.50 BSC 0.30 0.40 −−− 0.15 MOUNTING FOOTPRINT 0.05 C A1 A2 SIDE VIEW e 6X C 6X SEATING PLANE L 1.24 3 1 DETAIL A 6X 0.53 6 0.30 PACKAGE OUTLINE 4 BOTTOM VIEW 6X 0.50 PITCH DIMENSIONS: MILLIMETERS b 0.10 C A B 0.05 C 1 NOTE 3 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 8 NL17SG00 PACKAGE DIMENSIONS SC−88A (SC−70−5/SOT−353) CASE 419A−02 ISSUE L A G 5 4 −B− S 1 2 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 419A−01 OBSOLETE. NEW STANDARD 419A−02. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. 3 D 5 PL 0.2 (0.008) B M DIM A B C D G H J K N S M N J INCHES MIN MAX 0.071 0.087 0.045 0.053 0.031 0.043 0.004 0.012 0.026 BSC --0.004 0.004 0.010 0.004 0.012 0.008 REF 0.079 0.087 MILLIMETERS MIN MAX 1.80 2.20 1.15 1.35 0.80 1.10 0.10 0.30 0.65 BSC --0.10 0.10 0.25 0.10 0.30 0.20 REF 2.00 2.20 C K H SOLDER FOOTPRINT* 0.50 0.0197 0.65 0.025 0.65 0.025 0.40 0.0157 1.9 0.0748 SCALE 20:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. MiniGate is a trademark of Semiconductor Components Industries, LLC (SCILLC). ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. 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