NL17SG86 D

NL17SG86
Single 2-Input XOR Gate
The NL17SG86 MiniGatet is an advanced high−speed CMOS
2−State XOR gate in ultra−small footprint.
The NL17SG86 input structures provides protection when voltages
up to 4.6 V are applied.
http://onsemi.com
Features
Wide Operating VCC Range: 0.9 V to 3.6 V
MARKING
DIAGRAMS
High Speed: tPD = 2.7 ns (Typ) at VCC = 3.0 V, CL = 15 pF
Low Power Dissipation: ICC = 0.5 mA (Max) at TA = 25°C
1
These are Pb−Free and Halide−Free Devices
1
UDFN6
1.0 x 1.0
CASE 517BX
E
Ultra−Small Packages
M
1
UDFN6
1.45 x 1.0
CASE 517AQ
E
4.6 V Overvoltage Tolerant (OVT) Input Pins (VCC ≥ 0.9 V)
SOT−953
P5 SUFFIX
CASE 527AE
E
•
•
•
•
•
•
M
M
1
1
GND
2
IN B
3
5
4
VCC
OUT Y
IN B
1
IN A
2
GND
3
5
SC−88A
DF SUFFIX
CASE 419A
VCC
1
4
SOT−953
M
IN A
AT M G
G
E
= Specific Device Code
(E with 90 degree clockwise rotation)
M = Date Code*
G
= Pb−Free Package
(Note: Microdot may be in either location)
OUT Y
SC−88A
*Date Code orientation and/or position may vary
depending upon manufacturing location.
IN A
1
6
VCC
IN B
2
5
NC
PIN ASSIGNMENT
GND
4
3
OUT Y
UDFN6
Figure 1. Pinouts (Top View)
SOT−953
SC−88A
UDFN6
1
IN A
IN B
IN A
2
GND
IN A
IN B
3
IN B
GND
GND
4
OUT Y
OUT Y
OUT Y
5
VCC
VCC
NC
6
VCC
FUNCTION TABLE
IN A
IN B
=1
OUT Y
Figure 2. Logic Symbol
A Input
OE Input
Y Output
L
L
H
H
L
H
L
H
L
H
H
L
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
© Semiconductor Components Industries, LLC, 2014
September, 2014 − Rev. 5
1
Publication Order Number:
NL17SG86/D
NL17SG86
MAXIMUM RATINGS
Symbol
Parameter
VCC
DC Supply Voltage
VIN
DC Input Voltage
VOUT
DC Output Voltage
IIK
DC Input Diode Current
Value
Unit
−0.5 to +5.5
V
−0.5 to +4.6
V
−0.5 to VCC +0.5
−0.5 to +4.6
V
VIN < GND
−20
mA
VOUT < GND
Output at High or Low State
Power−Down Mode (VCC = 0 V)
IOK
DC Output Diode Current
−20
mA
IOUT
DC Output Source/Sink Current
±20
mA
ICC
DC Supply Current per Supply Pin
±20
mA
IGND
DC Ground Current per Ground Pin
±20
mA
TSTG
Storage Temperature Range
−65 to +150
°C
260
°C
+150
°C
TL
Lead Temperature, 1 mm from Case for 10 Seconds
TJ
Junction Temperature Under Bias
MSL
Moisture Sensitivity
FR
Flammability Rating
VESD
ILATCHUP
Level 1
Oxygen Index: 28 to 34
ESD Withstand Voltage
Latchup Performance
UL 94 V−0 @ 0.125 in
Human Body Model (Note 2)
Machine Model (Note 3)
>2000
>100
V
Above VCC and Below GND at 125°C (Note 4)
±100
mA
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/JESD22−A115−A.
4. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
Min
Max
Unit
VCC
Positive DC Supply Voltage
0.9
3.6
V
VIN
Digital Input Voltage
0.0
3.6
V
0.0
0.0
VCC
3.6
V
−55
+125
°C
0
10
ns/V
VOUT
TA
Dt / DV
Characteristics
Output Voltage
Output at High or Low State
Power−Down Mode (VCC = 0 V)
Operating Temperature Range
VCC = 3.3 V ± 0.3 V
Input Transition Rise or Fail Rate
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
http://onsemi.com
2
NL17SG86
DC ELECTRICAL CHARACTERISTICS
TA = 255C
Symbol
Parameter
VIH
High−Level
Input Voltage
VIL
VOH
VOL
Conditions
Low−Level Input
Voltage
High−Level
Output Voltage
Low−Level
Output Voltage
VIN =
VIH or
VIL
VIN =
VIH or
VIL
TA = −555C to +1255C
VCC (V)
Min
Max
Min
0.9
VCC
VCC
1.1 to 1.3
0.7xVCC
0.7xVCC
1.4 to 1.6
0.65xVCC
0.65xVCC
1.65 to 1.95
0.65xVCC
0.65xVCC
2.3 to 2.7
1.7
1.7
3.0 to 3.6
2.0
2.0
Max
Unit
V
0.9
GND
GND
1.1 to 1.3
0.3xVCC
0.3xVCC
1.4 to 1.6
0.35xVCC
0.35xVCC
1.65 to 1.95
0.35xVCC
0.35xVCC
2.3 to 2.7
0.7
0.7
3.0 to 3.6
0.8
0.8
IOH = −20 mA
0.9
0.75
0.75
IOH = −0.3 mA
1.1 to 1.3
0.75xVCC
0.75xVCC
IOH = −1.7 mA
1.4 to 1.6
0.75xVCC
0.75xVCC
IOH = −3.0 mA
1.65 to 1.95
VCC−0.45
VCC−0.4
5
IOH = −4.0 mA
2.3 to 2.7
2.0
2.0
IOH = −8.0 mA
3.0 to 3.6
2.48
IOL = 20 mA
0.9
0.1
0.1
IOL = 0.3 mA
1.1 to 1.3
0.25xVCC
0.25xVCC
IOL = 1.7 mA
1.4 to 1.6
0.25xVCC
0.25xVCC
IOL = 3.0 mA
1.65 to 1.95
0.45
0.45
IOL = 4.0 mA
2.3 to 2.7
0.4
0.4
IOL = 8.0 mA
V
V
2.48
V
3.0 to 3.6
0.4
0.4
IIN
Input Leakage
Current
0 ≤ VIN ≤ 3.6 V
0 to 3.6
$0.1
$1.0
mA
ICC
Quiescent
Supply Current
VIN = VCC or GND
3.6
0.5
10.0
mA
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
http://onsemi.com
3
NL17SG86
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 ns)
Symbol
tPLH,
tPHL
Parameter
Propagation Delay,
A or B to Y
Test Condition
CL = 10 pF,
RL = 1 MW
CL = 15 pF,
RL = 1 MW
CL = 30 pF,
RL = 1 MW
CIN
Input Capacitance
CO
Output Capacitance
CPD
Power Dissipation
Capacitance (Note 5)
VCC (V)
TA = 255C
TA = −555C to +1255C
Min
Typ
Max
Min
Max
0.9
−
23
−
−
−
1.1 to 1.3
−
11.7
20.9
−
39.1
1.4 to 1.6
−
6.7
10.0
−
11.8
1.65 to 1.95
−
5.1
6.6
−
7.6
2.3 to 2.7
−
3.4
4.1
−
4.7
3.0 to 3.6
−
2.7
3.3
−
3.9
0.9
−
23.7
−
−
−
1.1 to 1.3
−
11.9
22.8
−
39.4
1.4 to 1.6
−
6.7
9.9
−
11.9
1.65 to 1.95
−
5.1
7.3
−
7.5
2.3 to 2.7
−
3.4
4.7
−
5.3
3.0 to 3.6
−
2.7
3.6
−
4.1
0.9
−
32.1
−
−
−
1.1 to 1.3
−
15.7
31.4
−
59.4
1.4 to 1.6
−
8.7
13.9
−
16.9
1.65 to 1.95
−
6.5
9.8
−
10.2
2.3 to 2.7
−
4.2
6.0
−
6.5
3.0 to 3.6
−
Unit
ns
ns
ns
3.4
4.7
−
5.1
0 to 3.6
3
−
−
−
pF
VO = GND
0
3
−
−
−
pF
f = 10 MHz
0.9 to 3.6
4
−
−
−
pF
−
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
5. CPD is defined as the value of the internal equivalent capacitance which is calculated from the dynamic operating current consumption without
load. Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load
dynamic power consumption; PD = CPD VCC2 fin + ICC VCC.
http://onsemi.com
4
NL17SG86
VCC
A or B
50%
50%
GND
tPLH
Y
tPHL
50% VCC
Figure 3. Switching Waveform
VCC
OUTPUT
INPUT
CL *
*Includes all probe and jig capacitance.
A 1 MHz square input wave is recommended for
propagation delay tests.
Figure 4. Test Circuit
ORDERING INFORMATION
Package
Shipping†
NL17SG86P5T5G
SOT−953
(Pb−Free)
8000 / Tape & Reel
NL17SG86DFT2G
SC−88A
(Pb−Free)
3000 / Tape & Reel
NL17SG86AMUTCG*
UDFN6 1.45 x 1 mm
(Pb−Free)
3000 / Tape & Reel
NL17SG86CMUTCG*
UDFN6 1 x 1 mm
(Pb−Free)
3000 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*In Development.
http://onsemi.com
5
NL17SG86
PACKAGE DIMENSIONS
SOT−953
CASE 527AE
ISSUE E
X
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF THE BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS.
A
Y
5
4
PIN ONE
INDICATOR
HE
E
1
2 3
DIM
A
b
C
D
E
e
HE
L
L2
L3
C
TOP VIEW
SIDE VIEW
e
L
5X
5X
L3
MILLIMETERS
MIN
NOM
MAX
0.34
0.37
0.40
0.10
0.15
0.20
0.07
0.12
0.17
0.95
1.00
1.05
0.75
0.80
0.85
0.35 BSC
0.95
1.00
1.05
0.175 REF
0.05
0.10
0.15
−−−
−−−
0.15
SOLDERING FOOTPRINT*
5X
0.35
5X
0.20
5X
L2
5X
BOTTOM VIEW
b
PACKAGE
OUTLINE
0.08 X Y
1.20
1
0.35
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
6
NL17SG86
PACKAGE DIMENSIONS
UDFN6, 1x1, 0.35P
CASE 517BX
ISSUE O
PIN ONE
REFERENCE
0.10 C
2X
2X
ÉÉÉ
ÉÉÉ
ÉÉÉ
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.20 MM FROM TERMINAL TIP.
4. PACKAGE DIMENSIONS EXCLUSIVE OF
BURRS AND MOLD FLASH.
A B
D
E
DIM
A
A1
A3
b
D
E
e
L
L1
TOP VIEW
A3
0.05 C
A
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.13 REF
0.12
0.22
1.00 BSC
1.00 BSC
0.35 BSC
0.25
0.35
0.30
0.40
0.05 C
SIDE VIEW
A1
C
SEATING
PLANE
RECOMMENDED
SOLDERING FOOTPRINT*
e
5X
5X
L
0.48
3
1
6X
0.22
L1
1.18
6
4
BOTTOM VIEW
6X
b
0.10
M
C A B
0.05
M
C
0.53
1
PKG
OUTLINE
NOTE 3
0.35
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
7
NL17SG86
PACKAGE DIMENSIONS
UDFN6, 1.45x1.0, 0.5P
CASE 517AQ
ISSUE O
A
B
D
PIN ONE
REFERENCE
0.10 C
L
DETAIL A
E
OPTIONAL
CONSTRUCTIONS
OPTIONAL
CONSTRUCTIONS
A
A1
A2
SIDE VIEW
MOLD CMPD
DETAIL B
0.05 C
0.05 C
DIM
A
A1
A2
b
D
E
e
L
L1
ÉÉ
ÉÉ
EXPOSED Cu
TOP VIEW
DETAIL B
6X
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
L1
ÉÉÉ
ÉÉÉ
ÉÉÉ
0.10 C
L
C
MOUNTING FOOTPRINT
SEATING
PLANE
6X
0.30
PACKAGE
OUTLINE
e
6X
L
3
1
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.07 REF
0.20
0.30
1.45 BSC
1.00 BSC
0.50 BSC
0.30
0.40
−−−
0.15
1.24
DETAIL A
6X
0.53
6
4
BOTTOM VIEW
6X
b
0.10 C A B
0.05 C
1
0.50
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
NOTE 3
http://onsemi.com
8
NL17SG86
PACKAGE DIMENSIONS
SC−88A (SC−70−5/SOT−353)
CASE 419A−02
ISSUE L
A
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419A−01 OBSOLETE. NEW STANDARD
419A−02.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
G
5
4
−B−
S
1
2
0.2 (0.008)
D 5 PL
B
M
INCHES
MIN
MAX
0.071
0.087
0.045
0.053
0.031
0.043
0.004
0.012
0.026 BSC
--0.004
0.004
0.010
0.004
0.012
0.008 REF
0.079
0.087
DIM
A
B
C
D
G
H
J
K
N
S
3
M
N
MILLIMETERS
MIN
MAX
1.80
2.20
1.15
1.35
0.80
1.10
0.10
0.30
0.65 BSC
--0.10
0.10
0.25
0.10
0.30
0.20 REF
2.00
2.20
J
C
K
H
SOLDER FOOTPRINT
0.50
0.0197
0.65
0.025
0.65
0.025
0.40
0.0157
1.9
0.0748
SCALE 20:1
mm Ǔ
ǒinches
MiniGate is a trademark of Semiconductor Components Industries, LLC (SCILLC).
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC
reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without
limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC
does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for
surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where
personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and
its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly,
any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture
of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
http://onsemi.com
9
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
NL17SG86/D