12 PIN PDFN SMART HOTPLUG

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
Ç
ÇÇ
Ç
PLLP−12, 9x9 mm
CASE 488AB−01
ISSUE C
DATE 18 JUL 2005
SCALE 1:1
0.10 C
0.08 C
A
B
D
PIN ONE
LOCATION
Ç
Ç
Ç
E
4X
0.15 C
SEATING
PLANE
C
DIM
A
A1
A3
b
D
E
e
D2
E2
K
L
(A3)
A1
A
TOP VIEW
SIDE VIEW
12 X K
12 X L
e
MILLIMETERS
MIN
MAX
1.750
1.950
0.000
0.050
0.254 REF
0.400
0.600
9.000 BSC
9.000 BSC
1.270 BSC
5.400
5.600
7.400
7.600
0.850 REF
0.850
0.950
GENERIC
MARKING DIAGRAM*
D2
10 X
NOTES:
1. DIMENSIONS AND TOLERANCING PER
ASME Y14.5M, 1994.
2. DIMENSIONS IN MILLIMETERS.
3. COPLANARITY APPLIES TO THE LEAD,
DIMENSION B, AND EXPOSED PAD.
1
xxxxxxxxx
AWLYYWW
G
E2
e/2
12 X
b
0.10
M
C A B
0.05
M
C
xxxxxxx
A
WL
YY
WW
G or G
BOTTOM VIEW
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
SOLDERING FOOTPRINT*
9.305
5.652
12 X
1.054
= Specific Device Code
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
12 X
0.551
7.652
1.270 PITCH
STYLE 1:
PIN 1. OVLO
2. UVLO
3. ENABLE/TIMER
4. GND
5. CCHARGE
6. CURRENT LIMIT
7. POWER GOOD
8. N/C
9. N/C
10. SOURCE
11. SOURCE
12. SOURCE
Dimensions in mm
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON14458D
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
PLLP−12, 9*9 MM, SMART HOTPLUG
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON14458D
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY P. CELAYA.
01 MAR 2004
A
CHANGED TITLE OF CASE TO 12 PIN PLLP. REQ. BY S. CHANG.
03 FEB 2005
B
CHANGED DIMS A3, K AND L. ADDED STYLE 1. REQ. BY S. CHANG.
28 APR 2005
C
ADDED SOLDERING FOOTPRINT. REQ. BY S. CHANG.
18 JUL 2005
SMART HotPlug is a trademark of Semiconductor Components Industries, LLC (SCILLC).
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any
liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental
damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over
time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under
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SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
© Semiconductor Components Industries, LLC, 2005
July, 2005 − Rev. 01C
Case Outline Number:
488AB