511AK

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
TDFN8, 2x3, 0.5P
CASE 511AK
ISSUE B
1
DATE 18 MAR 2015
SCALE 2:1
PIN ONE
REFERENCE
0.10 C
B
A
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.25MM FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
L
L
L1
ÇÇ
ÇÇ
ÇÇ
DETAIL A
ALTERNATE
CONSTRUCTIONS
E
EXPOSED Cu
0.10 C TOP VIEW
ÇÇ
ÇÇ
ÉÉ
DIM
A
A1
A3
b
D
D2
E
E2
e
L
L1
MOLD CMPD
DETAIL B
A
DETAIL B
0.10 C
0.08 C
NOTE 4
ALTERNATE
CONSTRUCTION
A3
A1
SIDE VIEW
GENERIC
MARKING DIAGRAM*
SEATING
PLANE
C
MILLIMETERS
MIN
MAX
0.70
0.80
0.00
0.05
0.20 REF
0.20
0.30
2.00 BSC
1.30
1.50
3.00 BSC
1.20
1.40
0.50 BSC
0.20
0.40
−−−
0.15
1
DETAIL A
1
D2
XXXXX
AWLYWG
L
4
XXXXX
A
WL
Y
W
G
E2
8
5
8X
e
BOTTOM VIEW
b
0.10
M
C A B
0.05
M
C
= Specific Device Code
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
NOTE 3
RECOMMENDED
SOLDERING FOOTPRINT*
1.56
8X
0.68
1.45 3.40
1
8X
0.30
0.50
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
STATUS:
98AON34336E
ON SEMICONDUCTOR STANDARD
REFERENCE:
© Semiconductor Components Industries, LLC, 2002
October, DESCRIPTION:
2002 − Rev. 0
TDFN8, 2X3, 0.5P
http://onsemi.com
1
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
Case Outline Number:
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98AON34336E
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION FROM POD #TDFN8−008−01 TO ON SEMICONDUCTOR. REQ. BY B. BERGMAN.
19 DEC 2008
A
CHANGED DESCRIPTION FROM WDFN TO TDFN.
18 MAR 2009
B
REDREW PACKAGE DRAWING TO ON SEMICONDUCTOR/JEDEC STANDARD.
REQ. BY B. BECKER.
18 MAR 2015
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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© Semiconductor Components Industries, LLC, 2015
March, 2015 − Rev. B
Case Outline Number:
511AK