QHX220 Datasheet

Active Isolation Enhancer and Interference Canceller
QHx220
Features
Electromagnetic Interference (EMI) is emerging as a
major concern in next generation wireless
communication systems. As wireless terminals now
support multiple services and features that utilize high
data rates simultaneously, removing interference within
wireless terminals like handsets has become a challenge.
• Protocol agnostic. Designed for: GSM, CDMA, DVB-H,
ISDB-T, DMB
Reducing the Electromagnetic Interference recovers
the receiver sensitivity, enabling simultaneous
operation of multiple radios, and improves the overall
quality of service of communication devices. Intersil’s
QHx220 is situated in a handset to sample the source
of the noise and emulate the RF coupling channel
between the noise source and victim receiver antenna.
In doing so, an anti-noise signal can be applied directly
to the victim receive path to cancel the EMI and
achieve the signal integrity benefits. This approach
makes it possible to cancel both in-band (within the
victim Rx band) or out-of-band aggressors. This is a
revolutionary approach since it is only possible to
cancel out of band noise using conventional Rx filters.
• SPI bus controlled integrated DACs
In addition QHx220 may be used to increase the
inherent isolation between antennas or inside duplexers
and switches, thus allowing to increase the transmit
power in repeaters or yielding higher sensitivity in the
receivers. Both measures finally resulting in a better
coverage, larger cell size, smaller antennas or lower
power of infrastructure components such as
basestations, pico-and Femtocells as well as repeaters.
• Frequency Range 300MHz to 3GHz
• Integrated, programmable LNA gain stages in the
sampler path
• >20dB Noise Cancellation is possible
• 50dB typical Dynamic Range
• Low Power Consumption (<20mW typical, ~2µW
standby)
• Ultra Small ~ 1mm2 devices are available as tested
bumped die or 3x3mm2 QFN package
Applications
• Most any wireless device with a local aggressor:
- Cell phones
- Mobile TV devices
- Laptop Computers
- GPS terminals
- Pico- and Femtocells
• Improved Tx to Rx Isolation of devices (i.e. duplexer,
switches) or between neighboring antennae
• Basestations
• Linearization of PAs
The QHx220 integrates the sampler path LNA gain stages
as well as the DACs required to control the I and Q
control voltages (used to set the magnitude and phase of
the cancellation signal). Both the gain, and control
voltages are programmable using a SPI bus interface.
Typical Application Circuit
Benefits
• Actively cancels unwanted local RF noise
• Improves BER, receiver sensitivity, C/N by canceling
noise generated from local aggressors
• Improves isolation between adjacent antennas
• Can be used to cancel in-band or out-of-band
interferers (i.e. spurs, harmonics, phase noise, or
other noise sources like IM products generated in a
PA)
• Enables simultaneous operation of multiple
co-located radios
• Improves overall quality of service
FIGURE 1. ACTIVE ISOLATION ENHANCER AND NOISE
CANCELLER
October 20, 2009
FN6986.0
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright Intersil Americas Inc. 2009. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
QHx220
DESIGNS
DED FOR NEW
NOT RECOMMEN
MENT
CE
DED REPLA
NO RECOMMEN
nter at
Ce
t
nical Suppor
contact our Tech www.intersil.com/tsc
or
1-888-INTERSIL
QHx220
Ordering Information
PART NUMBER
(Note 1)
TEMP. RANGE
(°C)
PART MARKING
PACKAGE
(Pb-Free)
PKG. DWG. #
QHX220IQT7
QH220
-40 to +85
16 Ld QFN
7” Prod. Tape & Reel; Qty 1,000
L16.3x3B
QHX220IQSR
QH220
-40 to +85
16 Ld QFN
7” Sample Reel; Qty 100
L16.3x3B
Coming Soon
QHX220ICT7 (Note 2)
220
-40 to +85
9 Ball CSP
7” Prod. Tape & Reel; Qty 1,000
TBD
Coming Soon
QHX220ICSR (Note 2)
220
-40 to +85
9 Ball CSP
7” Sample Reel; Qty 100
TBD
NOTES:
1. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach
materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both
SnPb and Pb-free soldering operations). Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that
meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
2. Contact Intersil Marketing for availability.
Pin Configurations
QHx220
(9 BALL CSP)
TOP VIEW
GND2
IND
NC
VDDA2
QHx220
(16 LD QFN)
TOP VIEW
16
15
14
13
GND1 1
2
3
GND
RF IN
ENBAR
INDUCTOR
DATA
CLK
VDD
RF OUT
BUSEN
A
12 GND2
SAMPLER IN 2
1
11 RF OUT
B
10 GND2
GND1 3
6
7
8
EXTR
VDDA
5
DATA
9
CLK
ENBAR 4
BUS ENABLE
C
Pin Descriptions
QFN PIN #
QFN PIN NAME
CSP PIN #
CSP PIN NAME
1, 3, 10, 12, 16
GNDx
1A
GND
Ground
DESCRIPTION
2
SAMPLER IN
2A
RF IN
RF Input
4
ENBAR
3A
ENBAR
5, 13
VDDx
1C
VDD
1.8V Power Supply
6
CLK
3B
CLK
Input Clock (SPI)
7
DATA
2B
DATA
Enable (active low)  Tied to GND
Data Line (SPI)
8
EXTR
-
-
9
BUS ENABLE
3C
BUSEN
Bus Enable (active low, SPI)
11
RF OUT
2C
RF OUT
RF Output
14
NC
-
-
15
IND
1B
INDUCTOR
-
Exposed Center Pad
-
-
2
External Resistor for Gain Tempco Control
No Connect
External Inductor for LNA
Ground
FN6986.0
October 20, 2009
QHx220
Overcoming Noise or
Interference Using the QHx220
Identifying Common Sources of
Electromagnetic Interference (EMI)
• A flex cable carrying high-speed data from a
base-band processor to an LCD/Camera display.
• Closely spaced antennas of radios operating
simultaneously.
• Harmonics, other mixing products or spurs that fall
within the victim receive band.
• Poor isolation from local transmitter (via antennas,
duplexers or other front end modules).
• Noise on common Ground or VCC supply lines.
3
Acquiring and Sampling the Source of
Unwanted Interference
Intersil’s QHx220 reduces EMI by sampling the
interference source at its input. The sampled noise
signal is acquired in close proximity to the noise source
either with an EMI detector, an additional coupling
element on the PCB or direct tap of the noise source
using a RC network.
Emulating the Coupling Channel to Achieve
an Inverse Signal
Once the QHx220 acquires and samples the unwanted
interferer, the general-purpose canceller feeds the
sampled noise signal through an analog signal
processor, which allows control of the phase within 360°
and the amplitude within a dynamic range of 50dB. This
enables the QHx220 to output an inverse signal of the
interference plus coupling channel in order to eliminate
the desensitization of the victim receiver.
FN6986.0
October 20, 2009
QHx220
Absolute Maximum Ratings
Thermal Information
Supply Voltage (VDD to GND) . . . . . . . . . . . . . . . . . . .2.1V
I/O Voltage at All Input Pins . . . . GND - 0.3V to VDD + 0.3V
ESD Rating (HBM) . . . . . . . . . . . . . . . . . . . . . . . . . . . 2kV
Thermal Resistance (Typical)
JA (°C/W) JC (°C/W)
16 Ld QFN Package (Notes 3, 4) . .
60
13
Operating Ambient Temperature Range . . . . -40°C to +85°C
Storage Ambient Temperature Range . . . . -55°C to +150°C
Maximum Junction Temperature . . . . . . . . . . . . . . . +125°C
Pb-free reflow profile . . . . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact
product reliability and result in failures not covered by warranty.
NOTES:
3. JA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief
TB379 for details.
4. For JC, the “case temp” location is the center of the exposed metal pad on the package underside.
Operating Conditions
PARAMETER
SYMBOL
Supply Voltage
Operating Ambient Temperature
MIN
TYP
MAX
VDD
1.7
1.8
1.9
V
TA
-40
25
85
°C
@high/low gain mode
16
28.7
mW
5
@boost gain mode
23
33
mW
5
10
38.3
µW
5
Power Consumption (operation mode)
CONDITION
Power Consumption (standby mode)
UNITS
NOTES
NOTE:
5. Max Power specifications tested under ECC test conditions.
Control Pin Characteristics
Typical values are at VDD = 1.8V, TA = +25°C, and PIN = < -48dBm, unless otherwise noted.
Extreme Characterization Conditions (ECC) are VDD = 1.7V to 1.9V, TA = -40°C to +85°C.
PARAMETER
SYMBOL
Logic Input Level - Low
ENBAR low
CONDITION
MIN
TYP
MAX
0.2 VDD
Logic Input Level - High ENBAR high
0.8 VDD
UNITS NOTES
mV
V
Enable Response Time
Delay following high to low transition until RF
output is within 10% of its final value.
535
ns
Disable Response Time
Delay following low to high transition until RF
output is within 10% of its final value.
350
ns
24
Bits
Control Word Length
Bits 0-9
I-DAC value
10
Bits
Bits 10-19
Q-DAC value
10
Bits
Bits 20-21
Application select
6
00: UHF-Band
01: L-Band
11: ISM Band
Bit 22
Gain Switch
1
Bit
Bit 23 (Note 18)
Extended Feature
1
Bit
7
NOTES:
6. The enable response time is bounded by the input AC cap on board. Typical response time reflects 100pF capacitance.
7. Generally set to low. Two successive SPI instructions are needed to enable or disable boost gain mode.
Sequence to enable boost gain mode  1st instruction: set Bit<23:20> to 1x01’b
 2nd instruction: set Bit<23:20> to 0xxx’b
Sequence to disable boost gain mode  1st instruction: set Bit<23:20> to 1x10’b
 2nd instruction: set Bit<23:20> to 0xxx’b
4
FN6986.0
October 20, 2009
QHx220
SPI Bus Characteristics
TBEB2C
TC2BEB
TCL
CLK
TCH
TCP
BUSENBAR
24BIT
DATA
MSB
LSB
TDH
TDS
Data register lock
FIGURE 2. SPI BUS TIMING DIAGRAM
SPI BUS TIMING REQUIREMENT
SYMBOL
PARAMETER
MIN
tCP
SPI clock period
tCL
Clock pulse width low
40ns
tCH
Clock pulse width high
40ns
TYP
MAX
100ns
tBEB2C
BUSENBAR Fall to CLK Rise Setup Time
tC2BEB
CLK Rise BUSENBAR Fall Delay
40ns
tDS
Data Setup Time
20ns
tDH
Data Hold Time
5ns
0ns
TABLE 1. SPI BUS DATA FORMAT
10BIT I-DAC
<23:14>
10BIT Q-DAC
<13:4>
5
FREQ RANGE
<3:2>
GAIN
<1>
SPARE
<0>
FN6986.0
October 20, 2009
QHx220
Power ON/OFF Sequence
Power ON
Slope1: >1.8V/50ms
0V
ENBAR
Power ON
1.8V
VDDA & VDDA2
t1>0
Low
t2>250µs
BUS ENABLE
CLK
DATA
Low
1
Low
MSB
23
Low
2
22
3
21
4
20
5
19
6
18
7
17
8
16
9
15
10
14
11
13
12
12
13
11
I-DAC
(10 bits: 0111111111)
14
10
15
9
16
8
17
7
18
6
Q-DAC
(10 bits: 0111111111)
19
5
20
4
21
3
22
2
23
1
Freq. Range Gain
(MTV: 00)
(0)
24
LSB
0
Spare
(0)
(This command sets QHx220 into minimum gain (Note 8))
Power OFF
Power OFF
VDDA & VDDA2
1.8V
Slope2: >1.8V/50ms
0V
ENBAR
Low
BUS ENABLE
Low
CLK
Low
DATA
Low
NOTES:
8. When the chip is powered up its register are all zero. This means -135° phase and full analog gain, WLAN Application and 0dB
coarse gain (the boost gain mode is not enabled).
9. VDDA and VDDA2 should be connected on the PCB and decoupled with caps right next to the pin.
10. The SPI Bus is not accessible when VDDA/VDDA2 are <1V.
6
FN6986.0
October 20, 2009
QHx220
Electrical Specifications
PARAMETER
Typical test conditions (TTC) VDD = 1.8V, TA = +25°C, and PIN < -48 dBm, unless otherwise
noted. Extreme Characterization Conditions (ECC) are VDD = 1.7V to 1.9V, TA = -40°C to
+85°C. Output load test condition is 50 in parallel with 50 unless otherwise stated.
Electrical specifications reflect performance of QFN packaged devices.
CONDITION
Frequency Coverage
MIN
TYP
0.3
Max. Gain (high gain mode)
UHF-Band 450MHz/770MHz
L-Band 1575MHz
UHF-Band 450MHz/770MHz
L-Band 1575MHz
UHF-Band 450MHz/770MHz
L-Band 1575MHz
NOTES
3
GHz
11
14.9/8.0
18/11.8
dB
12
7.3
12.0
16.3
dB
12
dB
12
2.0
-7.2/-15.4
2.8/-4.1
7.3/1.4
dB
12
-5.4
0.9
4.9
dB
12
dB
12
ISM Band 2400MHz
Max. Gain (Boost gain mode)
UNITS
8.4/-3
ISM Band 2400MHz
Max. Gain (low gain mode)
MAX
-9.1
17.1/9.2
20.1/12.2
23.1/15.2
dB
12
14.7
17.7
20.7
dB
12
7.64
dB
12
50
dB
ISM Band 2400MHz
Max Dynamic Range
27.4
Phase Control Range
0
360
°
UHF-Band 450MHz/770MHz
-2.5
1.5
dB
13, 18
L-Band 1575MHz
-2.5
1.5
dB
13, 18
dB
13, 18
-34.7/-24.7
dBm
18
-31.3
dBm
18
-20.75
dBm
18
-33.4/-25.1
dBm
18
-31.5
dBm
18
-23
dBm
18
-42.8/-31.0
dBm
18
-36.98
dBm
18
-24
dBm
18
-158.8/-164.1
dBm/Hz
14, 18
L-Band 1575MHz
-161.7
dBm/Hz
14, 18
ISM Band 2400MHz
-168.7
dBm/Hz
14, 18
-168.6/-171.6
dBm/Hz
14, 18
L-Band 1575MHz
-169.8
dBm/Hz
14, 18
ISM Band 2400MHz
-173.1
dBm/Hz
14, 18
-153.9/-160.5
dBm/Hz
14, 18
L-Band 1575MHz
-156.1
dBm/Hz
14, 18
ISM Band 2400MHz
-164.7
dBm/Hz
14, 18
UHF-Band 450MHz/770MHz
1.5
dBm
15, 18
L-Band 1575MHz
1.5
dBm
15, 18
ISM Band 2400MHz
2.0
dBm
15, 18
Absolute Gain Accuracy over
ECC
ISM Band 2400MHz
IIP3 of Sampler Input
(high gain mode)
UHF-Band 450MHz/770MHz
L-Band 1575MHz
-34.8
ISM Band 2400MHz
IIP3 of Sampler Input
(low gain mode)
UHF-Band 450MHz/770MHz
L-Band 1575MHz
-35.1
ISM Band 2400MHz
IIP3 of Sampler Input
(Boost high gain mode)
UHF-Band 450MHz/770MHz -46.3/-34.5
L-Band 1575MHz
ISM Band 2400MHz
Output Noise Power
(high gain mode)
UHF-Band 450MHz/770MHz
Output Noise Power
(low gain mode)
UHF-Band 450MHz/770MHz
Output Noise Power
(Boost high gain mode)
UHF-Band 450MHz/770MHz
LNA Noise Figure (high gain
mode)
7
-40.48
FN6986.0
October 20, 2009
QHx220
Electrical Specifications
PARAMETER
Typical test conditions (TTC) VDD = 1.8V, TA = +25°C, and PIN < -48 dBm, unless otherwise
noted. Extreme Characterization Conditions (ECC) are VDD = 1.7V to 1.9V, TA = -40°C to
+85°C. Output load test condition is 50 in parallel with 50 unless otherwise stated.
Electrical specifications reflect performance of QFN packaged devices. (Continued)
CONDITION
Input Reflection Coefficient
(high gain)
MIN
UNITS
NOTES
-1.0/-2.6
dBm
15, 18
-0.06
dBm
15, 18
-2.3
dBm
15, 18
-1.3/-2.5
dB
16, 18
L-Band 1575MHz
-0.3
dB
16, 18
ISM Band 2400MHz
-2.1
dB
16, 18
-1.0/-2.7
dB
16, 18
L-Band 1575MHz
2.4
dB
16, 18
ISM Band 2400MHz
-1.0
dB
16, 18
Rp = 6.9/4.6,
Cp = 620/616
k, fF
17, 18
L-Band 1575MHz
Rp = 2.2, Cp = 619
k, fF
17, 18
ISM Band 2400MHz
Rp = 1.0, Cp = 680
k, fF
17, 18
UHF-Band 450MHz/770MHz
0.1
dB
18
L-Band 1575MHz
0.3
dB
18
ISM Band 2400MHz
0.7
dB
18
UHF-Band 450MHz/770MHz
L-Band 1575MHz
TYP
ISM Band 2400MHz
Input Reflection Coefficient
(low gain)
UHF-Band 450MHz/770MHz
Input Reflection Coefficient
(Boost high gain)
UHF-Band 450MHz/770MHz
RF Output Impedance (Rp//Cp) UHF-Band 450MHz/770MHz
Output Insertion Loss
MAX
NOTES:
11. Part will operate under the specified frequency ranges. Electrical performance is not optimal beyond the UHF-Band (low end)
and ISM Band (high end).
12. Data provided for external tank circuit with Q2 and fcenter550MHz.
13. Extreme corner conditions (ECC) are VDD = 1.7V to 1.9V, TA = -40°C to +85°C.
14. Input connected to a 50 load during measurement.
15. NF improves beyond high gain when going into boost gain. Values not tested on ATE.
16. S11 based upon single series inductor matching.
17. Rp//Cp given at typical gain point of canceller.
18. Limits established by characterization and not production tested.
8
FN6986.0
October 20, 2009
QHx220
Typical Performance Characteristics (UHF-Band)
ATTENUATION @750MHz
Plots are exemplary only, to show typical performance and provide a frame of reference. Typical test conditions (TTC)
VDD = 1.8V, TA = +25°C, and PIN < -48dBm, unless otherwise noted. Extreme Characterization Conditions (ECC) are
VDD = 1.7V to 1.9V, TA = -40°C to +85°C.
VCTRLb
VCTRLa
FIGURE 3. 3D ATTENUATION PLOT FOR GAIN AND
PHASE FAMILY OF CURVES
FIGURE 4. 2D CONTOUR PLOT FOR GAIN AND PHASE
FAMILY OF CURVES IN HIGH BOOST MODE
(RED CIRCLE = UNITY GAIN)
GAIN vs TEMPERATURE AT 770MHz
Vctrl_a = Vctrl_b = 0V
10
8
HG VDD = 1.9V
6
HG VDD = 1.8V
GAIN (dB)
4
HG VDD = 1.7V
2
0
LG VDD = 1.8V
-2
LG VDD = 1.9V
-4
-6
-8
FIGURE 5. GAIN vs FREQUENCY AT LOW, MID, HIGH,
AND BOOST GAIN SET POINTS
9
LG VDD = 1.7V
-40
-5
25
55
TEMPERATURE (°C)
85
FIGURE 6. GAIN VARIATION UNDER ECC MEASURED
AT 770MHz AT MAX GAIN SET-POINT
FN6986.0
October 20, 2009
QHx220
Typical Performance Characteristics (UHF-Band) (Continued)
Plots are exemplary only, to show typical performance and provide a frame of reference. Typical test conditions (TTC)
VDD = 1.8V, TA = +25°C, and PIN < -48dBm, unless otherwise noted. Extreme Characterization Conditions (ECC) are
VDD = 1.7V to 1.9V, TA = -40°C to +85°C.
PHASE vs TEMPERATURE AT 770MHz
Vctrl_a = Vctrl_b = 0V
222
-20
HG VDD = 1.8V
HG VDD = 1.9V
214
HG VDD = 1.7V
212
LG VDD = 1.7V
210
LG VDD = 1.9V
208
-24
HG VDD = 1.7V
HG VDD = 1.9V
-26
-28
LG VDD = 1.7V
LG VDD = 1.8V
LG VDD = 1.9V
-30
206
204
HG VDD = 1.8V
-22
IIP3 (dBm)
PHASE (°)
218
216
-18
LG VDD = 1.8V
220
IIP3 vs TEMPERATURE at 770MHz
Vctrl_a = Vctrl_b = 0V
-40
-5
25
55
85
TEMPERATURE (°C)
FIGURE 7. PHASE VARIATION UNDER ECC MEASURED
AT 770MHz AT MAX GAIN SET-POINT
FIGURE 9. PHASE COVERAGE FOR GAIN AND PHASE
FAMILY OF CURVES
10
-32
-40
-5
25
85
55
TEMPERATURE (°C)
FIGURE 8. IIP3 VARIATION UNDER ECC MEASURED AT
770MHz AT MAX GAIN SET-POINT
FIGURE 10. NOISE FLOOR FOR GAIN AND PHASE
FAMILY OF CURVES vs FREQUENCY
FN6986.0
October 20, 2009
QHx220
Typical Performance Characteristics (UHF-Band) (Continued)
Plots are exemplary only, to show typical performance and provide a frame of reference. Typical test conditions (TTC)
VDD = 1.8V, TA = +25°C, and PIN < -48dBm, unless otherwise noted. Extreme Characterization Conditions (ECC) are
VDD = 1.7V to 1.9V, TA = -40°C to +85°C.
1.2
Control A (V)
1.40
1.00
0.65
0.70
0.40
0.7
0.0
-157--155
-159--157
-161--159
-163--161
-165--163
-167--165
-169--167
-171--169
-173--171
-175--173
-177--175
Control B (V)
SUPPLY CURRENT vs TEMPERATURE AT 770MHz
11.0
HG VDD = 1.9V
10.5
HG VDD = 1.7V
1.0
9.5
IDD (mA)
-155
-157
-159
-161
-163
-165
-167
-169
-171
-173
-175
-177
0.00
Average Noise Power
(dBm/Hz)
MTV Noise Plot
9.0
HG VDD = 1.8V
LG VDD = 1.7V
8.5
8.0
LG VDD = 1.9V
7.5
7.0
LG VDD = 1.8V
6.5
6.0
-40
-5
25
85
55
TEMPERATURE (°C)
FIGURE 11. 3D NOISE FLOOR PLOT FOR GAIN AND
PHASE FAMILY OF CURVES @ 750MHz
FIGURE 12. SUPPLY CURRENT VARIATION UNDER ECC
Typical Performance Characteristics (L-Band)
ATTENUATION @750MHz
Plots are exemplary only, to show typical performance and provide a frame of reference. Typical test conditions (TTC)
VDD = 1.8V, TA = +25°C, and PIN < -48dBm, unless otherwise noted. Extreme Characterization Conditions (ECC) are
VDD = 1.7V to 1.9V, TA = -40°C to +85°C.
VCTRLb
VCTRLa
FIGURE 13. 3D CONTOUR PLOT FOR GAIN AND PHASE
FAMILY OF CURVES IN HIGH GAIN MODE
11
FIGURE 14. 2D CONTOUR PLOT FOR GAIN AND PHASE
FAMILY OF CURVES IN HIGH BOOST MODE
(RED CIRCLE = UNITY GAIN)
FN6986.0
October 20, 2009
QHx220
Typical Performance Characteristics (L-Band) (Continued)
Plots are exemplary only, to show typical performance and provide a frame of reference. Typical test conditions (TTC)
VDD = 1.8V, TA = +25°C, and PIN < -48dBm, unless otherwise noted. Extreme Characterization Conditions (ECC) are
VDD = 1.7V to 1.9V, TA = -40°C to +85°C.
GAIN VS TEMPERATURE AT 1575MHZ
Vctrl_a = Vctrl_b = 0V
14
HG VDD = 1.9V
12
GAIN (dB)
10
HG VDD = 1.7V
HG VDD = 1.8V
8
6
4
LG VDD = 1.8V
2
LG VDD = 1.9V
0
-2
LG VDD = 1.7V
-40
-5
25
55
85
TEMPERATURE (°C)
FIGURE 15. GAIN vs FREQUENCY AT LOW, MID, HIGH,
AND BOOST GAIN SET POINTS
230
FIGURE 16. GAIN VARIATION UNDER ECC MEASURED
AT 1575MHz AT LOW GAIN AND HIGH GAIN
SET-POINTS
PHASE vs TEMPERATURE AT 1575MHz
Vctrl_a = Vctrl_b = 0V
IIP3 vs TEMPERATURE AT 1575MHz
Vctrl_a = Vctrl_b = 0V
-26
LG VDD = 1.8V
225
220
LG VDD = 1.9V
HG VDD = 1.7V
215
HG VDD = 1.9V
HG VDD = 1.8V
210
-40
-5
25
-30
LG VDD = 1.7V
LG VDD = 1.8V
-32
LG VDD = 1.9V
HG VDD = 1.8V
-34
HG VDD = 1.9V
-36
-38
55
85
TEMPERATURE (°C)
FIGURE 17. PHASE VARIATION UNDER ECC MEASURED
AT 1575MHz AT LOW GAIN AND HIGH GAIN
SET-POINTS
12
IIP3 (dBm)
PHASE (°)
LG VDD = 1.7V
205
HG VDD = 1.7V
-28
-40
-40
-5
25
55
85
TEMPERATURE (°C)
FIGURE 18. IIP3 VARIATION UNDER ECC MEASURED
AT 1575MHz AT LOW GAIN AND HIGH GAIN
SET-POINTS
FN6986.0
October 20, 2009
QHx220
Typical Performance Characteristics (L-Band) (Continued)
Plots are exemplary only, to show typical performance and provide a frame of reference. Typical test conditions (TTC)
VDD = 1.8V, TA = +25°C, and PIN < -48dBm, unless otherwise noted. Extreme Characterization Conditions (ECC) are
VDD = 1.7V to 1.9V, TA = -40°C to +85°C.
FIGURE 19. PHASE COVERAGE FOR GAIN AND PHASE
FAMILY OF CURVES vs FREQUENCY
SUPPLY CURRENT vs TEMPERATURE AT 1575MHz
1.2
1.40
1.00
Control A (V)
0.65
0.70
0.40
0.7
0.00
0.0
-157--155
-159--157
-161--159
-163--161
-165--163
-167--165
-169--167
-171--169
-173--171
-175--173
-177--175
Control B (V)
FIGURE 21. 3D NOISE FLOOR PLOT FOR GAIN AND
PHASE FAMILY OF CURVES @ 1575MHz
13
11.0
10.5
HG VDD = 1.7V
10.0
9.5
IDD (mA)
Average Noise Power
(dBm/Hz)
GPS Noise Plot
-155
-157
-159
-161
-163
-165
-167
-169
-171
-173
-175
-177
FIGURE 20. NOISE FLOOR FOR GAIN AND PHASE
FAMILY OF CURVES vs FREQUENCY
HG VDD = 1.8V
HG VDD = 1.9V
9.0
LG VDD = 1.9V
8.5
8.0
LG VDD = 1.7V
7.5
7.0
LG VDD = 1.8V
6.5
6.0
-40
-5
25
55
85
TEMPERATURE (°C)
FIGURE 22. SUPPLY CURRENT VARIATION UNDER ECC
FN6986.0
October 20, 2009
QHx220
Typical Performance Characteristics (ISM Band)
ATTENUATION @750MHz
Plots are exemplary only, to show typical performance and provide a frame of reference. Typical test conditions (TTC)
VDD = 1.8V, TA = +25°C, and PIN < -48dBm, unless otherwise noted. Extreme Characterization Conditions (ECC) are
VDD = 1.7V to 1.9V, TA = -40°C to +85°C.
VCTRLb
VCTRLa
FIGURE 23. 3D ATTENUATION PLOT FOR GAIN AND
PHASE FAMILY OF CURVES vs FREQUENCY
FIGURE 24. 2D CONTOUR PLOT FOR GAIN AND PHASE
FAMILY OF CURVES IN BOOST MODE
(RED CIRCLE = UNITY GAIN)
FIGURE 25. GAIN vs FREQUENCY AT LOW, MID, HIGH, AND BOOST GAIN SET POINTS
14
FN6986.0
October 20, 2009
QHx220
Typical Performance Characteristics (ISM Band) (Continued)
Plots are exemplary only, to show typical performance and provide a frame of reference. Typical test conditions (TTC)
VDD = 1.8V, TA = +25°C, and PIN < -48dBm, unless otherwise noted. Extreme Characterization Conditions (ECC) are
VDD = 1.7V to 1.9V, TA = -40°C to +85°C.
FIGURE 26. PHASE COVERAGE FOR GAIN AND PHASE
FAMILY OF CURVES
FIGURE 27. NOISE FLOOR FOR GAIN AND PHASE
FAMILY OF CURVES vs FREQUENCY
-155
-157
-159
-161
-163
-165
-167
-169
-171
-173
-175
-177
-179
1.2
-157--155
-159--157
-161--159
-163--161
-165--163
-167--165
-169--167
-171--169
-173--171
-175--173
-177--175
-179--177
Control B (V)
0.0
1.40
1.00
Control A (V)
0.65
0.70
0.40
0.7
0.00
Average Noise Power
(dBm/Hz)
WLAN Noise Plot
FIGURE 28. 3D NOISE FLOOR PLOT FOR GAIN AND PHASE FAMILY OF CURVES @ 2.4GHz
15
FN6986.0
October 20, 2009
QHx220
FIGURE 29. BLOCK DIAGRAM
Operation
The architecture of the QHx220 is similar to that of a
linear vector modulator. A SPI bus interface is used to
control the internal 10-bit DACs, which in turn control
the VGAs in the RF-path. The VGA settings sett the I
and Q of a vector modulator and provide full control
over the magnitude and phase of the output
cancellation signal. The SPI interface is also used to
control internal LNA gain stages at the sampler input,
which can provide additional gain when sampling
weaker noise sources. The QHx220 allows for a full
360° phase control and up to 50 dB of dynamic range
of the input RF signal. This tuning range is used to
emulate the RF noise coupling channel that is present
between the noise source and victim receiver. The
noise coupling channel can be radiated from the noise
source to the victim receive antenna or via some other
leakage path to the receiver - most often it is a
combination of the two.
FIGURE 30. POLAR PLOT
Figure 30 illustrates the gain and phase control
provided by the vector modulator. The coverage map is
represented in polar form.
In practice it is not possible to reach origin at the
minimum gain setting, which represents a gain of zero.
This is due to the isolation limitations that exist in any
device. Thus it is not possible to completely eliminate
that signal in the forward path, resulting in minimum
gain levels in the order of -45dBm or -55dBm.
16
FN6986.0
October 20, 2009
QHx220
Evaluation Board
General purpose evaluations boards are available for
the QHx220 devices. They allow for basic functional
testing of the IC. However, more importantly they are
designed to be easily integrated into customer
applications as an RF daughter card for initial proof of
concept. The QHx220 has internal pre-amplification
GND
gain stages that can be used to amplify the sampled
noise signal if additional gain is required to emulate
the noise coupling channel. There are also internal
DACs to control the amplitude and phase (I and Q) of
the device. A software control GUI is provided to
enable control of the device.
1.8V INPUT
LED
Rx INPUT
(FROM ANTENNA)
NOISE
SAMPLER
INPUT
Rx OUTPUT
(TO RECEIVER)
QHx220
SPI INTERFACE
FIGURE 31. EVALUATION BOARD
17
FN6986.0
October 20, 2009
QHx220
Software GUI
A software interface is provided to facilitate the control
of the evaluation board. The GUI can be used to
control of the internal gain stages and DACs via a SPI
bus interface. These two control signals are also
referenced to as “I” (in phase”) and “Q” (quadrature
phase) control in the user interface. The QHx220
controller software is an application that uses the USB
port of a PC to emulate the SPI bus communications to
device. The initial user interface will look like the
following:
The left tab within the window allows the user to
directly set or sweep the I and Q values that control
the QHx220. The right tab allows the user to control
the Phase & Amplitude (which is simply a
mathematical conversion of the I and Q values).
Similarly to the I and Q panel, the Phase & Amplitude
panel can be used to set or sweep the amplitude and
phase of the QHx220 and is often a more intuitive
approach to performing the optimization. In both cases
a small window appears in the bottom right corner to
illustrate the alternate I & Q or Phase and Amplitude
representation.
About Q:ACTIVE
Q:ACTIVE Technology is behind Intersil’s ability to
insert its ICs inside radios, automotive infotainment
systems, satellite broadcast equipment, and various
consumer electronic devices such as GPS units, cell
phones, and portable gaming systems. By doing so,
Intersil achieves the ability to reduce electromagnetic
interference by as much as 30dB. This breakthrough in
radio sensitivity allows for several signals to run
simultaneously and enables new technologies such as
mobile TV on hand held games, cell phones, and in
automotive systems.
FIGURE 32. SOFTWARE GUI
For additional products, see www.intersil.com/product_tree
Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted
in the quality certifications found at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications
at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by
Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any
infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any
patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
18
FN6986.0
October 20, 2009
QHx220
Package Outline Drawing
L16.3x3B
16 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
Rev 1, 4/07
4X 1.5
3.00
12X 0.50
A
B
6
PIN 1
INDEX AREA
6
PIN #1 INDEX AREA
16
13
12
3.00
1
1 .70
4
9
(4X)
+ 0.10
- 0.15
0.15
5
8
0.10 M C A B
+ 0.07
TOP VIEW
4 16X 0.23 - 0.05
16X 0.40 ± 0.10
BOTTOM VIEW
SEE DETAIL "X"
0.10 C
0 . 90 ± 0.1
C
BASE PLANE
SEATING PLANE
0.08 C
( 2. 80 TYP )
(
SIDE VIEW
1. 70 )
( 12X 0 . 5 )
( 16X 0 . 23 )
C
0 . 2 REF
5
0 . 00 MIN.
0 . 05 MAX.
( 16X 0 . 60)
TYPICAL RECOMMENDED LAND PATTERN
DETAIL "X"
NOTES:
1. Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
3. Unless otherwise specified, tolerance : Decimal ± 0.05
4. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
5. Tiebar shown (if present) is a non-functional feature.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
19
FN6986.0
October 20, 2009