74AHC1G07-Q100;
74AHCT1G07-Q100
Buffer with open-drain output
Rev. 2 — 18 November 2014
Product data sheet
1. General description
74AHC1G07-Q100 and 74AHCT1G07-Q100 are high-speed Si-gate CMOS devices.
They provide a non-inverting buffer.
The output of these devices is open-drain and can be connected to other open-drain
outputs to implement active-LOW wired-OR or active-HIGH wired-AND functions. For
digital operation, this device must have a pull-up resistor to establish a logic HIGH-level.
The AHC device has CMOS input switching levels and supply voltage range 2 V to 5.5 V.
The AHCT device has TTL input switching levels and supply voltage range 4.5 V to 5.5 V.
This product has been qualified to the Automotive Electronics Council (AEC) standard
Q100 (Grade 1) and is suitable for use in automotive applications.
2. Features and benefits
Automotive product qualification in accordance with AEC-Q100 (Grade 1)
Specified from 40 C to +85 C and from 40 C to +125 C
High noise immunity
Low power dissipation
SOT353-1 and SOT753 package options
ESD protection:
MIL-STD-883, method 3015 exceeds 2000 V
HBM JESD22-A114F exceeds 2000 V
MM JESD22-A115-A exceeds 200 V (C = 200 pF, R = 0 )
3. Ordering information
Table 1.
Ordering information
Type number
74AHC1G07GW-Q100
Package
Temperature range
Name
40 C to +125 C
TSSOP5 plastic thin shrink small outline package;
5 leads; body width 1.25 mm
SOT353-1
40 C to +125 C
SC-74A
SOT753
74AHCT1G07GW-Q100
74AHC1G07GV-Q100
74AHCT1G07GV-Q100
Description
plastic surface-mounted package; 5 leads
Version
74AHC1G07-Q100; 74AHCT1G07-Q100
NXP Semiconductors
Buffer with open-drain output
4. Marking
Table 2.
Marking codes
Type number
Marking[1]
74AHC1G07GW-Q100
AS
74AHCT1G07GW-Q100
A07
74AHC1G07GV-Q100
CS
74AHCT1G07GV-Q100
C07
[1]
The pin 1 indicator is located on the lower left corner of the device, below the marking code.
5. Functional diagram
<
$
<
$
Logic symbol
$
*1'
PQD
PQD
Fig 1.
<
Fig 2.
IEC logic symbol
Fig 3.
PQD
Logic diagram
6. Pinning information
6.1 Pinning
$+&*4
$+&7*4
QF
$
*1'
9&&
<
DDD
Fig 4.
Pin configuration
6.2 Pin description
Table 3.
Pin description
Symbol
Pin
Description
n.c.
1
not connected
A
2
data input
GND
3
ground (0 V)
Y
4
data output
VCC
5
supply voltage
74AHC_AHCT1G07_Q100
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 18 November 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
2 of 12
NXP Semiconductors
74AHC1G07-Q100; 74AHCT1G07-Q100
Buffer with open-drain output
7. Functional description
Table 4.
Function table
H = HIGH voltage level; L = LOW voltage level; Z = high-impedance OFF-state
Input
Output
A
Y
L
L
H
Z
8. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
VCC
supply voltage
VI
input voltage
IIK
input clamping current
VI < 0.5 V
IOK
output clamping current
VO < 0.5 V
IO
output current
VO > 0.5 V
output voltage
VO
Conditions
[1]
Min
Max
Unit
0.5
+7.0
V
0.5
+7.0
V
20
-
mA
-
20
mA
-
25
mA
active mode
[1]
0.5
+7.0
V
high-impedance mode
[1]
0.5
+7.0
V
ICC
supply current
-
75
mA
IGND
ground current
75
-
mA
Tstg
storage temperature
65
+150
C
Ptot
total power dissipation
-
250
mW
Tamb = 40 C to +125 C
[2]
[1]
The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
[2]
For both TSSOP5 and SC-74A packages: above 87.5 C the value of Ptot derates linearly with 4.0 mW/K.
9. Recommended operating conditions
Table 6.
Recommended operating conditions
Voltages are referenced to GND (ground = 0 V).
Symbol Parameter
VCC
supply voltage
VI
input voltage
VO
output voltage
Tamb
ambient temperature
t/V
input transition rise
and fall rate
74AHC_AHCT1G07_Q100
Product data sheet
Conditions
74AHC1G07-Q100
74AHCT1G07-Q100
Unit
Min
Typ
Max
Min
Typ
Max
2.0
5.0
5.5
4.5
5.0
5.5
V
0
-
5.5
0
-
5.5
V
active mode
0
-
VCC
0
-
VCC
V
high-impedance mode
0
-
6.0
0
-
6.0
V
40
+25
+125
40
+25
+125
C
VCC = 3.3 V 0.3 V
-
-
100
-
-
-
ns/V
VCC = 5.0 V 0.5 V
-
-
20
-
-
20
ns/V
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 18 November 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
3 of 12
NXP Semiconductors
74AHC1G07-Q100; 74AHCT1G07-Q100
Buffer with open-drain output
10. Static characteristics
Table 7.
Static characteristics
Voltages are referenced to GND (ground = 0 V).
Symbol Parameter
25 C
Conditions
40 C to +85 C 40 C to +125 C Unit
Min
Typ
Max
Min
Max
Min
Max
VCC = 2.0 V
1.5
-
-
1.5
-
1.5
-
V
VCC = 3.0 V
2.1
-
-
2.1
-
2.1
-
V
VCC = 5.5 V
3.85
-
-
3.85
-
3.85
-
V
For type 74AHC1G07-Q100
VIH
VIL
VOL
HIGH-level
input voltage
LOW-level
input voltage
VCC = 2.0 V
-
-
0.5
-
0.5
-
0.5
V
VCC = 3.0 V
-
-
0.9
-
0.9
-
0.9
V
VCC = 5.5 V
-
-
1.65
-
1.65
-
1.65
V
LOW-level
VI = VIH or VIL
output voltage
IO = 50 A; VCC = 2.0 V
-
0
0.1
-
0.1
-
0.1
V
IO = 50 A; VCC = 3.0 V
-
0
0.1
-
0.1
-
0.1
V
IO = 50 A; VCC = 4.5 V
-
0
0.1
-
0.1
-
0.1
V
IO = 4.0 mA; VCC = 3.0 V
-
-
0.36
-
0.44
-
0.55
V
IO = 8.0 mA; VCC = 4.5 V
-
-
0.36
-
0.44
-
0.55
V
-
-
0.1
-
1.0
-
2.0
A
10.0
A
II
input leakage
current
VI = 5.5 V or GND;
VCC = 0 V to 5.5 V
IOZ
OFF-state
VI = VIH or VIL; VO = VCC or
output current GND; VCC = 5.5 V
-
-
0.25
ICC
supply current VI = VCC or GND; IO = 0 A;
VCC = 5.5 V
-
-
1.0
-
10
-
20
A
CI
input
capacitance
-
1.5
10
-
10
-
10
pF
2.5
For type 74AHCT1G07-Q100
VIH
HIGH-level
input voltage
VCC = 4.5 V to 5.5 V
2.0
-
-
2.0
-
2.0
-
V
VIL
LOW-level
input voltage
VCC = 4.5 V to 5.5 V
-
-
0.8
-
0.8
-
0.8
V
VOL
LOW-level
VI = VIH or VIL; VCC = 4.5 V
output voltage
IO = 50 A
-
0
0.1
-
0.1
-
0.1
V
IO = 8.0 mA
-
-
0.36
-
0.44
-
0.55
V
-
-
0.1
-
1.0
-
2.0
A
OFF-state
VI = VIH or VIL; VO = VCC or
output current GND; VCC = 5.5 V
-
-
0.25
10.0
A
ICC
supply current VI = VCC or GND; IO = 0 A;
VCC = 5.5 V
-
-
1.0
-
10
-
20
A
ICC
additional
per input pin; VI = 3.4 V;
supply current other inputs at VCC or GND;
IO = 0 A; VCC = 5.5 V
-
-
1.35
-
1.5
-
1.5
mA
CI
input
capacitance
-
1.5
10
-
10
-
10
pF
II
input leakage
current
IOZ
74AHC_AHCT1G07_Q100
Product data sheet
VI = 5.5 V or GND;
VCC = 0 V to 5.5 V
2.5
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 18 November 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
4 of 12
NXP Semiconductors
74AHC1G07-Q100; 74AHCT1G07-Q100
Buffer with open-drain output
11. Dynamic characteristics
Table 8.
Dynamic characteristics
GND = 0 V; tr = tf = 3.0 ns. For test circuit, see Figure 6.
Symbol
Parameter
25 C
Conditions
40 C to +85 C 40 C to +125 C Unit
Min
Typ
Max
Min
Max
Min
Max
-
3.5
5.6
1.0
6.3
1.0
7.0
ns
-
5.0
8.0
1.0
9.0
1.0
10.0
ns
CL = 15 pF
-
2.5
3.9
1.0
4.6
1.0
4.9
ns
CL = 50 pF
-
3.6
5.5
1.0
6.5
1.0
7.0
ns
-
5.8
7.9
1.0
8.4
1.0
8.9
ns
-
8.3
11.5
1.0
12.0
1.0
12.5
ns
-
4.2
5.1
1.0
5.6
1.0
6.1
ns
-
6.0
7.5
1.0
8.0
1.0
8.5
ns
-
5
-
-
-
-
-
pF
CL = 15 pF
-
2.8
4.6
1.0
5.3
1.0
5.6
ns
CL = 50 pF
-
4.0
6.5
1.0
7.5
1.0
8.0
ns
-
3.9
5.6
1.0
6.1
1.0
6.6
ns
-
5.5
8.0
1.0
8.5
1.0
9.0
ns
-
6.5
-
-
-
-
-
pF
For type 74AHC1G07-Q100
tPZL
OFF-state
to LOW
propagation
delay
A to Y; see Figure 5
VCC = 3.0 V to 3.6 V
[1]
CL = 15 pF
CL = 50 pF
VCC = 4.5 V to 5.5 V
tPLZ
LOW to
OFF-state
propagation
delay
[2]
A to Y; see Figure 5
VCC = 3.0 V to 3.6 V
[1]
CL = 15 pF
CL = 50 pF
VCC = 4.5 V to 5.5 V
[2]
CL = 15 pF
CL = 50 pF
CPD
power
dissipation
capacitance
per buffer;
CL = 50 pF; f = 1 MHz;
VI = GND to VCC
[3]
For type 74AHCT1G07-Q100
tPZL
tPLZ
OFF-state
to LOW
propagation
delay
LOW to
OFF-state
propagation
delay
A to Y; see Figure 5
VCC = 4.5 V to 5.5 V
[2]
A to Y; see Figure 5
VCC = 4.5 V to 5.5 V
[2]
CL = 15 pF
CL = 50 pF
CPD
power
dissipation
capacitance
per buffer;
CL = 50 pF; f = 1 MHz;
VI = GND to VCC
[1]
Typical values are measured at VCC = 3.3 V.
[2]
Typical values are measured at VCC = 5.0 V.
[3]
[3]
CPD is used to determine the dynamic power dissipation PD (W).
PD = CPD VCC2 fi + (CL VCC2 fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
CL = output load capacitance in pF;
VCC = supply voltage in Volts
74AHC_AHCT1G07_Q100
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 18 November 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
5 of 12
74AHC1G07-Q100; 74AHCT1G07-Q100
NXP Semiconductors
Buffer with open-drain output
12. Waveforms
9,
90
$LQSXW
*1'
W 3=/
W 3/=
9&&
<RXWSXW
90
92/9
92/
PQD
Measurement points are given in Table 9.
Fig 5.
Table 9.
Input (A) to output (Y) propagation delays
Measurement point
Type
Input
Output
VI
VM(1)
VM(2)
74AHC1G07-Q100
GND to VCC
0.5 VCC
0.5 VCC
74AHCT1G07-Q100
GND to 3.0 V
1.5 V
0.5 VCC
6
9&&
38/6(
*(1(5$725
9,
5/ ȍ
92
9&&
RSHQ
*1'
'87
57
&/
PQD
Test data is given in Table 8. Definitions for test circuit:
CL = Load capacitance including jig and probe capacitance.
RT = Termination resistance should be equal to output impedance Zo of the pulse generator.
For tPLZ, tPZL, S1 = VCC
Fig 6.
Test circuit for measuring switching times
74AHC_AHCT1G07_Q100
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 18 November 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
6 of 12
74AHC1G07-Q100; 74AHCT1G07-Q100
NXP Semiconductors
Buffer with open-drain output
13. Package outline
76623SODVWLFWKLQVKULQNVPDOORXWOLQHSDFNDJHOHDGVERG\ZLGWKPP
(
'
627
$
;
F
\
+(
Y 0 $
=
$
$
$
$
ș
/S
H
/
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ES
GHWDLO;
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PP
VFDOH
',0(16,216PPDUHWKHRULJLQDOGLPHQVLRQV
81,7
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$
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ES
F
'
(
H
H
+(
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Y
Z
\
=
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1RWH
3ODVWLFRUPHWDOSURWUXVLRQVRIPPPD[LPXPSHUVLGHDUHQRWLQFOXGHG
287/,1(
9(56,21
627
Fig 7.
5()(5(1&(6
,(&
-('(&
-(,7$
02
6&$
(8523($1
352-(&7,21
,668('$7(
Package outline SOT353-1 (TSSOP5)
74AHC_AHCT1G07_Q100
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 18 November 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
7 of 12
NXP Semiconductors
74AHC1G07-Q100; 74AHCT1G07-Q100
Buffer with open-drain output
3ODVWLFVXUIDFHPRXQWHGSDFNDJHOHDGV
627
'
%
$
(
\
;
+(
Y 0 $
4
$
$
F
/S
GHWDLO;
ES
H
Z 0 %
PP
VFDOH
',0(16,216PPDUHWKHRULJLQDOGLPHQVLRQV
81,7
$
$
ES
F
'
(
H
+(
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4
Y
Z
\
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287/,1(
9(56,21
5()(5(1&(6
,(&
-('(&
-(,7$
6&$
627
Fig 8.
(8523($1
352-(&7,21
,668('$7(
Package outline SOT753 (SC-74A)
74AHC_AHCT1G07_Q100
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 18 November 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
8 of 12
NXP Semiconductors
74AHC1G07-Q100; 74AHCT1G07-Q100
Buffer with open-drain output
14. Abbreviations
Table 10.
Abbreviations
Acronym
Description
CDM
Charged Device Model
CMOS
Complementary Metal-Oxide Semiconductor
DUT
Device Under Test
ESD
ElectroStatic Discharge
HBM
Human Body Model
MIL
Military
MM
Machine Model
TTL
Transistor-Transistor Logic
15. Revision history
Table 11.
Revision history
Document ID
Release date
74AHC_AHCT1G07_Q100 v.2 20141118
Modifications:
•
Product data sheet
Change notice
Supersedes
Product data sheet
-
74AHC_AHCT1G07_Q100 v.1
-
-
Section 4: table note added.
74AHC_AHCT1G07_Q100 v.1 20141020
74AHC_AHCT1G07_Q100
Data sheet status
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 18 November 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
9 of 12
NXP Semiconductors
74AHC1G07-Q100; 74AHCT1G07-Q100
Buffer with open-drain output
16. Legal information
16.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
16.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
16.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
74AHC_AHCT1G07_Q100
Product data sheet
Suitability for use in automotive applications — This NXP
Semiconductors product has been qualified for use in automotive
applications. Unless otherwise agreed in writing, the product is not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer's own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 18 November 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
10 of 12
NXP Semiconductors
74AHC1G07-Q100; 74AHCT1G07-Q100
Buffer with open-drain output
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
17. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
74AHC_AHCT1G07_Q100
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 18 November 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
11 of 12
NXP Semiconductors
74AHC1G07-Q100; 74AHCT1G07-Q100
Buffer with open-drain output
18. Contents
1
2
3
4
5
6
6.1
6.2
7
8
9
10
11
12
13
14
15
16
16.1
16.2
16.3
16.4
17
18
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 1
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2
Functional description . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Recommended operating conditions. . . . . . . . 3
Static characteristics. . . . . . . . . . . . . . . . . . . . . 4
Dynamic characteristics . . . . . . . . . . . . . . . . . . 5
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 9
Legal information. . . . . . . . . . . . . . . . . . . . . . . 10
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Contact information. . . . . . . . . . . . . . . . . . . . . 11
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP Semiconductors N.V. 2014.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 18 November 2014
Document identifier: 74AHC_AHCT1G07_Q100