Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
L68.10x10D
68 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (PUNCH QFN WITH WETTABLE FLANK)
Rev 0, 03/14
0.10 M C A B
5.2
0.10 C A (2x)
0.60 MAX (4x)
10.00
A
PIN 1 ID
R0.20
9.75
68
0.10 C B (2x)
1
2
3
5
68
0.80 DIA.
0.45
1
2
3
0.60 MAX (4x)
0.10 M C B A
10.00
5.2
9.75
(1.85)
CO
0.10 C B
(2x)
0.10 C A
(2x)
0.55 ±
0.10
TERMINAL TIP 4
(1.85)
B
TOP VIEW
0.50
0.25±0.05
0.10 M C A B
0.05 M C
BOTTOM VIEW
64x 0.50
0.10 C
0.08 C
6
0.85 ± 0.05
0.01 +0.04
-0.01
0.65 ± 0.05
(0.01)
5.20 SQ
(0.20)
9.65 SQ
68x 0.25
SECTION “C-C”
SCALE: NONE 4
SEE DETAIL “A”
0.15
68x 0.75
0.09
TYPICAL RECOMMENDED LAND PATTERN
DETAIL “A”
SCALE: NONE
NOTES:
1.
Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
Die thickness allowable is 0.305mm. Maximum 0.012 inches.
2.
Dimensioning and tolerancing conform to AMSE Y14.5-2009.
3.
Unless otherwise specified, tolerance: Decimal ± 0.05.
4.
Dimension applies to plated terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
5.
The Pin #1 identifier must be existed on the top surface of
the package by using indentation mark or other feature of
package body.
6.
Unilateral coplanarity zone applies to the exposed pad
as well as the terminals.
1
12° MAX
C
SIDE VIEW
SEATING PLANE
4