TLD2314EL Data Sheet

I n f i n e o n ® L I T I X TM B a s i c
TLD2314EL
3 Channel High Side Current Source
Data Sheet
Rev. 1.1, 2015-03-24
Automotive
TLD2314EL
1
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3
3.1
3.2
Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Pin Assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Pin Definitions and Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
4
4.1
4.2
4.3
General Product Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Functional Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Thermal Resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5
5.1
DEN Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Electrical Characteristics Internal Supply / DEN Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
6
6.1
6.2
IN_SETx Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Output Current Adjustment via RSET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Smart Input Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
7
7.1
7.2
7.3
ST Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Diagnosis Selector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Diagnosis Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Disable Input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
16
16
16
16
8
8.1
8.2
8.3
8.4
Load Diagnosis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Open Load . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Short Circuit to GND detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Double Fault Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Electrical Characteristics IN_SET Pin and Load Diagnosis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
18
18
19
21
23
9
9.1
9.1.1
9.1.2
9.2
Power Stage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Over Load Behavior . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Reverse Battery Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Electrical Characteristics Power Stage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
25
25
25
25
26
10
10.1
Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Further Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
11
Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
12
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Data Sheet
2
8
8
9
9
Rev. 1.1, 2015-03-24
3 Channel High Side Current Source
LITIXTM Basic
1
TLD2314EL
Overview
Features
•
•
•
•
•
•
•
•
•
•
•
•
•
3 Channel device with integrated output stages (current sources),
optimized to drive LEDs
Output current up to 120mA per channel
Low current consumption
PWM-operation supported via VS-pin
Output current adjustable via external low power resistor and
possibility to connect PTC resistor for LED protection during over
temperature conditions
Reverse polarity protection
Overload protection
Undervoltage detection
Open load and short circuit to GND diagnosis
Wide temperature range: -40 °C < Tj < 150 °C
PG-SSOP14 package with exposed heatslug
Green Product (RoHS compliant)
AEC Qualified
PG-SSOP14
Description
The LITIXTM Basic TLD2314EL is a three channel high side driver IC with integrated output stages. It is designed
to control LEDs with a current up to 120 mA. In typical automotive applications the device is capable to drive i.e.
3 red LEDs per chain (total 9 LEDs) with a current up to 60mA, which is limited by thermal cooling aspects. The
output current is controlled practically independent of load and supply voltage changes.
Table 1
Product Summary
VS(nom)
5.5 V… 40 V
VS(max)
40 V
VOUTx(max)
IOUTx(nom) 60 mA when using a supply voltage range of 8V
Operating voltage
Maximum voltage
Nominal output (load) current
- 18V (e.g. Automotive car battery). Currents up
to IOUT(max) possible in applications with low
thermal resistance RthJA
Maximum output (load) current
Output current accuracy at RSETx = 12 kΩ
IOUTx(max)
kLT
120 mA; depending on thermal resistance RthJA
750 ± 7%
Type
Package
Marking
TLD2314EL
PG-SSOP14
TLD2314EL
Data Sheet
3
Rev. 1.1, 2015-03-24
TLD2314EL
Overview
Protective functions
- ESD protection
- Under voltage lock out
- Over Load protection
- Over Temperature protection
- Reverse Polarity protection
Diagnostic functions
- Diagnosis enable function
- OL detection
- SC to Vs (indicated by OL diagnosis)
- SC to GND detection
Applications
Designed for exterior LED lighting applications such as tail/brake light, turn indicator, position light, side marker,...
The device is also well suited for interior LED lighting applications such as ambient lighting (e.g. RGB), interior
illumination and dash board lighting.
Data Sheet
4
Rev. 1.1, 2015-03-24
TLD2314EL
Block Diagram
2
Block Diagram
VS
Internal
supply
DEN Diagnosis
enable
Output
control
Thermal
protection
OUT3
OUT2
OUT1
IN_SET3
IN_SET2 Current
IN_SET1 adjust
TLD2314EL
Figure 1
Data Sheet
Status
ST
GND
Basic Block Diagram
5
Rev. 1.1, 2015-03-24
TLD2314EL
Pin Configuration
3
Pin Configuration
3.1
Pin Assignment
Figure 2
Data Sheet
VS
1
VS
2
DEN
3
NC
4
IN_SET3
14
NC
13
OUT3
12
OUT2
11
OUT1
5
10
ST
IN_SET2
6
9
GND
IN_SET1
7
8
NC
TLD2314EL
EP
Pin Configuration
6
Rev. 1.1, 2015-03-24
TLD2314EL
Pin Configuration
3.2
Pin Definitions and Functions
Pin
Symbol
Input/
Output
Function
1, 2
VS
–
Supply Voltage; battery supply, connect a decoupling capacitor (100 nF 1 µF) to GND
3
DEN
I
Diagnosis enable pin
4
NC
–
Pin not connected
5
IN_SET3
I/O
Input / SET pin 3; Connect a low power resistor to adjust the output current
6
IN_SET2
I/O
Input / SET pin 2; Connect a low power resistor to adjust the output current
7
IN_SET1
I/O
Input / SET pin 1; Connect a low power resistor to adjust the output current
8
NC
–
Pin not connected
9
GND
–
1)
10
ST
I/O
Status pin
11
OUT1
O
Output 1
12
OUT2
O
Output 2
13
OUT3
O
Output 3
14
NC
–
Pin not connected
–
1)
Exposed
Pad
GND
Ground
Exposed Pad; connect to GND in application
1) Connect all GND-pins together.
Data Sheet
7
Rev. 1.1, 2015-03-24
TLD2314EL
General Product Characteristics
4
General Product Characteristics
4.1
Absolute Maximum Ratings
Absolute Maximum Ratings 1)
Tj = -40 °C to +150 °C; all voltages with respect to ground, positive current flowing into pin for input pins (I), positive
currents flowing out of the I/O and output pins (O) (unless otherwise specified)
Pos.
Parameter
Symbol
Limit Values
Unit
Conditions
Min.
Max.
-16
40
V
–
-16
40
V
–
VS - 40
VS + 16
V
–
-16
40
V
–
-1
40
V
–
-16
40
V
–
-0.3
6
V
–
-0.3
6
V
–
Voltages
4.1.1
4.1.2
4.1.3
4.1.4
4.1.5
4.1.6
4.1.7
4.1.8
VS
Diagnosis enable voltage DEN
VDEN
Diagn. enable voltage DEN related to VS VDEN(VS)
Diagn. enable voltage DEN related to
VDEN VOUTx
VOUTx
VDEN - VOUTx
VOUTx
Output voltage
Power stage voltage
VPS
VPS = VS - VOUTx
IN_SETx voltage
VIN_SETx
Status voltage
VST
Supply voltage
Currents
4.1.9
IN_SETx current
IIN_SETx
–
–
2
3
mA
–
Diagnosis output
4.1.10
Output current
IOUTx
–
130
mA
–
Tj
Tstg
-40
150
°C
–
-55
150
°C
–
Temperatures
4.1.11
Junction temperature
4.1.12
Storage temperature
ESD Susceptibility
4.1.13
ESD resistivity to GND
VESD
-2
2
kV
Human Body
Model (100 pF via
1.5 kΩ)2)
4.1.14
ESD resistivity all pins to GND
-500
500
V
CDM3)
4.1.15
ESD resistivity corner pins to GND
VESD
VESD
-750
750
V
CDM3)
1) Not subject to production test, specified by design
2) ESD susceptibility, Human Body Model “HBM” according to ANSI/ESDA/JEDEC JS-001-2011
3) ESD susceptibility, Charged Device Model “CDM” according to JESD22-C101E
Note: Stresses above the ones listed here may cause permanent damage to the device. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Note: Integrated protection functions are designed to prevent IC destruction under fault conditions described in the
data sheet. Fault conditions are considered as “outside” normal operating range. Protection functions are
not designed for continuous repetitive operation.
Data Sheet
8
Rev. 1.1, 2015-03-24
TLD2314EL
General Product Characteristics
4.2
Pos.
Functional Range
Parameter
Symbol
Limit Values
Min.
Max.
Unit
Conditions
4.2.16
Supply voltage range for
normal operation
VS(nom)
5.5
40
V
–
4.2.17
Power on reset threshold
VS(POR)
–
5
V
RSETx = 12 kΩ
IOUTx = 80% IOUTx(nom)
VOUTx = 2.5 V
4.2.18
Junction temperature
Tj
-40
150
°C
–
Note: Within the functional range the IC operates as described in the circuit description. The electrical
characteristics are specified within the conditions given in the related electrical characteristics table.
4.3
Pos.
Thermal Resistance
Parameter
4.3.1
Junction to Case
4.3.2
Junction to Ambient 1s0p board
Symbol
RthJC
RthJA1
Limit Values
Min.
Typ.
Max.
–
8
10
–
–
4.3.3
Junction to Ambient 2s2p board
61
56
Unit
Conditions
K/W
1) 2)
K/W
1) 3)
Ta = 85 °C
Ta = 135 °C
–
–
RthJA2
K/W
–
–
45
43
–
–
1) 4)
Ta = 85 °C
Ta = 135 °C
1) Not subject to production test, specified by design. Based on simulation results.
2) Specified RthJC value is simulated at natural convection on a cold plate setup (all pins and the exposed Pad are fixed to
ambient temperature). Ta = 85°C, Total power dissipation 1.5 W.
3) The RthJA values are according to Jedec JESD51-3 at natural convection on 1s0p FR4 board. The product (chip + package)
was simulated on a 76.2 x 114.3 x 1.5 mm3 board with 70µm Cu, 300 mm2 cooling area. Total power dissipation 1.5 W
distributed statically and homogenously over all power stages.
4) The RthJA values are according to Jedec JESD51-5,-7 at natural convection on 2s2p FR4 board. The product (chip +
package) was simulated on a 76.2 x 114.3 x 1.5 mm3 board with 2 inner copper layers (outside 2 x 70 µm Cu, inner 2 x
35µm Cu). Where applicable, a thermal via array under the exposed pad contacted the first inner copper layer. Total power
dissipation 1.5 W distributed statically and homogenously over all power stages.
Data Sheet
9
Rev. 1.1, 2015-03-24
TLD2314EL
DEN Pin
5
DEN Pin
The DEN pin is a single function pin:
DEN
Output Control
IDEN
Figure 3
VDEN
Block Diagram DEN pin
This pin is used to activate or deactivate the device internal diagnosis functions. The diagnostic functions are
described in Chapter 6.2, Chapter 7 and Chapter 8. The diagnosis is activated, if the voltage applied at the DEN
pin VDEN is higher than VDEN(act). The diagnosis is disabled for voltages below VDEN(dis).
A possibility to use the DEN pin is via a Zener diode, which is connected between VS and DEN pin. A circuit
example is shown in the application information section Chapter 10.
The diagnosis is activated, if the following condition is fulfilled:
V S ≥ VDEN ( act ) + VZD
(1)
The current consumption on the DEN pin has to be considered for the total device current consumption. The
current is specified in Pos. 5.1.9. The typical current consumption IDEN(H) as a function of the supply voltage VS for
a Zener diode voltage of VZD = 6 V is shown in the following diagram.
Typical IDEN=f(VS) with (VS-VDEN)=6V
160
140
120
IDEN [µA]
100
80
Tj=-40°C
Tj=25°C
60
Tj=150°C
40
20
0
0
2
4
6
8
10
12
14
16
18
VS [V]
Figure 4
Typical IDEN(H) current for a Zener diode voltage of 6V
The device and channel turn on is independent of the VDEN-voltage. After applying a supply voltage the device is
activated after the power on reset time tPOR.
Data Sheet
10
Rev. 1.1, 2015-03-24
TLD2314EL
DEN Pin
VS
tPOR
IOU T
100%
80%
t
Figure 5
Power on reset
The DEN voltage VDEN does not influence the disable function via the ST pin. If VDEN < VDEN(dis) the device can still
be disabled via the ST pin, if VST > VST(H). For details, please refer to Chapter 7.3.
5.1
Electrical Characteristics Internal Supply / DEN Pin
Electrical Characteristics Internal Supply / DEN pin
Unless otherwise specified: VS = 5.5 V to 40 V, Tj = -40 °C to +150 °C, RSETx = 12 kΩ all voltages with respect to
ground, positive current flowing into pin for input pins (I), positive currents flowing out of the I/O and output pins
(O) (unless otherwise specified)
Pos.
Parameter
Symbol
Limit Values
Min.
Typ.
Max.
Unit
Conditions
1)
5.1.1
Current consumption,
active mode
IS(on)
–
–
1.9
mA
5.1.2
Current consumption,
device disabled via ST
IS(dis,ST)
–
–
1.7
mA
5.1.3
Current consumption,
device disabled via
IN_SETx
IS(dis,IN_SET) –
–
1.7
mA
5.1.4
Current consumption,
IS(fault,STu)
active mode in single fault
detection condition with STpin unconnected
–
–
2.1
mA
5.1.5
Current consumption,
IS(fault,STG)
active mode in single fault
detection condition with STpin connected to GND
–
–
6.2
mA
Data Sheet
11
IIN_SET = 0 µA
Tj < 105 °C
VS = 18 V
VOUTx = 3.6V
1)
VS = 18 V
Tj < 105 °C
VST = 5 V
1)
VS = 18 V
Tj < 105 °C
VIN_SETx = 5 V (all)
1)
VS = 18 V
Tj < 105 °C
RSETx = 12 kΩ
VOUTx = 18 V or 0 V
1)
VS = 18 V
Tj < 105 °C
RSET1 = 12 kΩ
RSET2,3 = unconnected
VOUTx = 18 V or 0 V
VST = 0 V
Rev. 1.1, 2015-03-24
TLD2314EL
DEN Pin
Electrical Characteristics Internal Supply / DEN pin (cont’d)
Unless otherwise specified: VS = 5.5 V to 40 V, Tj = -40 °C to +150 °C, RSETx = 12 kΩ all voltages with respect to
ground, positive current flowing into pin for input pins (I), positive currents flowing out of the I/O and output pins
(O) (unless otherwise specified)
Pos.
Parameter
Symbol
Limit Values
Min.
Typ.
Max.
5.1.6
Current consumption,
IS(dfault,STG)
active mode in double fault
detection condition one
output disabled via
IN_SETx and with ST-pin
connected to GND
–
–
9.2
5.1.7
Power-on reset delay time 2) tPOR
–
–
25
µs
5.1.8
Required supply voltage for VS(CC)
current control
–
–
5.5
V
5.1.9
DEN high input current
–
–
–
–
–
–
–
–
0.1
0.1
0.2
0.4
2.45
–
3.2
V
Tj < 105 °C
RSET1,2 = 12 kΩ
RSET3 = unconnected
VOUTx = 18 V or 0 V
VST = 0 V
3)
VS = 0 → 13.5 V
VOUTx(nom) = 3.6 ± 0.3V
IOUTx = 80% IOUTx(nom)
VOUTx = 3.6 V
IOUTx ≥ 90% IOUTx(nom)
Tj < 105 °C
VS = 13.5 V, VDEN = 5.5 V
VS = 18 V, VDEN = 5.5 V
VS = 18 V, VDEN = 12 V
VS = VDEN = 18 V
VS = 8...18 V
1.5
–
2.3
V
VS = 8...18 V
IDEN(H)
VDEN(act)
5.1.10
DEN activation threshold
(diagnosis enabled above
VDEN(act))
5.1.11
DEN deactivation threshold VDEN(dis)
(diagnosis disabled below
VDEN(dis))
Unit
Conditions
mA
1)
mA
VS = 18 V
1) The total device current consumption is the sum of the currents IS and IDEN(H), please refer to Pos. 5.1.9
2) See also Figure 4
3) Not subject to production test, specified by design
Data Sheet
12
Rev. 1.1, 2015-03-24
TLD2314EL
IN_SETx Pin
6
IN_SETx Pin
The IN_SET pin is a multiple function pin for output current definition, input and diagnostics:
Logic
IN_SET
high impedance
IIN_SET
VIN_SET
VIN_SET(OL/SC)
GND
Figure 6
Block Diagram IN_SET pin
6.1
Output Current Adjustment via RSET
The output current of each channel can be adjusted independently. The current adjustment can be done by placing
a low power resistor (RSET) at the IN_SETx pin to ground. The dimensioning of the resistor can be done using the
formula below:
kR SET = ---------I OUT
(2)
The gain factor k (RSET * output current) is specified in Pos. 9.2.4 and Pos. 9.2.5. The current through the RSET is
defined by the resistor itself and the reference voltage VIN_SET(ref), which is applied to the IN_SET during supplied
device.
6.2
Smart Input Pin
The IN_SETx pin can be connected via RSET to the open-drain output of a µC or to an external NMOS transistor
as described in Figure 7 This signal can be used to turn off the output stages of the IC. A minimum IN_SET current
of IIN_SET(act) is required to turn on the output stages. This feature is implemented to prevent glimming of LEDs
caused by leakage currents on the IN_SET pin, see Figure 10 for details. In addition, the IN_SET pin offers the
diagnostic feedback information, if the status pin is connected to GND and VDEN > VDEN(act) (refer to Chapter 5).
Another diagnostic possibility is shown in Figure 8, where the diagnosis information is provided via the ST pin
(refer to Chapter 7 and Chapter 8) to a micro controller In case of a fault event with the ST pin connected to GND
the IN_SET voltage is increased to VIN_SET(OL/SC) Pos. 8.4.2. Therefore, the device has two voltage domains at the
IN_SET-pin, which is shown in Figure 11.
Note: If one output has a present fault (open load or short circuit) and one or both of the other channels are dimmed
via PWM at the IN_SET-pins a short spike to VIN_SET(OL/SC) is possible. Please refer to Chapter 8.3.
Data Sheet
13
Rev. 1.1, 2015-03-24
TLD2314EL
IN_SETx Pin
Microcontroller
(e.g. XC866)
OUT
RSET/2
RSET/2
IN_SET
Current
adjust
Status
Basic LED Driver
ST
GND
IN
VDDP = 5 V
Figure 7
Schematics IN_SET interface to µC, diagnosis via IN_SET pin
Microcontroller
(e.g. XC866)
OUT
RSET
IN_SET
Current
adjust
Status
Basic LED Driver
ST
GND
IN
VDDP = 5 V
Figure 8
optional
Schematics IN_SET interface to µC, diagnosis via ST pin
The resulting switching times are shown in Figure 9:
IIN_ SET
IOU T
tON (IN_ SET )
tOFF(IN _ SET)
t
100%
80%
20%
t
Figure 9
Data Sheet
Switching times via IN_SET
14
Rev. 1.1, 2015-03-24
TLD2314EL
IN_SETx Pin
IOUT [mA]
k = IOUTx * VIN_SET(ref) / IIN_SETx
IOUTx
IIN_SET(ACT)
Figure 10
IIN_SETx
IIN_SET [µA]
IOUT versus IINSET
V IN_ SET
VIN _SET( OL /SC)m ax
Diagnostic voltage range
V IN_ SET(OL /SC) m in
VIN _SET (ref ) m ax
Normal operation and high temperature current
reduction range
Figure 11
Data Sheet
Voltage domains for IN_SET pin, if ST pin is connected to GND
15
Rev. 1.1, 2015-03-24
TLD2314EL
ST Pin
7
ST Pin
The ST pin is a multiple function pin.
IST(OL/SC)
VST(OL/SC)
No fault
Fault
Output Control
ST
No fault
Fault
VST
IST(PD)
Figure 12
Block Diagram ST pin
7.1
Diagnosis Selector
If the voltage at the DEN pin VDEN is higher than VDEN(act), the diagnosis is activated. For details, please refer to
Chapter 5. If the status pin is unconnected or connected to GND via a high ohmic resistor (VST to be below VST(L)),
the ST pin acts as diagnosis output pin. In normal operation (device is activated) the ST pin is pulled to GND via
the internal pull down current IST(PD). In case of an open load or short circuit to GND condition the ST pin is switched
to VST(OL/SC) after the open load or short circuit detection filter time (Pos. 8.4.9, Pos. 8.4.12).
If the device is operated in PWM operation via the VS pin the ST pin should be connected to GND via a high ohmic
resistor (e.g. 470kΩ) to ensure proper device behavior during fast rising VS slope.
If the ST pin is shorted to GND the diagnostic feedback is performed via the IN_SET-pin, which is shown in
Chapter 6.2 and Chapter 8.
7.2
Diagnosis Output
If the status pin is unconnected or connected to GND via a high ohmic resistor (VST to be below VST(L)), it acts as
a diagnostic output, if the voltage at the DEN pin is above VDEN(act). In case of a fault condition the ST pin rises its
voltage to VST(OL/SC) (Pos. 8.4.7). Details are shown in Chapter 8.
7.3
Disable Input
If an external voltage higher than VST(H) (Pos. 8.4.5) is applied to the ST pin, the device is switched off. This
function is working independently of the voltage at the DEN pin. Even if the diagnosis is disabled via
VDEN < VDEN(dis) the disable function of the ST pin is working. This function is used for applications, where multiple
drivers should be used for one light function. It is possible to combine the drivers’ fault diagnosis via the ST pins.
If a single LED chain fails, the entire light function is switched off. In this scenario e.g. the diagnostic circuit on the
body control module can easily distinguish between the two cases (normal load or load fault), because nearly no
current is flowing into the LED module during the fault scenario - the drivers consume a current of IS(fault,STu)
(Pos. 5.1.4) or IS(dis,ST) (Pos. 5.1.2).
Data Sheet
16
Rev. 1.1, 2015-03-24
TLD2314EL
ST Pin
As soon as one LED chain fails, the ST-pin of this device is switched to VST(OL/SC). The other devices used for the
same light function can be connected together via the ST pins. This leads to a switch off of all devices connected
together.
V ST
IOU T
tON (ST)
tOFF( ST)
t
100%
80%
20%
t
Figure 13
Data Sheet
Switching times via ST Pin
17
Rev. 1.1, 2015-03-24
TLD2314EL
Load Diagnosis
8
Load Diagnosis
The diagnosis function is enabled, if the voltage at the DEN pin VDEN is above VDEN(act) as described in Chapter 5.
8.1
Open Load
An open load diagnosis feature is integrated in the TLD2314EL driver IC. If there is an open load on one of the
outputs, the respective output is turned off. The potential on the IN_SET pin rises up to VIN_SET(OL/SC), if the ST is
connected to GND. This high voltage can be used as input signal for an µC as shown in Figure 8. If the ST pin is
open or connected to GND via a high ohmic resistor, the ST pin rises to a high potential as described in Chapter 7.
More details are shown in Figure 17. The open load status is not latched, as soon as the open load condition is
no longer present, the output stage will be turned on again. An open load condition is detected, if the voltage drop
over the output stage VPS is below the threshold according Pos. 8.4.10 and a filter time of tOL is passed.
V IN_ SET
VIN _SET( OL /SC)
VIN_ SET( ref )
tOL
tIN _SET (re se t)
VOU T
t
VS
V S – VPS(OL )
VF
open load
occurs
open load
disappears
t
Figure 14
Data Sheet
IN_SET behavior during open load condition with ST pin connected to GND and VDEN > VDEN(act)
18
Rev. 1.1, 2015-03-24
TLD2314EL
Load Diagnosis
VIN _SET
VIN _SET( ref )
t
VST
V ST( OL /SC)
tOL
tIN_ SET(re se t)
VOU T
t
VS
VS – VPS( OL)
VF
open load
occurs
open load
disappears
t
Figure 15
IN_SET and ST behavior during open load condition (ST unconnected) and VDEN > VDEN(act)
8.2
Short Circuit to GND detection
The TLD2314EL has an integrated SC to GND detection. If the output stage is turned on and the voltage at the
output falls below VOUT(SC) the potential on the IN_SET pin is increased up to VIN_SET(OL/SC) after tSC, if the ST pin
is connected to GND. If the ST is open or connected to GND via a high ohmic resistor the fault is indicated on the
ST pin according to Chapter 7 after tSC. More details are shown in Figure 17. This condition is not latched. For
detecting a normal condition after a short circuit detection an output current according to IOUT(SC) is driven by the
channel.
Data Sheet
19
Rev. 1.1, 2015-03-24
TLD2314EL
Load Diagnosis
VIN _SET
VIN _SET( OL /SC)
VIN _SET (ref )
VOU T
tSC
t
tIN_ SET( re se t)
VF
VOUT (SC)
t
short circuit
occurs
short circuit
disappears
IN_SET behavior during short circuit to GND condition with ST connected to GND and VDEN >
Figure 16
VDEN(act)
V IN_ SET
V IN_ SET(ref )
t
V ST
VST (OL /SC)
V OU T
tSC
tIN _SET (re se t)
t
VF
V OUT (SC)
t
short circuit
occurs
Figure 17
short circuit
disappears
IN_SET and ST behavior during short circuit to GND condition (ST unconnected) and VDEN >
VDEN(act)
Data Sheet
20
Rev. 1.1, 2015-03-24
TLD2314EL
Load Diagnosis
8.3
Double Fault Conditions
The TLD2314EL allows the diagnosis of each channel separately, as long as the ST-pin is shorted to GND The
diagnosis filter times tOL and tSC (Pos. 8.4.9 and Pos. 8.4.12) are valid only for the channel, which diagnoses first
the fault condition. For the other channel or channels with a subsequential fault the diagnosis is reported
immediately without the diagnosis filter time, if the filter time tOL has been elapsed for the channel with the first
fault. During activation via IN_SET of a non-faulty output, where one channel has already a fault detected, a short
spike to VIN_SET(OL/SC) could occur on the channel, which should be activated. Therefore, in general a diagnosis
should be done earliest after the diagnosis filter times tOL and tSC to avoid any incorrect diagnosis readout. In the
scenario mentioned above the turn on time tON(IN_SET) could be extended. The following figure shows the example
behavior, if OUT1 has a fault and OUT2 is operated in PWM-mode. OUT3 is disabled.
Data Sheet
21
Rev. 1.1, 2015-03-24
TLD2314EL
Load Diagnosis
IIN_ SET1
V IN_SET (OL /SC) / RSET 1
V IN_SET (ref ) / RSET 1
t
VIN _SET 1
VIN _SET (OL /SC)
VIN _SET( ref )
tOL
t
VOU T1
VS
VS – VPS(OL )
VF
open load
occurs
t
IIN_ SET2
VIN _SET( OL /SC) / RSET2
VIN _SET( ref ) / RSET2
t
VIN _ SET2
turn on command
VIN _SET (OL /SC)
VIN _SET( ref )
t
VOU T2
VF
VOUT ( SC)
t
Figure 18
Data Sheet
Example single channel fault on OUT1 and PWM-operation on OUT2 with ST pin connected to
GND and VDEN > VDEN(act)
22
Rev. 1.1, 2015-03-24
TLD2314EL
Load Diagnosis
8.4
Electrical Characteristics IN_SET Pin and Load Diagnosis
Electrical Characteristics IN_SET pin and Load Diagnosis
Unless otherwise specified: VS = 5.5 V to 40 V, Tj = -40 °C to +150 °C, RSETx = 12 kΩ, VDEN = 5.5 V, all voltages
with respect to ground, positive current flowing into pin for input pins (I), positive currents flowing out of the I/O and
output pins (O) (unless otherwise specified)
Pos.
Parameter
Symbol
Limit Values
Unit
Conditions
1)
Min.
Typ.
Max.
1.19
1.23
1.27
V
8.4.1
IN_SET reference
voltage
VIN_SET(ref)
8.4.2
IN_SET open load/short
circuit voltage
VIN_SET(OL/SC) 4
–
5.5
V
8.4.3
IN_SET open load/short
circuit current
IIN_SET(OL/SC) 0.5
–
2.5
mA
VOUTx = 3.6 V
Tj = 25...115 °C
1)
VS > 8 V
Tj = 25...150 °C
VS = VOUTx (OL) or VOUTx
= 0 V (SC)
1)
VS > 8 V
Tj = 25...150 °C
VIN_SET = 4 V
VS = VOUTx (OL) or VOUT
= 0 V (SC)
8.4.4
ST device turn on
threshold (active low) in
case of voltage applied
from external (ST-pin
acting as input)
VST(L)
0.8
–
–
V
–
8.4.5
ST device turn off
threshold (active low) in
case of voltage applied
from external (ST-pin
acting as input)
VST(H)
–
–
2.5
V
–
8.4.6
ST pull down current
–
–
15
µA
8.4.7
ST open load/short
circuit voltage (ST-pin
acting as diagnosis
output)
IST(PD)
VST(OL/SC)
4
–
5.5
V
VST = 0.8 V
1)
VS > 8 V
Tj = 25...150 °C
RST = 470 kΩ
VS = VOUTx (OL) or VOUT
= 0 V (SC)
8.4.8
ST open load/short
circuit current (ST-pin
acting as diagnosis
output)
IST(OL/SC)
100
–
220
µA
1)
VS > 8 V
Tj = 25...150 °C
VST = 2.5 V
VS = VOUTx (OL) or VOUT
= 0 V (SC)
8.4.9
8.4.10
OL detection filter time
OL detection voltage
VPS(OL) = VS - VOUTx
tOL
VPS(OL)
10
22
35
µs
1)
0.2
–
0.4
V
VS > 8 V
VS > 8 V
8.4.11
Short circuit to GND
detection threshold
VOUT(SC)
0.8
–
1.4
V
VS > 8 V
8.4.12
SC detection filter time
tSC
tIN_SET(reset)
10
22
35
µs
1)
µs
1)
8.4.13
IN_SET diagnosis reset
time
Data Sheet
–
5
23
20
VS > 8 V
VS > 8 V
Rev. 1.1, 2015-03-24
TLD2314EL
Load Diagnosis
Electrical Characteristics IN_SET pin and Load Diagnosis (cont’d)
Unless otherwise specified: VS = 5.5 V to 40 V, Tj = -40 °C to +150 °C, RSETx = 12 kΩ, VDEN = 5.5 V, all voltages
with respect to ground, positive current flowing into pin for input pins (I), positive currents flowing out of the I/O and
output pins (O) (unless otherwise specified)
Pos.
Parameter
Symbol
Limit Values
Unit
Conditions
Min.
Typ.
Max.
8.4.14
SC detection current in
IOUT(SC,STu)
case of unconnected STpin
100
200
300
µA
VS > 8 V
VOUTx = 0 V
8.4.15
SC detection current in
IOUT(SC,STG)
case of ST-pin shorted to
GND
0.1
2
4.75
mA
VS > 8 V
VOUTx = 0 V
VST = 0 V
8.4.16
IN_SET activation
IIN_SET(act)
current without turn on of
output stages
2
–
15
µA
See Figure 10
1) Not subject to production test, specified by design
Data Sheet
24
Rev. 1.1, 2015-03-24
TLD2314EL
Power Stage
9
Power Stage
The output stages are realized as high side current sources with a current of 120 mA. During off state the leakage
current at the output stage is minimized in order to prevent a slightly glowing LED. To increase the overall output
current for high brightness LED applications it is possible to connect two or all three output stages in parallel.
The maximum current of each channel is limited by the power dissipation and used PCB cooling areas (which
results in the applications RthJA).
For an operating current control loop the supply and output voltages according to the following parameters have
to be considered:
•
•
•
Required supply voltage for current control VS(CC), Pos. 5.1.8
Voltage drop over output stage during current control VPS(CC), Pos. 9.2.6
Required output voltage for current control VOUTx(CC), Pos. 9.2.7
9.1
Protection
The device provides embedded protective functions, which are designed to prevent IC destruction under fault
conditions described in this data sheet. Fault conditions are considered as “outside” normal operating range.
Protective functions are neither designed for continuous nor for repetitive operation.
9.1.1
Over Load Behavior
An over load detection circuit is integrated in the LITIXTM Basic IC. It is realized by a temperature monitoring of the
output stages (OUTx).
As soon as the junction temperature exceeds the current reduction temperature threshold Tj(CRT) the output current
will be reduced by the device by reducing the IN_SET reference voltage VIN_SET(ref). This feature avoids LED’s
flickering during static output overload conditions. Furthermore, it protects LEDs against over temperature, which
are mounted thermally close to the device. If the device temperature still increases, the three output currents
decrease close to 0 A. As soon as the device cools down the output currents rise again.
IOU T
V IN_ SET
Tj (C R T)
Figure 19
Tj
Output current reduction at high temperature
Note: This high temperature output current reduction is realized by reducing the IN_SET reference voltage voltage
(Pos. 8.4.1). In case of very high power loss applied to the device and very high junction temperature the
output current may drop down to IOUTx = 0 mA, after a slight cooling down the current increases again.
9.1.2
Reverse Battery Protection
The TLD2314EL has an integrated reverse battery protection feature. This feature protects the driver IC itself, but
also connected LEDs. The output reverse current is limited to IOUTx(rev) by the reverse battery protection.
Data Sheet
25
Rev. 1.1, 2015-03-24
TLD2314EL
Power Stage
Note: Due to the reverse battery protection a reverse protection diode for the light module may be obsolete. In case
of high ISO-pulse requirements and only minor protecting components like capacitors a reverse protection
diode may be reasonable. The external protection circuit needs to be verified in the application.
9.2
Electrical Characteristics Power Stage
Electrical Characteristics Power Stage
Unless otherwise specified: VS = 5.5 V to 18 V, Tj = -40 °C to +150 °C, VOUTx = 3.6 V, all voltages with respect to
ground, positive current flowing into pin for input pins (I), positive currents flowing out of the I/O and output pins
(O) (unless otherwise specified)
Pos.
Parameter
Symbol
Limit Values
Min.
9.2.1
Output leakage current
9.2.2
Output leakage current in
boost over battery setup
9.2.3
Reverse output current
Typ.
Unit
Conditions
µA
IIN_SET = 0 µA
VOUTx = 2.5 V
Tj = 150 °C
1)
Tj = 85 °C
1)
Max.
IOUTx(leak)
–
–
–
–
7
3
–
IOUTx(leak,B2B)
-IOUTx(rev)
–
–
50
µA
–
1
µA
IIN_SET = 0 µA
VOUTx = VS = 40 V
1)
VS = -16 V
Output load: LED with
break down voltage
< - 0.6 V
9.2.4
9.2.5
Output current accuracy
limited temperature range
Output current accuracy
over temperature
1)
kLT
697
645
750
750
803
855
697
645
750
750
803
855
kALL
9.2.6
Voltage drop over power
VPS(CC)
stage during current control
VPS(CC) = VS - VOUTx
0.75
–
–
V
9.2.7
Required output voltage for VOUTx(CC)
current control
2.3
–
–
V
9.2.8
Maximum output current
120
–
–
mA
IOUT(max)
Tj = 25...115 °C
VS = 8...18 V
VPS = 2 V
RSETx = 6...12 kΩ
RSETx = 30 kΩ
1)
Tj = -40...115 °C
VS = 8...18 V
VPS = 2 V
RSETx = 6...12 kΩ
RSETx = 30 kΩ
1)
VS = 13.5 V
RSETx = 12 kΩ
IOUTx ≥ 90% of
(kLT(typ)/RSETx)
1)
VS = 13.5 V
RSETx = 12 kΩ
IOUTx ≥ 90% of
(kLT(typ)/RSETx)
RSETx = 4.7 kΩ
The maximum output
current is limited by the
thermal conditions.
Please refer to
Pos. 4.3.1 - Pos. 4.3.3
Data Sheet
26
Rev. 1.1, 2015-03-24
TLD2314EL
Power Stage
Electrical Characteristics Power Stage (cont’d)
Unless otherwise specified: VS = 5.5 V to 18 V, Tj = -40 °C to +150 °C, VOUTx = 3.6 V, all voltages with respect to
ground, positive current flowing into pin for input pins (I), positive currents flowing out of the I/O and output pins
(O) (unless otherwise specified)
Pos.
Parameter
Symbol
9.2.9
ST turn on time
tON(ST)
Limit Values
Min.
Typ.
Max.
–
–
15
Unit
Conditions
µs
2)
VS = 13.5 V
RSETx = 12 kΩ
ST → L
9.2.10
ST turn off time
tOFF(ST)
–
–
10
µs
IOUTx = 80% of
(kLT(typ)/RSETx)
2)
VS = 13.5 V
RSETx = 12 kΩ
ST → H
9.2.11
IN_SET turn on time
tON(IN_SET)
–
–
15
µs
9.2.12
IN_SET turn off time
tOFF(IN_SET)
–
–
10
µs
9.2.13
Current reduction
temperature threshold
Tj(CRT)
–
140
–
°C
9.2.14
Output current during
current reduction at high
temperature
IOUT(CRT)
85% of –
(kLT(typ)/
RSETx)
–
A
IOUTx = 20% of
(kLT(typ)/RSETx)
VS = 13.5 V
IIN_SET = 0 → 100 µA
IOUTx = 80% of
(kLT(typ)/RSETx)
VS = 13.5 V
IIN_SET = 100 → 0 µA
IOUTx = 20% of
(kLT(typ)/RSETx)
1)
IOUTx = 95% of
(kLT(typ)/RSETx)
1)
RSETx = 12 kΩ
Tj = 150 °C
1) Not subject to production test, specified by design
2) see also Figure 13
Data Sheet
27
Rev. 1.1, 2015-03-24
TLD2314EL
Application Information
10
Application Information
Note: The following information is given as a hint for the implementation of the device only and shall not be
regarded as a description or warranty of a certain functionality, condition or quality of the device.
V BATT
C mo d=2.2µF
CVS =4.7nF
VS
Microcontroller
(e.g.
XC866)
ISO-Pulse protection circuit
depending on requirements
Internal
supply
DEN Diagnosis
enable
Output
control
Thermal
protection
RSET/2
OUT3*
RSET/2
OUT2*
OUT1
TM
Basic
LED
Driver
LITIX
Basic
IN2
OUT2
IN_SET3
IN_SET2 Current
IN_SET1 adjust
IN3
4.7nF** 4.7nF** 4.7nF**
OUT3
Status
ST
GND
OUT1*
IN1
* Open Drain
Figure 20
** For EMI improvement, if required.
Application Diagram with Diagnosis for each channel
Note: This is a very simplified example of an application circuit. In case of high ISO-pulse requirements a reverse
protection diode may be used for LED protection. The function must be verified in the real application.
10.1
•
Further Application Information
For further information you may contact http://www.infineon.com/
Data Sheet
28
Rev. 1.1, 2015-03-24
TLD2314EL
Package Outlines
11
Package Outlines
0.19 +0.06
0.08 C
0.15 M C A-B D 14x
0.64 ±0.25
1
8
1
7
0.2
M
D 8x
Bottom View
3 ±0.2
A
14
6 ±0.2
D
Exposed
Diepad
B
0.1 C A-B 2x
14
7
8
2.65 ±0.2
0.25 ±0.05 2)
0.1 C D
8˚ MAX.
C
0.65
3.9 ±0.11)
1.7 MAX.
Stand Off
(1.45)
0 ... 0.1
0.35 x 45˚
4.9 ±0.11)
Index Marking
1) Does not include plastic or metal protrusion of 0.15 max. per side
2) Does not include dambar protrusion
Dimensions in mm
PG-SSOP-14-1,-2,-3-PO V02
Figure 21
PG-SSOP14
Green Product (RoHS compliant)
To meet the world-wide customer requirements for environmentally friendly products and to be compliant with
government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e
Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020).
For further information on alternative packages, please visit our website:
http://www.infineon.com/packages.
Data Sheet
29
Rev. 1.1, 2015-03-24
TLD2314EL
Revision History
12
Revision History
Revision
Date
Changes
1.0
2013-08-08
Inital revision of data sheet
1.1
2015-03-19
Updated parameters KLT and KALL in the chapter Power Stage.
Data Sheet
30
Rev. 1.1, 2015-03-24
Edition 2015-03-24
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2015 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any
information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties
and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights
of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please contact the nearest
Infineon Technologies Office (www.infineon.com).
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Due to technical requirements, components may contain dangerous substances. For information on the types in
question, please contact the nearest Infineon Technologies Office.
Infineon Technologies components may be used in life-support devices or systems only with the express written
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