SCM1101MF High Voltage 3-Phase Motor Driver Features and Benefits Description ▪ Each half-bridge circuit consists of a pre-driver circuit that is completely independent from the others ▪ Protection against simultaneous high- and low-side turning on ▪ Bootstrap diodes with series resistors for suppressing inrush current are incorporated ▪ CMOS compatible input (3.3 to 5 V) ▪ Designed to minimize simultaneous current through both high- and low-side IGBTs by optimizing gate drive resistors ▪ Integrated Fast Recovery Diode (FRD) as freewheeling diode for each IGBT ▪ UVLO protection with auto restart ▪ Overcurrent protection with off-time period adjustable by an external capacitor ▪ Fault (FO indicator) signal output at protection activation: UVLO (low side only), OCP, and STP ▪ Proprietary power DIP package ▪ UL Recognized Component (File No.: E118037) The SCM1101MF inverter power module (IPM) device provides a robust, highly-integrated solution for optimally controlling 3-phase motor power inverter systems and variable speed control systems used in energy-conserving designs to drive motors of residential and commercial appliances. These ICs take 85 to 253 VAC input voltage, and 10 A (continuous) output current. They can withstand voltages of up to 600 V (IGBT breakdown voltage). Package: Power DIP The SCM1100M series employs a new, small-footprint proprietary DIP package. The IC itself consists of all of the necessary power elements (six IGBTs), pre-drive ICs (three), and freewheeling diodes (six), needed to configure the main circuit of an inverter, as well as a bootstrap circuit (three bootstrap diodes and three boot resistors) as a high-side drive power supply. This enables the main circuit of the inverter to be configured with fewer external components than traditional designs. Applications include residential white goods (home appliances) and commercial appliance motor control, such as: ▪ Air conditioner fan motor ▪ Refrigerator compressor motor ▪ Washing machine main motor ▪ Air conditioner compressor motor Not to scale. Thermal pad shown attached. Functional Block Diagram HS VB VBB HO UV VCC Input Detect HIN Logic Level LIN & Shift Drive Circuit U, V, or W Shoot Through Prevention UV Detect COM FO O .C . Drive LO Circuit LS Protect CFO HVIC Figure 1. Diagram of one of three phases in the device. 38110.100, Rev. 3 SCM1101MF High Voltage 3-Phase Motor Driver Selection Guide Output Current Part Number Packing IGBT Breakdown Voltage, VCES(min) (V) IGBT Saturation Voltage, VCE(sat)(typ) (V) Continuous, IO(max) (A) Pulsed, IOP (max) (A) SCM1101MF 10 pieces per tube 600 1.75 10 20 Absolute Maximum Ratings, valid at TA = 25°C Characteristic Symbol Supply Voltage Supply Voltage (Surge) Rating Units VDC Between VBB and LS1, LS2, and LS3 Remarks 450 V VDC(surge) Between VBB and LS1, LS2, and LS3 500 V IGBT Breakdown Voltage VCES VCC = 15 V, IC = 1 mA, VIN = 0 V 600 V Logic Supply Voltage VCC Between VCC and COM 20 V Boot-strap Voltage VBS Between VB and HS (U,V,W) 20 V TCase = 25°C 10 Adc TCase = 100°C 8.1 Adc Output Current, Continuous IO Output Current, Pulsed IOP Input Voltage VIN FO Terminal Voltage VFO Maximum Allowable Power Dissipation Thermal Resistance, Junction-to-Case PD Pulse Width ≤ 1 ms Between FO and COM 20 A –0.5 to 7 V 7 V TCase = 25°C, 1 element operation (IGBT) 33.8 W TCase = 100°C, 1 element operation (IGBT) 13.5 W R(j-c)Q 1 element operation (IGBT) 3.7 °C/W R(j-c)F 1 element operation (FRD) 4.2 °C/W Case Operation Temperature TCOP –20 to 100 °C Junction Temperature (IGBT) TJ 150 °C Storage Temperature Tstg Isolation Voltage Viso Between exposed thermal pad and each pin; 1 minute, AC –40 to 150 °C 2000 Vrms Recommended Operating Conditions Characteristic Symbol Remarks Min. Typ. Max. Units Main Supply Voltage VDC Between VBB and LS – 300 400 V Logic Supply Voltage VCC Between VCC and COM 13.5 – 16.5 V Logic Supply Voltage VBS Between VB and HS 13.5 – 16.5 V tINmin(on) On pulse 0.5 – – μs tINmin(off) Off pulse 0.5 – – μs Minimum Input Pulse Width Dead Time tdead 1.5 – – μs FO Pull-up Resistor RFO 1 – 22 kΩ CFO Capacitor CFO 1 – 10 nF FO Pull-up Voltage VFO 4.5 – 5.5 V Bootstrap Capacitor CBOOT 10 – 220 μF 25.5 – – mΩ Shunt Resistor RS PWM Carrier Frequency fC – – 10 kHz Junction Temperature TJ – – 125 °C For IP ≤ 20 A All performance characteristics given are typical values for circuit or system baseline design only and are at the nominal operating voltage and an ambient temperature, TA, of 25°C, unless otherwise stated. Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 2 SCM1101MF High Voltage 3-Phase Motor Driver Typical Application Diagram SCM1100M 8 7 Vcc 31 CBOOT VB 6 5 3 VCC HIN LIN 4 COM 1 FO Input Logic & Shoot Through Prevention CFO 2 UV Detect Level Shift UV Detect O.C. Protect HO Drive Circuit 32 HS Drive Circuit LO 33 LS HVIC1 16 15 28 CBOOT VB 14 Controller 13 11 12 9 VCC HIN LIN Input Logic & Shoot Through Prevention COM FO CFO 10 UV Detect Level Shift UV Detect O.C. Protect HO Drive Circuit 29 Drive Circuit LO 30 LS HVIC2 24 VBB 23 25 CBOOT VB 22 21 19 VCC HIN LIN VFO RFO M HS 20 17 18 Input Logic & Shoot Through Prevention UV Detect Level Shift UV Detect COM FO CFO O.C. Protect HO Drive Circuit 26 HS Drive Circuit LO 27 CS LS HVIC3 CN RS CFO NOTE: ▪ To use the OCP circuit, an external shunt resistor, RS, is needed. The RS value can be obtained from the formula: RS(Ω) = 0.5 (V) / Overcurrent Detection Set Current (A) – 0.0024 (Ω). ▪ To avoid malfunction, the wiring between the LS and COM pins should be as short as possible. ▪ To prevent surge destruction, put a 0.01 to 1 μF snubber capacitor, CS, in parallel with the electrolytic capacitor. ▪ To prevent surge destruction, put a 18 to 20 V Zener diode between the VCC and COM pins. ▪ To prevent surge malfunction, put a 0.01 to 0.1 μF ceramic capacitor between the VCC and COM pins and the VB and HS pins. Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 3 SCM1101MF High Voltage 3-Phase Motor Driver ELECTRICAL CHARACTERISTICS, valid at TA=25°C, unless otherwise noted Characteristics Symbol Conditions Min Typ Max Units Logic Supply Voltage VCC Between VCC and COM 13.5 – 16.5 V Logic Supply Current ICC VCC = 15 V, 3 phases operating – 5 8 mA Bootstrap Supply Current Input Voltage Input Voltage Hysteresis Input Current IBS VB – HS = 15 V, one phase operating – 400 800 μA VIH VCC = 15 V, output on – 2.0 2.5 V VIL VCC = 15 V, output off 1.0 1.5 – V VIhys VCC = 15 V – 0.5 – V IIHH VCC = 15 V, VIN = 5 V – 50 100 μA IILH VCC = 15 V, VIN = 0 V UVHL Undervoltage Lock Out (High Side) UVHH UVLL Undervoltage Lock Out (Low Side) UVLH VFOL FO Terminal Output Voltage VFOH Overcurrent Protection Trip Voltage VTRIP VCC = 15 V VCC = 15 V VCC = 15 V, VFO = 5 V, RFO = 10 kΩ VCC = 15 V – – 2 μA 10.0 – 12.0 V 10.5 – 12.5 V 10.5 – 12.5 V 11.0 – 13.0 V – – 0.5 V 4.8 – – V 0.46 0.50 0.54 V VCC = 15 V, CFO = 0.0022 μF 2 – – ms Blanking Time tblank VCC = 15 V – 2 – μs IGBT Breakdown Voltage VCES VCC = 15 V, IC = 1 mA, VIN = 0 V 600 – – V ICES Overcurrent Protection Hold Time tP IGBT Leakage Current VCC = 15 V, VCE = 600 V, VIN = 0 V – – 1 mA IGBT Saturation Voltage VCE(sat) VCC = 15 V, IC =10 A, VIN = 5 V – 1.75 2.2 V Diode Forward Voltage VF VCC = 15 V, IF = 10 A, VIN = 0 V – 1.7 2.2 V Diode Recovery Time (Bootstrap) trr IF / IRP = 100 mA/100 mA – 70 – ns Diode Leakage Current (Bootstrap) IIB VR = 600 V – 5 10 μA Diode Forward Voltage (Bootstrap) VFB IF = 0.15 A – 1.1 1.3 V RB 17.6 22.0 26.4 Ω tdH(on) – 320 – ns – 50 – ns – 80 – ns tdH(off) – 560 – ns tfH – 210 – ns tdL(on) – 350 – ns Diode Series Resistor (Bootstrap) trH High Side Switching Time trrH – 80 – ns – 140 – ns tdL(off) – 610 – ns tfL – 200 – ns trL Low Side Switching Time VDC = 300 V, VCC = 15 V, IC = 10 A, inductive load; HIN = 05 V or 50 V trrL VDC = 300 V, VCC = 15 V, IC = 10 A, inductive load; LIN = 05 V or 50 V Switching Timing Definitions VIN trr t(on) td(on) Input Output Truth Table t(off) td(off) tf tr 90% 90% VCE IC 10% 10% Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com HIN LIN OUT L L High Z L H L H L H H H High Z High Z = High Impedance 4 SCM1101MF High Voltage 3-Phase Motor Driver Timing Diagrams High-Side Driver Input/Output Low-Side Driver Input/Output HIN HIN LIN LIN UVHL UVHH VB- HS * Start from positive edge after UVLO release . UVLL VCC HO HO LO LO FO * No output at H-side UVLO *VCC = 15 V UVLH * Start from positive edge after UVLO release FO * VB- HS =15 V Shoot-Through Prevention HIN LIN VCC HO LO FO *VCC ,VB- HS = 15 V * While both HIN and LIN are in high state HO and LO turn off and FO signals out Overcurrent Protection LIN IGBT turns off softly after overcurrent condition is detected VB- HS VCC LS BlankingTime (2 μs typ.) FO CFO Vrc (3.5 V typ.) The slope depends on OCP Assist Timer CFO capacitance (2 μs min.) Off operation of all phases can be done by wired OR system * with the three FO pins short circuited Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 5 SCM1101MF High Voltage 3-Phase Motor Driver Pin-out Diagram 25 33 Branded Side 24 1 (Bottom View) Terminal List Table Name 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 Number FO1 CFO1 LIN1 COM1 HIN1 VCC1 VB1 HS1 FO2 CFO2 LIN2 COM2 HIN2 VCC2 VB2 HS2 FO3 CFO3 LIN3 COM3 HIN3 VCC3 VB3 HS3 VBB W LS3 VBB V LS2 VBB U 33 LS1 Function U phase fault output for overcurrent and UVLO detected Capacitor for U phase overcurrent protection hold time Signal input for low-side U phase (active high) Supply ground for U phase IC Signal input for high-side U phase (active high) Supply voltage for U phase IC High-side floating supply voltage for U phase High-side floating supply ground for U phase V phase fault output for overcurrent and UVLO detected Capacitor for V phase overcurrent protection hold time Signal input for low-side V phase (active high) Supply ground for V phase IC Signal input for high-side V phase (active high) Supply voltage for V phase IC High-side floating supply voltage for V phase High-side floating supply ground for V phase W phase fault output for overcurrent and UVLO detected Capacitor for W phase overcurrent protection hold time Signal input for low-side W phase (active high) Supply ground for W phase IC Signal input for high-side W phase (active high) Supply voltage for W phase IC High-side floating supply voltage for W phase High-side floating supply ground for W phase Positive DC bus supply voltage Output for W phase Negative DC bus supply ground for W phase Cut-pin ( positive DC bus supply voltage) Output for V phase Negative DC bus supply ground for V phase Cut-pin ( positive DC bus supply voltage) Output for U phase Negative DC bus supply ground for U phase Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 6 SCM1101MF High Voltage 3-Phase Motor Driver PACKAGE OUTLINE DRAWING (Bottom View) (Top View) Branding codes (exact appearance at manufacturer discretion): Section A, type: SCM1101MF Leadform: 2552 Dimensions in millimeters Section B, lot: YMDDT Where: Y is the last digit of the year of manufacture M is the month (1 to 9, O, N, D) DD is the date T is the tracking letter (A to Z) Leadframe plating Pb-free. Device composition complies with the RoHS directive. Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 7 SCM1101MF High Voltage 3-Phase Motor Driver MECHANICAL CHARACTERISTICS Characteristic Remarks Heatsink Mounting Screw Torque Use one M3 screw each end Flatness of Heatsink Attachment Area Refer to figure below (aaa) Min. Typ. Max. Units 58.8 – 78.4 N•cm kgf•cm 6.0 – 8.0 0 – 150 μm – 13.5 – g Package Weight B A aaa A aaa B (Top View) Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 8 SCM1101MF High Voltage 3-Phase Motor Driver PACKING SPECIFICATION Dimensions in millimeters : Tube type SCM-A Maximum 10 pieces per tube Pins aligned along X direction Rubber plug at each end Maximum 5 tubes in Y direction Maximum 5 tubes in Z direction < ; Maximum pieces per carton: 10 pieces per tube 5 rows of tubes x 5 layers of tubes 250 pieces per carton Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 9 SCM1101MF High Voltage 3-Phase Motor Driver WARNING — These devices are designed to be operated at lethal voltages and energy levels. Circuit designs that embody these components must conform with applicable safety requirements. Precautions must be taken to prevent accidental contact with power-line potentials. Do not connect grounded test equipment. The use of an isolation transformer is recommended during circuit development and breadboarding. Because reliability can be affected adversely by improper storage environments and handling methods, please observe the following cautions. Cautions for Storage • Ensure that storage conditions comply with the standard temperature (5°C to 35°C) and the standard relative humidity (around 40 to 75%); avoid storage locations that experience extreme changes in temperature or humidity. • Avoid locations where dust or harmful gases are present and avoid direct sunlight. • Reinspect for rust on leads and solderability of product that has been stored for a long time. Cautions for Testing and Handling When tests are carried out during inspection testing and other standard test periods, protect the product from power surges from the testing device, shorts between adjacent product packages, and shorts to the heatsink. Remarks About Using Silicone Grease with a Heatsink • Ensure there are no foreign objects between the heatsink and thermal pad; only silicone thermal grease is allowed. • When silicone grease is used in mounting this product with a heatsink, grease shall be applied evenly and thinly. If more silicone grease than required is applied, it may produce stress. • Volatile-type silicone greases may permeate the product and produce cracks after long periods of time, resulting in reduced heat radiation effect, and possibly shortening the lifetime of the product. • Hard silicone greases may cause cracks in the product when screwing the product to a heatsink. • Our recommended silicone greases for heat radiation purposes, which will not cause any adverse effect on the product life, are indicated below: Type Suppliers G746 Shin-Etsu Chemical Co., Ltd. YG6260 SC102 Momentive Performance Materials Dow Corning Toray Silicone Co., Ltd. Soldering • When soldering the product, please be sure to minimize the working time, within the following limits: 260±5°C 10 s 380±5°C 5 s • Soldering iron should be at a distance of at least 1.5 mm from the body of the product Electrostatic Discharge • When handling the product, operator must be grounded. Grounded wrist straps worn should have at least 1 MΩ of resistance to ground to prevent shock hazard. • Workbenches where the product is handled should be grounded and be provided with conductive table and floor mats. • When using measuring equipment such as a curve tracer, the equipment should be grounded. • When soldering the product, the head of soldering irons or the solder bath must be grounded in other to prevent leak voltages generated by them from being applied to the product. • The product should always be stored and transported in our shipping containers or conductive containers, or be wrapped in aluminum foil. Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 10 SCM1101MF High Voltage 3-Phase Motor Driver The products described herein are manufactured in Japan by Sanken Electric Co., Ltd. for sale by Allegro MicroSystems, Inc. Sanken and Allegro reserve the right to make, from time to time, such departures from the detail specifications as may be required to permit improvements in the performance, reliability, or manufacturability of its products. Therefore, the user is cautioned to verify that the information in this publication is current before placing any order. When using the products described herein, the applicability and suitability of such products for the intended purpose shall be reviewed at the users responsibility. Although Sanken undertakes to enhance the quality and reliability of its products, the occurrence of failure and defect of semiconductor products at a certain rate is inevitable. Users of Sanken products are requested to take, at their own risk, preventative measures including safety design of the equipment or systems against any possible injury, death, fires or damages to society due to device failure or malfunction. Sanken products listed in this publication are designed and intended for use as components in general-purpose electronic equipment or apparatus (home appliances, office equipment, telecommunication equipment, measuring equipment, etc.). Their use in any application requiring radiation hardness assurance (e.g., aerospace equipment) is not supported. When considering the use of Sanken products in applications where higher reliability is required (transportation equipment and its control systems or equipment, fire- or burglar-alarm systems, various safety devices, etc.), contact a company sales representative to discuss and obtain written confirmation of your specifications. The use of Sanken products without the written consent of Sanken in applications where extremely high reliability is required (aerospace equipment, nuclear power-control stations, life-support systems, etc.) is strictly prohibited. The information included herein is believed to be accurate and reliable. Application and operation examples described in this publication are given for reference only and Sanken and Allegro assume no responsibility for any infringement of industrial property rights, intellectual property rights, or any other rights of Sanken or Allegro or any third party that may result from its use. Anti radioactive ray design is not considered for the products listed herein. The contents in this document must not be transcribed or copied without Sanken’s written consent. Copyright ©2008-2010 Allegro MicroSystems, Inc. This datasheet is based on Sanken datasheet SSJ-03546 Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 11