SCM1104M Datasheet

SCM1104M
High Voltage 3-Phase Motor Driver
Features and Benefits
Description
▪ Each half-bridge circuit consists of a pre-driver circuit that
is completely independent from the others
▪ Protection against simultaneous high- and low-side turning on
▪ Bootstrap diodes with series resistors for suppressing
inrush current are incorporated
▪ CMOS compatible input (3.3 to 5 V)
▪ Designed to minimize simultaneous current through both
high- and low-side IGBTs by optimizing gate drive resistors
▪ Integrated Fast Recovery Diode (FRD) as freewheeling
diode for each IGBT
▪ UVLO protection with auto restart
▪ Overcurrent protection with off-time period adjustable by
an external capacitor
▪ Fault (FO indicator) signal output at protection activation:
UVLO (low side only), OCP, and STP
▪ Proprietary power DIP package
▪ UL Recognized Component (File No.: E118037)
The SCM1104M inverter power module (IPM) device provides
a robust, highly-integrated solution for optimally controlling
3-phase motor power inverter systems and variable speed
control systems used in energy-conserving designs to drive
motors of residential and commercial appliances. These ICs
take 85 to 253 VAC input voltage, and 8 A (continuous) output
current. They can withstand voltages of up to 600 V (IGBT
breakdown voltage).
Package: Power DIP
The SCM1100M series employs a new, small-footprint
proprietary DIP package. The IC itself consists of all of the
necessary power elements (six IGBTs), pre-drive ICs (three),
and freewheeling diodes (six), needed to configure the main
circuit of an inverter, as well as a bootstrap circuit (three
bootstrap diodes and three boot resistors) as a high-side drive
power supply. This enables the main circuit of the inverter to
be configured with fewer external components than traditional
designs.
Applications include residential white goods (home appliances)
and commercial appliance motor control, such as:
▪ Air conditioner fan motor
▪ Refrigerator compressor motor
▪ Washing machine main motor
▪ Air conditioner compressor motor
Not to scale
Functional Block Diagram
HS
VB
VBB
HO
UV
VCC
Input
Detect
HIN
Logic
Level
LIN
&
Shift
Drive
Circuit
U, V, or W
Shoot
Through
Prevention
UV
Detect
COM
FO
O .C .
Drive
LO
Circuit
LS
Protect
CFO
HVIC
Figure 1. Diagram of one of three phases in the device.
38110.070, Rev. 6
SCM1104M
High Voltage 3-Phase Motor Driver
Selection Guide
Output Current
Part Number
Packing
IGBT Breakdown
Voltage, VCES(min)
(V)
IGBT Saturation
Voltage, VCE(sat)(typ)
(V)
Continuous, IO(max)
(A)
Pulsed, IOP (max)
(A)
SCM1104M
10 pieces per tube
600
1.75
8
16
Absolute Maximum Ratings, valid at TA = 25°C
Characteristic
Symbol
Supply Voltage
Supply Voltage (Surge)
Rating
Units
VDC
Between VBB and LS1, LS2, and LS3
Remarks
450
V
VDC(surge)
Between VBB and LS1, LS2, and LS3
500
V
IGBT Breakdown Voltage
VCES
VCC = 15 V, IC = 1 mA, VIN = 0 V
600
V
Logic Supply Voltage
VCC
Between VCC and COM
20
V
Boot-strap Voltage
VBS
Between VB and HS (U,V,W)
20
V
TCase = 25°C
8
Adc
TCase = 100°C
5.3
Adc
Pulse Width ≤ 1 ms
16
A
Output Current, Continuous
IO
Output Current, Pulsed
IOP
Input Voltage
VIN
FO Terminal Voltage
VFO
Maximum Allowable Power Dissipation
PD
Thermal Resistance, Junction-to-Case
–0.5 to 7
V
7
V
TCase = 25°C, 1 element operation (IGBT)
20.2
W
TCase = 100°C, 1 element operation (IGBT)
8.1
W
Between FO and COM
R(j-c)Q
1 element operation (IGBT)
6.2
°C/W
R(j-c)F
1 element operation (FRD)
6.5
°C/W
Case Operating Temperature
TOPC
–20 to 100
°C
Junction Temperature (IGBT)
TJ
150
°C
Storage Temperature
Tstg
Isolation Voltage
Viso
Between exposed thermal pad and each pin; 1 minute, ac
–40 to 150
°C
2000
Vrms
Recommended Operating Conditions
Characteristic
Symbol
Remarks
Min.
Typ.
Max.
Units
–
300
400
V
Between VCC and COM
13.5
–
16.5
V
Main Supply Voltage
VDC
Between VBB and LS
Logic Supply Voltage
VCC
VBS
Logic Supply Voltage
Minimum Input Pulse Width
Between VB and HS
13.5
–
16.5
V
tINmin(on)
On pulse
0.5
–
–
μs
tINmin(off)
Off pulse
0.5
–
–
μs
Dead Time
tdead
1.5
–
–
μs
FO Pull-up Resistor
RFO
1
–
22
kΩ
CFO Capacitor
CFO
1
–
10
nF
FO Pull-up Voltage
VFO
4.5
–
5.5
V
Bootstrap Capacitor
CBOOT
10
–
220
μF
32.4
–
–
mΩ
For IP ≤ 16 A
Shunt Resistor
RS
PWM Carrier Frequency
fC
–
–
20
kHz
Junction Temperature
TJ
–
–
125
°C
All performance characteristics given are typical values for circuit or
system baseline design only and are at the nominal operating voltage and
an ambient temperature, TA, of 25°C, unless otherwise stated.
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
2
SCM1104M
High Voltage 3-Phase Motor Driver
Typical Application Diagram
SCM1100M
8
7
Vcc
31
CBOOT
VB
6
5
3
VCC
HIN
LIN
4
COM
1
FO
Input
Logic
&
Shoot
Through
Prevention
CFO
2
UV
Detect
Level
Shift
UV
Detect
O.C.
Protect
HO
Drive
Circuit
32
HS
Drive
Circuit
LO
33
LS
HVIC1
16
15
28
CBOOT
VB
14
Controller
13
11
12
9
VCC
HIN
LIN
Input
Logic
&
Shoot
Through
Prevention
COM
FO
CFO
10
UV
Detect
Level
Shift
UV
Detect
O.C.
Protect
HO
Drive
Circuit
29
Drive
Circuit
LO
30
LS
HVIC2
24
VBB
23
25
CBOOT
VB
22
21
19
VCC
HIN
LIN
VFO
RFO
M
HS
20
17
18
Input
Logic
&
Shoot
Through
Prevention
UV
Detect
Level
Shift
UV
Detect
COM
FO
CFO
O.C.
Protect
HO
Drive
Circuit
26
HS
Drive
Circuit
LO
27
CS
LS
HVIC3
CN
RS
CFO
NOTE:
▪ To use the OCP circuit, an external shunt resistor, RS, is needed. The RS value can be obtained from the formula:
RS(Ω) = 0.5 (V) / Overcurrent Detection Set Current (A) – 0.0024 (Ω).
▪ To avoid malfunction, the wiring between the LS and COM pins should be as short as possible.
▪ To prevent surge destruction, put a 0.01 to 1 μF snubber capacitor, CS, in parallel with the electrolytic capacitor.
▪ To prevent surge destruction, put a 18 to 20 V Zener diode between the VCC and COM pins.
▪ To prevent surge malfunction, put a 0.01 to 0.1 μF ceramic capacitor between the VCC and COM pins and the VB and HS
pins.
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
3
SCM1104M
High Voltage 3-Phase Motor Driver
ELECTRICAL CHARACTERISTICS, valid at TA=25°C, unless otherwise noted
Characteristics
Symbol
Conditions
Min
Typ
Max
Units
Logic Supply Voltage
VCC
Between VCC and COM
13.5
–
16.5
V
Logic Supply Current
ICC
VCC = 15 V, 3 phases operating
–
5
8
mA
Bootstrap Supply Current
Input Voltage
Input Voltage Hysteresis
Input Current
IBS
VB – HS = 15 V, one phase operating
–
400
800
μA
VIH
VCC = 15 V, output on
–
2.0
2.5
V
VIL
VCC = 15 V, output off
1.0
1.5
–
V
VIhys
VCC = 15 V
–
0.5
–
V
IIHH
VCC = 15 V, VIN = 5 V
–
50
100
μA
IILH
VCC = 15 V, VIN = 0 V
UVHL
Undervoltage Lock Out (High Side)
UVHH
UVLL
Undervoltage Lock Out (Low Side)
UVLH
VFOL
FO Terminal Output Voltage
VFOH
Overcurrent Protection Trip Voltage
VTRIP
VCC = 15 V
VCC = 15 V
VCC = 15 V, VFO = 5 V, RFO = 10 kΩ
VCC = 15 V
–
–
2
μA
10.0
–
12.0
V
10.5
–
12.5
V
10.5
–
12.5
V
11.0
–
13.0
V
–
–
0.5
V
4.8
–
–
V
0.46
0.50
0.54
V
VCC = 15 V, CFO = 0.0022 μF
2
–
–
ms
Blanking Time
tblank
VCC = 15 V
–
2
–
μs
IGBT Breakdown Voltage
VCES
VCC = 15 V, IC = 250 μA, VIN = 0 V
600
–
–
V
ICES
Overcurrent Protection Hold Time
tP
IGBT Leakage Current
VCC = 15 V, VCE = 600 V, VIN = 0 V
–
–
1
mA
IGBT Saturation Voltage
VCE(sat)
VCC = 15 V, IC = 8 A, VIN = 5 V
–
1.75
2.2
V
Diode Forward Voltage
VF
VCC = 15 V, IF = 8 A, VIN = 0 V
–
1.6
2.2
V
Diode Recovery Time (Bootstrap)
trr
IF / IRP = 100 mA/100 mA
–
70
–
ns
Diode Leakage Current (Boot Strap)
IIB
VR = 600 V
–
5
10
μA
Diode Forward Voltage (Boot Strap)
VFB
IF = 0.15 A
–
1.1
1.3
V
RB
17.6
22.0
26.4
Ω
tdH(on)
–
360
–
ns
–
70
–
ns
–
80
–
ns
tdH(off)
–
560
–
ns
tfH
–
210
–
ns
tdL(on)
–
420
–
ns
–
110
–
ns
–
140
–
ns
tdL(off)
–
630
–
ns
tfL
–
210
–
ns
Diode Series Resistor (Boot Strap)
trH
High Side Switching Time
trrH
trL
Low Side Switching Time
trrL
VDC = 300 V, VCC = 15 V, IC = 8 A, inductive load;
HIN = 05 V or 50 V
VDC = 300 V, VCC = 15 V, IC = 8 A, inductive load;
LIN = 05 V or 50 V
Switching Timing Definitions
VIN
trr
t(on)
td(on)
Input Output Truth Table
t(off)
td(off) tf
tr
90%
90%
VCE
IC
10%
10%
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
HIN
LIN
OUT
L
L
High Z
L
H
L
H
L
H
H
H
High Z
High Z = High Impedance
4
SCM1104M
High Voltage 3-Phase Motor Driver
Pin-out Diagram
25
33
Branded Side
24
1
(Bottom View)
Terminal List Table
Name
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
Number
FO1
CFO1
LIN1
COM1
HIN1
VCC1
VB1
HS1
FO2
CFO2
LIN2
COM2
HIN2
VCC2
VB2
HS2
FO3
CFO3
LIN3
COM3
HIN3
VCC3
VB3
HS3
VBB
W
LS3
VBB
V
LS2
VBB
U
33
LS1
Function
U phase fault output for overcurrent and UVLO detected
Capacitor for U phase overcurrent protection hold time
Signal input for low-side U phase (active high)
Supply ground for U phase IC
Signal input for high-side U phase (active high)
Supply voltage for U phase IC
High-side floating supply voltage for U phase
High-side floating supply ground for U phase
V phase fault output for overcurrent and UVLO detected
Capacitor for V phase overcurrent protection hold time
Signal input for low-side V phase (active high)
Supply ground for V phase IC
Signal input for high-side V phase (active high)
Supply voltage for V phase IC
High-side floating supply voltage for V phase
High-side floating supply ground for V phase
W phase fault output for overcurrent and UVLO detected
Capacitor for W phase overcurrent protection hold time
Signal input for low-side W phase (active high)
Supply ground for W phase IC
Signal input for high-side W phase (active high)
Supply voltage for W phase IC
High-side floating supply voltage for W phase
High-side floating supply ground for W phase
Positive DC bus supply voltage
Output for W phase
Negative DC bus supply ground for W phase
Cut-pin ( positive DC bus supply voltage)
Output for V phase
Negative DC bus supply ground for V phase
Cut-pin ( positive DC bus supply voltage)
Output for U phase
Negative DC bus supply ground for U phase
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
5
SCM1104M
High Voltage 3-Phase Motor Driver
Timing Diagrams
High-Side Driver Input/Output
Low-Side Driver Input/Output
HIN
HIN
LIN
LIN
UVHL
UVHH
VB- HS
* Start from positive edge
after UVLO release .
UVLL
VCC
HO
HO
LO
LO
FO
* No output at H-side UVLO
*VCC = 15 V
UVLH
* Start from positive edge
after UVLO release
FO
* VB- HS =15 V
Shoot-Through Prevention
HIN
LIN
VCC
HO
LO
FO
*VCC ,VB- HS = 15 V
* While both HIN and LIN are in high state
HO and LO turn off and FO signals out
Overcurrent Protection
LIN
IGBT turns off softly after
overcurrent condition is detected
VB- HS
VCC
LS
BlankingTime
(2 μs typ.)
FO
CFO
Vrc
(3.5 V typ.)
The slope depends on
OCP Assist Timer
CFO capacitance
(2 μs min.)
Off
operation
of
all
phases
can
be
done
by
wired
OR system
*
with the three FO pins short circuited
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
6
SCM1104M
High Voltage 3-Phase Motor Driver
PACKAGE OUTLINE DRAWING
(Bottom View)
(Top View)
Branding codes
(exact appearance at manufacturer discretion):
Section A, type: SCM1104M
Leadform: 2552
Dimensions in millimeters
Section B,
lot: YMDDT
Where: Y is the last digit of the year of manufacture
M is the month (1 to 9, O, N, D)
DD is the date
T is the tracking letter (A to Z)
Leadframe plating Pb-free. Device composition complies with the RoHS directive.
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
7
SCM1104M
High Voltage 3-Phase Motor Driver
MECHANICAL CHARACTERISTICS
Characteristic
Remarks
Heatsink Mounting Screw Torque
Use one M3 screw each end
Flatness of Heatsink Attachment Area
Refer to figure below (aaa)
Min.
Typ.
Max.
Units
58.8
–
78.4
N•cm
kgf•cm
6.0
–
8.0
–50
–
100
μm
–
13.5
–
g
Package Weight
B
A
aaa A
aaa B
(Top View)
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
8
SCM1104M
High Voltage 3-Phase Motor Driver
PACKING SPECIFICATION
Dimensions in millimeters
:
Tube type SCM-A
Maximum 10 pieces per tube
Pins aligned along X direction
Rubber plug at each end
Maximum 5 tubes in Y direction
Maximum 5 tubes in Z direction
<
;
Maximum pieces per carton:
10 pieces per tube
5 rows of tubes
x 5 layers of tubes
250 pieces per carton
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
9
SCM1104M
High Voltage 3-Phase Motor Driver
WARNING — These devices are designed to be operated at lethal voltages and energy levels. Circuit designs
that embody these components must conform with applicable safety requirements. Precautions must be
taken to prevent accidental contact with power-line potentials. Do not connect grounded test equipment.
The use of an isolation transformer is recommended during circuit development and breadboarding.
Because reliability can be affected adversely by improper storage
environments and handling methods, please observe the following
cautions.
Cautions for Storage
•
Ensure that storage conditions comply with the standard
temperature (5°C to 35°C) and the standard relative humidity
(around 40 to 75%); avoid storage locations that experience
extreme changes in temperature or humidity.
•
Avoid locations where dust or harmful gases are present and
avoid direct sunlight.
•
Reinspect for rust on leads and solderability of product that has
been stored for a long time.
Cautions for Testing and Handling
When tests are carried out during inspection testing and other
standard test periods, protect the product from power surges from
the testing device, shorts between adjacent product packages,
and shorts to the heatsink.
Remarks About Using Silicone Grease with a Heatsink
• Ensure there are no foreign objects between the heatsink and thermal
pad; only silicone thermal grease is allowed.
•
When silicone grease is used in mounting this product with
a heatsink, grease shall be applied evenly and thinly. If more
silicone grease than required is applied, it may produce stress.
•
Volatile-type silicone greases may permeate the product and
produce cracks after long periods of time, resulting in reduced
heat radiation effect, and possibly shortening the lifetime of the
product.
•
Hard silicone greases may cause cracks in the product when
screwing the product to a heatsink.
•
Our recommended silicone greases for heat radiation purposes,
which will not cause any adverse effect on the product life, are
indicated below:
Type
Suppliers
G746
Shin-Etsu Chemical Co., Ltd.
YG6260
SC102
Momentive Performance Materials
Dow Corning Toray Silicone Co., Ltd.
Soldering
•
When soldering the product, please be sure to minimize the
working time, within the following limits:
260±5°C 10 s
380±5°C 5 s
• Soldering iron should be at a distance of at least 1.5 mm from the
body of the product
Electrostatic Discharge
•
When handling the product, operator must be grounded.
Grounded wrist straps worn should have at least 1 MΩ of
resistance to ground to prevent shock hazard.
•
Workbenches where the product is handled should be grounded
and be provided with conductive table and floor mats.
•
When using measuring equipment such as a curve tracer, the
equipment should be grounded.
•
When soldering the product, the head of soldering irons or the
solder bath must be grounded in other to prevent leak voltages
generated by them from being applied to the product.
•
The product should always be stored and transported in our
shipping containers or conductive containers, or be wrapped in
aluminum foil.
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
10
SCM1104M
High Voltage 3-Phase Motor Driver
The products described herein are manufactured in Japan by Sanken Electric Co., Ltd. for sale by Allegro MicroSystems, Inc.
Sanken and Allegro reserve the right to make, from time to time, such departures from the detail specifications as may be required to permit improvements in the performance, reliability, or manufacturability of its products. Therefore, the user is cautioned to verify that the information in this
publication is current before placing any order.
When using the products described herein, the applicability and suitability of such products for the intended purpose shall be reviewed at the users
responsibility.
Although Sanken undertakes to enhance the quality and reliability of its products, the occurrence of failure and defect of semiconductor products at
a certain rate is inevitable.
Users of Sanken products are requested to take, at their own risk, preventative measures including safety design of the equipment or systems
against any possible injury, death, fires or damages to society due to device failure or malfunction.
Sanken products listed in this publication are designed and intended for use as components in general-purpose electronic equipment or apparatus
(home appliances, office equipment, telecommunication equipment, measuring equipment, etc.). Their use in any application requiring radiation
hardness assurance (e.g., aerospace equipment) is not supported.
When considering the use of Sanken products in applications where higher reliability is required (transportation equipment and its control systems
or equipment, fire- or burglar-alarm systems, various safety devices, etc.), contact a company sales representative to discuss and obtain written confirmation of your specifications.
The use of Sanken products without the written consent of Sanken in applications where extremely high reliability is required (aerospace equipment, nuclear power-control stations, life-support systems, etc.) is strictly prohibited.
The information included herein is believed to be accurate and reliable. Application and operation examples described in this publication are given
for reference only and Sanken and Allegro assume no responsibility for any infringement of industrial property rights, intellectual property rights, or
any other rights of Sanken or Allegro or any third party that may result from its use.
Anti radioactive ray design is not considered for the products listed herein.
The contents in this document must not be transcribed or copied without Sanken’s written consent.
Copyright ©2007-2010 Allegro MicroSystems, Inc.
This datasheet is based on Sanken datasheet SSJ-03461
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
11