SCM1240M High Voltage, High Current 3-Phase Motor Drivers Features and Benefits Description ▪ Each half-bridge circuit consists of a pre-driver circuit that is completely independent from the others ▪ 10 to 30 A continuous output IPM in a small-footprint package ▪ Protection against simultaneous high- and low-side turning on ▪ Bootstrap diodes with series resistors for suppressing inrush current are incorporated ▪ CMOS compatible input (3.3 to 5 V) ▪ Designed to minimize simultaneous current through both high- and low-side IGBTs by optimizing gate drive resistors ▪ Integrated Fast Recovery Diode (FRD) as freewheeling diode for each IGBT ▪ UVLO protection with auto restart ▪ Thermal shutdown (TSD) with auto restart ▪ Fault (F̄¯¯Ō¯ indicator) signal output at protection activation: UVLO (low side only), OCP, STP, and TSD ▪ Proprietary power DIP package ▪ UL Recognized Component (File No.: E118037) The SCM1240M inverter power module (IPM) devices provide a robust, highly-integrated solution for optimally controlling 3-phase motor power inverter systems and variable speed control systems used in energy-conserving designs to drive motors of residential and commercial appliances. These ICs take 85 to 253 VAC input voltage, and 10 to 30 A (continuous) output current. They can withstand voltages of up to 600 V (IGBT breakdown voltage). Applications include residential white goods (home appliances) and commercial appliance motor control, such as: ▪ Air conditioner compressor motor ▪ Air conditioner fan motor ▪ Refrigerator compressor motor ▪ Washing machine main motor Packages: Power DIP Not to scale Fully molded LF 2551 The high current SCM1240M employs a new, small-footprint proprietary DIP package. The IC itself consists of all of the necessary power elements (six IGBTs), pre-drive ICs (three), and freewheeling diodes (six), needed to configure the main circuit of an inverter, as well as a bootstrap circuit (three bootstrap diodes and three boot resistors) as a high-side drive power supply. This enables the main circuit of the inverter to be configured with fewer external components than traditional designs. Heatsink pad LF2552 Functional Block Diagram One of three phases SCM1240M VB VBB HS RB BootDi UV Detect VCC HIN Input Logic LIN COM UV Detect Level Shift FRD Drive Circuit U,V,W Drive Circuit STP FO OCP MIC O.C. Protect Thermal Protect FRD Figure 1. Diagram of one of three phases in the device. SCM1240MDS-Rev. 5 SANKEN ELECTRIC CO., LTD. http://www.sanken-ele.co.jp/en/ LS SCM1240M High Voltage, High Current 3-Phase Motor Drivers Selection Guide Package Packing IGBT Breakdown Voltage, VCES(min) (V) SCM1241M Fully Molded 10 pieces per tube 600 SCM1243MF Heatsink Pad 10 pieces per tube 600 SCM1245MF Heatsink Pad 10 pieces per tube SCM1246MF Heatsink Pad 10 pieces per tube Part Number IGBT Saturation Voltage, VCE(sat)(typ) (V) Output Current Continuous, IO(max) (A) Pulsed, IOP (max) (A) 1.7 10 20 1.7 15 30 600 1.7 20 30 600 1.7 30 45 Absolute Maximum Ratings, valid at TA = 25°C Characteristic Supply Voltage Supply Voltage (Surge) Symbol Remarks Rating Units VDC Between VBB and LS1, LS2, and LS3 450 V VDC(surge) Between VBB and LS1, LS2, and LS3 500 V IGBT Breakdown Voltage VCES VCC = 15 V, IC = 1 mA, VIN = 0 V 600 V Logic Supply Voltage VCC Between VCC and COM 20 V Boot-strap Voltage VBS Between VB and HS (U,V,W) 20 V Output Current, Continuous Output Current, Pulsed IO IOP SCM1241M TCase = 25°C 10 Adc SCM1243MF TCase = 25°C 15 Adc SCM1245MF TCase = 25°C 20 Adc SCM1246MF TCase = 25°C 30 Adc SCM1241M Pulse Width ≤ 1 ms 20 A SCM1243MF Pulse Width ≤ 1 ms 30 A SCM1245MF Pulse Width ≤ 1 ms 30 A SCM1246MF Pulse Width ≤ 1 ms 45 A –0.5 to 7 V Input Voltage VIN HIN, LIN, and OCP ¯¯Ō ¯ Terminal Voltage F̄ VFO ¯¯Ō ¯ and COM Between F̄ SCM1241M R(j-c)Q Thermal Resistance, Junction-to-Case SCM1243MF SCM1245MF SCM1246MF 1 element operation (IGBT) SCM1241M R(j-c)F SCM1243MF SCM1245MF SCM1246M 1 element operation (FRD) 7 V 6.0 °C/W 3.0 °C/W 6.5 °C/W 4.0 °C/W Case Operating Temperature TOPC –20 to 100 °C Junction Temperature (IGBT) TJ 150 °C Storage Temperature Tstg Isolation Voltage Viso Between exposed thermal pad and each pin; 1 minute, ac –40 to 150 °C 2000 Vrms All performance characteristics given are typical values for circuit or system baseline design only and are at the nominal operating voltage and an ambient temperature, TA, of 25°C, unless otherwise stated. SCM1240MDS-Rev. 5 SANKEN ELECTRIC CO., LTD. 2 SCM1240M High Voltage, High Current 3-Phase Motor Drivers Recommended Operating Conditions Characteristic Symbol Remarks Min. Typ. Max. Units – 300 400 V Between VCC and COM 13.5 – 16.5 V Between VB and HS 13.5 – 16.5 V tINmin(on) On pulse 0.5 – – μs tINmin(off) Off pulse 0.5 – – μs Main Supply Voltage VDC Between VBB and LS Logic Supply Voltage VCC Logic Supply Voltage VBS Minimum Input Pulse Width Dead Time* tdead 1.0 – – μs ¯¯Ō ¯ Pull-up Resistor F̄ RFO 1 – 22 kΩ ¯¯Ō ¯ Pull-up Voltage F̄ VFO 3.0 – 5.5 V Bootstrap Capacitor CBOOT 10 – 220 μF SCM1241M For IP ≤ 20 A 27 – – mΩ SCM1243MF SCM1245MF SCM1246MF For IP ≤ 30 A 15 – – mΩ Shunt Resistor RS RC Filter Resistor RO – – 100 Ω RC Filter Capacitor CO – – 2200 pF PWM Carrier Frequency fC – – 20 kHz Junction Temperature TJ – – 125 °C *Dead Time must be controlled from an external source. SCM1240MDS-Rev. 5 SANKEN ELECTRIC CO., LTD. 3 SCM1240M High Voltage, High Current 3-Phase Motor Drivers Typical Application Diagram Typical application utilizing one shunt resistor, RS VCC CP CBOOT (7) VB1 (8) HS1 (31) RB BootDi (6) ZD CP UV Detect VCC1 (5) HIN1 (3) LIN1 (4) COM1 (1) FO1 UV Detect Level Shift Input Logic CBOOT OCP1 (15) VB2 (16) HS2 Controller LIN2 (12) COM2 (9) FO2 UV Detect UV Detect Level Shift Input Logic STP CBOOT OCP2 (23) VB3 (24) HS3 INT (19) LIN3 COM3 (17) FO3 FRD (30) Thermal Protect LS2 RB UV Detect VCC3 (20) M V (25) (22) HIN3 (29) MIC2 BootDi (21) FRD Drive Circuit Drive Circuit O.C. Protect (10) LS1 (28) VCC2 HIN2 (33) FRD Thermal Protect RB (14) (11) (32) MIC１ BootDi (13) U Drive Circuit STP O.C. Protect (2) FRD Drive Circuit Input Logic VBB UV Detect Level Shift STP FRD Drive Circuit (26) Drive Circuit W Thermal Protect FRD (27) CS VFO (18) RFO OCP3 O.C. Protect LS3 MIC3 A/D RO CFO CO DRS RS COM See application notes on next page. SCM1240MDS-Rev. 5 SANKEN ELECTRIC CO., LTD. 4 SCM1240M High Voltage, High Current 3-Phase Motor Drivers Notes for Typical Application Diagram ▪ To use the OCP circuit shown in the Typical Application drawing, an external shunt resistor, RS, is needed. The RS value depends on how many low-side IGBTs turn on simultaneously. However, the low pass filter causes an additional delay to detecting an overcurrent condition of the SCM1240M, and if the total delay exceeds 1.7 μs, permanent damage to the SCM1240M may result. ▪ To avoid malfunction, the wiring between the LS and COM pins should be as short as possible. ▪ To prevent surge destruction, put a 0.01 to 1 μF snubber capacitor, CS, in parallel with the electrolytic capacitor. ▪ To prevent surge destruction, put a 18 to 20 V Zener diode between the VCC and COM pins. ▪ To prevent surge malfunction, put a 0.01 to 0.1 μF ceramic capacitor between the VCC and COM pins and the VB and HS pins. ▪ To add an external low pass filter, place RO and CO between the A to D pin of the application controller and shunt resistor RS, ensuring that the time constant of this low pass filter is less than 0.2 μs. The internal OCP circuit has a 1.5 μs (min) filtering delay. ▪ To suppress noise, connect a resistor, RF, and capacitor, CF, to the F̄¯¯Ō¯x pins. Also, when an overcurrent condition is detected, the F̄¯¯Ō¯x pin goes low for 25 μs (typ) as an active low fault flag, and then returns up to its normal state. It is recommended to connect the F̄¯¯Ō¯x pin directly to an interrupt pin of the external controller, to ensure the 25 μs interval is detected. SCM1240MDS-Rev. 5 ▪ To provide the best thermal shutdown protection (TSD), it is strongly recommended that the three F̄¯¯Ō¯x pins be tied together. In this way an overtemperature event (internal temperature rise above 150°C) in any of the three phases will cause all three phases to shut down. If the F̄¯¯Ō¯x pins are not tied together, but are independently pulled up to +5 V, the TSD function for each phase shuts down only that phase. SANKEN ELECTRIC CO., LTD. 5 SCM1240M High Voltage, High Current 3-Phase Motor Drivers ELECTRICAL CHARACTERISTICS, valid at TA=25°C, unless otherwise noted Characteristics Symbol Conditions Min Typ Max Units Logic Supply Voltage VCC Between VCC and COM 13.5 – 16.5 V Logic Supply Current ICC VCC = 15 V, 3 phases operating – 3 – mA Bootstrap Supply Current Input Voltage Input Voltage Hysteresis Input Current Undervoltage Lock Out (High Side) Undervoltage Lock Out (Low Side) ¯¯Ō ¯ Terminal Output Voltage F̄ Overcurrent Protection Trip Voltage Overcurrent Protection Hold Time IBS VB – HS = 15 V, one phase operating – 140 – μA VIH VCC = 15 V, output on – 2.0 2.5 V VIL VCC = 15 V, output off 1.0 1.5 – V VIhys VCC = 15 V – 0.5 – V IIHH VCC = 15 V, VIN = 5 V – 230 500 μA IILH VCC = 15 V, VIN = 0 V – – 2 μA 10.0 11.0 12.0 V 10.5 11.5 12.5 V 10.0 11.0 12.0 V 10.5 11.5 12.5 V – – 0.5 V UVHL UVHH UVLL UVLH VFOL VFOH VCC = 15 V VCC = 15 V VCC = 15 V, VFO = 5 V, RFO = 10 kΩ VTRIP VCC = 15 V tP VCC = 15 V 4.8 – – V 0.46 0.50 0.54 V 20 25 – μs 135 150 165 °C 105 120 135 °C – 1.65 – μs Overtemperature Protection Activation and Releasing Temperature TDH Blanking Time tblank VCC = 15 V IGBT Breakdown Voltage VCES VCC = 15 V, IC = 1 mA, VIN = 0 V 600 – – V IGBT Leakage Current ICES VCC = 15 V, VCE = 600 V, VIN = 0 V – – 1 mA SCM1241M VCC = 15 V, IC = 10 A, VIN = 5 V – 1.7 2.2 V SCM1243MF VCC = 15 V, IC = 15 A, VIN = 5 V – 1.7 2.2 V SCM1245MF VCC = 15 V, IC = 20 A, VIN = 5 V – 1.7 2.2 V IGBT Saturation Voltage TDL VCE(sat) VCC = 15 V SCM1246MF VCC = 15 V, IC = 30 A, VIN = 5 V – 1.7 2.2 V SCM1241M VCC = 15 V, IF = 10 A, VIN = 0 V – 1.9 2.4 V SCM1243MF VCC = 15 V, IF = 15 A, VIN = 0 V – 1.75 2.2 V SCM1245MF VCC = 15 V, IF = 20 A, VIN = 0 V – 1.9 2.4 V SCM1246MF VCC = 15 V, IF = 30 A, VIN = 0 V Diode Forward Voltage VF – 1.5 2.0 V Diode Recovery Time (Bootstrap) trr IF = IRECOVERY(PEAK) = 100 mA – 70 – ns Diode Leakage Current (Boot Strap) IIB VR = 600 V – – 10 μA Diode Forward Voltage (Boot Strap) VFB IF = 0.15 A – 1.1 1.3 V Diode Series Resistor (Boot Strap) RB 17.6 22.0 26.4 Ω Continued on the next page… SCM1240MDS-Rev. 5 SANKEN ELECTRIC CO., LTD. 6 SCM1240M High Voltage, High Current 3-Phase Motor Drivers ELECTRICAL CHARACTERISTICS, valid at TA=25°C, unless otherwise noted Characteristics Symbol Conditions Min Typ Max Units – 590 – ns – 80 – ns – 60 – ns tdH(off) – 550 – ns tfH – 90 – ns tdH(on) – 600 – ns – 70 – ns – 70 – ns tdH(off) – 620 – ns tfH – 60 – ns tdH(on) – 695 – ns trH – 95 – ns tdH(on) trH trrH SCM1241M trH trrH High Side Switching Time trrH SCM1243MF SCM1245MF VDC = 300 V, VCC = 15 V, IC = 10 A, inductive load; HIN = 05 V or 50 V VDC = 300 V, VCC = 15 V, IC = 15 A, inductive load; HIN = 05 V or 50 V VDC = 300 V, VCC = 15 V, IC = 20 A, inductive load; HIN = 05 V or 50 V – 75 – ns tdH(off) – 675 – ns tfH – 55 – ns tdH(on) – 660 – ns trH – 110 – ns SCM1246MF VDC = 300 V, VCC = 15 V, IC = 30 A, inductive load; HIN = 05 V or 50 V – 60 – ns tdH(off) – 700 – ns tfH – 50 – ns trrH Continued on the next page… SCM1240MDS-Rev. 5 SANKEN ELECTRIC CO., LTD. 7 SCM1240M High Voltage, High Current 3-Phase Motor Drivers ELECTRICAL CHARACTERISTICS, valid at TA=25°C, unless otherwise noted Characteristics Symbol Min Typ Max tdL(on) Conditions – 570 – ns trL – 100 – ns trrL SCM1241M – 70 – ns tdL(off) – 560 – ns tfL – 100 – ns tdL(on) – 600 – ns – 100 – ns – 80 – ns tdL(off) – 600 – ns tfL – 70 – ns trL trrL Low Side Switching Time VDC = 300 V, VCC = 15 V, IC = 10 A, inductive load; LIN = 05 V or 50 V Units SCM1243MF VDC = 300 V, VCC = 15 V, IC = 15 A, inductive load; LIN = 05 V or 50 V tdL(on) – 715 – ns trL – 135 – ns – 115 – ns tdL(off) – 670 – ns tfL – 50 – ns trrL SCM1245MF VDC = 300 V, VCC = 15 V, IC = 20 A, inductive load; LIN = 05 V or 50 V tdL(on) – 660 – ns trL – 150 – ns SCM1246MF VDC = 300 V, VCC = 15 V, IC = 30 A, inductive load; LIN = 05 V or 50 V – 70 – ns tdL(off) – 690 – ns tfL – 50 – ns trrL VIN trr t(on) Switching Timing Definitions td(on) tr 90% t(off) td(off) tf 90% VCE IC SCM1240MDS-Rev. 5 10% SANKEN ELECTRIC CO., LTD. 10% 8 SCM1240M High Voltage, High Current 3-Phase Motor Drivers Input-Output Truth Table Mode Normal1 TSD OCP VCCx UVLO2 VBx UVLO3 ¯¯Ō ¯ x Low F̄ HINx LINx High-side MOSFET Low-side MOSFET L L Off Off H L On Off L H Off On H H Off Off L L Off Off H L Off Off L H Off Off H H Off Off Off L L Off H L Off Off L H Off Off H H Off Off L L Off Off H L Off Off L H Off Off H H Off Off L L Off Off H L Off Off L H Off On H H Off Off L L Off Off H L Off Off L H Off Off H H Off Off 1In the case where a pair of HINx and LINx signals are asserted at the same time, the shoot-through prevention feature sets both the high-side and the low-side IGBTs off. 2After the VCCx power rail recovers from a UVLO condition, a rising edge of HINx starts driving the highside IGBT (edge trigger). On the other hand, after the UVLO condition is released, the input level of the LINx pins reflects the state of the low-side IGBTs (level trigger). 3After the VBx power rail recovers from a UVLO condition, a rising edge of HINx starts driving the highside IGBT (edge trigger). SCM1240MDS-Rev. 5 SANKEN ELECTRIC CO., LTD. 9 SCM1240M High Voltage, High Current 3-Phase Motor Drivers Pin-out Diagram 25 33 Branded Side 24 1 (Bottom View) Terminal List Table Name 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 SCM1240MDS-Rev. 5 32 Number ¯¯Ō ¯1 F̄ OCP1 LIN1 COM1 HIN1 VCC1 VB1 HS1 ¯¯Ō ¯2 F̄ OCP2 LIN2 COM2 HIN2 VCC2 VB2 HS2 ¯¯Ō ¯3 F̄ OCP3 LIN3 COM3 HIN3 VCC3 VB3 HS3 VBB W LS3 VBB V LS2 VBB U 33 LS1 Function U phase fault output for overcurrent and UVLO detected Input for U phase overcurrent protection Signal input for low-side U phase (active high) Supply ground for U phase IC Signal input for high-side U phase (active high) Supply voltage for U phase IC High-side floating supply voltage for U phase High-side floating supply ground for U phase V phase fault output for overcurrent and UVLO detected Input for V phase overcurrent protection Signal input for low-side V phase (active high) Supply ground for V phase IC Signal input for high-side V phase (active high) Supply voltage for V phase IC High-side floating supply voltage for V phase High-side floating supply ground for V phase W phase fault output for overcurrent and UVLO detected Input for W phase overcurrent protection Signal input for low-side W phase (active high) Supply ground for W phase IC Signal input for high-side W phase (active high) Supply voltage for W phase IC High-side floating supply voltage for W phase High-side floating supply ground for W phase Positive DC bus supply voltage Output for W phase Negative DC bus supply ground for W phase (Pin trimmed) positive DC bus supply voltage Output for V phase Negative DC bus supply ground for V phase (Pin trimmed) positive DC bus supply voltage Output for U phase Negative DC bus supply ground for U phase SANKEN ELECTRIC CO., LTD. 10 SCM1240M High Voltage, High Current 3-Phase Motor Drivers Timing Diagrams (one phase of three phases) High-Side Driver Input/Output and UVLO Protection VCC = 15 V Low-Side Driver Input/Output and UVLO Protection VB – HS = 15 V HIN HIN LIN LIN UVHL UVHH VCC HO HO LO LO FO UVLH UVLL VB- HS *No FO output at H-side UVLO. *HO starts from positive edge after UVLO release. FO * LO starts after UVLO release Shoot-Through Prevention VCC, VB – HS = 15 V Thermal Shutdown HIN HIN LIN LIN TDH Tmic VCC, VB TDL HO HO LO LO FO FO * Tmic is the temperature of the predriver IC (MIC) * HO and LO start after TSD release * While both HIN and LIN are in high state HO and LO turn off and FO signals out. Overcurrent Protection HIN … LIN … HO LO Vtrip (0.5 V TYP) OCP BlankingTime (1.65 μs TYP) FO 20 μs(min) * HO and LO start after OCP release SCM1240MDS-Rev. 5 SANKEN ELECTRIC CO., LTD. 11 SCM1240M High Voltage, High Current 3-Phase Motor Drivers PACKAGE OUTLINE DRAWING 0.5 (2.6) C 0.5 C 8 x P5.1 = 40.8 4.4 ±0.3 1.2 ±0.2 47 ±0.3 MAX 1.2 15.95 ±0.5 Ø3.2 ±0.15 43.3 ±0.3 2.08 ±0.2 5 x P1.27 = 6.35 3.24 3.7 1.27 3.7 D (0.6) (2.6) 1.27 11.2 ±0.5 D 2 +0.2 –0.1 C–C 0.5 +0.2 –0.1 Pin pitch measured at root Cu Thermal Pad B–B 0.7 +0.2 –0.1 A–A Leadform: 2551 (SCM1241M: Fully molded) or 2552 (SCM1243MF, SCM1245MF, SCM1246MF: Exposed copper thermal pad) Dimensions in millimeters The body shall be clean and shall not bear any stain, rust or flaw. The type number and lot number shall be clearly stamped by laser on the body so that cannot be erased easily. 0.6 +0.2 –0.1 0.5 +0.2 –0.1 2.57 3.7 1.27 B 5 x P1.27 = 6.35 +0.2 0.5 –0.1 5 x P1.27 = 6.35 (Top View) (5°) B 0.5 +0.2 –0.1 Two different types of marks to be used: Mark 1: Mark 2: B 11.45 ±0.5 A 12.25 ±0.5 17.25 ±0.5 Branding Area JAPAN (5°) A 19 ±0.3 (Bottom View) 2 +0.5 0 A 1.2 +0.2 –0.1 D–D Branding codes (exact appearance at manufacturer discretion): Section A, type: SCM124xMF or SCM1241M Section B, lot: YMDDT Where: Y is the last digit of the year of manufacture M is the month (1 to 9, O, N, D) DD is the date T is the tracking letter (A to Z) Device composition complies with the RoHS directive. SCM1240MDS-Rev. 5 SANKEN ELECTRIC CO., LTD. 12 SCM1240M High Voltage, High Current 3-Phase Motor Drivers 0.5 (2.6) C 0.5 C 8 x P5.1 = 40.8 4.4 ±0.3 1.2 ±0.2 47 ±0.3 MAX 1.2 15.95 ±0.5 Ø3.2 ±0.15 43.3 ±0.3 B 2.08 ±0.2 5 x P1.27 = 6.35 3.24 3.7 1.27 3.7 D (0.6) (2.6) 1.27 D 2 +0.2 –0.1 C–C 0.5 +0.2 –0.1 Pin pitch measured at root Cu Thermal Pad B–B 0.7 +0.2 –0.1 A–A Leadform: 2557 (SCM1241M: Fully molded) or (SCM1243MF, SCM1245MF, SCM1246MF: Exposed copper thermal pad) Dimensions in millimeters The body shall be clean and shall not bear any stain, rust or flaw. The type number and lot number shall be clearly stamped by laser on the body so that cannot be erased easily. 0.6 +0.2 –0.1 0.5 +0.2 –0.1 2.57 3.7 1.27 14 to 14.8 5 x P1.27 = 6.35 0.5 +0.2 –0.1 5 x P1.27 = 6.35 (Top View) (5°) B 0.5 +0.2 –0.1 Two different types of marks to be used: Mark 1: Mark 2: B 12.25 ±0.5 17.25 ±0.5 A 11.45 ±0.5 Branding Area JAPAN (5°) A 19 ±0.3 (Bottom View) 2 +0.5 0 A 1.2 +0.2 –0.1 D–D Branding codes (exact appearance at manufacturer discretion): Section A, type: SCM124xMF or SCM1241M Section B, lot: YMDDT Where: Y is the last digit of the year of manufacture M is the month (1 to 9, O, N, D) DD is the date T is the tracking letter (A to Z) Device composition complies with the RoHS directive. SCM1240MDS-Rev. 5 SANKEN ELECTRIC CO., LTD. 13 SCM1240M High Voltage, High Current 3-Phase Motor Drivers 0.5 (2.6) C 0.5 C 8 x P5.1 = 40.8 4.4 ±0.3 1.2 ±0.2 47 ±0.3 (5°) MAX 1.2 Branding Area 15.95 ±0.5 Ø3.2 ±0.15 43.3 ±0.3 2.08 ±0.2 5 x P1.27 = 6.35 3.24 3.7 1.27 3.7 D (0.6) (2.6) 1.27 11.2 ±0.5 D 2 +0.2 –0.1 C–C 0.5 +0.2 –0.1 Pin pitch measured at root Cu Thermal Pad B–B 0.7 +0.2 –0.1 A–A Leadform: 2558 (SCM1241M: Fully molded) or (SCM1243MF, SCM1245MF, SCM1246MF: Exposed copper thermal pad) Dimensions in millimeters The body shall be clean and shall not bear any stain, rust or flaw. The type number and lot number shall be clearly stamped by laser on the body so that cannot be erased easily. 0.6 +0.2 –0.1 0.5 +0.2 –0.1 2.57 3.7 1.27 B 5 x P1.27 = 6.35 0.5 +0.2 –0.1 5 x P1.27 = 6.35 (Top View) (5°) B 0.5 +0.2 –0.1 Two different types of marks to be used: Mark 1: Mark 2: B 11.45 ±0.5 A JAPAN 14.75 ±0.5 17.25 ±0.5 A 19 ±0.3 (Bottom View) 2 +0.5 0 A 1.2 +0.2 –0.1 D–D Branding codes (exact appearance at manufacturer discretion): Section A, type: SCM124xMF or SCM1241M Section B, lot: YMDDT Where: Y is the last digit of the year of manufacture M is the month (1 to 9, O, N, D) DD is the date T is the tracking letter (A to Z) Device composition complies with the RoHS directive. SCM1240MDS-Rev. 5 SANKEN ELECTRIC CO., LTD. 14 SCM1240M High Voltage, High Current 3-Phase Motor Drivers MECHANICAL CHARACTERISTICS Characteristic Remarks Min. Typ. Max. Units 58.8 – 78.4 N•cm kgf•cm Heatsink Mounting Screw Torque Use one M3 screw each end 6.0 – 8.0 Flatness of Heatsink Attachment Area Refer to figure below 0 – 200 μm SCM1241M – 10.8 – g SCM124xMF – 11.8 – g Package Weight Flatness Measurement Position (Top View) ＋ ＋ − − ＋ SCM1240MDS-Rev. 5 ＋ SANKEN ELECTRIC CO., LTD. 15 SCM1240M High Voltage, High Current 3-Phase Motor Drivers PACKING SPECIFICATION Dimensions in millimeters : Tube type SCM-A Maximum 10 pieces per tube Pins aligned along X direction Rubber plug at each end Maximum 5 tubes in Y direction Maximum 5 tubes in Z direction < ; SCM1240MDS-Rev. 5 Maximum pieces per carton: 10 pieces per tube 5 rows of tubes x 5 layers of tubes 250 pieces per carton SANKEN ELECTRIC CO., LTD. 16 SCM1240M High Voltage, High Current 3-Phase Motor Drivers WARNING — These devices are designed to be operated at lethal voltages and energy levels. Circuit designs that embody these components must conform with applicable safety requirements. Precautions must be taken to prevent accidental contact with power-line potentials. Do not connect grounded test equipment. The use of an isolation transformer is recommended during circuit development and breadboarding. Because reliability can be affected adversely by improper storage environments and handling methods, please observe the following cautions. Cautions for Storage • Ensure that storage conditions comply with the standard temperature (5°C to 35°C) and the standard relative humidity (around 40 to 75%); avoid storage locations that experience extreme changes in temperature or humidity. • Avoid locations where dust or harmful gases are present and avoid direct sunlight. • Reinspect for rust on leads and solderability of product that has been stored for a long time. Cautions for Testing and Handling • When tests are carried out during inspection testing and other standard test periods, protect the product from power surges from the testing device, shorts between adjacent product packages, and shorts to the heatsink. • The screwing torque for attaching a heatsink shall be 58.8 to 78.4 N•cm (6.0 to 8.0 Kgf•cm). • Ensure there are no foreign objects between the heatsink and thermal pad; only silicone thermal grease is allowed. Remarks About Using Silicone Grease with a Heatsink • When silicone grease is used in mounting this product with a heatsink, grease shall be applied evenly and thinly. If more silicone grease than required is applied, it may produce stress. • Volatile-type silicone greases may permeate the product and produce cracks after long periods of time, resulting in reduced heat radiation effect, and possibly shortening the lifetime of the product. • Hard silicone greases may cause cracks in the product when screwing the product to a heatsink. SCM1240MDS-Rev. 5 • Our recommended silicone greases for heat radiation purposes, which will not cause any adverse effect on the product life, are indicated below: Type G746 YG6260 Suppliers Shin-Etsu Chemical Co., Ltd. Momentive Performance Materials Holding, Inc. SC102 Dow Corning Toray Silicone Co., Ltd. Soldering • When soldering the product, please be sure to minimize the working time, within the following limits: 260±5°C 10 s 380±5°C 5 s • Soldering iron should be at a distance of at least 1.5 mm from the body of the product Electrostatic Discharge • When handling the product, operator must be grounded. Grounded wrist straps worn should have at least 1 MΩ of resistance to ground to prevent shock hazard. • Workbenches where the product is handled should be grounded and be provided with conductive table and floor mats. • When using measuring equipment such as a curve tracer, the equipment should be grounded. • When soldering the product, the head of soldering irons or the solder bath must be grounded in other to prevent leak voltages generated by them from being applied to the product. • The product should always be stored and transported in our shipping containers or conductive containers, or be wrapped in aluminum foil. SANKEN ELECTRIC CO., LTD. 17 SCM1240M High Voltage, High Current 3-Phase Motor Drivers • The contents in this document are subject to changes, for improvement and other purposes, without notice. Make sure that this is the latest revision of the document before use. • Application and operation examples described in this document are quoted for the sole purpose of reference for the use of the products herein and Sanken can assume no responsibility for any infringement of industrial property rights, intellectual property rights or any other rights of Sanken or any third party which may result from its use. • Although Sanken undertakes to enhance the quality and reliability of its products, the occurrence of failure and defect of semiconductor products at a certain rate is inevitable. Users of Sanken products are requested to take, at their own risk, preventative measures including safety design of the equipment or systems against any possible injury, death, fires or damages to the society due to device failure or malfunction. • Sanken products listed in this document are designed and intended for the use as components in general purpose electronic equipment or apparatus (home appliances, office equipment, telecommunication equipment, measuring equipment, etc.). When considering the use of Sanken products in the applications where higher reliability is required (transportation equipment and its control systems, traffic signal control systems or equipment, fire/crime alarm systems, various safety devices, etc.), and whenever long life expectancy is required even in general purpose electronic equipment or apparatus, please contact your nearest Sanken sales representative to discuss, prior to the use of the products herein. The use of Sanken products without the written consent of Sanken in the applications where extremely high reliability is required (aerospace equipment, nuclear power control systems, life support systems, etc.) is strictly prohibited. • In the case that you use our semiconductor devices or design your products by using our semiconductor devices, the reliability largely depends on the degree of derating to be made to the rated values. Derating may be interpreted as a case that an operation range is set by derating the load from each rated value or surge voltage or noise is considered for derating in order to assure or improve the reliability. In general, derating factors include electric stresses such as electric voltage, electric current, electric power etc., environmental stresses such as ambient temperature, humidity etc. and thermal stress caused due to self-heating of semiconductor devices. For these stresses, instantaneous values, maximum values and minimum values must be taken into consideration. In addition, it should be noted that since power devices or IC’s including power devices have large self-heating value, the degree of derating of junction temperature (TJ) affects the reliability significantly. • When using the products specified herein by either (i) combining other products or materials therewith or (ii) physically, chemically or otherwise processing or treating the products, please duly consider all possible risks that may result from all such uses in advance and proceed therewith at your own responsibility. • Anti radioactive ray design is not considered for the products listed herein. • Sanken assumes no responsibility for any troubles, such as dropping products caused during transportation out of Sanken’s distribution network. • The contents in this document must not be transcribed or copied without Sanken’s written consent. SCM1240MDS-Rev. 5 SANKEN ELECTRIC CO., LTD. 18