HEF4040B-Q100 12-stage binary ripple counter Rev. 1 — 4 April 2013 Product data sheet 1. General description The HEF4040B-Q100 is a 12-stage binary ripple counter with a clock input (CP), an overriding asynchronous master reset input (MR) and twelve fully buffered outputs (Q0 to Q11). The counter advances on the HIGH-to-LOW transition of CP. A HIGH on MR clears all counter stages and forces all outputs LOW, independent of CP. Each counter stage is a static toggle flip-flop. The clock input is highly tolerant of slow rise and fall times due to its Schmitt trigger action. It operates over a recommended VDD power supply range of 3 V to 15 V referenced to VSS (usually ground). Unused inputs must be connected to VDD, VSS, or another input. This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 3) and is suitable for use in automotive applications. 2. Features and benefits Automotive product qualification in accordance with AEC-Q100 (Grade 3) Specified from 40 C to +85 C Tolerant of slow clock rise and fall time Fully static operation 5 V, 10 V, and 15 V parametric ratings Standardized symmetrical output characteristics ESD protection: MIL-STD-883, method 3015 exceeds 2000 V HBM JESD22-A114F exceeds 2000 V MM JESD22-A115-A exceeds 200 V (C = 200 pF, R = 0 ) Complies with JEDEC standard JESD 13-B 3. Applications Frequency dividing circuits Time delay circuits Control counters HEF4040B-Q100 NXP Semiconductors 12-stage binary ripple counter 4. Ordering information Table 1. Ordering information All types operate from 40 C to +85 C. Type number Package Name HEF4040BT-Q100 SO16 Description Version plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 5. Functional diagram CP MR 10 11 T 12-STAGE COUNTER CD 9 7 6 5 3 2 4 13 12 14 15 1 Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7 Q8 Q9 Q10 Q11 001aad589 Fig 1. Functional diagram FF 1 Q CP FF 2 Q T FF 12 Q T Q CD T Q Q CD CD MR Q0 Q1 Q11 001aae615 Fig 2. Logic diagram HEF4040B_Q100 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 4 April 2013 © NXP B.V. 2013. All rights reserved. 2 of 13 HEF4040B-Q100 NXP Semiconductors 12-stage binary ripple counter 1 2 4 8 16 32 64 128 256 512 1024 2048 4096 CP input MR input Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7 Q8 Q9 Q10 Q11 001aad587 Fig 3. Timing diagram 6. Pinning information 6.1 Pinning +()%4 4 9'' 4 4 4 4 4 4 4 4 4 05 4 &3 966 4 DDD Fig 4. Pin configuration HEF4040B_Q100 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 4 April 2013 © NXP B.V. 2013. All rights reserved. 3 of 13 HEF4040B-Q100 NXP Semiconductors 12-stage binary ripple counter 6.2 Pin description Table 2. Pin description Symbol Pin Description VSS 8 ground supply voltage Q0 to Q11 9, 7, 6, 5, 3, 2, 4, 13, 12, 14, 15, 1 parallel output CP 10 clock input (HIGH-to-LOW edge-triggered) MR 11 master reset input (active HIGH) VDD 16 supply voltage 7. Limiting values Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit 0.5 +18 V - 10 mA 0.5 VDD + 0.5 V - 10 mA VDD supply voltage IIK input clamping current VI input voltage IOK output clamping current II/O input/output current - 10 mA IDD supply current - 50 mA Tstg storage temperature 65 +150 C Tamb ambient temperature 40 +85 C - 500 mW - 100 mW Ptot total power dissipation P power dissipation [1] VI < 0.5 V or VI > VDD + 0.5 V VO < 0.5 V or VO > VDD + 0.5 V [1] per output For SO16 package: Ptot derates linearly with 8 mW/K above 70 C. 8. Recommended operating conditions Table 4. Recommended operating conditions Symbol Parameter VDD VI Conditions Min Typ Max Unit supply voltage 3 - 15 V input voltage 0 - VDD V Tamb ambient temperature in free air 40 - +85 C t/V input transition rise and fall rate VDD = 5 V - - 3.75 ms/V VDD = 10 V - - 0.5 ms/V VDD = 15 V - - 0.08 ms/V HEF4040B_Q100 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 4 April 2013 © NXP B.V. 2013. All rights reserved. 4 of 13 HEF4040B-Q100 NXP Semiconductors 12-stage binary ripple counter 9. Static characteristics Table 5. Static characteristics VSS = 0 V; VI = VSS or VDD; unless otherwise specified. Symbol Parameter VIH VIL VOH VOL IOH IOL HIGH-level input voltage LOW-level input voltage VDD IO < 1 A LOW-level output voltage HIGH-level output current LOW-level output current input leakage current IDD supply current input capacitance HEF4040B_Q100 Product data sheet Tamb = 40 C Tamb = 25 C Tamb = 85 C Min Max Min Max Min Max Unit 5V 3.5 - 3.5 - 3.5 - V 10 V 7.0 - 7.0 - 7.0 - V 15 V 11.0 - 11.0 - 11.0 - V 5V - 1.5 - 1.5 - 1.5 V 10 V - 3.0 - 3.0 - 3.0 V 15 V - 4.0 - 4.0 - 4.0 V 5V 4.95 - 4.95 - 4.95 - V 10 V 9.95 - 9.95 - 9.95 - V 15 V 14.95 - 14.95 - 14.95 - V 5V - 0.05 - 0.05 - 0.05 V 10 V - 0.05 - 0.05 - 0.05 V 15 V - 0.05 - 0.05 - 0.05 V VO = 2.5 V 5V - 1.7 - 1.4 - 1.1 mA VO = 4.6 V 5V - 0.52 - 0.44 - 0.36 mA VO = 9.5 V 10 V - 1.3 - 1.1 - 0.9 mA VO = 13.5 V 15 V - 3.6 - 3.0 - 2.4 mA IO < 1 A HIGH-level output voltage IO < 1 A ILI CI Conditions IO < 1 A VO = 0.4 V 5V 0.52 - 0.44 - 0.36 - mA VO = 0.5 V 10 V 1.3 - 1.1 - 0.9 - mA VO = 1.5 V 15 V 3.6 - 3.0 - 2.4 - mA 15 V - 0.3 - 0.3 - 1.0 A 5V - 20 - 20 - 150 A 10 V - 40 - 40 - 300 A 15 V - 80 - 80 - 600 A - - - - 7.5 - - IO = 0 A All information provided in this document is subject to legal disclaimers. Rev. 1 — 4 April 2013 pF © NXP B.V. 2013. All rights reserved. 5 of 13 HEF4040B-Q100 NXP Semiconductors 12-stage binary ripple counter 10. Dynamic characteristics Table 6. Dynamic characteristics VSS = 0 V; Tamb = 25 C; unless otherwise specified; for test circuit see Figure 6. Symbol Parameter Conditions tPHL HIGH to LOW propagation delay CP Q0 see Figure 5 Qn Qn + 1 MR Qn see Figure 5 LOW to HIGH propagation delay tPLH CP Q0 see Figure 5 Extrapolation formula[1] Min Typ Max Unit 5V 78 ns + (0.55 ns/pF)CL - 105 210 ns 10 V 34 ns + (0.23 ns/pF)CL - 45 90 ns 15 V 27 ns + (0.16 ns/pF)CL - 35 70 ns 5V [2] (0.55 ns/pF)CL - 35 70 ns 10 V [2] (0.23 ns/pF)CL - 15 30 ns 15 V [2] VDD (0.16 ns/pF)CL - 10 20 ns 5V 63 ns + (0.55 ns/pF)CL - 90 180 ns 10 V 29 ns + (0.23 ns/pF)CL - 40 80 ns 15 V 22 ns + (0.16 ns/pF)CL - 30 60 ns 5V 58 ns + (0.55 ns/pF)CL - 85 170 ns 10 V 29 ns + (0.23 ns/pF)CL - 40 80 ns 22 ns + (0.16 ns/pF)CL - 30 60 ns 5V [2] (0.55 ns/pF)CL - 35 70 ns 10 V [2] (0.23 ns/pF)CL - 15 30 ns 15 V [2] (0.16 ns/pF)CL - 10 20 ns 5V [3] 10 ns + (1.00 ns/pF)CL - 60 120 ns 10 V 9 ns + (0.42 ns/pF)CL - 30 60 ns 15 V 6 ns + (0.28 ns/pF)CL 15 V Qn Qn + 1 transition time tt pulse width tW recovery time trec maximum frequency fmax see Figure 5 - 20 40 ns CP input HIGH; minimum width; see Figure 5 5V 50 25 - ns 10 V 30 15 - ns 15 V 20 10 - ns MR input HIGH; minimum width; see Figure 5 5V 40 20 - ns 10 V 30 15 - ns 15 V 20 10 - ns 5V 40 20 - ns 10 V 30 15 - ns 15 V 20 10 - ns 5V 10 20 - MHz 10 V 15 30 - MHz 15 V 25 50 - MHz MR input; see Figure 5 CP input; see Figure 5 [1] The typical values of the propagation delay and transition times are calculated from the extrapolation formulas shown (CL in pF). [2] For loads other than 50 pF at the nth output, use the slope given. [3] tt is the same as tTHL and tTLH. HEF4040B_Q100 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 4 April 2013 © NXP B.V. 2013. All rights reserved. 6 of 13 HEF4040B-Q100 NXP Semiconductors 12-stage binary ripple counter Table 7. Dynamic power dissipation PD PD can be calculated from the formulas shown. VSS = 0 V; tr = tf 20 ns; Tamb = 25 C. Symbol Parameter dynamic power dissipation PD VDD Typical formula for PD (W) where: PD = 400 fi + (fo CL) VDD 5V 2 fi = input frequency in MHz, 10 V PD = 2000 fi + (fo CL) VDD2 fo = output frequency in MHz, 15 V PD = 5200 fi + (fo CL) VDD CL = output load capacitance in pF, 2 VDD = supply voltage in V, (fo CL) = sum of the outputs. 11. Waveforms VI VM MR input VSS 1/fmax tW trec VI VM CP input VSS tPHL tPLH VOH Q0 or Qn output VOL tW tPHL VM tTLH tPLH tPHL tTHL VOH VM Qn + 1 output VOL 001aaj763 Logic levels: VOL and VOH are typical output voltage levels that occur with the output load. Transition times: transition time (tt) = HIGH LOW (tTHL) or LOW HIGH (tTLH) transition times. Measurement points are given in Table 8, test circuit in Figure 6 and test data in Table 9 Fig 5. Waveforms showing propagation delays for MR to Qn and CP to Q0, minimum MR and CP pulse widths Table 8. Measurement points Supply voltage Input VDD VI VM VM 5 V to 15 V VDD or VSS 0.5VDD 0.5VDD HEF4040B_Q100 Product data sheet Output All information provided in this document is subject to legal disclaimers. Rev. 1 — 4 April 2013 © NXP B.V. 2013. All rights reserved. 7 of 13 HEF4040B-Q100 NXP Semiconductors 12-stage binary ripple counter tW VI 90 % 90 % negative pulse VM VM 10 % 0V VI 10 % tf tr tr tf 90 % positive pulse 90 % VM VM 10 % 0V 10 % tW 001aaj781 a. Input waveforms VDD VI VO G DUT CL RT 001aag182 b. Test circuit Test data is given in Table 9. Definitions test circuit: DUT = Device Under Test; CL = load capacitance, including the jig and probe capacitance; RL = load resistance, which should be equal to the output impedance of the pulse generator. Fig 6. Test circuit for measuring switching times Table 9. Test data Supply voltage Input VDD VI tr, tf CL 5 V to 15 V VSS or VDD 20 ns 50 pF HEF4040B_Q100 Product data sheet Load All information provided in this document is subject to legal disclaimers. Rev. 1 — 4 April 2013 © NXP B.V. 2013. All rights reserved. 8 of 13 HEF4040B-Q100 NXP Semiconductors 12-stage binary ripple counter 12. Package outline SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 D E A X c y HE v M A Z 16 9 Q A2 A (A 3) A1 pin 1 index θ Lp 1 L 8 e 0 detail X w M bp 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 10.0 9.8 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 0.01 0.019 0.0100 0.39 0.014 0.0075 0.38 0.039 0.016 0.028 0.020 inches 0.010 0.057 0.069 0.004 0.049 0.16 0.15 0.05 0.244 0.041 0.228 0.01 0.01 0.028 0.004 0.012 θ 8o o 0 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. Fig 7. REFERENCES OUTLINE VERSION IEC JEDEC SOT109-1 076E07 MS-012 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 Package outline SOT109-1 (SO16) HEF4040B_Q100 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 4 April 2013 © NXP B.V. 2013. All rights reserved. 9 of 13 HEF4040B-Q100 NXP Semiconductors 12-stage binary ripple counter 13. Abbreviations Table 10. Abbreviations Acronym Description HBM Human Body Model ESD ElectroStatic Discharge MM Machine Model MIL Military 14. Revision history Table 11. Revision history Document ID Release date Data sheet status Change notice Supersedes HEF4040B_Q100 v.1 20130404 Product data sheet - - HEF4040B_Q100 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 4 April 2013 © NXP B.V. 2013. All rights reserved. 10 of 13 HEF4040B-Q100 NXP Semiconductors 12-stage binary ripple counter 15. Legal information 15.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 15.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 15.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. HEF4040B_Q100 Product data sheet Suitability for use in automotive applications — This NXP Semiconductors product has been qualified for use in automotive applications. Unless otherwise agreed in writing, the product is not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. All information provided in this document is subject to legal disclaimers. Rev. 1 — 4 April 2013 © NXP B.V. 2013. All rights reserved. 11 of 13 HEF4040B-Q100 NXP Semiconductors 12-stage binary ripple counter No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. 15.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 16. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] HEF4040B_Q100 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 4 April 2013 © NXP B.V. 2013. All rights reserved. 12 of 13 HEF4040B-Q100 NXP Semiconductors 12-stage binary ripple counter 17. Contents 1 2 3 4 5 6 6.1 6.2 7 8 9 10 11 12 13 14 15 15.1 15.2 15.3 15.4 16 17 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 Recommended operating conditions. . . . . . . . 4 Static characteristics. . . . . . . . . . . . . . . . . . . . . 5 Dynamic characteristics . . . . . . . . . . . . . . . . . . 6 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10 Legal information. . . . . . . . . . . . . . . . . . . . . . . 11 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Contact information. . . . . . . . . . . . . . . . . . . . . 12 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2013. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 4 April 2013 Document identifier: HEF4040B_Q100