INTERSIL 5962R9662101TCC

CD4011BT
Data Sheet
July 1999
File Number
CMOS Quad 2-Input NAND Gate
Features
Intersil’s Satellite Applications FlowTM (SAF) devices are fully
tested and guaranteed to 100kRAD total dose. These QML
Class T devices are processed to a standard flow intended
to meet the cost and shorter lead-time needs of large
volume satellite manufacturers, while maintaining a high
level of reliability.
• QML Class T, Per MIL-PRF-38535
The CD4011BT, Quad 2-Input NAND gate provides the
system designer with direct implementation of the NAND
function and supplements the existing family of CMOS
gates. All inputs and outputs are buffered.
4620.1
• Radiation Performance
- Gamma Dose (γ) 1 x 105 RAD(Si)
- SEP Effective LET > 75 MEV/gm/cm2
• Propagation Delay Time = 60ns (typ.) at CL = 50pF,
VDD = 10V
• Buffered Inputs and Outputs
• Standardized Symmetrical Output Characteristics
• 100% Tested for Maximum Quiescent Current at 20V
Specifications
• 5V, 10V and 15V Parametric Ratings
Specifications for Rad Hard QML devices are controlled by
the Defense Supply Center in Columbus (DSCC). The SMD
numbers listed below must be used when ordering.
Pinouts
CD4011BT (SBDIP), CDIP2-T14
TOP VIEW
Detailed Electrical Specifications for the CD4011BT are
contained in SMD 5962-96621. A “hot-link” is provided from
our website for downloading.
www.intersil.com/quality/manuals.asp
Intersil’s Quality Management Plan (QM Plan), listing all
Class T screening operations, is also available on our
website.
www.intersil.com/quality/manuals.asp
Ordering Information
ORDERING
NUMBER
PART
NUMBER
TEMP.
RANGE
(oC)
5962R9662101TCC
CD4011BDTR
-55 to 125
5962R9662101TXC
CD4011BKTR
-55 to 125
A 1
14 VDD
B 2
13 H
J = AB 3
12 G
K = CD 4
11 M = GH
C 5
10 L = EF
D 6
9 E
VSS 7
8 F
CD4011BT (FLATPACK), CDFP3-F14
TOP VIEW
A
1
14
VDD
B
2
13
H
NOTE: Minimum order quantity for -T is 150 units through
J = AB
3
12
G
distribution, or 450 units direct.
K = CD
4
11
M = GH
C
5
10
L = EF
D
6
9
E
VSS
7
8
F
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
www.intersil.com or 407-727-9207 | Copyright © Intersil Corporation 1999
CD4011BT
Schematic and Logic Diagram
14
p
1†
p
n
(8, 6, 13)
VDD
p
2†
p
(9, 5, 12)
p
n
3 (10, 4, 11)
n
n
n
VDD
7
VSS
VSS
† ALL INPUTS ARE PROTECTED
BY CMOS PROTECTION NETWORK
1 OF 4 GATES (NUMBERS
IN PARENTHESES ARE
TERMINAL NUMBERS FOR
OTHER GATES)
1(8, 6,13)
3
(10, 4, 11)
2(9, 5, 12)
2
LOGIC DIAGRAM
CD4011BT
Die Characteristics
DIE DIMENSIONS:
PASSIVATION:
(1143µm x 1626µm x 533µm ±25.4µm)
Type: Phosphorus Doped Silox (SiO2)
45 x 64 x 21mils ±1mil
Thickness: 13kÅ ±2.6kÅ
METALLIZATION:
WORST CASE CURRENT DENSITY:
< 2.0e5 A/cm2
Type: Al
Thickness: 12.5kÅ ±1.5kÅ
TRANSISTOR COUNT:
SUBSTRATE POTENTIAL:
10
Leave Floating or Tie to VDD
PROCESS:
Bond Pad #14 (VDD) First
Bulk CMOS
BACKSIDE FINISH:
Silicon
Metallization Mask Layout
CD4011BT
45mils
64mils
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
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3
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